CN205691623U - Testing impedance probe assembly - Google Patents
Testing impedance probe assembly Download PDFInfo
- Publication number
- CN205691623U CN205691623U CN201620479498.9U CN201620479498U CN205691623U CN 205691623 U CN205691623 U CN 205691623U CN 201620479498 U CN201620479498 U CN 201620479498U CN 205691623 U CN205691623 U CN 205691623U
- Authority
- CN
- China
- Prior art keywords
- probe
- testing impedance
- screen layer
- conductor structure
- impedance probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Landscapes
- Measuring Leads Or Probes (AREA)
Abstract
The testing impedance probe assembly that this utility model provides, including: the testing impedance probe that at least two is made up of with the screen layer being coated on outside probe inner wire probe inner wire, and for the conductor structure of testing impedance probe described in electrical connection two；Wherein one testing impedance probe pair of each two testing impedance probe composition；It is equipped with conductive elastic component on the screen layer of each testing impedance probe, constitutes the conductive elastic component on two testing impedance probes of testing impedance probe pair and be in close contact with same described conductor structure respectively under the effect of respective elastic force.Testing impedance probe assembly of the present utility model, realizes good electric connection by conductor structure between the screen layer of two testing impedance probes of testing impedance probe pair, can be prevented effectively from high-frequency signal distortion, it is ensured that the accuracy of impedance test results.
Description
Technical field
This utility model relates to testing impedance technical field, is specifically related to a kind of testing impedance probe assembly.
Background technology
Along with the continuous progress of communication technology, traffic rate is more and more higher, and pcb board cabling is proposed by increasing user
Impedance control and the requirement of signal frequency.Testing impedance is typically required and is realized by probe assembly.Described probe assembly is general
Including two probes, can be the single-ended probe assembly comprising a signal probe and a grounded probe, it is also possible to be to comprise
The differential probe assembly of two signal probes.
When testing impedance, in order to avoid high-frequency signal distortion, affect test result, it is generally required to by testing impedance probe
Electric connection between the screen layer of two probes of assembly.
In existing testing impedance probe assembly, the screen layer of two probes is coupled together by copper cash, it is common that,
Copper cash welds with one of them probe, overlaps with another one probe.Although this mode can realize two probe screen layers
Between electric connection, but, owing to copper cash and another one probe overlap, contact effect is difficult to ensure that, and tested weldering on pcb board
The spacing of dish or via is uncertain, therefore needs to regulate the distance between two probes at any time in test process, and this is just
Making the probe with copper cash overlap joint can be with copper cash generation relative motion, probe and the easy loose contact of copper cash, relative motion produces
When friction also can make probe screen layer or copper cash that abrasion occurs, can affect probe screen layer and copper cash equally contacts effect.Cause
This, the probe screen layer of above-mentioned existing testing impedance probe assembly and copper cash to contact effect poor, and then affect two spies
Electric connection between pin screen layer.
Utility model content
Therefore, the technical problems to be solved in the utility model is to overcome in impedance probe test suite of the prior art
The poor defect of two probe screen layer electric connection effects, thus provide the screen layer electric connection effect of a kind of two probes relatively
Good testing impedance probe assembly.
A kind of testing impedance probe assembly of the present utility model, including:
The testing impedance that at least two is made up of probe inner wire and the screen layer being coated on outside described probe inner wire is visited
Pin), and for the conductor structure of testing impedance probe described in electrical connection two；Wherein testing impedance probe composition one described in each two
Individual testing impedance probe pair；
It is equipped with conductive elastic component on the screen layer of each described testing impedance probe, constitutes described testing impedance probe
To two described testing impedance probes on described conductive elastic component under the effect of respective elastic force respectively with same institute
State conductive structure to be in close contact.
Described conductor structure in the form of sheets, is arranged at two described conductive elastic components and the institute of described testing impedance probe pair
State the same side contact of conductor structure.
Described conductor structure is copper sheet.
Described conductor structure surface gold-plating, gold plating thickness is 20～40um.
Described conductive elastic component is reed, including the first end, the second end, and integrally connects described first end and described
The arch arc portion of two ends, described first end is fixed in the described screen layer of described testing impedance probe, and described arch arc portion leads with described
Body form touch, described second end and described arch arc portion have under the recovery elastic force effect of described reed ties towards described conductor
The trend of structure motion.
Described probe inner wire stretches out the part of described screen layer and forms needle point, and described first end is fixed in described screen layer
Near one end of described needle point, described arch arc portion by described first end towards axially away from described screen layer, near described needle point
Direction extends.
Described reed is beryllium copper reed.
The surface that described reed contacts with described conductor structure is provided with Gold plated Layer.
The quantity of described testing impedance probe is two, and one of them is signal probe, and another is grounded probe, constitutes
Single-ended probe pair.
Described probe inner wire stretches out the part of described screen layer and forms needle point, the described needle point of described grounded probe and institute
State screen layer welding.
The quantity of described testing impedance probe is two, is signal probe, constitutes differential probe pair.
Also include that frame, described test probe and described conductor structure are respectively arranged in described frame.
The described screen layer of described testing impedance probe welds with described conductive elastic component.
Technical solutions of the utility model, have the advantage that
1. the testing impedance probe assembly that this utility model provides, including: at least two is by probe inner wire and is coated on
The testing impedance probe that screen layer outside described probe inner wire is constituted, and leading for testing impedance probe described in electrical connection two
Body structure；Wherein one testing impedance probe pair of testing impedance probe composition described in each two；Each described testing impedance probe
Described screen layer on be equipped with conductive elastic component, constitute two described testing impedance probes of described testing impedance probe pair
On described conductive elastic component under the effect of respective elastic force respectively with same described conductor structure be in close contact.This practicality
Novel testing impedance probe assembly, by described conductor structure, and arranges electrically conductive elastic at the screen layer of testing impedance probe
Element, described conductive elastic component can keep in the moment with conductor structure being in close contact under the effect of its own resilient, makes described
Good electric connection is realized by conductor structure between the screen layer of two testing impedance probes of testing impedance probe pair, permissible
It is prevented effectively from high-frequency signal distortion, it is ensured that the accuracy of impedance test results.
2. the testing impedance probe assembly that this utility model provides, described conductor structure in the form of sheets, is arranged at described impedance
Two described conductive elastic components of test probe pair contact with the same side of described conductor structure.So can make described resistance
Anti-test probe on two testing impedance probes do not affecting the conductive elastic component being arranged on respective screen layer with same
While the contact of described conductor structure, there is relative movement, it is simple to the spacing regulation between two testing impedance probes.
3. the testing impedance probe assembly that this utility model provides, described conductor structure surface gold-plating, gold plating thickness is 20
～40um.Gold-plated it is possible to prevent copper sheet oxidized, strengthens the electric conductivity of copper sheet.Gold plating thickness is 20～40um, has enough
Thickness, wearability can be increased.
4. the testing impedance probe assembly that this utility model provides, described probe inner wire stretches out the part of described screen layer
Forming needle point, described first end is fixed in described screen layer one end near described needle point, and described arch arc portion is by described first end
Towards axially away from described screen layer, near the extension of the direction of described needle point.So can make shape between probe inner wire and reed
The ground loop area become is less, and ground loop area is the least, and the interference noise of introducing is the least, and impedance test results is the most accurate
Really.
5. the testing impedance probe assembly that this utility model provides, the surface that described reed contacts with described conductor structure sets
There is Gold plated Layer.Gold plated Layer is difficult to oxidized, can strengthen the electric conductivity of reed, makes two impedances of testing impedance probe pair survey
Sound out, between the screen layer of pin, there is more preferable electric connection effect.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model detailed description of the invention or technical scheme of the prior art, below by right
In detailed description of the invention or description of the prior art, the required accompanying drawing used is briefly described, it should be apparent that, describe below
In accompanying drawing be embodiments more of the present utility model, for those of ordinary skill in the art, do not paying creativeness
On the premise of work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
The partial sectional view of the Fig. 1 testing impedance probe assembly for providing in the first embodiment of the present utility model,
Testing impedance probe therein is signal probe；
The partial sectional view of the Fig. 2 testing impedance probe assembly for providing in the first embodiment of the present utility model,
Testing impedance probe therein is grounded probe；
The sectional view of the Fig. 3 testing impedance probe assembly for providing in the first embodiment of the present utility model, wherein
Testing impedance probe to for single-ended probe pair；
The partial sectional view of the Fig. 4 testing impedance probe assembly for providing in another embodiment of the present utility model,
Testing impedance probe therein is signal probe；
The partial sectional view of the Fig. 5 testing impedance probe assembly for providing in another embodiment of the present utility model,
Testing impedance probe therein is grounded probe；
Description of reference numerals:
1-testing impedance probe, 11-probe inner wire, 111-needle point, 12-screen layer, 10-signal probe, 20-ground connection is visited
Pin, 2-conductor structure, 3-reed, 31-the first end, 32-the second end, 33 arch arc portions.
Detailed description of the invention
Below in conjunction with accompanying drawing, the technical solution of the utility model is clearly and completely described, it is clear that described
Embodiment is a part of embodiment of this utility model rather than whole embodiments.Based on the embodiment in this utility model, this
The every other embodiment that field those of ordinary skill is obtained under not making creative work premise, broadly falls into this practicality
Novel protected scope.
As long as additionally, technical characteristic involved in this utility model difference embodiment disclosed below is each other
The conflict of not constituting just can be combined with each other.
As shown in Figure 1-Figure 3, a kind of testing impedance probe assembly of the present embodiment, including:
The impedance that at least two is made up of with the screen layer 12 being coated on outside described probe inner wire 11 probe inner wire 11
Test probe 1, and for the conductor structure 2 of testing impedance probe 1 described in electrical connection two；Wherein testing impedance described in each two is visited
Pin 1 forms a testing impedance probe pair；
It is equipped with conductive elastic component on the described screen layer 12 of each described testing impedance probe 1, constitutes described impedance
Described conductive elastic component on two described testing impedance probes 1 of test probe pair difference under the effect of respective elastic force
It is in close contact with same described conductor structure 2.
The testing impedance probe assembly of the present embodiment, by described conductor structure 2, and the screen layer at testing impedance probe
12 arrange conductive elastic component, and described conductive elastic component can keep in the moment with conductor structure 2 under the effect of its own resilient
Be in close contact, make described testing impedance probe pair two testing impedance probes 1 screen layer 12 between real by conductor structure 2
The best electric connection, can be prevented effectively from high-frequency signal distortion, it is ensured that the accuracy of impedance test results.
As a kind of specific embodiment, described conductor structure in the form of sheets, is arranged at described testing impedance probe pair
Two described conductive elastic components contact with the same side of described conductor structure 2.So can make described testing impedance probe
On two testing impedance probes 1 do not affecting the conductive elastic component that is arranged on respective screen layer 12 and same described conductor
While structure 2 contact, there is relative movement, it is simple to the spacing regulation between two testing impedance probes 1.
Specifically, described conductor structure 2 is copper sheet.
As the embodiment of a kind of improvement, copper sheet surface gold-plating, gold plating thickness is 20～40um.In the present embodiment,
Gold plating thickness is 30um.Gold-plated it is possible to prevent copper sheet oxidized, strengthens the electric conductivity of copper sheet.Gold plating thickness is 20～40um,
There is enough thickness, wearability can be increased.
As a kind of specific embodiment, described conductive elastic component is reed 3, including first end the 31, second end 32,
And integrally connecting described first end 31 and the arch arc portion 33 of described second end 32, described first end 31 is fixed in described testing impedance
The described screen layer 12 of probe 1, described arch arc portion 33 contacts with described conductor structure 2, described second end 32 and described arch arc portion
33 have the trend towards the motion of described conductor structure 2 under the recovery elastic force effect of described reed 3.
The described reed 3 mounting means on described screen layer 12 can have multiple, as a kind of specific embodiment,
In the present embodiment, described probe inner wire 11 stretches out the part of described screen layer 12 and forms needle point 111, and described first end 31 is solid
Be connected to described screen layer 12 one end near described needle point 111, described arch arc portion 33 by described first end 31 towards axially away from institute
State screen layer 12, extend near the direction of described needle point 111.Described second end 32 is leaning on axially with respect to described first end 31
Nearly described needle point 111.The ground loop area formed between probe inner wire 11 and reed 3 so can be made less, ground loop
Road surface is long-pending the least, and the interference noise of introducing is the least, and impedance test results is the most accurate.
As the embodiment of a kind of deformation, as shown in Figure 4 and Figure 5, described first end 31 is fixed in described screen layer 12
Near one end of described needle point 111, described arch arc portion 33 by described first end (31) towards the direction axially away from described needle point 111
Extend, described second end 32 axially with respect to described first end 31 away from described needle point 111.
The concrete form of described reed can have multiple, such as, can be beryllium copper reed, it is also possible to blue or green for rustless steel and phosphorus
Copper reed, in the present embodiment, described reed 3 is beryllium copper reed.
As the embodiment of a kind of improvement, the surface that described reed 3 contacts with described conductor structure 2 is provided with Gold plated Layer.
Gold plated Layer is difficult to oxidized, can strengthen the electric conductivity of reed 3, makes two testing impedance probes 1 of testing impedance probe pair
Screen layer 12 between there is more preferable electric connection effect.In order to increase the wearability of described Gold plated Layer, the thickness of described Gold plated Layer
Degree is 20～40um, and in the present embodiment, the thickness of described Gold plated Layer is 30um.
As a kind of specific embodiment, the quantity of described testing impedance probe 1 is two, and one of them is visited for signal
Pin 10, another is grounded probe 20, constitutes single-ended probe pair.
Specifically, described probe inner wire 11 stretches out the part formation needle point 111 of described screen layer 12, described grounded probe
The described needle point 111 of 20 welds with described screen layer 12.
As the embodiment of a kind of deformation, the quantity of described testing impedance probe 1 is two, is signal probe 10,
Constitute differential probe pair.
As a kind of specific embodiment, the testing impedance probe assembly of the present embodiment, also include frame, described impedance
Test probe 1 and described conductor structure 2 are respectively arranged in described frame.
Specifically, the screen layer 12 of described testing impedance probe 1 is permissible with the concrete connected mode of described electrically conductive elastic unit
Having multiple, in the present embodiment, the described screen layer 12 of described testing impedance probe 1 welds with described conductive elastic component.
Further, described testing impedance probe 1 is rf probe.
Obviously, above-described embodiment is only for clearly demonstrating example, and not restriction to embodiment.Right
For those of ordinary skill in the field, can also make on the basis of the above description other multi-form change or
Variation.Here without also cannot all of embodiment be given exhaustive.And the obvious change thus extended out or
Change among the protection domain still in this utility model creation.
Claims (12)
1. a testing impedance probe assembly, it is characterised in that including:
At least two is by probe inner wire (11) and is coated on the resistance that described probe inner wire (11) screen layer (12) outward is constituted
Anti-test probe (1), and for the conductor structure (2) of testing impedance probe (1) described in electrical connection two；Wherein hinder described in each two
Anti-test probe (1) one testing impedance probe pair of composition；
It is equipped with conductive elastic component on the described screen layer (12) of each described testing impedance probe (1), constitutes described impedance
Described conductive elastic component on two described testing impedance probes (1) of test probe pair divides under the effect of respective elastic force
It is not in close contact with same described conductor structure (2).
Testing impedance probe assembly the most according to claim 1, it is characterised in that described conductor structure in the form of sheets, is arranged
Contact with the same side of described conductor structure (2) in two described conductive elastic components of described testing impedance probe pair.
3. the testing impedance probe assembly described in claim 2, it is characterised in that described conductor structure (2) is copper sheet.
4. the testing impedance probe assembly described in claim 3, it is characterised in that described conductor structure (2) surface gold-plating, gold-plated
Thickness is 20～40um.
5. the testing impedance probe assembly according to any one of claim 1-4, it is characterised in that described conductive elastic component is
Reed (3), including the first end (31), the second end (32), and integrally connects described first end (31) and described second end (32)
Arch arc portion (33), described first end (31) is fixed in the described screen layer (12) of described testing impedance probe (1), described arch arc portion
(33) contacting with described conductor structure (2), described second end (32) and described arch arc portion (33) are at the recovery bullet of described reed (3)
There is under power effect the trend moved towards described conductor structure (2).
Testing impedance probe assembly the most according to claim 5, it is characterised in that described probe inner wire (11) stretches out institute
The part stating screen layer (12) forms needle point (111), and described first end (31) is fixed in described screen layer (12) near described pin
One end of point (111), described arch arc portion (33) by described first end (31) towards axially away from described screen layer (12), near institute
The direction stating needle point (111) extends.
Testing impedance probe assembly the most according to claim 5, it is characterised in that described reed (3) is beryllium copper reed.
Testing impedance probe assembly the most according to claim 5, it is characterised in that described reed (3) is tied with described conductor
The surface that structure (2) contacts is provided with Gold plated Layer.
9. according to the testing impedance probe assembly according to any one of claim 1-4, it is characterised in that described testing impedance is visited
The quantity of pin (1) is two, and one of them is signal probe (10), and another is grounded probe (20), constitutes single-ended probe pair.
Testing impedance probe assembly the most according to claim 6, it is characterised in that the number of described testing impedance probe (1)
Amount is two, and one of them is signal probe (10), and another is grounded probe (20), constitutes single-ended probe pair, described ground connection
The described needle point (111) of probe (20) welds with described screen layer (12).
11. according to the testing impedance probe assembly according to any one of claim 1-4, it is characterised in that described testing impedance
The quantity of probe (1) is two, is signal probe (10), constitutes differential probe pair.
12. according to the testing impedance probe assembly according to any one of claim 1-4, it is characterised in that described testing impedance
The described screen layer (12) of probe (1) welds with described conductive elastic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620479498.9U CN205691623U (en) | 2016-05-24 | 2016-05-24 | Testing impedance probe assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620479498.9U CN205691623U (en) | 2016-05-24 | 2016-05-24 | Testing impedance probe assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205691623U true CN205691623U (en) | 2016-11-16 |
Family
ID=57262903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620479498.9U Withdrawn - After Issue CN205691623U (en) | 2016-05-24 | 2016-05-24 | Testing impedance probe assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205691623U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105823912A (en) * | 2016-05-24 | 2016-08-03 | 南京协辰电子科技有限公司 | Impedance test probe assembly |
| CN116754814A (en) * | 2023-08-11 | 2023-09-15 | 杭州朗迅科技股份有限公司 | High-density probe card, preparation method and test method |
-
2016
- 2016-05-24 CN CN201620479498.9U patent/CN205691623U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105823912A (en) * | 2016-05-24 | 2016-08-03 | 南京协辰电子科技有限公司 | Impedance test probe assembly |
| CN116754814A (en) * | 2023-08-11 | 2023-09-15 | 杭州朗迅科技股份有限公司 | High-density probe card, preparation method and test method |
| CN116754814B (en) * | 2023-08-11 | 2023-10-24 | 杭州朗迅科技股份有限公司 | High-density probe card, preparation method and test method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11088494B2 (en) | High speed communication jack | |
| US9385477B2 (en) | High speed edge card connector | |
| JP2010176944A (en) | Connector device | |
| JP2007524207A5 (en) | ||
| CN103091520A (en) | Probe block, probe card and probe apparatus both having the probe block | |
| CN205691623U (en) | Testing impedance probe assembly | |
| US10483702B2 (en) | High speed communication jack | |
| TWI691129B (en) | Plug device | |
| JP5352734B2 (en) | Test probe for high frequency measurement | |
| CN105513616A (en) | A suspension board with a circuit | |
| CN102759644B (en) | Cantilever type high-frequency probe card | |
| CN205029112U (en) | Electric connector | |
| US20140338465A1 (en) | Flow meter with ultrasound transducer directly connected to and fixed to measurement circuit board | |
| CN105823912B (en) | Testing impedance probe assembly | |
| CN201450139U (en) | Plug connecting device and baseplate | |
| US20180175569A1 (en) | High speed communication jack | |
| TWI743118B (en) | High speed communication jack | |
| CN110098540A (en) | Connector modules and the connector for being used for transmission HF signal | |
| US9899776B2 (en) | High speed communication jack | |
| JP7028517B2 (en) | High-speed communication jack | |
| JP5658783B2 (en) | Connector device | |
| CN205960215U (en) | Electric connector | |
| CN105098418B (en) | Electrical connection arrangement | |
| US9627816B2 (en) | High speed grounded communication jack | |
| WO2022007186A1 (en) | Multi-pole connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20161116 Effective date of abandoning: 20181002 |
|
| AV01 | Patent right actively abandoned |