CN205723605U - Light-emitting component, include its light emitting module, back light unit and display device - Google Patents
Light-emitting component, include its light emitting module, back light unit and display device Download PDFInfo
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- CN205723605U CN205723605U CN201620268116.8U CN201620268116U CN205723605U CN 205723605 U CN205723605 U CN 205723605U CN 201620268116 U CN201620268116 U CN 201620268116U CN 205723605 U CN205723605 U CN 205723605U
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Abstract
This utility model discloses a kind of light-emitting component, includes its light emitting module, back light unit and display device.Light-emitting component includes: the first pin spaced apart from each other and the second pin；Insulation division, it includes fixing the first pin and the basilar part of the second pin, the first side wall being positioned on basilar part and the second sidewall；And light-emitting diode chip for backlight unit, it is positioned on basilar part, by the first side wall and the second side wall ring around, wherein, the depressed part that first pin and the second pin include the prominent protuberance in face from it respectively and formed from caving in below and configure accordingly with the position of protuberance, first pin and the above of the second pin are covered by basilar part part, and the exposing at least partially of protuberance, and light-emitting diode chip for backlight unit is electrically connected in the first pin and the second pin by contact protuberance.
Description
Technical field
This utility model relates to light-emitting component and includes its light emitting module, particularly relates to the light-emitting component of the structure of a kind of insulation division including improving luminous efficiency and characteristic pin and includes its light emitting module.
Background technology
Lifetime of LED length, power consumption are low, fast response time, are expected to replace conventional light source including light-emitting devices such as the light-emitting component of this light emitting diode, light emitting packages, light emitting modules.
The light-emitting diode chip for backlight unit that light emitting packages typically by substrate, mounts on substrate, the encapsulating material being packaged light-emitting diode chip for backlight unit, the shell supporting encapsulating material and the lens being positioned on luminescence chip are constituted.But, in order to manufacture this common light emitting packages, independent of light-emitting diode chip for backlight unit manufacturing process, it is desirable to packaging process, thus manufacturing process is complicated, and expense increases.Further it is necessary to need the substrate etc. for mounting light-emitting diode chip for backlight unit, thus realize minimizing aspect in the size making packaging part and there is limitation.
In order to simplify this light emitting packages manufacturing process, disclose wafer scale (wafer level) packaging part.Wafer-level packaging part, as the packaging part of holding light-emitting component level, has and can embody miniaturization and high-power advantage.
Utility model content
Technical problem
Problem to be solved in the utility model is to provide a kind of structured light-emitting component of spy having and radiating efficiency and luminous efficiency can being made to increase.
Another problem to be solved in the utility model is to provide that a kind of radiating efficiency is improved, life-span length, luminous efficiency are high, the light emitting module of excellent reliability.
Technical scheme
The light-emitting component of one aspect of this utility model includes: the first pin spaced apart from each other and the second pin；Insulation division, it includes fixing described first pin and the basilar part of the second pin, the first side wall being positioned on described basilar part and the second sidewall；And light-emitting diode chip for backlight unit, it is positioned on described basilar part, by described the first side wall and the second side wall ring around, the depressed part that described first pin and the second pin include the prominent protuberance in face from it respectively and formed from caving in below and configure accordingly with the position of described protuberance, described first pin and the above of the second pin are covered by described basilar part part, and the exposing at least partially of described protuberance, described light-emitting diode chip for backlight unit is electrically connected in described first pin and the second pin by contacting described protuberance.
This utility model light emitting module on the other hand includes: substrate；The light-emitting component of the embodiment being positioned on described substrate；And the junction surface between described light-emitting component and substrate.
The back light unit of the another aspect of this utility model includes light-emitting component or the light emitting module of various embodiment of various embodiment.
The display device of the another aspect of this utility model includes the back light unit of embodiment.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the light-emitting component of diagram one embodiment of this utility model；
Fig. 2 is the top view of the light-emitting component of diagram one embodiment of this utility model；
Fig. 3 is the upward view of the light-emitting component of diagram one embodiment of this utility model；
Fig. 4 is the top view of the light-emitting component of diagram one embodiment of this utility model；
Fig. 5 and Fig. 6 is the profile of the light-emitting component of diagram one embodiment of this utility model；
Fig. 7 a and Fig. 7 b is top view and the profile of the light-emitting diode chip for backlight unit of diagram this utility model embodiment respectively；
Fig. 8 is the axonometric chart of the light-emitting component illustrating various embodiment of the present utility model；
Fig. 9 is the profile of the light emitting module including light-emitting component illustrating the other various embodiment of this utility model；
Figure 10 is the profile of the light emitting module including light-emitting component of the diagram another various embodiment of this utility model；
Figure 11 is to illustrate including light-emitting component or the backlight module of light emitting module and including its profile of display device of various embodiment of the present utility model；
Figure 12 is to show including light-emitting component or the backlight module of light emitting module and including its profile of display device of the other various embodiment of this utility model.
Detailed description of the invention
The light-emitting component of this utility model embodiment, light emitting module, back light unit and display device can embody with various form.
The light-emitting component of embodiment includes: the first pin and the second pin, it is spaced from each other；Insulation division, it includes fixing described first pin and the basilar part of the second pin, the first side wall being positioned on described basilar part and the second sidewall；And light-emitting diode chip for backlight unit, it is positioned on described basilar part, by described the first side wall and the second side wall ring around, the depressed part that described first pin and the second pin include the prominent protuberance in face from it respectively and formed from caving in below and configure accordingly with the position of described protuberance, the upper part ground of described first pin and the second pin is covered by described basilar part, and the exposing at least partially of described protuberance, described light-emitting diode chip for backlight unit is connected to described protuberance, is electrically connected with described first pin and the second pin.
Described insulation division can have light reflective.
Described basilar part, described the first side wall and described second sidewall may be integrally formed.
Described protuberance and described depressed part can be formed by described first pin and the bending respectively of described second pin.
Described first pin and the second pin above in, except described protuberance above in addition to remainder can be covered by described basilar part.
Described the first side wall can configure along the one side of described light-emitting component, described second sidewall can be more than the horizontal direction thickness of described second sidewall along the another side configuration configured on the contrary with described one side, the horizontal direction thickness of described the first side wall.
Described the first side wall and the second sidewall can include respectively with described light-emitting diode chip for backlight unit medial wall in opposite directions, in described the first side wall and described second sidewall at least one can include horizontal direction thickness along the part reduced towards the direction of bottom from the top of described light-emitting component, in the medial wall of described the first side wall and the medial wall of described second sidewall, at least one can include the sloping portion that formed because described horizontal direction thickness reduces.
Can change relative to the gradient of the tangent line of the end face of described sloping portion.
Groove is could be formed with between described sloping portion and described basilar part.
Described light-emitting component can also include the wavelength conversion section covering described light-emitting diode chip for backlight unit.
Described wavelength conversion section can be at least partially filled in described basilar part top by described the first side wall and the second side wall ring around and the dented space that provides.
In the side of described wavelength conversion section, the side between described the first side wall and described second sidewall can be exposed to the side of described light-emitting component.
Described light-emitting diode chip for backlight unit can include multiple luminescence unit (cell).
The light emitting module of various embodiment includes: substrate；The light-emitting component of the embodiment being positioned on described substrate；And the junction surface between described light-emitting component and substrate.
Described junction surface can fill described depressed part at least in part, below described first pin and the second pin in, can connect with described substrate at least partially in the remainder in addition to below described depressed part.
Back light unit includes light-emitting component or the light emitting module of various embodiment of various embodiment.
Display device includes the back light unit of embodiment.
Described back light unit can be edge-lit backlight unit, described display device can include the display floater exporting image, the horizontal direction thickness of described the first side wall can be more than the horizontal direction thickness of described second sidewall, and described the first side wall can more closely be configured at described display floater than described second sidewall.
With reference to the accompanying drawings, embodiment of the present utility model is described in detail.Embodiment introduced below is as example, it is provided that for can fully transmit thought of the present utility model to this utility model person of ordinary skill in the field.Therefore, this utility model is not limited to embodiment explained below, can embody with other form.And, in the accompanying drawings, the width of element, length, thickness etc., may show turgidly for facility.Additionally, when record element " top " of another element or " on " time, not only include each several part " tight top " or the situation of " on Jin " at other position, be additionally included in the situation that there are other elements between each element and another element.In description in the whole text, identical reference marks represents identical element.
Fig. 1 is the axonometric chart of the light-emitting component of diagram one embodiment of this utility model.Fig. 2 is the top view of the light-emitting component of diagram one embodiment of this utility model, and for the facility illustrated, wavelength conversion section 400 omits diagram.Fig. 3 is the upward view of the light-emitting component of diagram one embodiment of this utility model.Fig. 4 is the top view of the light-emitting component of diagram one embodiment of this utility model, for the facility illustrated, illustrates the configuration relation of each composition with solid line.Fig. 5 and Fig. 6 is the profile of the section of diagram and the A-A' line of Fig. 1 to Fig. 4 and B-B' line corresponding part respectively.
Referring to figs. 1 through Fig. 6, light-emitting component 10 includes light-emitting diode chip for backlight unit 100, insulation division 200, pin 300.Further, light-emitting component 10 can also include wavelength conversion section 400.Light-emitting diode chip for backlight unit 100 is positioned on pin 300, and pin 300 is electrically connected to each other with light-emitting diode chip for backlight unit 100.Insulation division 200 contacts at least some of side of pin 300, and pin 300 is fixed by means of insulation division 200.It addition, at least partly about light-emitting diode chip for backlight unit of insulation division 200 100, in the dented space that insulation division 200 is formed to configure in the way of light-emitting diode chip for backlight unit 100, wavelength conversion section 400 can be filled at least in part.Therefore, wavelength conversion section 400 can be with covering luminousing diode chip 100.Below each composition is described in more detail.
Light-emitting diode chip for backlight unit 100 can include n-type semiconductor layer, p-type semiconductor layer and the active layer between n-type semiconductor layer and p-type semiconductor layer.Described n-type semiconductor layer, p-type semiconductor layer and active layer can include such as the nitride semiconductor of (Al, In, Ga) N, or formed by nitride semiconductor.Light-emitting diode chip for backlight unit 100 can be formed with known many spline structures.Such as, light-emitting diode chip for backlight unit 100 can have horizontal type, vertical-type or flip-chip type structure.
Light-emitting diode chip for backlight unit 100 can include at least one luminescence unit.In one embodiment, as shown in Figure 7a, light-emitting diode chip for backlight unit 100 can include plural luminescence unit 111,112.Each luminescence unit 111,112 embodies mutually different light-emitting zone respectively, and the light-emitting zone of these luminescence units 111,112 can be spaced from each other.Luminescence unit 111,112 can be formed be serially connected, the electrical connection of at least one in parallel and inverse parallel.
It addition, light-emitting diode chip for backlight unit 100 can include forming, with pin 300, at least two pad electrode 121,123 being electrically connected.In one embodiment, as shown in Figure 7b, light-emitting diode chip for backlight unit 100 can be included in the first pad electrode 121 and the second pad electrode 123 formed below.First pad electrode 121 can directly contact with the first pin 310 described later and the second pin 320 respectively with the second pad electrode 123, or connected by other medium and form electrical connection.But, this utility model is not limited to this, and the pad of light-emitting diode chip for backlight unit 100 can also be positioned at the top of light-emitting diode chip for backlight unit 100.
In certain embodiments, light-emitting diode chip for backlight unit 100 includes two luminescence units 111,112, is included in the first pad electrode 121 and the second pad electrode 123 that its underpart is formed.Now, light-emitting diode chip for backlight unit 100 can have flip-chip type structure.The light-emitting diode chip for backlight unit 100 of flip-chip type structure includes p-type semiconductor layer, the n-type semiconductor layer on the top of described p-type semiconductor layer and the active layer between described p-type semiconductor layer and n-type semiconductor layer.The concrete structure of light-emitting diode chip for backlight unit 100 can be known many spline structures.
Referring again to Fig. 1 to Fig. 6, insulation division 200 can include basilar part 210, the first side wall 220 that is positioned on basilar part 210 and the second sidewall 230.Although basilar part 210, the first side wall 220 and the second sidewall 230 be the most independent composition for the facility illustrated, but basilar part 210, the first side wall 220 and the second sidewall 230 may be integrally formed.But, this utility model is not limited to this, and basilar part 210, the first side wall 220 and the second sidewall 230 can be formed with mutually different material respectively, have mutually different characteristic.
Insulation division 200 can have light reflective characteristic.The insulation division 200 with this light reflective characteristic is formed around light-emitting diode chip for backlight unit 100, thus from the light of light-emitting diode chip for backlight unit 100 release and carry out the light of wavelength conversion by means of wavelength conversion section 400 and reflected by insulation division 200, the luminous efficiency of light-emitting component 10 can be improved.The insulation division 200 with light reflective can be formed with polymer or silicon etc..Further, insulation division 200 can also include the implant that can make luminous reflectance or scattering.Described polymer or silicon can be transparent or semitransparent, for example, it is possible to include silicones or epoxy resin, polyimide resin, polyurethane resin etc..In the present embodiment, insulation division 200 can be formed with white silicone.
Described implant can brokenly or uniformly dispersing configuration in described polymer or silicon.As long as described implant can make the material of luminous reflectance or scattering, then it is not intended to, for example, it may be titanium dioxide (TiO2), silicon dioxide (SiO2) or zirconium dioxide (ZrO2) etc..Reflecting material 130 can include at least one in described implant.By regulating kind or the concentration etc. of implant, such that it is able to the reflexivity of regulation reflecting material 130 or scattering of light degree etc..
But, this utility model is not limited to this, it is also possible to as required, regulates the reflexivity of insulation division 200, light transmission degree etc., regulates the sensing angle of the light discharged from light-emitting diode chip for backlight unit 100.Such as so that basilar part 210 is formed with the silicon matter that luminous reflectance degree is of a relatively high, the first side wall 220 and the second sidewall 230 are formed with translucence material, thus can also regulate the sensing angle of light-emitting component 10.
Basilar part 210 covers the side of the above and pin 300 of pin 300 at least in part.Pin 300 can provide with the form tied up by basilar part 210.In one embodiment, basilar part 210 can cover above pin 300, and the part that pin 300 is above, and particularly protuberance 311a, 321a of pin 300 exposes at least in part.Do not covered by basilar part 210 below pin 300, can expose below light-emitting component 10.Basilar part 210 is integrally fixed with pin 300, using the teaching of the invention it is possible to provide the pasting area of light-emitting diode chip for backlight unit 100.Such as, as shown in the figure, light-emitting diode chip for backlight unit 100 may be located on basilar part 210 and pin 300, by pin 300 above in do not covered by basilar part 210 and the part (protuberance 311a, 321a) exposed, light-emitting diode chip for backlight unit 100 can be electrically connected with pin 30 0.Basilar part 210 covers the above of pin 300 at least in part and is formed, thus is reflected by basilar part 210 from the light of light-emitting diode chip for backlight unit 100 release, can improve the luminous efficiency of light-emitting component 10.
It addition, the side of basilar part 210 and at least some of side of pin 300 can concordant (flush) formed.As shown in Fig. 1, Fig. 3 to Fig. 5 etc., the prominent side projection 313,323 of side surface direction to pin 300 can substantially side with basilar part 210 the most evenly be formed.But, this utility model is not limited to this.
The first side wall 220 and the second sidewall 230 are positioned on basilar part 210.The first side wall 220 can be formed along the one side of light-emitting component 10, and the second sidewall 230 can be formed along the another side contrary with the one side of described light-emitting component 10.Therefore, at least two side of light-emitting component 10 can be formed with the side of sidewall 220,230.On the contrary, in the side of the light-emitting component 10 not forming sidewall 220,230, the side of wavelength conversion section 400 at least can partly be exposed.Therefore, now, a part for the side of light-emitting component 10 can at least some of corresponding with the side of wavelength conversion section 400.
The first side wall 220 and the second at least partly about light-emitting diode chip for backlight unit of sidewall 230 100 and configure.It addition, the first side wall 220 and the second sidewall 230 can separate from light-emitting diode chip for backlight unit 100.But being not limited to this, in certain embodiments, the first side wall 220 and the second sidewall 230 can connect with light-emitting diode chip for backlight unit 100.It addition, the above height of the first side wall 220 and the second sidewall 230 can be higher than the above height of light-emitting diode chip for backlight unit 100.As it has been described above, the first side wall 220 and the second at least partly about light-emitting diode chip for backlight unit of sidewall 230 100 and formed, thus reflected by sidewall 220,230 from the light of light-emitting diode chip for backlight unit 100 release, the luminous efficiency of light-emitting component 10 can be improved.
On the other hand, this utility model is not limited to this, and in certain embodiments, as shown in Figure 8, insulation division 200 can also be formed along all sides of light-emitting component 10a.Now, in the side of light-emitting component 10a, wavelength conversion section 400 is not exposed.The light-emitting component 10a of Fig. 8 has the sensing distribution of the light-emitting component 10 being different from Fig. 1 to Fig. 6, such as, for the sensing angle measured along A-A' line, the light-emitting component 10 of Fig. 1 to Fig. 6 is more than the light-emitting component 10a of Fig. 8.
Referring again to Fig. 1 to Fig. 6, the first side wall 220 and the second sidewall 230 can have mutually different thickness.Specifically, as shown in Fig. 1 etc., the thickness T1 of the horizontal direction of the first side wall 220 can be more than the thickness T2 of the horizontal direction of the second sidewall 230.As mentioned above so that the first side wall 220 is the most different with the horizontal direction thickness of the second sidewall 230 such that it is able to improve the reliability in the various application applying this utility model light-emitting component 10 and characteristic.Such as, when the light-emitting component 10 of this utility model embodiment is applied to display device side light type back light module, if the first side wall 220 direction toward upper (direction that image is sent) of light-emitting component 10 is configured, then the light leakage phenomena being possible to prevent or reducing in display device.
It addition, the sidewall of at least one in the first side wall 220 and the second sidewall 230, its horizontal direction thickness (T1 and/or T2) can reduce along from the top of light-emitting component 10 towards the direction of bottom.Therefore, the sidewall of at least one in the first side wall 220 and the second sidewall 230, the sloping portion that its medial wall is formed can be included in.It addition, relative to the end face of described sloping portion, the tangential tilt degree of described sloping portion can be changed.
Such as, as shown in Fig. 6 etc., the first side wall 220 and the second sidewall 230 can include and light-emitting diode chip for backlight unit 100 medial wall 220s, 230s in opposite directions respectively.The medial wall 220s of the first side wall 220 and medial wall 230s of the second sidewall 230 can include the part tilted respectively.Now, the medial wall 220s of the first side wall 220 and the respective sloping portion of medial wall 230s of the second sidewall 230, it can change relative to the tangential tilt degree of end face.As mentioned above, the medial wall 220s of the first side wall 220 and medial wall 230s of the second sidewall 230 includes the part tilted respectively, thus horizontal direction its size of thickness T2 of the horizontal direction thickness T1 of the first side wall 220 and the second sidewall 230 can reduce along from the top of light-emitting component 10 towards the direction of bottom respectively.
The medial wall 220s of the first side wall 220 and medial wall 230s of the second sidewall 230 includes the part tilted respectively, thus forms set groove between the first side wall 220 and basilar part 210 and between the second sidewall 230 and basilar part 210.Therefore, the thickness of the wavelength conversion section 400 of the side perimeters of light-emitting diode chip for backlight unit 100 is relatively thick, can improve wavelength shifting efficiency.Particularly when light-emitting diode chip for backlight unit 100 is flip-chip type light emitting diode, with light-emitting diode chip for backlight unit 100 above compared with, active layer is closer to following, thus by means of described set groove, wavelength conversion section 400 thickness of the peripheral part of active layer increases, and wavelength shifting efficiency improves further.
Pin 300 is configured at the bottom of light-emitting diode chip for backlight unit 100.Pin 300 can include the first pin 310 and the second pin 320 spaced apart from each other.In certain embodiments, pin 300 can also include more than three pins spaced apart from each other.As it has been described above, the first pin 310 and the second pin 320 can be tied up by insulation division 200, the basilar part 210 being fixed on insulation division 200 particularly can be tied up.
First pin 310 and the second pin 320 include protuberance 311a, 321a prominent towards upper direction from it respectively.Further, the first pin 310 and the second pin 320 can also include from below to depressed part 311b, 321b of upper direction depression.In the first pin 310 and the second pin 320, the position of each protuberance 311a, 321a is corresponding with the position of depressed part 311b, 321b.I.e., as shown in Figures 5 and 6, the part caved in because of depressed part 311b, 321b can be prominent to the top of the first pin 310 and the second pin 320, such that it is able to form protuberance 311a, 321a.
Protuberance 311a, 321a and depressed part 311b, 321b can be formed by the first pin 310 and the second pin 320 bending.Such as, utilize stamping procedure, the power that applying is set below the first pin 310 and the second pin 320 such that it is able to form protuberance 311a, 321a and depressed part 311b, 321b.But, this utility model is not limited to this.
First pin 310 and the second pin 320 include protuberance 311a, 321a and depressed part 311b, 321b, thus generation staggered floor on the first pin 310 and the second pin 320.Basilar part 210 can cover the first pin 310 and the second pin 320 above in relatively low above.That is, as shown in Fig. 5 and Fig. 6 etc., basilar part 210 can cover the first pin 310 and part not forming protuberance 311a, 321a of the second pin 320, it is possible to further cover the side as protuberance 311a, 321a.Therefore, above the covering by basilar part 210 of protuberance 311a, 321a and expose, by above the exposing of described protuberance 311a, 321a, light-emitting diode chip for backlight unit 100 is electrically connected with pin 310,320.
As it has been described above, the first pin 310 and the second pin 320 include protuberance 311a, 321a, thus the part in addition to above of protuberance 311a, 321a can be covered by basilar part 210.Therefore, towards the light in direction, bottom of light-emitting diode chip for backlight unit 100 from the light of light-emitting diode chip for backlight unit 100 release, other region outside the formed region of protuberance 311a, 321a, by insulation division 200 (particularly basilar part 210) reflection.The luminous reflectance of the insulation division 200 with light reflective can be higher than the luminous reflectance of metallic pin 310,320, thus from the light of light-emitting diode chip for backlight unit 100 release, compared with the situation reflected by pin 310,320, in the case of being reflected by basilar part 210, luminous efficiency can be improved further.
Wavelength conversion section 400 can be with covering luminousing diode chip 100.Wavelength conversion section 400 can form to be at least partially filled in the dented space provided on basilar part 210 by means of the first side wall 220 and the second sidewall 230.Now, the above of wavelength conversion section 400 can be the most concordant with the first side wall 220, alternatively, it is also possible to the most concordant with the second sidewall 230.In certain embodiments, the side between the first side wall 220 and the second sidewall 230 in the side of wavelength conversion section 400 can be exposed.Being different from this, as shown in Figure 8, when the sidewall of insulation division 200 configures in the way of around all sides of light-emitting diode chip for backlight unit 100, wavelength conversion section 400 can fill the depression formed by means of described sidewall at least in part.
Wavelength conversion section 400 can include wavelength conversion body and accommodate the photopermeability material of described fluorophor, and described wavelength conversion body can configure in described photopermeability material randomly or equably.The light that wavelength conversion body can make light-emitting diode chip for backlight unit 100 discharge is transformed into the light of other wavelength.Therefore, it can the light variation making light-emitting component 10 discharge, and then white-light luminescent component can be embodied.
Described photopermeability material can include fluoropolymer resin or the silicones of such as epoxy resin or acrylic resin, can play and make the scattered matrix effect of wavelength conversion body.Wavelength conversion body can include fluorophor, quantum dot material etc..Described fluorophor can include the well-known various fluorophor of those of ordinary skill, for example, it is possible to include at least one in garnet fluorescent body, chlorate MClO 3 fluorescent substance, sulphide phosphor, nitrogen oxides fluorophor, nitride phosphor, fluorination system fluorophor, silicate phosphor.But, this utility model is not limited to this.
Light-emitting component 10 according to described embodiment, insulation division 200 partly covers above pin 300, it is possible to increase luminous reflectance efficiency, the luminous efficiency of light-emitting component 10 is improved.It addition, insulation division 200 includes the sidewall that thickness is different, thus when being applied to some application, characteristic and the reliability of the light-emitting device of the light emitting module etc. applying light-emitting component 10 can be improved.It addition, pin 300 includes depressed part 311b, 321b, when light-emitting component 10 is mounted on other other substrate, radiating efficiency can be improved.Related to this, further describe in the examples below.
Fig. 9 is the profile of the light emitting module including light-emitting component illustrating the other various embodiment of this utility model, and Figure 10 is the profile of the light emitting module including light-emitting component of the diagram another various embodiment of this utility model.
First, with reference to Fig. 9, the light emitting module of the present embodiment includes substrate 20, light-emitting component 10 and junction surface 30.
As long as substrate 20 can mount the substrate of light-emitting component 10, do not limit, the electrode that light-emitting component 20 can be electrically connected can be included.Such as, substrate 20 can include printed circuit board (PCB) (PCB substrate).
Light-emitting component 10 is mounted on substrate 20, and by means of junction surface 30, light-emitting component 10 can be engaged in substrate 20.Junction surface 30 can include engaging the first junction surface 31 of the first pin 320 and substrate 20 and engage the second junction surface 33 of the second pin 330 and substrate 20.As long as junction surface 30 has the material of cohesive and electrical conductance, then it is not intended to.In one embodiment, junction surface 30 can be solder, but this utility model is not limited to this.
In the present embodiment, first pin 310 and depressed part 311b, 321b of the second pin 320 is filled at junction surface 30 at least in part.Therefore, light-emitting component 10 engages with substrate 20 by means of at least one of junction surface 30 filling depressed part 311b, 321b.Now, below the first pin 310 and the second pin 320 in, below remaining outside depressed part 311b, 321b forming part at least some of, can connect with substrate 20.As it has been described above, the part that formation the first pin 310 and the second pin 320 directly connect with substrate 20, thus improve the radiating efficiency of light-emitting component 10.It is thus possible to improve the life-span of the light emitting module of the present embodiment and reliability.
In other various embodiment, fill first pin 310 and depressed part 311b, 321b of the second pin 320 at least in part at junction surface, but also can be formed with connecting below remaining of the first pin 310 and the second pin 320.As shown in Figure 10, junction surface 40 can also be with being formed of the first pin 310 and depressed part 311b, 321b of the second pin 320 and remaining face thereof with connecting at least partially.Now, owing at the first pin 310 and staggered floor being formed below of the second pin 320, being possible to prevent the filling etc. at junction surface 40.Therefore, light-emitting component 10 the most more stably mounts.
The light emitting module of described embodiment can apply to various application such as illumination, display device backlight.Illustrate that the light-emitting component of described embodiment or light emitting module are applied to the embodiment of display device backlight below.Therefore, light-emitting component of the present utility model and light emitting module can serve as backlight module.
Figure 11 is to illustrate including light-emitting component or the backlight module of light emitting module and including its profile of display device of various embodiment of the present utility model.
The display device of the present embodiment includes display floater 2110, provides the back light unit of light to display floater 2110, and supports the panel guide portion of the lower edge of described display floater 2110.
Display floater 2110 without particular limitation of, for example, it may be include the display panels of liquid crystal layer.At the edge of display floater 2110, can be further equipped with driving the raster data model PCB of signal to described gate line supply.Wherein, raster data model PCB can not also be constituted on other PCB, and is formed on thin film transistor base plate.
Back light unit includes at least one substrate and includes the light emitting module of multiple light-emitting component 2160.Further, back light unit can also include housing 2180, reflector plate 2170, diffuser plate 2131 and optical sheet 2130.
Housing 2180, to upper opening, can receive substrate, light-emitting component 2160, reflector plate 2170, diffuser plate 2131 and optical sheet 2130.It addition, housing 2180 can be combined with panel guide portion.Substrate may be located at the bottom of reflector plate 2170, configures with the form by reflector plate 2170 cincture.But, it is not limited to this, in the case of reflecting material coats surface, it is also possible to be positioned on reflector plate 2170.It addition, substrate is formed multiple, multiple substrates with the form configuration being arranged side-by-side, but can be not limited to this, it is also possible to is formed with single substrate.
Light-emitting component 2160 can include at least one in the light-emitting component of described this utility model embodiment.It addition, described light emitting module can include at least one in the light-emitting component of described this utility model embodiment.Light-emitting component 2160 can be regularly arranged into predetermined pattern on substrate.It addition, be configured with lens 2210 on each light-emitting component 2160, the light from the release of multiple light-emitting components 2160 can be made to improve homogeneity.
Diffuser plate 2131 and optical sheet 2130 are positioned on light-emitting component 2160.Display floater 2110 can be supplied to through diffuser plate 2131 and optical sheet 2130 with area source form from the light of light-emitting component 2160 release.
As it has been described above, the light-emitting component of this utility model embodiment can apply to the full run-down type display device shown in the present embodiment.
Figure 12 is to show including light-emitting component or the backlight module of light emitting module and including its profile of display device of the other various embodiment of this utility model.
The display device of the back light unit possessing the present embodiment includes showing the display floater 3210 of image, being configured at the back side of display floater 3210 and irradiate the back light unit of light.Further, described display device includes supporting display floater 3210 and receiving the framework 240 of back light unit and surround the cover 3240,3280 of described display floater 3210.Described back light unit can be side-light type display device back light unit.
Display floater 3210 without particular limitation of, for example, it may be include the display panels of liquid crystal layer.Edge at display floater 3210, it is also possible to be equipped with oriented described gate line supply and drive the raster data model PCB of signal.Wherein, raster data model PCB can not also be constituted on other PCB, and is formed on thin film transistor base plate.Display floater 3210 is fixed by the cover 3240,3280 being positioned at its top and the bottom, and the cover 3280 being positioned at bottom can be tied up with back light unit.
The back light unit of light is provided to display floater 3210, the lower cover 3270 of above a part of opening can be included, be configured at the light source module of the interior side of lower cover 3270 and evenly configure and a light is transformed into the light guide plate 3250 of face light with described light source module.It addition, the back light unit of the present embodiment can also include: optical sheet 3230, it is positioned on light guide plate 3250, makes light diffusion and optically focused；Reflector plate 3260, it is configured at the bottom of light guide plate 3250, makes the light advanced to the direction, bottom of light guide plate 3250 reflect to display floater 3210 direction.
Light emitting module includes that substrate 3220 and the one side at described substrate 3220 separate multiple light-emitting components 3110 of predetermined distance configuration.As long as substrate 3220 supports light-emitting component 3110 and is electrically connected in light-emitting component, then it is not intended to, such as, can be printed circuit board (PCB).Light-emitting component 3110 can include the light-emitting component of at least one described this utility model embodiment.Incide light guide plate 3250 from the light of light emitting module release, be supplied to display floater 3210 by optical sheet 3230.By light guide plate 3250 and optical sheet 3230, area source can be deformed into from the point source of light-emitting component 3110 release.
The most in one embodiment, light-emitting component 3110 can include the light-emitting component 10 of Fig. 1 to Fig. 6 embodiment.Now, the first side wall 220 of light-emitting component 10 can be than the second sidewall 230 closer to image outlet side.That is, light-emitting component 10 can be arranged to make the first side wall 220 to the second sidewall 230 of light-emitting component 10 closer to display floater 3210.It is therefore prevented that at the first side wall 220 periphery, light discharges to unexpected direction, it is possible to maximally reduce or prevent the side perimeters generation light leakage phenomena at display floater 3210.
Above various embodiment of the present utility model is illustrated, but this utility model is not limited to each embodiment described and feature.The utility model changed by the combination of technical characteristic of explanation in embodiment and displacement is also both contained in scope of the present utility model, in the range of without departing from the technological thought of the technical solution of the utility model, can diversely deform and change.
Claims (19)
1. a light-emitting component, it is characterised in that including:
First pin spaced apart from each other and the second pin；
Insulation division, it includes fixing described first pin and the basilar part of the second pin, the first side wall being positioned on described basilar part and the second sidewall；And
Light-emitting diode chip for backlight unit, it is positioned on described basilar part, by described the first side wall and the second side wall ring around,
The depressed part that described first pin and the second pin include the prominent protuberance in face from it respectively and formed from caving in below and configure accordingly with the position of described protuberance,
Described first pin and the above of the second pin are covered by described basilar part part, and the exposing at least partially of described protuberance,
Described light-emitting diode chip for backlight unit is electrically connected in described first pin and the second pin by contacting described protuberance.
Light-emitting component the most according to claim 1, it is characterised in that:
Described insulation division has light reflective.
Light-emitting component the most according to claim 1, it is characterised in that:
Described basilar part, described the first side wall and described second sidewall are integrally formed.
Light-emitting component the most according to claim 1, it is characterised in that:
Described protuberance and described depressed part are formed by described first pin and the bending respectively of described second pin.
Light-emitting component the most according to claim 1, it is characterised in that:
Described first pin and the second pin above in, except described protuberance above in addition to remainder covered by described basilar part.
Light-emitting component the most according to claim 1, it is characterised in that:
Described the first side wall configures along the one side of described light-emitting component,
Described second sidewall configures along the another side relative with described one side,
The horizontal direction thickness of described the first side wall is more than the horizontal direction thickness of described second sidewall.
Light-emitting component the most according to claim 1, it is characterised in that:
Described the first side wall and the second sidewall include and described light-emitting diode chip for backlight unit multiple medial walls in opposite directions respectively,
In described the first side wall and described second sidewall at least one include horizontal direction thickness along from the top of described light-emitting component towards the direction of bottom reduce part,
In the medial wall of described the first side wall and the medial wall of described second sidewall, at least one includes the sloping portion formed because described horizontal direction thickness reduces.
Light-emitting component the most according to claim 7, it is characterised in that:
Change relative to the gradient of the tangent line of the end face of described sloping portion.
Light-emitting component the most according to claim 7, it is characterised in that also include:
Groove, it is arranged between described sloping portion and described basilar part.
Light-emitting component the most according to claim 1, it is characterised in that also include:
Wavelength conversion section, it covers described light-emitting diode chip for backlight unit.
11. light-emitting components according to claim 10, it is characterised in that:
Described wavelength conversion section is at least partially filling in the top of described basilar part by described the first side wall and the second side wall ring around the dented space formed.
12. light-emitting components according to claim 11, it is characterised in that:
In multiple sides of described wavelength conversion section, the side between described the first side wall and described second sidewall is exposed to the side of described light-emitting component.
13. light-emitting components according to claim 1, it is characterised in that:
Described light-emitting diode chip for backlight unit includes multiple luminescence unit.
14. 1 kinds of light emitting modules, it is characterised in that including:
Substrate；
It is positioned at the light-emitting component of any one in the claim 1 to 13 on described substrate；And
Junction surface between described light-emitting component and substrate.
15. light emitting modules according to claim 14, it is characterised in that:
Described depressed part is at least partly filled at described junction surface,
In below described first pin and the second pin, connecting with described substrate at least partially in the remainder in addition to below described depressed part.
16. 1 kinds of back light units, it is characterised in that include the light-emitting component described in any one in claim 1 to 13.
17. 1 kinds of back light units, it is characterised in that include the light emitting module described in claims 14 or 15.
18. 1 kinds of display devices, it is characterised in that include the back light unit described in claim 16 or 17.
19. display devices according to claim 18, it is characterised in that:
Described back light unit is edge-lit backlight unit,
Described display device includes the display floater exporting image,
The horizontal direction thickness of described the first side wall is more than the horizontal direction thickness of described second sidewall, and described the first side wall is arranged to than described second sidewall closer to described display floater.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620268116.8U CN205723605U (en) | 2016-03-31 | 2016-03-31 | Light-emitting component, include its light emitting module, back light unit and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620268116.8U CN205723605U (en) | 2016-03-31 | 2016-03-31 | Light-emitting component, include its light emitting module, back light unit and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205723605U true CN205723605U (en) | 2016-11-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620268116.8U Expired - Fee Related CN205723605U (en) | 2016-03-31 | 2016-03-31 | Light-emitting component, include its light emitting module, back light unit and display device |
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| CN (1) | CN205723605U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110828637A (en) * | 2018-08-14 | 2020-02-21 | 首尔半导体株式会社 | Light emitting diode package and display device having the same |
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2016
- 2016-03-31 CN CN201620268116.8U patent/CN205723605U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110828637A (en) * | 2018-08-14 | 2020-02-21 | 首尔半导体株式会社 | Light emitting diode package and display device having the same |
| CN110828638A (en) * | 2018-08-14 | 2020-02-21 | 首尔半导体株式会社 | Light emitting diode package and display device having the same |
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