CN205724032U - Chip accommodating structure - Google Patents
Chip accommodating structure Download PDFInfo
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- CN205724032U CN205724032U CN201620639796.XU CN201620639796U CN205724032U CN 205724032 U CN205724032 U CN 205724032U CN 201620639796 U CN201620639796 U CN 201620639796U CN 205724032 U CN205724032 U CN 205724032U
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- ring cover
- snap fit
- annular walls
- groove
- holding section
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Abstract
A kind of chip accommodating structure, comprises a circuit board, an annular walls and a ring cover.Annular walls is on circuit board.Annular walls definition one first accommodation space is in wherein.Annular walls has at least one groove and at least one holding section.Holding section highlights relative to groove.Groove is between holding section and circuit board.Ring cover detachability ground covers annular walls.Ring cover definition one second accommodation space is in wherein.First accommodation space and the second accommodation space be connection with a common accommodating chip.Ring cover has at least one snap fit.Snap fit can in the grooves and abut holding section.Being designed by this, user can be inserted in the way of easier or take out chip.
Description
Technical field
This utility model is about a kind of chip accommodating structure.
Background technology
Along with the prosperity of Information technology, desktop computer, notebook computer, panel computer or integral computer (all-in-
One computer) etc. device become indispensable important tool in people's life.Above-mentioned various types of computer all wraps
Containing central processing unit (central processing unit；CPU) chip, to process various signal.
In general, central processor core is affixed on the circuit board of computer, and during in order to avoid computer moves, central authorities process
Device chip departs from circuit board, and causes the fault of computer.The fixed structure of typical central processor core can include crown cap,
Fastener and chip pocket.Chip pocket is on circuit board.Crown cap is to be articulated in chip pocket.When assembling, first by core
After sheet inserts the chip pocket on circuit board, then, upset crown cap makes crown cap be covered in chip pocket, then, then
Pull fastener with fixing crown cap and chip pocket；Otherwise, when dismounting, fastener to be pulled unclamps crown cap and inserts with chip
Fixed relationship between groove, then, then overturns crown cap to expose chip pocket, then, is taken by chip in chip pocket
Go out.
But, the part needed for such fixed structure is various, and mode of operation step is the most numerous and diverse, unfavorable user
Insert on assembling or take out chip.
Utility model content
This utility model provides the chip accommodating structure of a kind of simple in construction, and is available for users in the way of easier come
Insert or take out chip.
According to some embodiments of the present utility model, a kind of chip accommodating structure comprise a circuit board, an annular walls with
And a ring cover.Annular walls is on circuit board.Annular walls definition one first accommodation space is in wherein.Annular walls has at least
One groove and at least one holding section.Holding section highlights relative to groove.Groove is between holding section and circuit board.
Ring cover detachability ground covers annular walls.Ring cover definition one second accommodation space is in wherein.First accommodation space and second
Accommodation space be connection with a common accommodating chip.Ring cover has at least one snap fit.Snap fit can in the grooves and support
Connect holding section.
In some embodiments, ring cover has a lid inner surface, and annular walls has an exterior surface of wall, works as annular
During blanketing lid annular walls, the lid inner surface of ring cover and the exterior surface of wall of annular walls are facing, and snap fit is to be based in
The lid inner surface of ring cover, groove is recessed in the exterior surface of wall of annular walls.
In some embodiments, snap fit comprises an inclined plane, when snap fit is in the grooves and when abutting holding section, tilts
Face is the surface on snap fit farthest away from holding section, and inclined plane is to tilt relative to the lid inner surface of ring cover, and inclined plane
It is obtuse angle with the angle of lid inner surface.
In some embodiments, snap fit also comprises one first bearing surface, when snap fit in the grooves time, the first bearing surface
Abutting holding section, the first bearing surface is to be not parallel to inclined plane.
In some embodiments, the first bearing surface is perpendicular to the orientation of ring cover and circuit board.
In some embodiments, holding section has one second bearing surface near groove, when snap fit in the grooves
Time, the first bearing surface abuts the second bearing surface, and the first bearing surface is parallel to the second bearing surface.
In some embodiments, the width of at least part of snap fit is that the direction along circuit board towards ring cover increases
's.
In some embodiments, ring cover, annular walls or both be tool resilient.
In some embodiments, chip accommodating structure also comprises multiple electrical pin, is arranged on circuit board and is positioned at
In annular walls this first accommodation space defined.
In some embodiments, the quantity of snap fit, groove and holding section is plural number, annular walls be positioned at these snap fits it
Between, and these snap fits lay respectively in these grooves and abut these holding sections respectively.
In above-mentioned embodiment, the groove of annular walls is between holding section and circuit board, and ring cover may utilize
Its snap fit enters and abuts against with the holding section of annular walls and engage in groove, therefore when assembling, user only needs ring cover
Oppress towards annular walls so that snap fit strides across holding section and enters in groove, and snap fit just can abut against with holding section, thus will
Ring cover is fixed on annular walls, to be fixed on by chip in the ring cover accommodation space with annular walls.Therefore, compared to tradition
For utilizing the structure of pivoted crown cap and fastener, the chip accommodating structure of above-mentioned embodiment is not only simple in structure, and also may be used
It is beneficial to assembler in the way of easier, fix chip.
The above be only illustrate problem that this utility model to be solved, solve problem technological means and
Effect produced etc., detail of the present utility model will be discussed in detail in embodiment below and relevant drawings.
Accompanying drawing explanation
For above and other purpose of the present utility model, feature, advantage can be become apparent with embodiment, appended accompanying drawing
Be described as follows:
Fig. 1 illustrates the three-dimensional combination figure of the chip accommodating structure according to this utility model one embodiment；
Fig. 2 illustrates the explosive view of the chip accommodating structure shown in Fig. 1；
Fig. 3 illustrates the chip accommodating structure profile along 3-3 line of Fig. 1；And
Fig. 4 illustrates the partial enlarged drawing of the chip accommodating structure of Fig. 3.
Detailed description of the invention
Hereinafter will disclose multiple embodiment of the present utility model with accompanying drawing, as clearly stated, in many practices
Details will be explained in the following description.But, those of ordinary skill in the art are it should be appreciated that in this utility model portion
In point embodiment, the details in these practices not necessarily, is not the most applied to limit this utility model.Additionally, be letter
For the sake of changing accompanying drawing, some known usual structures and element will illustrate in the accompanying drawings in the way of simple signal.It addition, in order to just
Watching in reader, in accompanying drawing, the size of each element not illustrates according to actual ratio.
Fig. 1 illustrates the three-dimensional combination figure of the chip accommodating structure according to this utility model one embodiment.Fig. 2 illustrates Fig. 1
The explosive view of shown chip accommodating structure.As shown in Figures 1 and 2, in present embodiment, chip accommodating structure can comprise electricity
Road plate 100, annular walls 200 and ring cover 300.Annular walls 200 is on circuit board 100.Annular walls 200 defines the first appearance
It is empty a S1 in wherein.In other words, annular walls 200 is round the first accommodation space S1.Ring cover 300 detachability ground covers
Annular walls 200.In other words, ring cover 300 can cover annular walls 200, and the ring cover 300 covering annular walls 200 also can quilt
Pull down and depart from annular walls 200.Ring cover 300 defines the second accommodation space S2 in wherein.In other words, ring cover 300 around
The second accommodation space S2.When ring cover 300 covers annular walls 200, the first accommodation space S1 and the second accommodation space S2 is
Connect houses chip 400 with common.Consequently, it is possible to chip 400 can spacing or be fixed on the first accommodation space S1 and second hold
It is empty in a S2, and is fixed on circuit board 100 by annular walls 200 and ring cover 300.
Fig. 3 illustrates the chip accommodating structure profile along 3-3 line of Fig. 1.As it is shown on figure 3, annular walls 200 has engaging
Portion 210 and groove 220.Holding section 210 highlights relative to groove 220.Groove 220 is in holding section 210 and circuit
Between plate 100.In other words, groove 220 than holding section 210 closer to circuit board 100, that is, holding section 210 is than groove 220
Further from circuit board 100.Ring cover 300 has the snap fit 310 corresponding with groove 220 position.Snap fit 310 can be positioned at groove
In 220 and abut holding section 210.Furthermore, it is understood that ring cover 300 is being covered to annular walls 200, snap fit 310
May extend across holding section 210 and enter in groove 220, and the snap fit 310 entered in groove 220 can abut the holding section above it
210.Consequently, it is possible to the holding section 210 above snap fit 310 can prevent ring cover 300 from moving up, and depart from annular walls 200.Borrow
This, ring cover 300 is securable on annular walls 200, and helps keep and the position of fixed chip 400.
More particularly, see Fig. 4, this figure illustrates the partial enlarged drawing of the chip accommodating structure of Fig. 3.As shown in Figure 4,
In some embodiments, ring cover 300 has relative lid inner surface 301 and cover outer surface 302, annular walls 200
There is relative wall-body energy saving 201 and exterior surface of wall 202.The wall-body energy saving 201 of annular walls 200 is directed towards the first appearance
It is empty a S1, and exterior surface of wall 202 is the first accommodation space S1 dorsad.When ring cover 300 covers annular walls 200, annular
The lid inner surface 301 of lid 300 is facing with the exterior surface of wall 202 of annular walls 200.Furthermore, it is understood that work as ring cover
300 cover annular walls 200 time, the lid inner surface 301 of ring cover 300 can around the exterior surface of wall 202 of annular walls 200, and
In some embodiments, lid inner surface 301 can connecting wall external surface 202, and in other embodiments, table in lid
Face 301 and exterior surface of wall 202 can be separated by a gap.Snap fit 310 is the lid inner surface 301 being based in ring cover 300.Groove
220 is recessed to have concave face 222 in the exterior surface of wall 202 of annular walls 200.In other words, concave face 222 and annular walls
The exterior surface of wall 202 of 200 is separated by one section of difference, in order to forming groove 220.Holding section 210 is the concave face being based in groove 220
222.Consequently, it is possible to make the lid inner surface 301 of ring cover 300 in the face of annular walls when ring cover 300 covers annular walls 200
200 exterior surface of wall 202 time, be based in the snap fit 310 of lid inner surface 301 and can be inserted in groove 220 and abut and be based in
The holding section 210 of concave face 222.
In some embodiments, ring cover 300 can have elasticity.During assembling, assembler can be first by chip
400 are placed in the first accommodation space S1 of annular walls 200, and then, assembler can be along the direction of arrow A1 by ring cover 300 court
Moving to annular walls 200, when the direction that ring cover 300 continues along arrow A1 is moved, snap fit 310 can contact annular walls 200
Exterior surface of wall 202 (that is, be positioned at the exterior surface of wall 202 of holding section 210), so exterior surface of wall 202 can oppress card
Hook 310 so that snap fit 310 with its outside part-toroidal lid 300 can outwards elastic deformation be (such as: along the side of arrow A2
To bending).When ring cover 300 continue on arrow A1 move time, snap fit 310 can move on exterior surface of wall 202, until card
When hook 310 continues to move down and leave exterior surface of wall 202, snap fit 310 and the part-toroidal lid 300 outside it can be upcountry
Resilience falls in groove 220 (such as: along the direction resilience of arrow A3), and now, snap fit 310 can be located at holding section 210 and electricity
Between road plate 100, and abut the concave face 222 of holding section 210 and groove 220.Consequently, it is possible to holding section 210 can prevent annular
Lid 300 departs from annular walls 200 along the direction of arrow A4.
During disassembling, the person of disassembling can apply sufficiently large strength to ring cover 300 along the direction of arrow A4, makes
Snap fit 310 with its outside part-toroidal lid 300 can outwards elastic deformation (such as: along the direction bending of arrow A2),
So that snap fit 310 departs from groove 220.Then, the person of disassembling can continue on the direction of arrow A4 and move ring cover 300 so that card
Hooking 310 can be along arrow on the exterior surface of wall 202 (that is, be positioned at the exterior surface of wall 202 of holding section 210) of annular walls 200
The direction of head A4 is moved, and during until snap fit 310 departs from this exterior surface of wall 202, ring cover 300 can be separated with annular walls 200.
Now, the person of disassembling can be taken off chip 400.
From aforesaid assembling process with disassemble process, the chip accommodating structure of present embodiment can allow following pressure
Mode engages ring cover 300 and annular walls 200 below, additionally, the chip accommodating structure of present embodiment also can allow
The ring cover 300 and annular walls 200 being mutually clamped is separated in the way of pull-up.Arrange in pairs or groups with pivoted crown cap compared to tradition
For the structure of fastener, the chip accommodating structure of present embodiment is available for users in the way of easier insert or take out core
Sheet 400, reaches quickly to assemble and dismantle the effect of chip 400.
In other embodiments, annular walls 200 can have elasticity, and ring cover 300 can not have elasticity.Such
Under design, during assembling, when ring cover 300 moves so that snap fit 310 contacts the body of wall of annular walls 200 along arrow A1
Outer surface 202 (that is, it is positioned at the exterior surface of wall 202 of holding section 210) time, snap fit 310 can oppress annular walls 200 so that ring
Shape wall 200 can upcountry elastic deformation.When ring cover 300 continue on arrow A1 move time, snap fit 310 can be at exterior surface of wall
Moving on 202, during until snap fit 310 continues to move down and leave exterior surface of wall 202, annular walls 200 can outwards resilience
Making snap fit 310 fall in groove 220, now, snap fit 310 can be located between holding section 210 and circuit board 100, and abuts card
Conjunction portion 210 and the concave face 222 of groove 220.
During disassembling, the person of disassembling can apply sufficiently large strength to ring cover 300 along the direction of arrow A4, makes
Annular walls 200 can upcountry elastic deformation, and make snap fit 310 depart from groove 220.Then, the person of disassembling can continue on arrow
Ring cover 300 is moved in the direction of head A4 so that snap fit 310 can annular walls 200 exterior surface of wall 202 (that is, be positioned at engaging
The exterior surface of wall 202 in portion 210) on move along the direction of arrow A4, during until snap fit 310 departs from this exterior surface of wall 202,
Ring cover 300 can be separated with annular walls 200.Now, the person of disassembling can be taken off chip 400.
In some embodiments, annular walls 200 and ring cover 300 can be respectively provided with elasticity, thus reduce further and make
The resistance that user is met with when pressing down ring cover 300 to assemble on annular walls 200, also can reduce user by annular walls 200
On ring cover 300 pull up the resistance that met with when separating, can more easily control dismount this chip in order to profit user and house
Structure.
In some embodiments, as shown in Figure 4, snap fit 310 has width W.This width W is along being perpendicular to circuit board
100 are measured with the direction (horizontal direction in such as figure) of the orientation (longitudinal direction in such as figure) of ring cover 300
Surveying, namely the direction along the lid inner surface 301 being perpendicular to ring cover 300 is measured.At least part of snap fit 310
Width W be that direction along circuit board 100 towards ring cover 300 increases.In other words, at least part of snap fit 310 is
The widest from lower to upper.Such design can beneficially reduce presses snap fit for 310 times and strides across the resistance that holding section 210 is met with
Power.
Furthermore, it is understood that as shown in Figure 4, in some embodiments, snap fit 310 comprises inclined plane 312.When snap fit 310
When being in groove 220 and abut holding section 210, inclined plane 312 is the surface on snap fit 310 farthest away from holding section 210.Change
Sentence is talked about, and inclined plane 312 can be the lower surface of snap fit 310.Inclined plane 312 is the lid inner surface 301 relative to ring cover 300
Tilt, and the angle of this inclined plane 312 and lid inner surface 301 is obtuse angle.Consequently, it is possible in an assembling process, annular is worked as
Lid 300 move along the direction of arrow A1 so that inclined plane 312 contact the upside of holding section 210 time, the inclination of inclined plane 312 sets
Meter can be beneficial to it and slide on holding section 210, continues on the resistance that arrow A1 direction is moved reducing ring cover 300, thus
It is beneficial to assemble ring cover 300 and annular walls 200.In the embodiment shown in Fig. 4, inclined plane 312 is plane, but real in other
Executing in mode, inclined plane 312 also can be curved surface or cambered surface.For example, inclined plane 312 can be the arc of outer gibbosity or inner concavity
Face.
In some embodiments, snap fit 310 also can comprise the first bearing surface 314.First bearing surface 314 and inclined plane
312 is relative, and the first bearing surface 314 is to be not parallel to inclined plane 312.For example, inclined plane 312 can be snap fit 310
Lower surface, and the first bearing surface 314 can be the upper surface of snap fit 310, and the upper surface of this snap fit 310 is the most uneven with lower surface
OK.When snap fit 310 is in the groove 220 of annular walls 200, the first bearing surface 314 can abut holding section 210.By card
Conjunction portion 210 mutually abuts with the first bearing surface 314, and holding section 210 can stop that snap fit 310 departs from recessed along the direction of arrow A4
Groove 220.It may be noted that, when being intended to separate the annular walls 200 fastened with ring cover 300, as long as along the direction of arrow A4
Apply sufficiently large strength, also enable to snap fit 310 and ring cover 300 elastic deformation outside it, or make annular walls 200
Elastic deformation, thus help snap fit 310 and depart from groove 220 and holding section 210, so that ring cover 300 departs from annular walls 200.
In some embodiments, as shown in Figure 4, the first bearing surface 314 of snap fit 310 be perpendicular to ring cover 300 with
The orientation of circuit board 100, is namely perpendicular to the lid inner surface 301 of ring cover 300.For example, the first bearing surface
314 is to be extended along the horizontal direction in figure, and circuit board 100 and ring cover 300 are then along the longitudinal direction in figure
Arranged.By such design, after moving towards circuit board 100 when ring cover 300 and being sticked in annular walls 200, vertically
The first bearing surface 314 in circuit board 100 with the orientation of ring cover 300 may help to stop that ring cover 300 oppositely departs from
Annular walls 200.
In some embodiments, as shown in Figure 4, holding section 210 has the second bearing surface 212.Second bearing surface 212 is
Near the surface of groove 220 in holding section 210.When snap fit 310 is positioned in groove 220, the first bearing surface of snap fit 310
314 the second bearing surfaces 212 that can abut holding section 210, and the first bearing surface 314 is parallel to the second bearing surface 212.Due to
One bearing surface 314 is parallel with the second bearing surface 212 and abuts against, therefore may help to holding section 210 and stop that snap fit 310 is along arrow
A4 moves in direction, thus can help the engaging effect promoting ring cover 300 with annular walls 200.
In some embodiments, as it is shown on figure 3, the quantity of holding section 210, groove 220 and snap fit 310 is plural number,
And when ring cover 300 engages with annular walls 200, annular walls 200 is between these snap fits 310, and these snap fits 310 can
Lay respectively in these grooves 220 and abut these holding sections 210 respectively.For example, in Fig. 3, ring cover 300 can comprise
Two snap fits 310 laying respectively at the second accommodation space S2 opposite sides, annular walls 200 can comprise two holding sections 210 and two
Groove 220, two grooves 220 are the opposite sides laying respectively at annular walls 200, and two holding sections 210 are also to lay respectively at annular
The opposite sides of wall 200, and it is based in groove 220 respectively.This two snap fit 310 can during correspondence is positioned at this two groove 220 respectively also
Abut this two holding section 210.Consequently, it is possible to annular walls 200 can clip between this two snap fit 310, whereby, annular walls 200 can
Stop that ring cover 300 laterally moves.It is to say, the holding section 210 of present embodiment, groove 220 and the design of snap fit 310
Ring cover 300 not only can be prevented upwardly away from annular walls 200, also can prevent ring cover 300 from laterally moving, thus more securely
Stationary annular lid 300.
Additionally, in some embodiments, the exterior surface of wall 202 of the same side of annular walls 200 also can be designed with
Multiple grooves 220 (as shown in Figure 2 two) and be based in the holding section 210 of groove 220 respectively.Relative, at ring cover 300
The same side lid inner surface 301 on also multiple snap fit 310 is designed with regard to respective slot 220 position.Whereby, ring cover is allowed
300 is the most firm with the engaging of annular walls 200.
In some embodiments, as in figure 2 it is shown, chip accommodating structure also can comprise multiple electrical pin 500.These electricity
Property pin 500 is disposed on circuit board 100 and is positioned in the first accommodation space S1 defined in annular walls 200.In other words,
These electrical pins 500 by annular walls 200 institute around.Consequently, it is possible to when chip 400 is placed in the first accommodation space S1
Time, these electrical pins 500 can be supported chip 400, and be beneficial to support and be electrically connected with chip 400.Furthermore, it is understood that such as Fig. 3
And shown in Fig. 4, chip 400 has bottom surface 420, multiple electrical contact (be not shown in the drawing) can be distributed, work as chip on bottom surface 420
400 when being positioned in the first accommodation space S1, and the electrical contact on the bottom surface 420 of chip 400 can distinguish that in electrical contact these are electrical
Pin 500, is electrically connected with other electronic components (being not shown in the drawing) on circuit board 100 in order to chip 400.It may be noted that
It is that " in electrical contact " word described herein, in addition to representing two conducting elements and can directly contacting, also can represent two conducting elements
Between there is extra conducting element (such as conductive paste or conducting resinl).
In some embodiments, defined in ring cover 300, the second accommodation space S2 is nonocclusive.It is to say,
Second accommodation space S2 exposes.Chip 400 has end face 410.Chip 400 is made when ring cover 300 covers annular walls 200
When being positioned in the first accommodation space S1 and the second accommodation space S2, the end face 410 of chip 400 can be by the second accommodation space S2
Expose, in order to the heat radiation of chip 400.For example, the second non-enclosed accommodation space S2 can allow radiator to be arranged at
Above two accommodation space S2, and provide radiating effect with the form of conduction of heat or thermal convection current to the end face 410 of chip.
In sum, this utility model is designed by the snap-in structure of annular walls and ring cover, not only allows chip house knot
The structure design of structure is simple, is not more easy to use person and carries out inserting or taking out of chip, reaches quickly assemble and dismantle chip
Effect.
Although this utility model is disclosed above with embodiment, so it is not limited to this utility model, any ripe
Know this those skilled in the art, without departing from spirit and scope of the present utility model, when being used for a variety of modifications and variations, therefore this practicality
Novel protection domain is when being defined in the range of standard depending on appending claims.
Claims (10)
1. a chip accommodating structure, it is characterised in that comprise:
One circuit board；
One annular walls, is positioned on this circuit board, and this annular walls definition one first accommodation space is in wherein, and this annular walls has at least
One groove and at least one holding section, this holding section relative to this groove highlight, and this groove be in this holding section with
Between this circuit board；And
One ring cover, detachability ground covers this annular walls, and this ring cover definition one second accommodation space is in wherein, and this first holds
Between being empty with this second accommodation space be connect with a common accommodating chip, this ring cover has at least one snap fit, this snap fit
Can be positioned in this groove and abut this holding section.
Chip accommodating structure the most according to claim 1, it is characterised in that this ring cover has a lid inner surface, should
Annular walls has an exterior surface of wall, when this ring cover covers this annular walls, and this lid inner surface of this ring cover and this ring
This exterior surface of wall of shape wall is facing, and this snap fit is this lid inner surface being based in this ring cover, and this groove is recessed
It is located at this exterior surface of wall of this annular walls.
Chip accommodating structure the most according to claim 2, it is characterised in that this snap fit comprises an inclined plane, when this snap fit
When being positioned in this groove and abut this holding section, this inclined plane is the surface on this snap fit farthest away from this holding section, this inclined plane
It is to tilt relative to this lid inner surface of this ring cover, and the angle of this inclined plane and this lid inner surface is obtuse angle.
Chip accommodating structure the most according to claim 3, it is characterised in that this snap fit also comprises one first bearing surface, when
When this snap fit is positioned in this groove, this first bearing surface abuts this holding section, and this first bearing surface is to be not parallel to this inclined plane.
Chip accommodating structure the most according to claim 4, it is characterised in that this first bearing surface is perpendicular to this ring cover
Orientation with this circuit board.
Chip accommodating structure the most according to claim 4, it is characterised in that this holding section has near this groove
Second bearing surface, when this snap fit is positioned in this groove, this first bearing surface abuts this second bearing surface, and this first bearing surface
It is parallel to this second bearing surface.
Chip accommodating structure the most according to claim 1, it is characterised in that the width of this snap fit at least part of be along
This circuit board towards this ring cover direction increase.
Chip accommodating structure the most according to claim 1, it is characterised in that this ring cover, this annular walls or both be tool
Resilient.
Chip accommodating structure the most according to claim 1, it is characterised in that also comprise multiple electrical pin, be arranged at this
On circuit board and be positioned in this annular walls this first accommodation space defined.
Chip accommodating structure the most according to claim 1, it is characterised in that this at least one snap fit, this at least one groove with
The quantity of this at least one holding section is plural number, and this annular walls is between described snap fit, and described snap fit lays respectively at institute
State in groove and abut described holding section respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620639796.XU CN205724032U (en) | 2016-06-24 | 2016-06-24 | Chip accommodating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620639796.XU CN205724032U (en) | 2016-06-24 | 2016-06-24 | Chip accommodating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205724032U true CN205724032U (en) | 2016-11-23 |
Family
ID=57317414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620639796.XU Active CN205724032U (en) | 2016-06-24 | 2016-06-24 | Chip accommodating structure |
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| Country | Link |
|---|---|
| CN (1) | CN205724032U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107546507A (en) * | 2016-06-24 | 2018-01-05 | 宸展光电（厦门）有限公司 | Chip accommodating structure |
-
2016
- 2016-06-24 CN CN201620639796.XU patent/CN205724032U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107546507A (en) * | 2016-06-24 | 2018-01-05 | 宸展光电（厦门）有限公司 | Chip accommodating structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 361021 Fourth Floor, No. 1-7 Tianyang Road, North Industrial Zone, Jimei District, Xiamen City, Fujian Province Patentee after: Chenzhan Photoelectric (Xiamen) Co., Ltd. Address before: 361021 Fourth Floor, No. 1-7 Tianyang Road, North Industrial Zone, Jimei District, Xiamen City, Fujian Province Patentee before: Chen shine photoelectric (Xiamen) Co., Ltd. |
|
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 361021 No. 60 Xinglin South Road, Jimei District, Xiamen City, Fujian Province Patentee after: Chenzhan Photoelectric (Xiamen) Co., Ltd. Address before: 361021 Fourth Floor, No. 1-7 Tianyang Road, North Industrial Zone, Jimei District, Xiamen City, Fujian Province Patentee before: Chenzhan Photoelectric (Xiamen) Co., Ltd. |