CN205629124U - Mould of bending under backplate - Google Patents
Mould of bending under backplate Download PDFInfo
- Publication number
- CN205629124U CN205629124U CN201620393604.1U CN201620393604U CN205629124U CN 205629124 U CN205629124 U CN 205629124U CN 201620393604 U CN201620393604 U CN 201620393604U CN 205629124 U CN205629124 U CN 205629124U
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- CN
- China
- Prior art keywords
- bending mould
- mould under
- backboard
- cope match
- membrane module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Bending Of Plates, Rods, And Pipes (AREA)
Abstract
The utility model discloses a mould of bending under backplate relates to backplate mould technical field. This mould of bending under backplate includes membrane module and lower membrane module, it includes upper die base, mobilizable welt and cope match -plate pattern gone up to go up the membrane module, the membrane module includes lower bolster and die holder down, be provided with on the cope match -plate pattern into the son, when acting as the membrane module with lower membrane module closure, it is used for realizing the fashioned difference in height of bending to go up the welt and go into to form between the son under the product, go up the membrane module and set up the elastically positioned device down between the membrane module. The utility model discloses it is effective that to solve the machining precision that current mould of bending under backplate caused low, the problem of production poor stability, and convenient operation, the machining precision is high, the maintenance of being convenient for, the processing cost is low.
Description
Technical field
This utility model relates to backboard technical field of mold, particularly relates to Bending Mould under a kind of backboard.
Background technology
Electrochemistry is in the course of processing of backboard workpiece, it is sometimes desirable to carry out lower bending process, it is especially desirable to enter
Under row right angle, bending processes.Process the pressing equipment of the backboard workpiece of bending under this right angle at present the most logical
Cross a kind of upper and lower mould slide block device it is processed, by be separately positioned on upper die and lower die with
Match the slide block of vertical plane and jacking block, reaches punch forming the purpose of the demoulding smoothly, but this structure
The shortcoming of form is: slide block and jacking block lay respectively on upper and lower mould, so in the two moment contacted, and impact
Power is relatively big, may have influence on machining accuracy, and its production stability is poor, the number of times of the mould that needs to place under repair
More, when produced in large volumes, often it is delayed production process because of repairing a die.
Utility model content
The purpose of this utility model is to propose Bending Mould under a kind of backboard, solves bender under existing backboard
The machining accuracy that tool causes is low, the problem of production stability difference.
For reaching this purpose, this utility model by the following technical solutions:
Bending Mould under a kind of backboard, including upper die component and lower mold assemblies, described upper die component includes upper mold
Seat, mobilizable upper liner plate and cope match-plate pattern, described lower mold assemblies includes lower bolster and die shoe, described upper mold
Being provided with into son on plate, when upper die component closes with lower mold assemblies, described upper liner plate and entering is formed between son
For realizing the difference in height of bending and molding under product, it is elastic fixed to arrange between described upper die component and lower mold assemblies
Position device.
As the preferred version of Bending Mould under a kind of backboard, described in enter the side setting that son is relative with lower bolster
Fluted.
As the preferred version of Bending Mould under a kind of backboard, described groove is vertical near the sidewall of upper liner plate
Face.
As the preferred version of Bending Mould under a kind of backboard, described in enter the bottom, side that sub and upper liner plate is relative
It is provided with circular arc chamfering.
As the preferred version of Bending Mould under a kind of backboard, described elastic positioning device includes alignment pin and right
The hole, location answered, hole, location is arranged on the bottom of cope match-plate pattern, and alignment pin passes lower bolster, the bottom of alignment pin
Being provided with the first support spring, first supports the bottom surface conflict die shoe of spring, and the bottom of alignment pin is up squeezed
Pressure template.
As the preferred version of Bending Mould under a kind of backboard, described location is provided with buffer spring bottom hole.
As the preferred version of Bending Mould under a kind of backboard, described lower bolster is provided with location punching, location
The bottom of punching is provided with the second support spring.
As the preferred version of Bending Mould under a kind of backboard, between described cope match-plate pattern and upper bolster and lower mold
Stage clip it is provided with between plate and die shoe.
As the preferred version of Bending Mould under a kind of backboard, it is provided with between described upper die component and lower mold assemblies
Guiding mechanism.
As the preferred version of Bending Mould under a kind of backboard, described guiding mechanism includes being arranged on cope match-plate pattern
Guide pillar and the gathering sill that is arranged on lower bolster, described guide pillar is provided with damping spring, described gathering sill
Match with guide pillar.
The beneficial effects of the utility model are:
The utility model proposes Bending Mould under a kind of backboard, under this backboard, the upper membrane module of Bending Mould is arranged
Have mobilizable upper liner plate and be arranged on cope match-plate pattern enter son, when upper die component and lower mold assemblies close,
By upper liner plate and enter between son formation difference in height, it is achieved the lower bending and molding of product.This utility model is effective
Solve the machining accuracy that under existing backboard, Bending Mould causes low, the problem of production stability difference, operation side
Just, machining accuracy is high, it is simple to maintenance, processing cost is low.
Accompanying drawing explanation
Fig. 1 is structural representation during Bending Mould die opening state under the backboard that this utility model embodiment provides
Figure；
Fig. 2 is the partial enlarged drawing in Fig. 1 at A；
Fig. 3 is structural representation during Bending Mould closure state under the backboard that this utility model embodiment provides
Figure；
Fig. 4 is the partial enlarged drawing in Fig. 3 at B.
In figure:
1, mounting plate；2, upper bolster；3, upper padding plate；4, cope match-plate pattern；5, lower bolster；6, lower bolster；
7, die shoe；8, bottom plate；9, son is entered；10, groove；11, upper liner plate；12, location punching；13、
Alignment pin；14, first spring is supported；15, stage clip；16, second spring is supported；17, backboard；91、
Circular arc chamfering.
Detailed description of the invention
For making this utility model solve the technical problem that, the technical scheme that uses and the technique effect that reaches more
Clear, below in conjunction with accompanying drawing, the technical scheme of this utility model embodiment is described in further detail,
Obviously, described embodiment is only a part of embodiment of this utility model rather than whole realities
Execute mode.Based on the embodiment in this utility model, those skilled in the art are not making creative labor
The every other embodiment obtained under dynamic premise, broadly falls into the scope of this utility model protection.
In description of the present utility model, it is to be understood that term " " center ", " longitudinally ", " laterally ",
"front", "rear", "left", "right", " vertically ", " level ", " top ", " end ", " interior ", " outward " etc. refer to
The orientation shown or position relationship, for based on orientation shown in the drawings or position relationship, are for only for ease of description originally
Utility model and simplification describe rather than indicate or imply that the device of indication or element must have specific side
Position, with specific azimuth configuration and operation, therefore it is not intended that restriction to this utility model protection domain.
Present embodiment proposes Bending Mould under a kind of novel backboard, as shown in Figures 1 to 4, under this backboard
Bending Mould includes upper die component and lower mold assemblies, and wherein, upper die component includes the most detachable
Mounting plate 1, upper bolster 2, upper padding plate 3, mobilizable upper liner plate 11 and the cope match-plate pattern 4 connected.Lower module
Lower bolster 5 that part includes removably connecting the most successively, lower bolster 6, die shoe 7, lower carriage and
Bottom plate 8.Wherein, the setting of mounting plate 1 and bottom plate 8 can easy disassembly, more mold exchange.Upper padding plate
3 and the setting of lower bolster 6 is prevented from that impulsive force is excessive and then damage upper bolster 2 and die shoe 7, play one
Fixed cushioning effect.
In the present embodiment, cope match-plate pattern 4 being provided with into son 9, this enters son 9 and is close to liner plate 11 and arranges,
And the bottom surface of bottom surface and cope match-plate pattern 4 flushes.When upper die component closes with lower mold assemblies, enter son 9 with upper
The height difference H (seeing Fig. 4) for realizing bending and molding under product, so, panel beating is formed between liner plate 11
Part backboard 17 completes lower bending and molding in bonding processes, and stability and the reliability of time bending have been effectively ensured,
Decrease the bending resistance in Forging Process, reduce backboard 17 product and produce because of the abrasion in Forging Process
Raw disqualification rate, easy to operate, machining accuracy is high, it is simple to maintenance, processing cost is low.
As shown in Figure 2 and Figure 4, enter son 9 sides relative with lower bolster 5 and be provided with groove 10, groove 10
Setting the end of backboard can be facilitated when punching press to be pre-formed bending structure.Further, groove 10 leans on
The sidewall of nearly upper liner plate 11 is vertical plane so that the end of backboard is pre-formed back shaped with level when punching press
Upper bending structure at a right angle, in case bending and molding lays the foundation under right angle afterwards.
As shown in Figure 2 and Figure 4, enter the son 9 side bottoms relative with upper liner plate 11 and be provided with circular arc chamfering 91,
Not only facilitate the process operation of bending under backboard, and be prevented effectively from the sharp comer scratching backboard 17 into son 9,
Machining accuracy is high, and product quality is high.
Further, lower bolster 4 being provided with location punching 12, the bottom of location punching 12 is provided with the second support
Spring 16, it is possible to be accurately positioned processed product.
In the present embodiment, elastic positioning device it is provided with between upper die component and lower mold assemblies.Elastic fixed
Position device includes that alignment pin 13 and corresponding hole, location (not shown), hole, location are arranged on cope match-plate pattern 4
Bottom, alignment pin 13 is through lower bolster 5, and the bottom of alignment pin 13 is provided with the first support spring 14,
The first bottom surface conflict die shoe 7 supporting spring 14, the bottom of alignment pin 13 up extrudes lower bolster 5.Fixed
Position is provided with buffer spring bottom hole.Under buffer spring nature extended configuration, outside its bottom to hole, location
A length of alignment pin 13 between end face stretches out 2nd/1st to three/2nd of face length, makes alignment pin
13 can shrink generation elastic force when inserting hole, location.Stage clip 15 it is provided with between cope match-plate pattern 4 and upper bolster 2,
Being provided with stage clip 15 between lower bolster 5 and die shoe 7, the stage clip 15 at two can increase delaying in work process
Punching effect, improves punching press stability.
In use, upper die component moves downward, and alignment pin 13 inserts hole, location, and upper die component continues
Moving downward, the upper surface of alignment pin 13 contacts with buffer spring bottom, and buffer spring and first supports bullet
Spring 14, second supports spring 16 and all shrinks generation elastic force, and the common motion for cope match-plate pattern 4 brings buffering.The
One support spring 14 and second support spring 16 shrink the power making alignment pin 13 bottom squeeze lower bolster 5 by
The least, the support force of lower bolster 5 is gradually reduced by the i.e. first support spring 14 and the second support spring 16,
The stage clip 15 of lower bolster 5 and the first support spring 14, second support spring 16 and jointly support lower bolster 5,
When lower bolster 5 support force is gradually reduced by the first support spring 14 and the second support spring 16, lower bolster 5
Stage clip 15 pressure become larger and shrink generation elastic force, bring when contacting lower bolster 5 for cope match-plate pattern 4
Buffering.It is the fastest that upper die component moves downward speed, and the buffering that cope match-plate pattern 4 brings given by the stage clip 15 of lower bolster 5
Act on the most notable.Before cope match-plate pattern 4 contacts lower bolster 5, coordinate for buffer spring, the first support spring 14
Produce double cushioning effect.When cope match-plate pattern 4 contacts lower bolster 5, buffer spring, first support spring 14,
Second support spring 16, the cooperation of stage clip 15 produce cushioning effect jointly.First supports spring 14 and second
Support spring 16 and lower bolster 5 support force is had a progressive formation, improve punching press stability and yield rate, reduce
Die wear, increases the service life.
Guiding mechanism it is provided with between upper die component and lower mold assemblies.Guiding mechanism includes being arranged on cope match-plate pattern 4
Guide pillar and the gathering sill that is arranged on lower bolster 5, guide pillar is provided with damping spring, gathering sill and guide pillar
Match.By the setting of guiding mechanism, it is possible in the course of processing, mould is accurately positioned, improve
Machining accuracy.
Know-why of the present utility model is described above in association with detailed description of the invention.These descriptions are intended merely to
Explain principle of the present utility model, and the limit to this utility model protection domain can not be construed to by any way
System.Based on explanation herein, those skilled in the art need not pay creative work can associate this reality
By other novel detailed description of the invention, within these modes fall within protection domain of the present utility model.
Claims (10)
1. a Bending Mould under backboard, including upper die component and lower mold assemblies, described upper die component includes
Die holder (2), mobilizable upper liner plate (11) and cope match-plate pattern (4), described lower mold assemblies includes lower bolster (5)
With die shoe (7), it is characterised in that be provided with into son (9) on described cope match-plate pattern (4), work as upper die component
When closing with lower mold assemblies, described upper liner plate (11) and enter to be formed between son (9) and be used for realizing under product rolling over
The difference in height of roll forming, arranges elastic positioning device between described upper die component and lower mold assemblies.
Bending Mould under backboard the most according to claim 1, it is characterised in that described in enter son (9)
The side relative with lower bolster (5) is provided with groove (10).
Bending Mould under backboard the most according to claim 2, it is characterised in that described groove (10)
Sidewall near upper liner plate (11) is vertical plane.
Bending Mould under backboard the most according to claim 1, it is characterised in that described in enter son (9)
The side bottom relative with upper liner plate (11) is provided with circular arc chamfering (91).
Bending Mould under backboard the most according to claim 1, it is characterised in that described flexibly positioned dress
Put and include that alignment pin (13) and corresponding hole, location, hole, location are arranged on the bottom of cope match-plate pattern (4), location
Pin (13) is through lower bolster (5), and the bottom of alignment pin (13) is provided with the first support spring (14), the
One bottom surface conflict die shoe (7) supporting spring (14), the bottom of alignment pin (13) up extrudes lower mold
Plate (5).
Bending Mould under backboard the most according to claim 5, it is characterised in that bottom hole, described location
It is provided with buffer spring.
Bending Mould under backboard the most according to claim 5, it is characterised in that described lower bolster (5)
On be provided with location punching (12), location punching (12) bottom be provided with the second support spring (16).
Bending Mould under backboard the most according to claim 1, it is characterised in that described cope match-plate pattern (4)
And between upper bolster (2) and between lower bolster (5) and die shoe (7), it is provided with stage clip (15).
Bending Mould under backboard the most according to claim 1, it is characterised in that described upper die component and
Guiding mechanism it is provided with between lower mold assemblies.
Bending Mould under backboard the most according to claim 9, it is characterised in that described guiding mechanism
Including the guide pillar being arranged on cope match-plate pattern (4) and the gathering sill being arranged on lower bolster (5), described guide pillar
On be provided with damping spring, described gathering sill matches with guide pillar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620393604.1U CN205629124U (en) | 2016-05-04 | 2016-05-04 | Mould of bending under backplate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620393604.1U CN205629124U (en) | 2016-05-04 | 2016-05-04 | Mould of bending under backplate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205629124U true CN205629124U (en) | 2016-10-12 |
Family
ID=57048817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620393604.1U Expired - Fee Related CN205629124U (en) | 2016-05-04 | 2016-05-04 | Mould of bending under backplate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205629124U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105750421A (en) * | 2016-05-04 | 2016-07-13 | 昆山电子羽电业制品有限公司 | Back plate down-bending mold |
-
2016
- 2016-05-04 CN CN201620393604.1U patent/CN205629124U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105750421A (en) * | 2016-05-04 | 2016-07-13 | 昆山电子羽电业制品有限公司 | Back plate down-bending mold |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161012 Termination date: 20170504 |