CN205640323U

CN205640323U - Led lamp

Info

Publication number: CN205640323U
Application number: CN201620488788.XU
Authority: CN
Inventors: 曾茂进; 鲍永均; 曹亮亮; 黄温昌
Original assignee: Zhangzhou Lidaxin Optoelectronic Technology Co ltd
Current assignee: Zhangzhou Lidaxin Optoelectronic Technology Co ltd
Priority date: 2016-05-26
Filing date: 2016-05-26
Publication date: 2016-10-12
Anticipated expiration: 2026-05-26

Abstract

The utility model provides a LED lamp, includes lamp shade, base plate, many LED chips and the heat -insulating material that looses, the LED chip be fixed in on this base plate and with this base plate hot link, the bottom of this base plate be fixed in that this heat -insulating material that looses goes up and with this scattered heat -insulating material hot link, this base plate is accomodate in this lamp shade, the bottom of this lamp shade is fixed in on should scattered heat -insulating material, this base plate is platelike structure, this base plate is made by the heat conduction material, the LED chip sets up the side at this base plate, the lateral wall or the top of this lamp shade of light orientation that the LED chip sent are shone. This LED lamp has simple, the good advantage of dispelling the heat of packaging technology.

Description

LED

Technical field

This utility model relates to technical field of LED illumination, particularly to a kind of LED.

Background technology

In recent years, due to quickly growing of LED industry, LED lamp progressively replaces traditional lighting.Owing to LED sends out Light has the characteristic such as point source and directivity, therefore LED lamp is difficult to replace conventional incandescent completely, accomplishes that full luminous intensity distribution illuminates.Existing There is a kind of LED filament, be that one group of LED chip encapsulation is formed LED filament on the transparent substrate, it is possible to achieve wide-angle is luminous, Then multiple filaments are connected the illumination effect forming similar tengsten lamp.At present, LED filament does not has radiator, LED filament substantially Cannot be carried out heat conducting and radiating, conducting so being difficult to the heat by LED chip produces, heat can only be by radiation and internal gas The convection current of body carries out heat conduction and heat radiation, easily causes the accumulation of heat so that the lost of life of LED filament.

Existing LED filament lamp generally uses and fills heat-conducting gas and glass envelope bubble technique manufacture, this technique skill to envelope bubble Art requires height, apparatus expensive, is easily caused envelope bubble and is not tamping, gas leakage, and blast, the problem such as glass envelope is frangible, life-time service can go out Existing leakage problem, and the heat dispersion of gas is limited, can only meet the exploitation of low-power LED filament lamp, and once do high-power, The heat of the generation of LED filament cannot shed in time, easily causes cause thermal damage and the light decay of LED chip so that the light of whole lamp leads to Sustainment rate is low, and the life-span is short.

Utility model content

In view of this, it is necessary to a kind of simple for assembly process, good LED of dispelling the heat is provided.

A kind of LED, including lampshade, substrate, plurality of LEDs chip and radiating piece, described LED chip is fixed on this substrate Upper and be connected with this substrate heat, the bottom of this substrate be fixed on this radiating piece and with this radiating piece thermally coupled, this substrate receive Being contained in this lampshade, the bottom of this lampshade is fixed on this radiating piece, and this substrate is platy structure, and this substrate is by Heat Conduction Material system Becoming, described LED chip is arranged on the side of this substrate, and the light that described LED chip sends is towards the sidewall of this lampshade or top Irradiate.

Compared with prior art, these LED chip are arranged on this substrate of platy structure by this utility model, so, The heat that these LED chip produce can be delivered to rapidly on this substrate of platy structure, then by this substrate and this radiating piece Contact be delivered to distribute on this radiating piece, therefore, these LED chip produce heat can distribute in time, make Obtain this LED and there is good radiating effect, and without additionally filling heat-conducting gas and glass envelope bubble technique, it is to avoid exclusively for filling The complicated technology that heat-conducting gas and glass envelope are steeped and designed, has simple for assembly process, good advantage of dispelling the heat.

Accompanying drawing explanation

Fig. 1 is the axonometric chart of this utility model LED first embodiment.

Fig. 2 is the profile of LED shown in Fig. 1.

Fig. 3 is the cross section of LED shown in Fig. 1.

Fig. 4 is the axonometric chart of this utility model LED the second embodiment.

Fig. 5 is the profile of LED shown in Fig. 4.

Description of reference numerals:

10,10a lampshade 11 top cover

12 rotary body 112 contact sites

20 substrate 30 radiating pieces

31 fix post 311 slot

41 kinks

Detailed description of the invention

With detailed description of the invention, this utility model is described in further detail below in conjunction with the accompanying drawings.

Embodiment one:

Refer to Fig. 1 to Fig. 3, this utility model first embodiment, this LED, including lampshade 10, substrate 20, plurality of LEDs Chip (not shown) and radiating piece 30, be fixed on this substrate 20 upper of described LED chip and with this substrate 20 thermally coupled, this base The bottom of plate 20 be fixed on this radiating piece 30 and with this radiating piece 30 thermally coupled, this substrate 20 is accommodated in this lampshade 10, should The bottom of lampshade 10 is fixed on this radiating piece 30.

In the present embodiment, this substrate 20 is platy structure, and this substrate 20 is made from a material that be thermally conductive, and these LED chip are arranged In the side of this substrate 20, the light that these LED chip send irradiates towards sidewall or the top of this lampshade 10.This substrate 20 is Plate-like structure, this substrate 20 is made up of transparent or semitransparent glass, pottery or sapphire.These LED chip are at this substrate Spaced on 20 being arranged into strip structure, these LED chip are arranged at a side or former and later two sides of this substrate 20 Upper (as shown in Figure 2), outside these LED chip, it is coated with the fluorescent adhesive layer of an one.In the present embodiment, these LED chip set Being placed on the two sides of this substrate 20, these LED chip are arranged on this substrate 20 and are formed U-bend folded structure, including kink 41 (as shown in Figure 1), wherein this kink 41 to should lampshade 10 top arrange so that the LED chip of this kink 41 sends Light towards this lampshade 10 top irradiate, so top and sidewall of this lampshade 10 all can be illuminated.Wherein, this substrate 20 Be positioned at this lampshade 10 part side near or abut this lampshade 10 medial wall arrange.In the present embodiment, this substrate 20 The side of the part being positioned at this lampshade 10 abuts the medial wall of this lampshade 10 and arranges, and the side at the middle part of this substrate 20 is by leading Hot glue is bonded on the medial wall of this lampshade 10 medial wall with this lampshade 10 and forms thermally coupled, so these LED chip generation Heat can be delivered on this lampshade 10 by this substrate 20, improve the whole lamp radiating effect of this LED.It addition, these LED core Sheet on the base plate 20 near the part of this radiating piece 30 be distributed closeer, quantity is the most more relative to other positions, so that these LED core The heat that sheet produces is delivered on this radiating piece 30 quickly.

Wherein, this radiating piece 30 is provided with fixing post 31, and this fixing post 31 is provided with slot 311, the bottom of this substrate 20 Being inserted in this slot 311, in order to be fixed on this radiating piece 30, the heat that these LED chip produce simultaneously can be by this base Plate 20 is delivered on this radiating piece 30 to distribute.

Embodiment two:

Refer to Fig. 4 to Fig. 5, this utility model the second embodiment, this substrate 20 is positioned at the side of the part of this lampshade 10a While arrange near the medial wall of this lampshade 10a.The side at the top of this substrate 20 is bonded in the interior of this lampshade 10a by heat-conducting glue On sidewall, the medial wall with this lampshade 10a forms thermally coupled.In the present embodiment, this lampshade 10 has top cover 11 and rotary body 12, This top cover 11 can fasten on this rotary body 12, and the inwall projection of this top cover 11 is provided with contact site 112, and the top of this substrate 20 leads to Cross heat-conducting glue and be bonded on this contact site 112 inwall the formation thermally coupled, so these LED core of the top cover 11 with this lampshade 10a The heat that sheet produces can be delivered on this lampshade 10a by this substrate 20.These LED chip are arranged on this substrate 20 and are formed folding Angle linear.

It will be understood that, the middle part of this substrate 20 and the side at top also can abut shape with the medial wall of this lampshade 20 simultaneously Become thermally coupled.

In sum, these LED chip are arranged on this substrate 20 of platy structure by this utility model, so, and these The heat that LED chip produces can be delivered to rapidly on this substrate 20 of platy structure, then by this substrate 20 and this radiating piece The contact of 30 is delivered on this radiating piece 30 to distribute, and therefore, the heat that these LED chip produce can give out in time Go so that this LED has a good radiating effect, and without additionally filling heat-conducting gas and glass envelope bubble technique, it is to avoid special The complicated technology that door designs for filling heat-conducting gas and glass envelope bubble, has simple for assembly process, good advantage of dispelling the heat.With Time, these LED chip are arranged on the side of this substrate of platy structure, and so, the light that these LED chip send can be simultaneously It is irradiated to this lampshade 10, the sidewall of 10a and top, luminous to realize whole lamp, relative to needs, the connection of multiple filaments is formed class The simplest like the structure of tengsten lamp.

The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, Ren Heben Field personnel, without departing from this programme technical scope, utilize the technology contents of above-mentioned exposure to make changing for equal of few modifications Equivalent embodiments.In every case depart from technical solutions of the utility model content, implement above according to this utility model technical spirit Any modification, equivalent substitution and improvement etc. that example is done, should be included within the scope of this utility model protection.

Claims

1. a LED, including lampshade, substrate, plurality of LEDs chip and radiating piece, described LED chip is fixed on this substrate also Be connected with this substrate heat, the bottom of this substrate be fixed on this radiating piece and with this radiating piece thermally coupled, this substrate reception is at this In lampshade, the bottom of this lampshade is fixed on this radiating piece, it is characterised in that: this substrate is platy structure, and this substrate is by heat conduction Material is made, and described LED chip is arranged on the side of this substrate, and the light that described LED chip sends is towards the sidewall of this lampshade Or top irradiation.

LED the most according to claim 1, it is characterised in that: the side of the part that this substrate is positioned at this lampshade is close Or the medial wall abutting this lampshade is arranged.

LED the most according to claim 2, it is characterised in that: the middle part of this substrate or the side at top pass through heat-conducting glue It is bonded on the medial wall of this lampshade the medial wall with this lampshade and forms thermally coupled.

LED the most according to claim 1, it is characterised in that: this lampshade has top cover and rotary body, and this top cover can fasten On this rotary body, the inwall projection of this top cover is provided with contact site, and the top of this substrate is bonded in described contact by heat-conducting glue In portion, the inwall with the top cover of this lampshade forms thermally coupled.

LED the most according to claim 1, it is characterised in that: this radiating piece is provided with fixing post, and described fixing post sets Having slot, the bottom of this substrate is inserted in described slot.

LED the most according to claim 1, it is characterised in that: this substrate is plate-like structure, and this substrate is by transparent or half Transparent glass, pottery or sapphire are made.

LED the most according to claim 6, it is characterised in that: including multiple LED chip, described LED chip is at this substrate On be arranged into strip structure, described LED chip is arranged on the one or both sides of this substrate, is coated with outside described LED chip Fluorescent adhesive layer.

LED the most according to claim 6, it is characterised in that: described LED chip is arranged formation U-bend on the substrate Folded structure, including kink, wherein this kink is to should the top of lampshade arrange so that the LED chip of this kink sends Light towards this lampshade top irradiate.

LED the most according to claim 6, it is characterised in that: described LED chip is arranged formation chine on the substrate Bar structure.

LED the most according to claim 1, it is characterised in that: described LED chip is this radiating piece close on substrate Part distribution is closeer, so that the heat that this LED chip produces is delivered on this radiating piece quickly.