CN205688048U - A kind of electroplating device improving electroplating evenness - Google Patents
A kind of electroplating device improving electroplating evenness Download PDFInfo
- Publication number
- CN205688048U CN205688048U CN201620543833.7U CN201620543833U CN205688048U CN 205688048 U CN205688048 U CN 205688048U CN 201620543833 U CN201620543833 U CN 201620543833U CN 205688048 U CN205688048 U CN 205688048U
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- CN
- China
- Prior art keywords
- electroplating
- edge strip
- plating
- evenness
- hook
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- Expired - Fee Related
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- Electroplating Methods And Accessories (AREA)
Abstract
This utility model belongs to electroplating technology field, relate to a kind of electroplating device improving electroplating evenness, including electroplating bath, galvanic anode, electroplating cathode, accompany plating edge strip, galvanic anode and electroplating cathode are installed in electroplating bath, set up on galvanic anode and accompany plating edge strip, described accompany plating edge strip include main edge strip and secondary bar, the upper end of described main edge strip is provided with hook, first fixed knob is installed on hook, the upper end of described secondary bar is provided with slip cap, slip cap is enclosed within main edge strip and can move along main edge strip, and described slip cap is equipped with the second fixed knob.This utility model uses electric current density when accompanying plating edge strip scalable plating, improves electroplating evenness.
Description
Technical field
This utility model relates to a kind of electroplating device improving electroplating evenness, belongs to technical field of plating equipment.
Background technology
Plating utilizes electrolysis principle to plate the process of other metal or alloy of a thin layer on some metal surface exactly, is
Utilize electrolysis to make the technique of surface attachment layer of metal film of metal or other material thus play and prevent metal oxygen
Change (such as corrosion), improve the effects such as wearability, electric conductivity, reflective, corrosion resistance (copper sulfate etc.) and having improved aesthetic appearance.Much
The outer layer of coin is also for plating.
Coating is single metal or alloy mostly, such as titanium palladium, zinc, cadmium, gold or pyrite, bronze etc.；Also there is diffusion layer, as
Nickel-carborundum, nickel-fluorographite etc.；Also has laminating layer, such as the copper-nickel-layers of chrome on steel, the silver-indium on steel
Layer etc..Plating matrix material in addition to cast iron, steel and the rustless steel of iron-based, also nonferrous metal, or ABS plastics, poly-third
Alkene, polysulfones and bakelite, but before plastic electroplating, it is necessary to through special activation and sensitized treatment.
SMD LED base plate for packaging process for treating surface requires the highest, and concrete surface to meet in product encapsulation beats gold thread
The pulling force of (Wire Bonding) and thrust requirements.The best surface treatment mode meeting dozen gold thread is exactly electric thick gold
(Au >=0.2um) or thick silver (Ag >=2.5um).The good surface treatment mode done of going together both at home and abroad at present is two-sided mostly
Electric thick gold or the thick silver of electricity, or nickel plating.
In electroplating process, in electroplating bath, the electric current density in each region can be because minus plate is different with the distance of positive plate or places
Processing workpiece how much the most different with position and change, electric current density difference can cause electroplating uneven.
The electroplating evenness of existing electroplating device is poor, and the result of its electroplating evenness shows, the thick overproof region of copper is main
Being distributed in and fly bar two ends, this is the main cause causing overall uniformity on the low side；If electroplating evenness is poor, it will affect circuit
The quality problem such as etching, finished product aperture, folder film, also can increase copper facing, stannum cost.
Utility model content
In order to improve electroplating evenness, this utility model provides a kind of electroplating device improving electroplating evenness, will accompany
Plating edge strip is suspended on galvanic anode, thus regulates the distance of galvanic anode and the workpiece to be plated of negative electrode, improves electroplating evenness.
This utility model is achieved through the following technical solutions above-mentioned purpose.
A kind of electroplating device improving electroplating evenness, including electroplating bath, galvanic anode, electroplating cathode, accompanies plating edge strip, electricity
Galvanic anode and electroplating cathode are installed in coating bath, galvanic anode set up and accompanies plating edge strip, described in accompany plating edge strip include main edge strip and
Secondary bar, the upper end of described main edge strip is provided with hook, and hook is provided with the first fixed knob, and the upper end of described secondary bar sets
Having slip cap, slip cap to be enclosed within main edge strip and can move along main edge strip, described slip cap is equipped with the second fixed knob.
More preferably improvement project is, described hook is provided with rebate, and rebate is installed the first fixed knob, described roundabout
Portion is also connected with shell fragment, and shell fragment bends inside rebate, and the end of thread of the first fixed knob is against on shell fragment.
Further preferably, connected by one section of kink between main edge strip and hook.
Further preferably, the bottom of described secondary bar is provided with welding gasket.
Technique effect of the present utility model: set up at galvanic anode and accompany plating edge strip, uses and accompanies plating edge strip can regulate plating
Time electric current density, improve electroplating evenness.Weaken the electric current distribution at anode two ends, reduce the copper flying bar two ends
Thick difference, improves electroplating evenness, advantageously ensures that the quality problem such as circuit etching, finished product aperture, folder film, also can reduce
Copper facing, stannum cost.And of the present utility model accompany plating edge strip employ elastic piece structure, it is easy for installation with galvanic anode, contact
Well, regulation secondary bar changes the length accompanying plating edge strip with the relative position of main edge strip.
Accompanying drawing explanation
Fig. 1 is electroplating device schematic diagram of the present utility model.
Fig. 2 is the front view accompanying plating edge strip.
Fig. 3 is the side view accompanying plating edge strip.
In figure: 100. electroplating baths, 200. electroplating cathodes, 300. galvanic anodes, 400. accompany plating edge strip, the most main edge strip, 2. sliding
The fixing rotation of dynamic set, 3. hook, 4. welding gasket, 5. secondary bar, 6. rebate, 7. shell fragment, 8. the first fixed knob, 9. second
Button, 10. kink.
Detailed description of the invention
In order to make it easy to understand, below in conjunction with the accompanying drawings this utility model is elaborated.
As it is shown in figure 1, described electroplating device includes electroplating bath 100, galvanic anode 300, electroplating cathode 200, accompanies plating edge strip
400, galvanic anode 300 and electroplating cathode 200 are installed in electroplating bath 100, galvanic anode 300 set up and accompanies plating edge strip 400.More special
Other, accompany plating edge strip 400 to be erected at the two ends of galvanic anode 300.
As shown in Figures 2 and 3, plating edge strip is accompanied to include that main edge strip 1 and secondary bar 5, the upper end of described main edge strip 1 set described in
Having hook 3, hook 3 is provided with the first fixed knob 8, the upper end of described secondary bar 5 is provided with slip cap 2, and slip cap 2 is enclosed within master
On edge strip 1 and can move along main edge strip 1, described slip cap 2 is equipped with the second fixed knob 9, regulation secondary bar 5 and main edge strip 1
Position relatively changes the length accompanying plating edge strip, accompanies the length of plating edge strip to determine according to the position of electroplating parts, regulates pair
Behind the position of edge strip 5, fix the second fixed knob 9, then accompanying plating edge strip to hang on galvanic anode, tighten the first fixed knob
8 fixing accompany plating edge strip.
As in figure 2 it is shown, described hook 3 is provided with rebate 6, rebate 6 is installed the first fixed knob 8, described rebate
Being also connected with shell fragment 7, shell fragment 7 bends inside rebate 6, and the end of thread of the first fixed knob 8 is against on shell fragment 7, accompanies plating edge strip
When hanging on galvanic anode, shell fragment 7 is in close contact with galvanic anode, so accompanies plating edge strip contact effect more preferable, and electric conductivity is more steady
Fixed.
More preferably embodiment, is connected by one section of kink 10 between main edge strip 1 and hook 3, so makes to accompany plating limit
When bar hangs on galvanic anode, main edge strip 1 can align galvanic anode, advantageously ensures that electroplating effect.
Further, the bottom of described secondary bar 5 is provided with welding gasket 4, in order to extending accompanies the length of plating edge strip,
Or the convenient miscellaneous part with electroplating bath is fixed and is connected.
More particularly, described slip cap 2 is a loop members.
Do not use before accompanying plating edge strip, copper thickness 30um, edges of boards 1 ~ 2cm copper thickness 45um in the plate of copper facing plate, increase this practicality new
Type with accompany plating edge strip after, copper thickness 30um in the plate of LED-baseplate, edges of boards about 30um, the plating reaching to improve copper facing plate is equal
Even property.
Of the present utility model accompany plating edge strip can stretch, various sizes of copper facing plate can be used to accompany plating.
The above is only preferred implementation of the present utility model, it should be pointed out that: for the common skill of the art
For art personnel, on the premise of without departing from this utility model principle, it is also possible to make some improvements and modifications, these improve
Also protection domain of the present utility model is should be regarded as with retouching.
Claims (4)
1. the electroplating device improving electroplating evenness, it is characterised in that: include electroplating bath, galvanic anode, electroplating cathode, accompany
Plating edge strip, installs galvanic anode and electroplating cathode in electroplating bath, galvanic anode sets up and accompanies plating edge strip, described in accompany plating edge strip to include
Main edge strip and secondary bar, the upper end of described main edge strip is provided with hook, and hook is provided with the first fixed knob, described secondary bar
Upper end be provided with slip cap, slip cap is enclosed within main edge strip and can move along main edge strip, and described slip cap is equipped with the second fixing rotation
Button.
The electroplating device of raising electroplating evenness the most according to claim 1, it is characterised in that: described hook is provided with roundabout
Portion, rebate is installed the first fixed knob, and described rebate is also connected with shell fragment, and shell fragment bends inside rebate, and first is solid
The end of thread determining knob is against on shell fragment.
The electroplating device of raising electroplating evenness the most according to claim 1, it is characterised in that: between main edge strip and hook
Connected by one section of kink.
The electroplating device of raising electroplating evenness the most according to claim 1, it is characterised in that: the bottom of described secondary bar
It is provided with welding gasket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620543833.7U CN205688048U (en) | 2016-06-07 | 2016-06-07 | A kind of electroplating device improving electroplating evenness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620543833.7U CN205688048U (en) | 2016-06-07 | 2016-06-07 | A kind of electroplating device improving electroplating evenness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205688048U true CN205688048U (en) | 2016-11-16 |
Family
ID=57260010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620543833.7U Expired - Fee Related CN205688048U (en) | 2016-06-07 | 2016-06-07 | A kind of electroplating device improving electroplating evenness |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205688048U (en) |
-
2016
- 2016-06-07 CN CN201620543833.7U patent/CN205688048U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161116 Termination date: 20170607 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |