CN205621449U - Solid state hard drives integrated circuit board and control circuit thereof - Google Patents
Solid state hard drives integrated circuit board and control circuit thereof Download PDFInfo
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- CN205621449U CN205621449U CN201620176231.2U CN201620176231U CN205621449U CN 205621449 U CN205621449 U CN 205621449U CN 201620176231 U CN201620176231 U CN 201620176231U CN 205621449 U CN205621449 U CN 205621449U
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Abstract
The utility model relates to a solid state hard drives integrated circuit board and control circuit thereof, which comprises a plate body, the front end of plate body is equipped with and closes golden finger as an organic whole with the plate body, integrated control circuit includes main control chip, serial storage module, special procure function allotment module, special procure function setting module, SATA interface module, data storage space module, high efficiency supply voltage IC module no. 1, high efficiency supply voltage IC module no. 2, high efficiency supply voltage IC module no. 3, serial storage module, special procure function allotment module, special procure function setting module, SATA interface module, data storage space module, high efficiency supply voltage IC module no. 1, high efficiency supply voltage IC module no. 2, high efficiency supply voltage IC module no. 3 links to each other with main control chip respectively. The utility model discloses a design that integrates, the PCB circuit plate body that has reduced solid state hard drives is long -pending, has improved solid state hard drives's read -write performance.
Description
Technical field
This utility model relates to solid state hard disc technical field, be specifically related to a kind of solid state hard disc surface-mounted integrated circuit and
Its control circuit.
Background technology
The core of solid state hard disc is exactly internal PCB, and it is unreasonable that PCB designs and produces, meeting
Directly influence the normal usage energy of solid state hard disc, occur in use card, read or write speed slowly with contact
The phenomenon such as bad, makes troubles to user.The PCB of existing solid state hard disc is due to internal structure
Designing unreasonable, the size of plate body is bigger, it is impossible to accomplish integrated so that the kind of solid state hard disc is also subject to
Limiting, performance also cannot promote further.The solid state hard disc of SATA interface is provided with at SATA interface
SATA interface support, SATA interface is to be welded in PCB, the most again by SATA by the way of welding
Interface cradle is arranged on PCB and solid hard disk shell, and mounting process is complicated, the longest, SATA
The size of interface cradle own is relatively big, occupies bigger bulk, and when normally using, data cable plug is direct
It is inserted on SATA interface, but after life-time service, SATA interface support is easily inserted bad, causes solid state hard disc
Cannot normally use.
Summary of the invention
In order to solve the deficiency in the presence of prior art, the utility model proposes a kind of integrated electricity of solid state hard disc
Road plate and control circuit thereof.
A kind of solid state hard disc surface-mounted integrated circuit, including plate body, the front end of described plate body is provided with and is combined into one with plate body
The golden finger of body.This utility model have employed integrated design, reduces the size of plate body greatly, with
In time, be designed to integrally by golden finger and plate body, instead of traditional SATA interface and SATA interface support assorted
Mode, solves SATA interface support and occupies larger space size and install and use the most troublesome problem, adopt
After golden finger of the present utility model, golden finger is utilized directly to realize and external calculating by external data wire
The reading and writing data of machine equipment, transmit and store, during using, do not have similar SATA interface support
Easily inserted bad problem, extended the service life of solid state hard disc.
The left back of described plate body, rear portion, right side are arranged with side V-type draw-in groove, this utility model design side V
Type draw-in groove, thus conveniently plate body is fixed in external solid state hard disc shell.
The control circuit of a kind of solid state hard disc surface-mounted integrated circuit, including main control chip, serial memory module, spy
Need function scheduling module, special procure function setting module, SATA interface module, data storage space module, height
Effect power supply supply IC module one, high effect power supply supply IC module two, high effect power supply supply IC module three,
Described serial memory module, special procure function scheduling module, special procure function setting module, SATA interface module,
Data storage space module, high effect power supply supply IC module one, high effect power supply supply IC module two, height
Effect power supply supply IC module three is connected with main control chip respectively, described SATA interface module and high effect power supply
Supply IC module one is connected, and described data storage space module is connected with high effect power supply supply IC module three.
SATA interface module of the present utility model can connect upstream data. signals, and is delivered in main control chip；String
Row memory module is capable of processing the compatibility issue of solid state hard disc；High effect power supply supply IC mould
Block one can provide big electric current to use to rear end equipment, high effect power supply supply IC module two, high effect power supply
Supply IC module three provides electric current of voltage regulation for equipment stable operation.This utility model passes through main control chip to each portion
The control of part, it is achieved that the PCB of solid state hard disc integrated, reduces the PCB of solid state hard disc greatly
The size of circuit board, and improve the performance of solid state hard disc further.
Described data storage space module includes storage chip, and the F10 foot of described main control chip is serially connected with the 4th electricity
After resistance, the H3 foot of storage chip with data storage space module is connected, and the F9 foot of described main control chip is serially connected with
After 5th resistance, the H4 foot of storage chip with data storage space module is connected, the G9 foot of described main control chip
After being serially connected with the 6th resistance, the H5 foot of storage chip with data storage space module is connected, described main control chip
H9 foot be serially connected with the 8th resistance after be connected with the J2 foot of the storage chip of data storage space module, described master
The G10 foot of control chip is connected with data storage space module, and the H10 foot of described main control chip is serially connected with the 3rd electricity
After resistance, the W5 foot of storage chip with data storage space module is connected, the H7 foot of described main control chip and Gao Gong
Effect power supply supply IC module three is connected, and the H7 foot of described main control chip connects after being serially connected with the tenth resistance 3.3V
Power interface, the J8 foot of described main control chip is connected with 3.3V power interface after being serially connected with the 11st resistance, institute
State the J10 foot of main control chip and be serially connected with after the 12nd resistance the J3 with the storage chip of data storage space module
Foot is connected, and the J9 foot of described main control chip is serially connected with the storage after the 13rd resistance with data storage space module 6
The J4 of chip is connected, the G8 foot of described main control chip be serially connected with after the 14th resistance with data storage space module
The J5 foot of storage chip be connected, the H8 foot of described main control chip be serially connected with after the 15th resistance with data storage
The J6 foot of the storage chip of space module is connected.
The D1 foot of described main control chip, D2 foot, B1 foot, B2 foot are all connected with SATA interface module, thus real
Show the transmission of upstream data. signals.
The 23rd resistance, the E1 of described main control chip it is serially connected with between the E1 foot of described main control chip, F1 foot
Also being serially connected with crystal oscillator between foot, F1 foot, 1 foot of described crystal oscillator is connected with the E1 foot of main control chip, described crystal oscillator
3 feet be connected with the F1 foot of main control chip, be serially connected with the 27th electric capacity between 3 feet and 4 feet of described crystal oscillator,
It is serially connected with the 30th electric capacity, 2 feet of described crystal oscillator and the equal ground connection of 4 feet between 1 foot and 2 feet of described crystal oscillator.
The G1 foot of described main control chip, D3 foot, C3 foot also connect after connecing and have 1V power interface, described master control core
The G1 foot of sheet, D3 foot, C3 foot are also serially connected with combination capacitor one after connecing, and described combination capacitor one includes the 20th
Five electric capacity and the 26th electric capacity, the one end after described 25th electric capacity and the 26th electric capacity parallel connection and master
The control G1 foot of chip, D3 foot, C3 foot are connected, after described 25th electric capacity and the 26th electric capacity parallel connection
Other end ground connection.
The F2 foot of described main control chip, G2 foot also connect after connecing and have 3.3V power interface, described main control chip
F2 foot, G2 foot connecting after connecing has combination capacitor two, described combination capacitor two to include the 23rd electric capacity and the
The F2 of 24 electric capacity, the one end after described 23rd electric capacity and the 24th electric capacity parallel connection and main control chip
Foot, G2 foot are connected, the other end ground connection after described 23rd electric capacity and the 24th electric capacity parallel connection.
The F3 foot of described main control chip, E2 foot, E3 foot, C2 foot, C1 foot, A1 foot, D7 foot, B10 foot, K9
Foot, K3 foot, J1 foot, G4 foot, G3 foot, F7 foot, F4 foot, E5 foot, E4 foot, D6 foot, C5 foot, A2 foot
All ground connection.
The K6 foot of described main control chip, H6 foot, G6 foot, J6 foot are all connected with serial memory module.
The B9 foot of described main control chip, C8 foot, B8 foot, A8 foot, C7 foot, B7 foot all with special procure function set
Module be connected, the B8 foot of described main control chip, A8 foot, B7 foot, J2 foot all with special procure function scheduling module phase
Even, the H5 foot of described main control chip is serially connected with ground connection after the 16th electric capacity, the H5 foot concatenation of described main control chip
It is connected with 3.3V power interface after having the first resistance.
The J5 foot ground connection of described main control chip, the K2 foot of described main control chip, F8 foot also connect after connecing and have combination
Electric capacity three, described combination capacitor three includes the 5th electric capacity and the 6th electric capacity, described 5th electric capacity and the 6th electric capacity
One end after parallel connection is connected with K2 foot, the F8 foot of main control chip, after described 5th electric capacity and the 6th electric capacity parallel connection
Other end ground connection.
The J3 foot of described main control chip is serially connected with combination capacitor four, the J3 foot of described main control chip and 3.3V power supply
Interface is connected, and described combination capacitor four includes the first electric capacity and the second electric capacity, described first electric capacity and the second electricity
Hold the one end after parallel connection to be connected with the J3 foot of main control chip, another after described first electric capacity and the second electric capacity parallel connection
One end ground connection.
The J4 foot of described main control chip is serially connected with combination capacitor five, and the J4 foot of described main control chip connects with 1V power supply
Mouth is connected, and described combination capacitor five includes the 3rd electric capacity and the 4th electric capacity, described 3rd electric capacity and the 4th electric capacity
One end after parallel connection is connected with the J4 foot of main control chip, another after described 3rd electric capacity and the 4th electric capacity parallel connection
End ground connection.
The E7 foot of described main control chip is connected with 3.3V power interface, the H4 foot of described main control chip, H2 foot,
G7 foot, D5 foot are also serially connected with combination capacitor six after connecing, the H4 foot of described main control chip, H2 foot, G7 foot, D5
Foot is also connected with 1V power interface after connecing, described combination capacitor six include the 7th electric capacity, the 8th electric capacity, the 9th
Electric capacity, the H4 foot of the one end after described 7th electric capacity, the 8th electric capacity, the 9th electric capacity parallel connection and main control chip,
H2 foot, G7 foot, D5 foot are connected, the other end after described 7th electric capacity, the 8th electric capacity, the 9th electric capacity parallel connection
Ground connection.
The K8 foot of described main control chip, K5 foot, H1 foot, D4 foot, C6 foot are also serially connected with combination capacitor seven after connecing,
The K8 foot of described main control chip, K5 foot, H1 foot, D4 foot, C6 foot are also connected with 3.3V power interface after connecing,
Described combination capacitor seven includes the 14th electric capacity, the 15th electric capacity, described 14th electric capacity, the 15th electric capacity
The K8 foot of the one end after parallel connection and main control chip, K5 foot, H1 foot, D4 foot, C6 foot are connected, and the described 14th
Other end ground connection after electric capacity, the 15th electric capacity parallel connection.
Described serial memory module includes serial storage chip, the 36th electric capacity and the 36th resistance, institute
State 1 foot of serial storage chip, 2 feet to be connected with J6, G6 foot of main control chip respectively, described serial storage core
3 feet of sheet are connected with 3.3V power interface, 4 foot ground connection of described serial storage chip, described serial storage core
5 feet of sheet, 6 feet correspondence respectively is connected with H6 foot, the K6 foot of main control chip, described 36th resistance concatenation
Between 7 feet, 8 feet of serial storage chip, 8 feet of described serial storage chip are connected with 3.3V power interface,
Described one end of 36th electric capacity is connected with 8 feet of serial storage chip, another of described 36th electric capacity
End ground connection.
Described special procure function scheduling module 3 include allocating chip one, allotment chip two, the 25th resistance, the
32 resistance, the 33rd resistance, 1 foot of described allotment chip one, the 2 equal ground connection of foot, described allotment core
3 feet of sheet one are connected with 1 foot of allotment chip two, the B7 foot phase of 4 feet of described allotment chip one and main control chip
Even, 5 feet of described allotment chip one are connected with 3.3V power interface, 6 feet of described allotment chip one and master control
The A8 foot of chip is connected, and 2 foot ground connection of described allotment chip two, 3 feet of described allotment chip two and 5 feet also connect
Being followed by 3.3V power interface, 4 feet of described allotment chip two are connected with the J2 foot of main control chip, and described
One end of 25 resistance is connected with 3.3V power interface, and the other end of described 25th resistance is connected on allotment
On 1 foot of chip two, one end of described 32nd resistance is connected with 1 foot of allotment chip two, and the described 3rd
The other end ground connection of 12 resistance, an end of described 33rd resistance is connected on 4 feet of allotment chip two, institute
State the other end ground connection of the 33rd resistance.
Described special procure function setting module include the 19th resistance, the 20th resistance, the 21st resistance,
26 resistance, the 28th resistance and the 30th resistance, one end of described 19th resistance and 3.3V power supply
Interface is connected, and the described other end of the 19th resistance is connected with the B9 foot of main control chip, described 26th electricity
One end of resistance is connected with the B9 foot of main control chip, the other end ground connection of described 26th resistance, and described second
One end of ten electricity is connected with 3.3V power interface, the other end of described 20th resistance and the C8 foot of main control chip
Being connected, described one end of 28th resistance is connected with the B8 foot of main control chip, described 28th resistance
Other end ground connection, one end of described 21st resistance is connected with 3.3V power interface, described 21st electricity
The other end of resistance is connected with the A8 foot of main control chip, the C7 foot ground connection of described main control chip, described 30th electricity
One end of resistance is connected with the B7 foot of main control chip, the other end ground connection of described 30th resistance.
1 foot of described SATA interface module, 4 feet, 7 feet, 11 feet, 12 feet, 13 feet, 17 feet, 18 feet, 19
The equal ground connection of foot, 2 feet of described SATA interface module are serially connected with the B1 foot phase after the 35th electric capacity with main control chip
Even, 3 feet of described SATA interface module are connected with the B2 foot of main control chip after being serially connected with the 37th electric capacity, institute
State after 5 feet of SATA interface module are serially connected with the 39th electric capacity and be connected with the D2 foot of main control chip, described SATA
6 feet of interface module are connected with the D1 foot of main control chip after being serially connected with the 38th electric capacity, described SATA interface mould
14 feet of block, 15 feet, 16 feet are also connected with high effect power supply supply IC module one after connecing.
Described data storage space module also include the 17th electric capacity C17, the 18th electric capacity, the 19th electric capacity,
20th electric capacity, the 16th resistance, the 21st electric capacity, the 22nd electric capacity, the 17th resistance, the tenth
Eight resistance, ground connection after the K2 foot of described storage chip and the 21st capacitance series, the U5 of described storage chip
It is linked into after foot and the 16th resistant series in high effect power supply supply IC module three, the U5 of described storage chip
Ground connection after foot and the 22nd capacitance series, the M7 foot of described storage chip, P5 foot, R10 foot, U8 foot, K4
Foot, Y2 foot, Y5 foot, AA4 foot, the equal ground connection of AA6 foot, the W6 foot of described storage chip and the 18th resistance string
Being linked into after connecing on the G10 foot of main control chip, the W5 foot of described storage chip and the 17th resistance access after being connected
In high effect power supply supply IC module three, the one end after described 19th electric capacity, the 20th electric capacity parallel connection is divided
Not it is not connected with the K6 foot of storage chip, W4 foot, Y4 foot, AA3 foot, AA5 foot, described 19th electric capacity, the
Other end ground connection after 20 electric capacity parallel connections, the K6 foot of described storage chip, W4 foot, Y4 foot, AA3 foot, AA5
Foot is also linked into after connecing in high effect power supply supply IC module three, and described 17th electric capacity, the 18th electric capacity are also
One end after connecing is connected with the M6 foot of storage chip, N5 foot, T10 foot, U9 foot respectively, described 17th electric capacity,
18th electric capacity the other end ground connection after connecing, the M6 foot of described storage chip, N5 foot, T10 foot, U9 foot are also
It is linked into after connecing in high effect power supply supply IC module three.
Described high effect power supply supply IC module one includes processing chip the, the 40th electric capacity, the 3rd inductor wire
Circle, the 39th resistance, the 40th resistance, the 41st electric capacity, 1 foot of described process chip one, 4 feet
And one end with the 40th electric capacity is connected after connecing, the other end ground connection of described 40th electric capacity, described process core
1 foot of sheet one, 4 feet are also connected with 14 feet of SATA interface module, 15 feet, 16 feet after connecing, described process core
It is linked into 3.3V power supply after 2 foot ground connection of sheet one, 3 feet of described process chip one and the 3rd inductance coil concatenation
On interface, one end of described 39th resistance is connected with 5 feet processing chip one, described 39th resistance
The other end be linked on 3.3V power interface, one end of described 40th resistance and process chip one 5 foot phases
Even, the other end ground connection of described 40th resistance, one end of described 41st electric capacity is linked into 3.3V power supply
On interface, the other end ground connection of described 41st electric capacity.
Described high effect power supply supply IC module two includes processing chip the two, the 31st electric capacity, the first inductance
Coil, the 24th resistance, the 27th resistance, the 28th electric capacity and the 29th electric capacity, described place
Reason 1 foot of chip two, 4 feet are also linked on 3.3V power interface after connecing, 1 foot of described process chip two, 4
Foot is also connected with one end of the 31st electric capacity after connecing, and the other end ground connection of described 31st electric capacity is described
It is linked into 1V after processing 2 foot ground connection of chip two, 3 feet of described process chip two and the first inductance coil concatenation
On power interface, the end after described 24th resistance, the 29th electric capacity parallel connection is connected on process chip two
5 feet on, the end after described 24th resistance, the 29th electric capacity parallel connection is connected on 1V power interface,
One end of described 27th resistance is connected on 5 feet processing chip two, the other end of described 27th resistance
Ground connection, an end of described 28th electric capacity is connected on 1V power interface, another of described 28th electric capacity
End ground connection.
Described high effect power supply supply IC module three includes processing chip the three, the 32nd electric capacity, a field effect
Ying Guan, No. two field effect transistor, the 38th resistance, the 34th resistance, the 33rd electric capacity, the second electricity
Sense coil, the 35th resistance, the 37th resistance, the 34th electric capacity, the 1 of a described field effect transistor
Foot is connected with main control chip, ground connection after 1 foot of a described field effect transistor and the 32nd capacitance series, described
1 foot of 1 foot of No. two field effect transistor and a field effect transistor is connected, 2 feet and the 3rd of described No. two field effect transistor
Ground connection after 18 resistance concatenations, 3 feet of described No. two field effect transistor and 3 feet of a field effect transistor connecing are followed by
Enter to processing on 1 foot of chip three, 4 feet, after 2 feet of a described field effect transistor and the 34th resistance concatenation
Be linked into process 1 foot of chip three, 4 feet on, one end of described 33rd electric capacity with process chip three 1 foot,
4 feet are connected, the other end ground connection of described 33rd electric capacity, 1 foot of described process chip three, 4 feet after connecing
It is linked on the M6 foot of the storage chip of data storage space module, N5 foot, T10 foot, U9 foot, described process
It is linked into data after 2 foot ground connection of chip three, 3 feet of described process chip three and the second inductance coil concatenation to deposit
On storage the K6 foot of space module, W4 foot, Y4 foot, AA3 foot, AA5 foot, one end of described 35th resistance
It is connected with 5 feet processing chip three, the other end of described 35th resistance and the K6 of data storage space module
Foot, W4 foot, Y4 foot, AA3 foot, AA5 foot are connected, and an end of described 37th resistance is connected on process chip
On 5 feet of three, the other end ground connection of described 37th resistance R37, one end of described 34th electric capacity with
The K6 foot of data storage space module 6, W4 foot, Y4 foot, AA3 foot, AA5 foot are connected, described 34th electricity
The other end ground connection held.
The beneficial effects of the utility model are: this utility model has reasonable in design, manufacturing cost
The advantages such as low and volume is little, have employed integrated design, reduce the PCB circuit of solid state hard disc greatly
Plate bulk, thus contribute to the kind of abundant solid state hard disc, improve the readwrite performance of solid state hard disc simultaneously,
Solve traditional problem that PCB size is big, manufacturing cost is high and read or write speed is slow；By golden finger
It is designed to one with plate body, instead of the mode of traditional SATA interface and SATA interface support assorted, solve
SATA interface support of having determined occupies larger space size and installs and uses the most troublesome problem.
Accompanying drawing explanation
With embodiment, this utility model is further illustrated below in conjunction with the accompanying drawings.
Fig. 1 is the structural representation of main control chip of the present utility model；
Fig. 2 is the structural representation of serial memory module of the present utility model；
Fig. 3 is the structural representation special procuring function scheduling module of the present utility model；
Fig. 4 is the structural representation special procuring function setting module of the present utility model；
Fig. 5 is the structural representation of SATA interface module of the present utility model；
Fig. 6 is the structural representation of data storage space module of the present utility model；
Fig. 7 is the structural representation of high effect power supply of the present utility model supply IC module one；
Fig. 8 is the structural representation of high effect power supply of the present utility model supply IC module two；
Fig. 9 is the structural representation of high effect power supply of the present utility model supply IC module three；
Figure 10 is the perspective view of solid state hard disc surface-mounted integrated circuit of the present utility model.
Detailed description of the invention
For the technological means making this utility model realize, creation characteristic, reach purpose and be readily apparent from effect
Understand, below this utility model is expanded on further.
As shown in Figures 1 to 10, a kind of solid state hard disc surface-mounted integrated circuit, including plate body 10, described plate body 10
Front end is provided with the golden finger 11 being integrated with plate body 10.This utility model have employed integrated design, pole
The big size reducing plate body 10, is designed to one by golden finger 11 and plate body 10 simultaneously, instead of tradition
The mode of SATA interface and SATA interface support assorted, solve SATA interface support and occupy larger space chi
Very little and install and use the most troublesome problem, after using golden finger 11 of the present utility model, in the process used
In do not have similar SATA interface support and easily inserted bad problem, extend the service life of solid state hard disc.
The left back of described plate body 10, rear portion, right side are arranged with side V-type draw-in groove 10a, and this utility model sets
Meter side V-type draw-in groove 10a, thus conveniently plate body 10 is fixed in external solid state hard disc shell.
A kind of control circuit of solid state hard disc surface-mounted integrated circuit, including main control chip 1, serial memory module 2,
Special procure function scheduling module 3, special procure function setting module 4, SATA interface module 5, data storage space module
6, high effect power supply supply IC module 1, high effect power supply supply IC module 28, high effect power supply supply IC
Module 39, described serial memory module 2, special procures function scheduling module 3, special procures function setting module 4, SATA
Interface module 5, data storage space module 6, high effect power supply supply IC module 1, the supply of high effect power supply
IC module 28, high effect power supply supply IC module 39 is connected with main control chip 1 respectively, described SATA interface mould
Block 5 is connected with high effect power supply supply IC module 1, and described data storage space module 6 supplies with high effect power supply
IC module 39 is answered to be connected.SATA interface module 5 of the present utility model can connect upstream data. signals, and defeated
Deliver in main control chip 1；Serial memory module 2 is capable of processing the compatibility issue of solid state hard disc；
High effect power supply supply IC module 1 can provide big electric current to use to rear end equipment, high effect power supply supply IC
Module 28, high effect power supply supply IC module 39 provides electric current of voltage regulation for equipment stable operation.This practicality is new
Type passes through the main control chip 1 control to each parts, it is achieved that the PCB of solid state hard disc integrated, greatly
The size of the PCB reducing solid state hard disc, and improve the performance of solid state hard disc further.
Described data storage space module 6 includes that storage chip U2, the F10 foot of described main control chip 1 are serially connected with
After four resistance R4, the H3 foot of storage chip U2 with data storage space module 6 is connected, described main control chip 1
F9 foot is connected with the H4 foot of the storage chip U2 of data storage space module 6 after being serially connected with the 5th resistance R5, described
The G9 foot of main control chip 1 is serially connected with the H5 after the 6th resistance R6 with the storage chip U2 of data storage space module 6
Foot is connected, the H9 foot of described main control chip 1 be serially connected with the 8th resistance R8 after with the depositing of data storage space module 6
The J2 foot of storage chip U2 is connected, and the G10 foot of described main control chip 1 is connected with data storage space module 6, described
The H10 foot of main control chip 1 is serially connected with after the 3rd resistance R3 with the storage chip U2's of data storage space module 6
W5 foot is connected, and the H7 foot of described main control chip 1 is connected with high effect power supply supply IC module 39, described master control
The H7 foot of chip 1 connects after being serially connected with the tenth resistance R10 3.3V power interface, the J8 foot of described main control chip 1
Being connected with 3.3V power interface after being serially connected with the 11st resistance R11, the J10 foot of described main control chip 1 is serially connected with
After 12 resistance R12, the J3 foot of storage chip U2 with data storage space module 6 is connected, described main control chip 1
J9 foot be serially connected with the 13rd resistance R13 after be connected with the J4 of the storage chip U2 of data storage space module 6,
The G8 foot of described main control chip 1 is serially connected with the storage core after the 14th resistance R14 with data storage space module 6
The J5 foot of sheet U2 is connected, and the H8 foot of described main control chip 1 is empty with data storage after being serially connected with the 15th resistance R15
Between module 6 storage chip U2 J6 foot be connected.
The D1 foot of described main control chip 1, D2 foot, B1 foot, B2 foot are all connected with SATA interface module 5, thus
Achieve the transmission of upstream data. signals.
The 23rd resistance R23, described main control chip 1 it is serially connected with between the E1 foot of described main control chip 1, F1 foot
E1 foot, be also serially connected with crystal oscillator between F1 foot, 1 foot of described crystal oscillator is connected with the E1 foot of main control chip 1, institute
The F1 foot of 3 feet and main control chip 1 of stating crystal oscillator is connected, and is serially connected with the 20th between 3 feet and 4 feet of described crystal oscillator
Seven electric capacity C27, are serially connected with the 30th electric capacity C30 between 1 foot and 2 feet of described crystal oscillator, 2 feet of described crystal oscillator with
The 4 equal ground connection of foot.
The G1 foot of described main control chip 1, D3 foot, C3 foot also connect after connecing and have 1V power interface, described master control core
The G1 foot of sheet 1, D3 foot, C3 foot are also serially connected with combination capacitor one after connecing, and described combination capacitor one includes the 20th
Five electric capacity C25 and the 26th electric capacity C26, described 25th electric capacity C25 and the 26th electric capacity C26 are in parallel
After the G1 foot of one end and main control chip 1, D3 foot, C3 foot be connected, described 25th electric capacity C25 and second
Other end ground connection after 16 electric capacity C26 parallel connections.
The F2 foot of described main control chip 1, G2 foot also connect after connecing and have 3.3V power interface, described main control chip 1
F2 foot, G2 foot connect after connecing and have combination capacitor two, described combination capacitor two to include the 23rd electric capacity C23
With the 24th electric capacity C24, the one end after described 23rd electric capacity C23 and the 24th electric capacity C24 parallel connection with
The F2 foot of main control chip 1, G2 foot are connected, after described 23rd electric capacity C23 and the 24th electric capacity C24 parallel connection
Other end ground connection.
The F3 foot of described main control chip 1, E2 foot, E3 foot, C2 foot, C1 foot, A1 foot, D7 foot, B10 foot,
K9 foot, K3 foot, J1 foot, G4 foot, G3 foot, F7 foot, F4 foot, E5 foot, E4 foot, D6 foot, C5 foot, A2
The equal ground connection of foot.
The K6 foot of described main control chip 1, H6 foot, G6 foot, J6 foot are all connected with serial memory module 2.
The B9 foot of described main control chip 1, C8 foot, B8 foot, A8 foot, C7 foot, B7 foot all with special procure function set
Module 4 is connected, the B8 foot of described main control chip 1, A8 foot, B7 foot, J2 foot all with special procure function scheduling module 3
Being connected, the H5 foot of described main control chip 1 is serially connected with ground connection after the 16th electric capacity C16, the H5 of described main control chip 1
Foot is connected with 3.3V power interface after being serially connected with the first resistance R1.
The J5 foot ground connection of described main control chip 1, the K2 foot of described main control chip 1, F8 foot also connect after connecing and have group
Close electric capacity three, described combination capacitor three include the 5th electric capacity C5 and the 6th electric capacity C6, described 5th electric capacity C5 and
One end after 6th electric capacity C6 parallel connection is connected with K2 foot, the F8 foot of main control chip 1, described 5th electric capacity C5 and
Other end ground connection after six electric capacity C6 parallel connections.
The J3 foot of described main control chip 1 is serially connected with combination capacitor four, the J3 foot of described main control chip 1 and 3.3V electricity
Source interface is connected, and described combination capacitor four includes the first electric capacity C1 and the second electric capacity C2, described first electric capacity C1
It is connected with the J3 foot of main control chip 1 with the one end after the second electric capacity C2 parallel connection, described first electric capacity C1 and second electricity
Hold the other end ground connection after C2 parallel connection.
The J4 foot of described main control chip 1 is serially connected with combination capacitor five, the J4 foot of described main control chip 1 and 1V power supply
Interface be connected, described combination capacitor five include the 3rd electric capacity C3 and the 4th electric capacity C4, described 3rd electric capacity C3 and
One end after 4th electric capacity C4 parallel connection is connected with the J4 foot of main control chip 1, described 3rd electric capacity C3 and the 4th electric capacity
Other end ground connection after C4 parallel connection.
The E7 foot of described main control chip 1 is connected with 3.3V power interface, the H4 foot of described main control chip 1, H2 foot,
G7 foot, D5 foot are also serially connected with combination capacitor six, the H4 foot of described main control chip 1, H2 foot, G7 foot, D5 after connecing
Foot is also connected with 1V power interface after connecing, described combination capacitor six include the 7th electric capacity C7, the 8th electric capacity C8,
9th electric capacity C9, the one end after described 7th electric capacity C7, the 8th electric capacity C8, the 9th electric capacity C9 parallel connection and master control
The H4 foot of chip 1, H2 foot, G7 foot, D5 foot are connected, described 7th electric capacity C7, the 8th electric capacity C8, the 9th electricity
Hold the other end ground connection after C9 parallel connection.
The K8 foot of described main control chip 1, K5 foot, H1 foot, D4 foot, C6 foot are also serially connected with combination capacitor seven after connecing
C7, the K8 foot of described main control chip 1, K5 foot, H1 foot, D4 foot, C6 foot and after connecing with 3.3V power interface phase
Even, described combination capacitor seven C7 includes the 14th electric capacity C14, the 15th electric capacity C15, described 14th electric capacity
One end after C14, the 15th electric capacity C15 parallel connection and the K8 foot of main control chip 1, K5 foot, H1 foot, D4 foot, C6
Foot is connected, the other end ground connection after described 14th electric capacity C14, the 15th electric capacity C15 parallel connection.
Described serial memory module 2 includes serial storage chip U7, the 36th electric capacity C36 and the 36th electricity
Hindering R36,1 foot of described serial storage chip U7,2 feet are connected with J6, G6 foot of main control chip 1 respectively, institute
3 feet stating serial storage chip U7 are connected with 3.3V power interface, the 4 foot ground connection of described serial storage chip U7,
5 feet of described serial storage chip U7,6 feet correspondence respectively is connected with H6 foot, the K6 foot of main control chip 1, described
36th resistance R36 is serially connected between 7 feet of serial storage chip U7,8 feet, described serial storage chip U7
8 feet be connected with 3.3V power interface, one end of described 36th electric capacity C36 and the 8 of serial storage chip U7
Foot is connected, the other end ground connection of described 36th electric capacity C36.
Described function scheduling module 3 of special procuring includes allocating chip one U3, allotment chip two U5, the 25th resistance
R25, the 32nd resistance R32, the 33rd resistance R33,1 foot of described allotment chip one U3,2 feet all connect
Ground, 3 feet of described allotment chip one U3 are connected with 1 foot of allotment chip two U5, the 4 of described allotment chip one U3
Foot is connected with the B7 foot of main control chip 1, and 5 feet of described allotment chip one U3 are connected with 3.3V power interface, institute
6 feet stating allotment chip one U3 are connected with the A8 foot of main control chip 1, the 2 foot ground connection of described allotment chip two U5,
3 feet of described allotment chip two U5 and 5 feet connecing are followed by 3.3V power interface, described allotment chip two U5
4 feet be connected with the J2 foot of main control chip 1, one end of described 25th resistance R25 and 3.3V power interface phase
Even, the other end of described 25th resistance R25 is connected on 1 foot of allotment chip two U5, and the described 32nd
One end of resistance R32 is connected with 1 foot of allotment chip two U5, another termination of described 32nd resistance R32
Ground, an end of described 33rd resistance R33 is connected on 4 feet of allotment chip two U5, described 33rd electricity
The other end ground connection of resistance R33.
Described function setting module 4 of special procuring includes the 19th resistance R19, the 20th resistance R20, the 21st electricity
Resistance R21, the 26th resistance R26, the 28th resistance R28 and the 30th resistance R30, described 19th electricity
One end of resistance R19 is connected with 3.3V power interface, the other end of described 19th resistance R19 and main control chip 1
B9 foot is connected, and described one end of 26th resistance R26 is connected with the B9 foot of main control chip 1, and the described 20th
The other end ground connection of six resistance R26, one end of described 20th resistance R20 is connected with 3.3V power interface, institute
The C8 foot of the other end and main control chip 1 of stating the 20th resistance R20 is connected, the one of described 28th resistance R28
End is connected with the B8 foot of main control chip 1, the other end ground connection of described 28th resistance R28, and the described 20th
One end of one resistance R21 is connected with 3.3V power interface, the other end of described 21st resistance R21 and master control
The A8 foot of chip 1 is connected, the C7 foot ground connection of described main control chip 1, one end of described 30th resistance R30 and master
The B7 foot of control chip 1 is connected, the other end ground connection of described 30th resistance R30.
1 foot of described SATA interface module 5,4 feet, 7 feet, 11 feet, 12 feet, 13 feet, 17 feet, 18 feet,
The 19 equal ground connection of foot, 2 feet of described SATA interface module 5 be serially connected with after the 35th electric capacity C35 with main control chip 1
B1 foot be connected, 3 feet of described SATA interface module 5 be serially connected with after the 37th electric capacity C37 with main control chip 1
B2 foot be connected, 5 feet of described SATA interface module 5 be serially connected with after the 39th electric capacity C39 with main control chip 1
D2 foot be connected, 6 feet of described SATA interface module 5 be serially connected with after the 38th electric capacity C38 with main control chip 1
D1 foot be connected, 14 feet of described SATA interface module 5,15 feet, 16 feet also connect after with high effect power supply supply
IC module 1 is connected.
Described data storage space module 6 also includes the 17th electric capacity C17, the 18th electric capacity C18, the 19th electricity
Hold C19, the 20th electric capacity C20, the 16th resistance R16, the 21st electric capacity C21, the 22nd electric capacity C22,
17th resistance R17, the 18th resistance R18, the K2 foot of described storage chip U2 and the 21st electric capacity C21 string
It is linked into high effect power supply after connecing rear ground connection, the U5 foot of described storage chip U2 and the 16th resistance R16 series connection to supply
Answer in IC module 39, ground connection after the U5 foot of described storage chip U2 and the 22nd electric capacity C22 concatenation is described
The M7 foot of storage chip U2, P5 foot, R10 foot, U8 foot, K4 foot, Y2 foot, Y5 foot, AA4 foot, AA6 foot are equal
The G10 foot of main control chip 1 it is linked into after ground connection, the W6 foot of described storage chip U2 and the 18th resistance R18 concatenation
On, the W5 foot of described storage chip U2 and the 17th resistance R17 are linked into high effect power supply supply IC mould after being connected
On block 39, the one end after described 19th electric capacity C19, the 20th electric capacity C20 parallel connection respectively with storage chip U2
K6 foot, W4 foot, Y4 foot, AA3 foot, AA5 foot be connected, described 19th electric capacity C19, the 20th electric capacity C20
Other end ground connection after parallel connection, the K6 foot of described storage chip U2, W4 foot, Y4 foot, AA3 foot, AA5 foot are also
It is linked into after connecing in high effect power supply supply IC module 39, described 17th electric capacity C17, the 18th electric capacity C18
And the one end after connecing is connected with the M6 foot of storage chip U2, N5 foot, T10 foot, U9 foot respectively, the described 17th
Electric capacity C17, the 18th electric capacity C18 the other end ground connection after connecing, the M6 foot of described storage chip U2, N5 foot,
T10 foot, U9 foot are also linked into after connecing in high effect power supply supply IC module 39.
Described high effect power supply supply IC module 1 include process chip one U8, the 40th electric capacity C40, the 3rd
Inductance coil L3, the 39th resistance R39, the 40th resistance R40, the 41st electric capacity C41, described process
1 foot of chip one U8,4 feet are also connected with one end of the 40th electric capacity C40 after connecing, described 40th electric capacity C40
Other end ground connection, 1 foot of described process chip one U8,4 feet and after connecing and 14 feet of SATA interface module 5,
15 feet, 16 feet are connected, the 2 foot ground connection of described process chip one U8,3 feet of described process chip one U8 and the
It is linked on 3.3V power interface after three inductance coil L3 concatenations, one end of described 39th resistance R39 and place
5 feet of reason chip one U8 are connected, and the other end of described 39th resistance R39 is linked on 3.3V power interface,
One end of described 40th resistance R40 is connected with 5 feet processing chip one U8, and described 40th resistance R40's is another
One end ground connection, one end of described 41st electric capacity C41 is linked on 3.3V power interface, and the described 41st
The other end ground connection of electric capacity C41.
Described high effect power supply supply IC module 28 include processing chip two U4, the 31st electric capacity C31, the
One inductance coil L1, the 24th resistance R24, the 27th resistance R27, the 28th electric capacity C28 and second
19 electric capacity C29,1 foot of described process chip two U4,4 feet are also linked on 3.3V power interface after connecing, institute
It is connected with one end of the 31st electric capacity C31 after stating process 1 foot of chip two U4,4 feet and connecing, the described 30th
The other end ground connection of one electric capacity C31, the 2 foot ground connection of described process chip two U4, the 3 of described process chip two U4
It is linked on 1V power interface after foot and the first inductance coil L1 concatenation, described 24th resistance R24, second
An end after 19 electric capacity C29 parallel connections is connected on 5 feet processing chip two U4, described 24th resistance R24,
An end after 29th electric capacity C29 parallel connection is connected on 1V power interface, the one of described 27th resistance R27
Terminate on 5 feet processing chip two U4, the other end ground connection of described 27th resistance R27, described second
One end of 18 electric capacity C28 is connected on 1V power interface, the other end ground connection of described 28th electric capacity C28.
Described high effect power supply supply IC module 39 include process chip three U6, the 32nd electric capacity C32, one
Number field effect transistor Q1, No. two field effect transistor Q2, the 38th resistance R38, the 34th resistance R34, the 3rd
13 electric capacity C33, the second inductance coil L2, the 35th resistance R35, the 37th resistance R37, the 30th
Four electric capacity C34,1 foot of described field effect transistor Q1 is connected with main control chip 1, described field effect transistor Q1
1 foot and the 32nd electric capacity C32 concatenation after ground connection, 1 foot of described No. two field effect transistor Q2 and a field effect
1 foot of pipe Q1 is connected, ground connection after 2 feet of described No. two field effect transistor Q2 and the 38th resistance R38 concatenation, institute
Access after stating 3 feet of No. two field effect transistor Q2 and 3 feet of field effect transistor Q1 and connecing and manage chip three U6's everywhere
On 1 foot, 4 feet, access after 2 feet of described field effect transistor Q1 and the 34th resistance R34 concatenation and manage everywhere
On 1 foot of chip three U6,4 feet, one end of described 33rd electric capacity C33 with process 1 foot of chip three U6,4
Foot is connected, and the other end ground connection of described 33rd electric capacity C33,1 foot of described process chip three U6,4 feet are also
It is linked into after connecing on the M6 foot of the storage chip U2 of data storage space module 6, N5 foot, T10 foot, U9 foot,
The 2 foot ground connection of described process chip three U6,3 feet of described process chip three U6 and the second inductance coil L2 concatenation
After be linked on the K6 foot of data storage space module 6, W4 foot, Y4 foot, AA3 foot, AA5 foot, the described 3rd
One end of 15 resistance R35 is connected with 5 feet processing chip three U6, the other end of described 35th resistance R35
It is connected with the K6 foot of data storage space module 6, W4 foot, Y4 foot, AA3 foot, AA5 foot, the described 37th
One end of resistance R37 is connected on 5 feet processing chip three U6, another termination of described 37th resistance R37
Ground, one end of described 34th electric capacity C34 and the K6 foot of data storage space module 6, W4 foot, Y4 foot,
AA3 foot, AA5 foot are connected, the other end ground connection of described 34th electric capacity C34.
This utility model have employed integrated design philosophy, the size of solid state hard disc is reduced further, makes
Obtaining the kind more diversification of solid state hard disc, performance is promoted the most further.
Of the present utility model ultimate principle, principal character and of the present utility model advantage have more than been shown and described.
Skilled person will appreciate that of the industry, this utility model is not restricted to the described embodiments, above-described embodiment
With the simply principle of the present utility model described in description, without departing from this utility model spirit and scope
Under premise, this utility model also has various changes and modifications, and these changes and improvements both fall within claimed
This utility model in the range of.This utility model claims scope by appending claims and equivalence thereof
Thing defines.
Claims (10)
1. a solid state hard disc surface-mounted integrated circuit, including plate body (10), it is characterised in that: described plate body (10)
Front end be provided with the golden finger (11) being integrated with plate body (10).
A kind of solid state hard disc surface-mounted integrated circuit the most according to claim 1, it is characterised in that: described plate
The left back of body (10), rear portion, right side are arranged with side V-type draw-in groove (10a).
The control electricity of a kind of solid state hard disc surface-mounted integrated circuit the most according to any one of claim 1 to 2
Road, it is characterised in that: described control circuit includes main control chip (1), serial memory module (2), special procures
Function scheduling module (3), to special procure function setting module (4), SATA interface module (5), data storage empty
Between module (6), high effect power supply supply IC module one (7), high effect power supply supply IC module two (8),
High effect power supply supply IC module three (9), described serial memory module (2), special procure function scheduling module (3),
Special procure function setting module (4), SATA interface module (5), data storage space module (6), high effect
Power supply supply IC module one (7), high effect power supply supply IC module two (8), high effect power supply supply IC mould
Block three (9) is connected with main control chip (1) respectively, and described SATA interface module (5) supplies with high effect power supply
Answering IC module one (7) to be connected, described data storage space module (6) supplies IC module with high effect power supply
Three (9) are connected.
The control circuit of a kind of solid state hard disc surface-mounted integrated circuit the most according to claim 3, its feature exists
In: described data storage space module (6) includes storage chip (U2), the F10 of described main control chip (1)
Foot be serially connected with the 4th resistance (R4) afterwards with the H3 foot of the storage chip (U2) of data storage space module (6)
Be connected, the F9 foot of described main control chip (1) be serially connected with the 5th resistance (R5) afterwards with data storage space module
(6) the H4 foot of storage chip (U2) is connected, and the G9 foot of described main control chip (1) is serially connected with the 6th electricity
Hinder (R6) H5 foot afterwards with the storage chip (U2) of data storage space module (6) to be connected, described master control
The H9 foot of chip (1) be serially connected with the 8th resistance (R8) afterwards with the storage core of data storage space module (6)
The J2 foot of sheet (U2) is connected, the G10 foot of described main control chip (1) and data storage space module (6) phase
Even, the H10 foot of described main control chip (1) be serially connected with the 3rd resistance (R3) afterwards with data storage space module
(6) the W5 foot of storage chip (U2) is connected, the H7 foot of described main control chip (1) and high effect power supply
Supply IC module three (9) is connected, after the H7 foot of described main control chip (1) is serially connected with the tenth resistance (R10)
Connect and have 3.3V power interface, after the J8 foot of described main control chip (1) is serially connected with the 11st resistance (R11)
It is connected with 3.3V power interface, after the J10 foot of described main control chip (1) is serially connected with the 12nd resistance (R12)
It is connected with the J3 foot of the storage chip (U2) of data storage space module (6), described main control chip (1)
J9 foot be serially connected with the 13rd resistance (R13) afterwards with the storage chip (U2) of data storage space module (6)
J4 be connected, the G8 foot of described main control chip (1) is serially connected with the 14th resistance (R14) afterwards and data storage
The J5 foot of the storage chip (U2) of space module (6) is connected, the H8 foot concatenation of described main control chip (1)
Have the 15th resistance (R15) afterwards with the J6 foot phase of the storage chip (U2) of data storage space module (6)
Even；
Described data storage space module (6) also include the 17th electric capacity (C17), the 18th electric capacity (C18),
19th electric capacity (C19), the 20th electric capacity (C20), the 16th resistance (R16), the 21st electric capacity (C21),
22nd electric capacity (C22), the 17th resistance (R17), the 18th resistance (R18), described storage chip
(U2) ground connection after K2 foot and the 21st electric capacity (C21) concatenation, the U5 foot of described storage chip (U2)
Be linked into after connecting with the 16th resistance (R16) high effect power supply supply IC module three (9) on, described in deposit
Ground connection after the U5 foot of storage chip (U2) and the 22nd electric capacity (C22) concatenation, described storage chip (U2)
M7 foot, P5 foot, R10 foot, U8 foot, K4 foot, Y2 foot, Y5 foot, AA4 foot, the equal ground connection of AA6 foot, described
The G10 of main control chip (1) it is linked into after the W6 foot of storage chip (U2) and the 18th resistance (R18) concatenation
On foot, the W5 foot of described storage chip (U2) and the 17th resistance (R17) are linked into high effect electricity after being connected
In source supply IC module three (9), after described 19th electric capacity (C19), the 20th electric capacity (C20) parallel connection
One end be connected with the K6 foot of storage chip (U2), W4 foot, Y4 foot, AA3 foot, AA5 foot respectively, described
Other end ground connection after 19th electric capacity (C19), the 20th electric capacity (C20) parallel connection, described storage chip (U2)
K6 foot, W4 foot, Y4 foot, AA3 foot, AA5 foot be linked into high effect power supply supply IC module three (9) after connecing
On, described 17th electric capacity (C17), the 18th electric capacity (C18) the one end after connecing respectively with storage chip
(U2) M6 foot, N5 foot, T10 foot, U9 foot are connected, described 17th electric capacity (C17), the 18th electric capacity
(C18) other end ground connection and after connecing, the M6 foot of described storage chip (U2), N5 foot, T10 foot, U9
Foot is also linked into after connecing in high effect power supply supply IC module three (9)；
The D1 foot of described main control chip (1), D2 foot, B1 foot, B2 foot all with SATA interface module (5) phase
Even；
The 23rd resistance (R23), described master it is serially connected with between the E1 foot of described main control chip (1), F1 foot
Crystal oscillator also it is serially connected with, 1 foot of described crystal oscillator and main control chip (1) between the E1 foot of control chip (1), F1 foot
E1 foot be connected, 3 feet of described crystal oscillator are connected with the F1 foot of main control chip (1), 3 feet of described crystal oscillator and 4
It is serially connected with the 27th electric capacity (C27) between foot, between 1 foot and 2 feet of described crystal oscillator, is serially connected with the 30th electricity
Hold (C30), 2 feet of described crystal oscillator and the equal ground connection of 4 feet；
The G1 foot of described main control chip (1), D3 foot, C3 foot also connect after connecing and have 1V power interface, described master
Being serially connected with combination capacitor one after controlling the G1 foot of chip (1), D3 foot, C3 foot and connecing, described combination capacitor one wraps
Include the 25th electric capacity (C25) and the 26th electric capacity (C26), described 25th electric capacity (C25) and
The G1 foot of the one end after the 26th electric capacity (C26) parallel connection and main control chip (1), D3 foot, C3 foot are connected,
Other end ground connection after described 25th electric capacity (C25) and the 26th electric capacity (C26) parallel connection；
The F2 foot of described main control chip (1), G2 foot also connect after connecing and have 3.3V power interface, described master control core
The F2 foot of sheet (1), G2 foot also connect after connecing and have combination capacitor two, described combination capacitor two to include the 23rd
Electric capacity (C23) and the 24th electric capacity (C24), described 23rd electric capacity (C23) and the 24th electricity
Hold the one end after (C24) parallel connection to be connected with F2 foot, the G2 foot of main control chip (1), described 23rd electricity
Hold the other end ground connection after (C23) and the 24th electric capacity (C24) parallel connection；
The F3 foot of described main control chip (1), E2 foot, E3 foot, C2 foot, C1 foot, A1 foot, D7 foot, B10
Foot, K9 foot, K3 foot, J1 foot, G4 foot, G3 foot, F7 foot, F4 foot, E5 foot, E4 foot, D6 foot, C5 foot,
The equal ground connection of A2 foot；
The K6 foot of described main control chip (1), H6 foot, G6 foot, J6 foot all with serial memory module (2) phase
Even；
The B9 foot of described main control chip (1), C8 foot, B8 foot, A8 foot, C7 foot, B7 foot all with special procure function
Setting module (4) be connected, the B8 foot of described main control chip (1), A8 foot, B7 foot, J2 foot all with special procure
Function scheduling module (3) is connected, and the H5 foot of described main control chip (1) is serially connected with the 16th electric capacity (C16)
Rear ground connection, the H5 foot of described main control chip (1) be serially connected with the first resistance (R1) afterwards with 3.3V power interface phase
Even；
The J5 foot ground connection of described main control chip (1), the K2 foot of described main control chip (1), F8 foot after connecing
Connecting has combination capacitor three, described combination capacitor three to include the 5th electric capacity (C5) and the 6th electric capacity (C6), institute
State the one end after the 5th electric capacity (C5) and the 6th electric capacity (C6) parallel connection and the K2 foot of main control chip (1), F8
Foot is connected, the other end ground connection after described 5th electric capacity (C5) and the 6th electric capacity (C6) parallel connection；
The J3 foot of described main control chip (1) is serially connected with combination capacitor four, the J3 foot of described main control chip (1)
Being connected with 3.3V power interface, described combination capacitor four includes the first electric capacity (C1) and the second electric capacity (C2),
The J3 foot phase of the one end after described first electric capacity (C1) and the second electric capacity (C2) parallel connection and main control chip (1)
Even, the other end ground connection after described first electric capacity (C1) and the second electric capacity (C2) parallel connection；
The J4 foot of described main control chip (1) is serially connected with combination capacitor five, the J4 foot of described main control chip (1)
Being connected with 1V power interface, described combination capacitor five includes the 3rd electric capacity (C3) and the 4th electric capacity (C4), institute
State the 3rd electric capacity (C3) to be connected with the J4 foot of main control chip (1) with the one end after the 4th electric capacity (C4) parallel connection,
Other end ground connection after described 3rd electric capacity (C3) and the 4th electric capacity (C4) parallel connection；
The E7 foot of described main control chip (1) is connected with 3.3V power interface, the H4 of described main control chip (1)
Foot, H2 foot, G7 foot, D5 foot are also serially connected with combination capacitor six after connecing, the H4 foot of described main control chip (1),
H2 foot, G7 foot, D5 foot are also connected with 1V power interface after connecing, described combination capacitor six include the 7th electric capacity (C7),
8th electric capacity (C8), the 9th electric capacity (C9), described 7th electric capacity (C7), the 8th electric capacity (C8), the 9th
The H4 foot of the one end after electric capacity (C9) parallel connection and main control chip (1), H2 foot, G7 foot, D5 foot are connected, institute
State the other end ground connection after the 7th electric capacity (C7), the 8th electric capacity (C8), the 9th electric capacity (C9) parallel connection；
The K8 foot of described main control chip (1), K5 foot, H1 foot, D4 foot, C6 foot are also serially connected with combination electricity after connecing
Holding seven (C7), the K8 foot of described main control chip (1), K5 foot, H1 foot, D4 foot, C6 foot also meet rear and 3.3V
Power interface is connected, and described combination capacitor seven (C7) includes the 14th electric capacity (C14), the 15th electric capacity (C15),
One end after described 14th electric capacity (C14), the 15th electric capacity (C15) parallel connection and main control chip (1)
K8 foot, K5 foot, H1 foot, D4 foot, C6 foot are connected, described 14th electric capacity (C14), the 15th electric capacity (C15)
Other end ground connection after parallel connection；
Described serial memory module (2) include serial storage chip (U7), the 36th electric capacity (C36) and
36th resistance (R36), 1 foot of described serial storage chip (U7), 2 feet respectively with main control chip (1)
J6, G6 foot be connected, 3 feet of described serial storage chip (U7) are connected with 3.3V power interface, described string
4 foot ground connection of row storage chip (U7), 5 feet of described serial storage chip (U7), 6 feet respectively corresponding with
The H6 foot of main control chip (1), K6 foot are connected, and described 36th resistance (R36) is serially connected in serial storage
Between 7 feet of chip (U7), 8 feet, 8 feet of described serial storage chip (U7) and 3.3V power interface phase
Even, described one end of 36th electric capacity (C36) is connected with 8 feet of serial storage chip (U7), described
The other end ground connection of the 36th electric capacity (C36).
The control circuit of a kind of solid state hard disc surface-mounted integrated circuit the most according to claim 3, its feature exists
In: described in special procure function scheduling module (3) include allocating chip one (U3), allotment chip two (U5), the
25 resistance (R25), the 32nd resistance (R32), the 33rd resistance (R33), described allotment core
1 foot of sheet one (U3), the 2 equal ground connection of foot, 3 feet of described allotment chip one (U3) and allotment chip two (U5)
1 foot be connected, 4 feet of described allotment chip one (U3) are connected with the B7 foot of main control chip (1), described tune
5 feet of distribution chip one (U3) are connected with 3.3V power interface, 6 feet of described allotment chip one (U3) and master
The A8 foot of control chip (1) is connected, 2 foot ground connection of described allotment chip two (U5), described allotment chip two
(U5) 3 feet and 5 feet connecing are followed by 3.3V power interface, 4 feet of described allotment chip two (U5) with
The J2 foot of main control chip (1) is connected, one end of described 25th resistance (R25) and 3.3V power interface
Being connected, the other end of described 25th resistance (R25) is connected on 1 foot of allotment chip two (U5), institute
1 foot of one end and allotment chip two (U5) of stating the 32nd resistance (R32) is connected, and the described 32nd
The other end ground connection of resistance (R32), an end of described 33rd resistance (R33) is connected on allotment chip two
(U5) on 4 feet, the other end ground connection of described 33rd resistance (R33).
The control circuit of a kind of solid state hard disc surface-mounted integrated circuit the most according to claim 3, its feature exists
In: described in special procure function setting module (4) include the 19th resistance (R19), the 20th resistance (R20),
21st resistance (R21), the 26th resistance (R26), the 28th resistance (R28) and the 30th electricity
Resistance (R30), one end of described 19th resistance (R19) is connected with 3.3V power interface, described 19th electricity
The other end of resistance (R19) is connected with the B9 foot of main control chip (1), described 26th resistance (R26)
One end is connected with the B9 foot of main control chip (1), the other end ground connection of described 26th resistance (R26),
One end of described 20th resistance (R20) is connected with 3.3V power interface, described 20th resistance (R20)
The other end be connected with the C8 foot of main control chip (1), one end of described 28th resistance (R28) and master
The B8 foot of control chip (1) is connected, the other end ground connection of described 28th resistance (R28), and described second
One end of 11 resistance (R21) is connected with 3.3V power interface, described 21st resistance (R21) another
One end is connected with the A8 foot of main control chip (1), the C7 foot ground connection of described main control chip (1), and the described 3rd
One end of ten resistance (R30) is connected with the B7 foot of main control chip (1), described 30th resistance (R30)
Other end ground connection.
The control circuit of a kind of solid state hard disc surface-mounted integrated circuit the most according to claim 3, its feature exists
In: 1 foot of described SATA interface module (5), 4 feet, 7 feet, 11 feet, 12 feet, 13 feet, 17 feet, 18
Foot, the 19 equal ground connection of foot, after 2 feet of described SATA interface module (5) are serially connected with the 35th electric capacity (C35)
Being connected with the B1 foot of main control chip (1), 3 feet of described SATA interface module (5) are serially connected with the 37th electricity
Hold (C37) B2 foot afterwards with main control chip (1) to be connected, 5 foot concatenations of described SATA interface module (5)
The 39th electric capacity (C39) the D2 foot afterwards with main control chip (1) is had to be connected, described SATA interface module (5)
6 feet be serially connected with the 38th electric capacity (C38) the D1 foot afterwards with main control chip (1) and be connected, described SATA circle
14 feet of face mould block (5), 15 feet, 16 feet are also supplied IC module one (7) with high effect power supply after connecing and are connected.
The control circuit of a kind of solid state hard disc surface-mounted integrated circuit the most according to claim 4, its feature exists
In: described high effect power supply supply IC module one (7) include processing chip one (U8), the 40th electric capacity (C40),
3rd inductance coil (L3), the 39th resistance (R39), the 40th resistance (R40), the 41st electric capacity
(C41), 1 foot of described process chip one (U8), 4 feet and after connecing with one end of the 40th electric capacity (C40)
It is connected, the other end ground connection of described 40th electric capacity (C40), 1 foot of described process chip one (U8), 4
Foot is also connected with SATA interface module (5) after connecing, and 2 foot ground connection of described process chip one (U8) are described
It is linked on 3.3V power interface after 3 feet of process chip one (U8) and the 3rd inductance coil (L3) concatenation,
One end of described 39th resistance (R39) is connected with 5 feet processing chip one (U8), and the described 30th
The other end of nine resistance (R39) is linked on 3.3V power interface, the one of described 40th resistance (R40)
5 feet held and process chip one (U8) are connected, the other end ground connection of described 40th resistance (R40), institute
The one end stating the 41st electric capacity (C41) is linked on 3.3V power interface, described 41st electric capacity (C41)
Other end ground connection.
The control circuit of a kind of solid state hard disc surface-mounted integrated circuit the most according to claim 3, its feature exists
In: described high effect power supply supply IC module two (8) includes processing chip two (U4), the 31st electric capacity
(C31), the first inductance coil (L1), the 24th resistance (R24), the 27th resistance (R27),
28 electric capacity (C28) and the 29th electric capacity (C29), 1 foot of described process chip two (U4), 4 feet
And be linked into after connecing on 3.3V power interface, 1 foot of described process chip two (U4), 4 feet and after connecing with the
One end of 31 electric capacity (C31) is connected, the other end ground connection of described 31st electric capacity (C31), institute
State the 2 foot ground connection processing chip two (U4), 3 feet of described process chip two (U4) and the first inductance coil
(L1) it is linked on 1V power interface after concatenation, described 24th resistance (R24), the 29th electric capacity
(C29) end after parallel connection is connected on 5 feet processing chip two (U4), described 24th resistance (R24),
An end after 29th electric capacity (C29) parallel connection is connected on 1V power interface, described 27th resistance (R27)
An end be connected on process chip two (U4) 5 feet on, described 27th resistance (R27) another termination
Ground, an end of described 28th electric capacity (C28) is connected on 1V power interface, described 28th electric capacity (C28)
Other end ground connection.
The control circuit of a kind of solid state hard disc surface-mounted integrated circuit the most according to claim 3, its feature exists
In: described high effect power supply supply IC module three (9) includes processing chip three (U6), the 32nd electric capacity
(C32), field effect transistor (Q1), No. two field effect transistor (Q2), the 38th resistance (R38),
34 resistance (R34), the 33rd electric capacity (C33), the second inductance coil (L2), the 35th resistance
(R35), the 37th resistance (R37), the 34th electric capacity (C34), a described field effect transistor (Q1)
1 foot be connected with main control chip (1), 1 foot of a described field effect transistor (Q1) and the 32nd electric capacity (C32)
Ground connection after concatenation, 1 foot of described No. two field effect transistor (Q2) and 1 foot of a field effect transistor (Q1) are connected,
Ground connection after 2 feet of described No. two field effect transistor (Q2) and the 38th resistance (R38) concatenation, described No. two
3 feet of field effect transistor (Q2) and 3 feet of a field effect transistor (Q1) also access reason chip three (U6) everywhere after connecing
1 foot, on 4 feet, after 2 feet of a described field effect transistor (Q1) and the 34th resistance (R34) concatenation
It is linked into and processes on 1 foot of chip three (U6), 4 feet, one end of described 33rd electric capacity (C33) and place
1 foot of reason chip three (U6), 4 feet are connected, the other end ground connection of described 33rd electric capacity (C33), institute
State and be linked on data storage space module (6) after processing 1 foot of chip three (U6), 4 feet and connecing, described
Process 2 foot ground connection of chip three (U6), 3 feet of described process chip three (U6) and the second inductance coil (L2)
Be linked into after concatenation on data storage space module (6), one end of described 35th resistance (R35) with
5 feet processing chip three (U6) are connected, the other end of described 35th resistance (R35) and data storage
Space module (6) is connected, and an end of described 37th resistance (R37) is connected on process chip three (U6)
5 feet on, the other end ground connection of described 37th resistance (R37), described 34th electric capacity (C34)
One end be connected with data storage space module (6), described 34th electric capacity (C34) another termination
Ground.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620176231.2U CN205621449U (en) | 2016-03-08 | 2016-03-08 | Solid state hard drives integrated circuit board and control circuit thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620176231.2U CN205621449U (en) | 2016-03-08 | 2016-03-08 | Solid state hard drives integrated circuit board and control circuit thereof |
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| CN205621449U true CN205621449U (en) | 2016-10-05 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105609125A (en) * | 2016-03-08 | 2016-05-25 | 芜湖金胜电子科技股份有限公司 | Solid-state disk integrated circuit board and control circuit thereof |
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2016
- 2016-03-08 CN CN201620176231.2U patent/CN205621449U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105609125A (en) * | 2016-03-08 | 2016-05-25 | 芜湖金胜电子科技股份有限公司 | Solid-state disk integrated circuit board and control circuit thereof |
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Effective date of registration: 20211207 Address after: 214000 room 1920, block C, Cygnus, No. 111, Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Wuxi Xinming Microelectronics Co.,Ltd. Address before: 241000 floor 2, building a, electronic industrial park, Wanchun Middle Road, Jiujiang Development Zone, Wuhu City, Anhui Province Patentee before: WUHU KINGSHARE ELECTRONIC TECHNOLOGY CO.,LTD. |
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