CN205611129U - Liquid cooling board - Google Patents
Liquid cooling board Download PDFInfo
- Publication number
- CN205611129U CN205611129U CN201620020908.3U CN201620020908U CN205611129U CN 205611129 U CN205611129 U CN 205611129U CN 201620020908 U CN201620020908 U CN 201620020908U CN 205611129 U CN205611129 U CN 205611129U
- Authority
- CN
- China
- Prior art keywords
- lower house
- casing
- water
- upper shell
- cooling plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a liquid cooling board, include last casing and lower casing and set up at the internal last casing of inferior valve, go up the casing with housing seal connects down, go up the copper aluminium composite substrate that the casing is integrated into one piece, water inlet and delivery port have been offered to casing head and the tail both ends down, go up the casing lower part and be equipped with a plurality of heat dissipation posts, it is a plurality of the even row of heat dissipation post establishes in last casing lower part and detains and establish in the first die cavity of the internal portion of inferior valve, it is protruding that the internal portion of inferior valve is equipped with the arc form. The utility model discloses the liquid cooling board radiating efficiency is high, the radiating effect is good, simple to operate and practical safety.
Description
Technical field
This utility model relates to a kind of water-cooling plate.
Background technology
Current electron trade quickly grows, and numerous electronic equipments all can relate to heat dissipation problem, electronic equipment dispels the heat to ensure the normal operation of electronic equipment.Radiating principle is to be taken away by the heat that electronics unit plate gives out by radiator, thus meets the temperature of electronics unit plate working environment.
But current water-filled radiator structure is complicated, installation difficulty；Secondly, price is higher and easily leaks, and uses dangerous；Further, radiating efficiency is low, it is impossible to comparatively fast distribute the heat of electronic equipment, affect the normal work of electronic equipment.
Summary of the invention
This utility model is for the deficiencies in the prior art, it is provided that a kind of radiating efficiency is high, the water-cooling plate of practical safety.
In order to solve above-mentioned technical problem, this utility model is addressed by following technical proposals:
A kind of water-cooling plate, including upper shell and lower house and the upper shell being arranged in lower house, described upper shell is tightly connected with described lower house, the Copper-Aluminum compound substrate that described upper shell is formed in one, described lower house head and the tail two ends offer water inlet and outlet, described upper shell bottom is provided with some thermal columns, and some described thermal columns are arranged uniformly and are located at upper shell bottom and be located in the first die cavity within lower house, is provided with arc shape protruding inside described lower house.
As further improvement of the utility model, in inner concavity and form the second die cavity at the initial and end of described lower house upper end.
Cylindrical-shaped structure logical in as further improvement of the utility model, described water inlet and outlet being, described water inlet and a length of 13mm of a diameter of 9mm of outlet, described water inlet and outlet.
As further improvement of the utility model, described thermal column is cylindrical structural.
As further improvement of the utility model, described lower house is internally formed the first die cavity in order to accommodating described thermal column.
Beneficial effect: compared with prior art, it has the advantages that this utility model
This utility model water-cooling plate radiating efficiency height, good heat dissipation effect, easy for installation and practical safety.
Described above is only the general introduction of technical solutions of the utility model, in order to better understand technological means of the present utility model, and can be practiced according to the content of description, and in order to above and other objects, features and advantages of the present utility model can be become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, describe in detail as follows.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of water-cooling plate.
Fig. 2 is the decomposition texture schematic diagram of water-cooling plate.
Detailed description of the invention
Refering to Fig. 1～2, a kind of water-cooling plate, including upper shell 10 and the upper shell 10 that is arranged in lower house 20, the Copper-Aluminum compound substrate that described upper shell 10 is formed in one, use integrated Copper-Aluminum compound substrate can replace plane copper substrate traditional in device encapsulation, reducing the cold design work of liquid of client and overall purchase cost and use safety, its heat dispersion improves 30～40% than fine aluminium substrate.
Described upper shell 10 bottom is provided with some thermal columns 40, specifically, thermal column 40 is one-body molded with upper shell 10, so can ensure that radiating effect, described thermal column 40 is arranged uniformly and is located at upper shell 10 bottom and be located in lower house 20 inside, so that better heat-radiation effect.In the present embodiment, thermal column 40 is cylindrical structural, in order to improve the heat dispersion of water-cooling plate.
Described lower house 20 head and the tail two ends offer water inlet 30 and outlet 80, and the effect of water inlet 30 and outlet 80 is flowing into and out of current.
Described lower house 20 is internal is provided with arc shape projection 50, it is simple to water-cooling plate is installed.
Described upper shell 10 is tightly connected with described lower house 20, and specifically, described upper shell 10 and described lower house 20 use the methods such as overall vacuum soldering, friction rabbling welding, electron beam weldering or O to be tightly connected.
Lower house 20 is internally formed the first die cavity 201 in order to accommodating described thermal column 40, it is simple to upper shell 10 and the assembling of lower house 20.
In inner concavity and form the second die cavity 202 at the initial and end of described lower house 20 upper end.The design of such structure can make the water circulation in water-cooling plate rapider, makes the better heat-radiation effect of water-cooling plate.
As preferably, the cylindrical-shaped structure that described water inlet 30 and outlet 80 are logical in being, described water inlet 30 and a diameter of 9mm of outlet 80, described water inlet 30 and a length of 13mm of outlet 80.So that flowing into and out of current is more smooth and easy.
Described upper shell 10 and a length of 235mm of lower house 20, the width of described upper shell 10 and lower house 20 is 56mm, and such structure is designed to make low cost of manufacture and the low price of water-cooled box,
In sum, this utility model water-cooling plate radiating efficiency height, good heat dissipation effect, easy for installation and practical safety.
Embodiment described above is only to be described preferred implementation of the present utility model, is not defined spirit and scope of the present utility model.On the premise of without departing from this utility model design concept; various modification that the technical solution of the utility model is made by this area ordinary person and improvement; protection domain of the present utility model all should be dropped into, the technology contents that this utility model is claimed, all record in detail in the claims.
Claims (5)
1. a water-cooling plate, it is characterized in that, including lower house (20) and the upper shell (10) that is arranged in lower house (20), described upper shell (10) is tightly connected with described lower house (20), the Copper-Aluminum compound substrate that described upper shell (10) is formed in one, described lower house (20) two ends from beginning to end offer water inlet (30) and outlet (80), described upper shell (10) bottom is provided with some thermal columns (40), some described thermal columns (40) row uniformly is located at upper shell (10) bottom and be located in lower house (20) inside, described lower house (20) is internal is provided with arc shape projection (50).
Water-cooling plate the most according to claim 1, it is characterised in that in inner concavity and form the second die cavity (202) at the initial and end of described lower house (20) upper end.
Water-cooling plate the most according to claim 1, it is characterized in that, the cylindrical-shaped structure that described water inlet (30) and outlet (80) are logical in being, described water inlet (30) and a diameter of 9mm of outlet (80), described water inlet (30) and a length of 13mm of outlet (80).
Water-cooling plate the most according to claim 1, it is characterised in that described thermal column (40) is cylindrical structural.
Water-cooling plate the most according to claim 4, it is characterised in that described lower house (20) is internally formed the first die cavity (201) in order to accommodating described thermal column (40).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620020908.3U CN205611129U (en) | 2016-01-11 | 2016-01-11 | Liquid cooling board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620020908.3U CN205611129U (en) | 2016-01-11 | 2016-01-11 | Liquid cooling board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205611129U true CN205611129U (en) | 2016-09-28 |
Family
ID=56961115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620020908.3U Expired - Fee Related CN205611129U (en) | 2016-01-11 | 2016-01-11 | Liquid cooling board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205611129U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109714935A (en) * | 2018-12-28 | 2019-05-03 | 广西南宁凯得利电子科技有限公司 | Controller for electric vehicle |
| CN112258990A (en) * | 2020-11-09 | 2021-01-22 | 安徽文香信息技术有限公司 | Electronic blackboard assembly based on heat dissipation structure and control system |
-
2016
- 2016-01-11 CN CN201620020908.3U patent/CN205611129U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109714935A (en) * | 2018-12-28 | 2019-05-03 | 广西南宁凯得利电子科技有限公司 | Controller for electric vehicle |
| CN112258990A (en) * | 2020-11-09 | 2021-01-22 | 安徽文香信息技术有限公司 | Electronic blackboard assembly based on heat dissipation structure and control system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205318312U (en) | Integral type water -cooling forced air cooling hybrid radiator | |
| CN202617585U (en) | Water-cooled heat dissipation device | |
| CN205611129U (en) | Liquid cooling board | |
| CN203840469U (en) | Set top box | |
| CN103607872B (en) | Radiating shell | |
| CN205830241U (en) | A kind of power inductance radiator | |
| CN202749364U (en) | Annular heat pipe section material superconducting radiator | |
| CN205664140U (en) | Possesses lamp plate from heat radiation structure's LED | |
| CN202433827U (en) | Integral water-cooled radiator | |
| CN203633006U (en) | Heat radiation housing connecting with heat radiation fin | |
| CN203633047U (en) | Heat radiation housing | |
| CN207474442U (en) | A kind of radiating enhanced integrated circuit packaging structure | |
| CN203633005U (en) | Connecting composition of heat radiation fin and housing | |
| CN203633007U (en) | Heat radiation fin and housing composition structure | |
| CN208690780U (en) | A kind of hermetic multiple heat dissipation power distribution box | |
| CN207478514U (en) | A kind of high-efficiency water cooling system of high pressure homogenizer | |
| CN206539931U (en) | A kind of heat dissipation LED combines lamp plate | |
| CN205648303U (en) | Power module heat radiation structure with power type components and parts | |
| CN206058098U (en) | A kind of heat radiator of computer CPU | |
| CN203204537U (en) | CPU heat-dissipation aluminum profile having functions of both air cooling and water cooling | |
| CN2490638Y (en) | Heat sink mould set with cooling device | |
| CN207471496U (en) | A kind of LED light aluminium alloy heat-dissipating casing | |
| CN209233637U (en) | A kind of junction box structure of motor | |
| CN207995613U (en) | Four-quadrant supply unit | |
| CN209116300U (en) | A kind of LED light with radiator structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160928 Termination date: 20180111 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |