CN205595314U - Needle is surveyed antiskid of quick -witted transmission device wafer and is gone out protection device - Google Patents
Needle is surveyed antiskid of quick -witted transmission device wafer and is gone out protection device Download PDFInfo
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- CN205595314U CN205595314U CN201620418417.4U CN201620418417U CN205595314U CN 205595314 U CN205595314 U CN 205595314U CN 201620418417 U CN201620418417 U CN 201620418417U CN 205595314 U CN205595314 U CN 205595314U
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- plummer
- push pedal
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Abstract
The utility model discloses a needle is surveyed antiskid of quick -witted transmission device wafer and is gone out protection device, including plummer and corresponding plummer lid, be provided with the brilliant boat that holds the wafer between plummer and the plummer lid, brilliant boat side opening, it is provided with infrared ray monitoring device and antiskid play device to correspond brilliant boat side open position on the plummer, infrared ray monitoring device includes that infra -red transmitter reaches complex receiver with it, infra -red transmitter set up in on the plummer, the receiver correspondence set up in directly over the infra -red transmitter, the antiskid go out the device mobilizable set up in brilliant boat side opening part, the antiskid go out the device with the cooperation of infrared ray monitoring device. The utility model has the advantages of: the utility model discloses utilize infrared ray monitoring device and the cooperation that the antiskid goes out the device to carry out effective protection to the wafer, press broken risk after having avoided the wafer roll -off, reduced the test loss, have good economic value.
Description
Technical field
This utility model relates to semiconductor element detection equipment technical field, is specifically related to a kind of pin and surveys machine transmission mechanism wafer anti-skidding protection device.
Background technology
Production and the manufacture of quasiconductor define perfect production procedure in constantly development.It is usually chip circuit to design (for realizing some function, design rational circuit) test of manufacture (being integrated on wafer through special process by the circuit)-wafer of-wafer (carries out functional test to thousands of chips integrated on wafer, eliminate the chip of part of functions defect) encapsulation of cutting and grinding (by being taken off by the chip cutting of functional test on wafer)-chip of-wafer (is packaged the chip taken off on wafer, protect its circuit the most protected from environmental) test of-finished chip (carries out functional test to the most packaged chip, eliminate the chip of functional defect).
During semiconductor production manufactures, the cost control of this chip is even more important by the test of wafer.The chip of functional defect can be found out by the test of wafer, does not enter in the encapsulation of later stage bigger cost, has saved the cost of entirety, and the most also manufacturing a upper operation wafer provides the direction of improvement.Therefore requisite important step during wafer sort is the whole manufacture process of quasiconductor.Wafer sort equipment is by manually to semi-automatic, then machine surveyed by full-automatic pin till now, and efficiency, stability, safety are all increasing exponentially.
Full-automatic pin is surveyed machine and is divided into two large divisions for outward appearance: machine table main body part and wafer transfer mechanism, machine table main body part is main operating part, test for wafer and probe card are positioned under the measuring head of test machine, and the groundwork of wafer transfer mechanism is wafer transfer in cassette to be used as test to carrier.
The work process of wafer transfer mechanism is: 1. open the upper cover of plummer, and the cassette that will be equipped with wafer puts into the plummer position of transmission mechanism elevator, after pushing button, makes elevator toward declining；2. mechanical arm puts in crystal-boat box grasping silicon wafer, wafer is put into pin and surveys on the carrier of owner's body portion.Carrier holds wafer by vacuum, detects wafer simultaneously, and wafer detection is complete, and wafer is sent back in crystal-boat box by mechanical arm from carrier.
Wafer is uniformly carried in crystal-boat box in whole manufacture process, and a cassette is a collection of, and a usual box carries 25 wafer.
Cassette is put in during test pin survey on board cassette plummer；In crystal-boat box, wafer is parallel is placed in cassette, and cassette is inwardly open.When wafer skids off outside box, now covering plummer lid, supporting gas bar can crush the wafer skidded off；It addition, wafer carrying platform is also had fragmentation risk toward when declining by elevator, cause bigger economic loss.
Utility model content
This utility model is for the deficiency of existing Zhen Ceji wafer transfer mechanism, it is proposed that machine transmission mechanism wafer anti-skidding protection device surveyed by a kind of pin, avoids wafer and skid off caused wafer breakage from cassette in course of conveying, effectively reduces test loss.
This utility model solves above-mentioned technical problem by the following technical solutions: machine transmission mechanism wafer anti-skidding protection device surveyed by pin, plummer lid including plummer and correspondence, the cassette holding wafer it is provided with between described plummer and plummer lid, described cassette side openings, on described plummer, corresponding described cassette side openings position is provided with ultrared sensing device and skid-proof device, described ultrared sensing device includes infrared transmitter and matched receptor, described infrared transmitter is arranged on described plummer, described receptor is correspondingly arranged in the surface of described infrared transmitter, described skid-proof device is movably arranged at described cassette side openings, described skid-proof device coordinates with described ultrared sensing device.
Wherein optimizing, described skid-proof device includes push pedal and the horizontal air cylinder being connected with described push pedal, and described push pedal is arranged at described cassette side openings, and described horizontal air cylinder drives described push pedal to carry out toward polyslip relative to cassette center.
Optimizing further, for strengthening push pedal, wafer is pushed effect, described push pedal is arc component, and the arcwall face of described push pedal is the most corresponding with described wafer side.
As the consideration to wafer with protection, the wooden partition of the corresponding described cassette side of described push pedal is provided with soft bed course.
Concrete, described soft bed course is any one in spongy layer or rubber layer or layer of silica gel.
Use wafer anti-skidding guard method of the present utility model, comprise the steps:
A) monitoring process is monitored at cassette side openings by ultrared sensing device, ultrared sensing device produces continuous signal, when there being wafer to skid off, the wafer that the continuous signal of ultrared sensing device is skidded off stops, now, ultrared sensing device sends wafer to controller and skids off information；
B) protection process controller receives after the wafer that step a middle infrared (Mid-IR) detector sends skids off information; propelling movement instruction is sent to skid-proof device; the wafer skidded off is pushed in cassette by described skid-proof device; when infrared ray detector recovers signal communication; show that wafer is pushed back; controller sends to skid-proof device and recalls instruction, and skid-proof device is recalled, and i.e. completes to protect operation.
The utility model has the advantage of: this utility model utilizes the cooperation of ultrared sensing device and skid-proof device; the transmission mechanism that pin is surveyed machine is improved; thus wafer has been carried out effective protection; avoid the risk crushed by support gas bar or body after wafer skids off; decrease test loss, there is good economic worth.
Accompanying drawing explanation
Fig. 1 is overall structure schematic diagram of the present utility model；
Position relationship schematic diagram when Fig. 2 is that in this utility model embodiment, wafer is static；
Position relationship schematic diagram when Fig. 3 is that in this utility model embodiment, wafer skids off；
Fig. 4 is position relationship schematic diagram during push pedal promotion wafer in this utility model embodiment.
Detailed description of the invention
As shown in Figure 1, machine transmission mechanism wafer anti-skidding protection device surveyed by pin, plummer lid 1 including plummer 5 and correspondence, described plummer 5 and plummer lid 1 connect by supporting gas bar 3, the cassette 8 holding wafer 6 it is provided with between described plummer 5 and plummer lid 1, described cassette 8 side openings, on described plummer 5, corresponding described cassette 8 side openings position is provided with ultrared sensing device and skid-proof device, described ultrared sensing device includes infrared transmitter 4 and matched receptor 2, described infrared transmitter 4 is arranged on described plummer 5, described receptor 2 is correspondingly arranged in the surface of described infrared transmitter 4, described skid-proof device is movably arranged at described cassette 8 side openings, described skid-proof device coordinates with described ultrared sensing device.
Described skid-proof device includes push pedal 7 and the horizontal air cylinder 9 being connected with described push pedal 7, and described push pedal 7 is arranged at described cassette 8 side openings, and described horizontal air cylinder 9 drives described relative cassette 8 center of push pedal 7 to carry out toward polyslip.
For strengthening the push pedal 7 effect that pushes to wafer 6, described push pedal 7 is designed as arc component, and the arcwall face of described push pedal 7 is the most corresponding with described wafer 6 side.
As the consideration to wafer with protection, the wooden partition of corresponding described cassette 8 side of described push pedal 7 being provided with soft bed course 10, described soft bed course is any one in spongy layer or rubber layer or layer of silica gel.
Work process of the present utility model is as in Figure 2-4: ultrared sensing device is monitored (such as Fig. 2) at cassette side openings, when there being wafer to skid off, the infrared ray that infrared transmitter on plummer sends is blocked, the receptor at top does not receives signal (such as Fig. 3), now, ultrared sensing device sends instruction by controller horizontal air cylinder in skid-proof device, push pedal is promoted to be pushed by the wafer skidded off in cassette (as shown in Figure 4), when infrared ray detector recovers signal communication, show that wafer is pushed back, push pedal is recalled, complete to protect operation.
This utility model has carried out effective protection to wafer, it is to avoid the risk that wafer is supported gas bar after skidding off or body crushes, and decreases test loss, has good economical and practical value.
The foregoing is only the preferred embodiment that this utility model is created; not in order to limit this utility model creation; any amendment, equivalent and the improvement etc. made within all spirit in this utility model creation and principle, within should be included in the protection domain that this utility model is created.
Claims (5)
1. machine transmission mechanism wafer anti-skidding protection device surveyed by pin, including the plummer lid of plummer and correspondence,
Being provided with the cassette holding wafer, described cassette side openings between described plummer and plummer lid, it is special
Levy and be, on described plummer corresponding described cassette side openings position be provided with ultrared sensing device and
Skid-proof device, described ultrared sensing device includes infrared transmitter and matched receptor, described
Infrared transmitter is arranged on described plummer, and described receptor is just being correspondingly arranged in described infrared transmitter
Top, described skid-proof device is movably arranged at described cassette side openings, described skid-proof device
Coordinate with described ultrared sensing device.
2. machine transmission mechanism wafer anti-skidding protection device surveyed by pin as claimed in claim 1, it is characterised in that
Described skid-proof device includes push pedal and the horizontal air cylinder being connected with described push pedal, and described push pedal is arranged at described
At cassette side openings, described horizontal air cylinder drives described push pedal to carry out toward polyslip relative to cassette center.
3. machine transmission mechanism wafer anti-skidding protection device surveyed by pin as claimed in claim 2, it is characterised in that
Described push pedal is arc component, and the arcwall face of described push pedal is the most corresponding with described wafer side.
4. pin surveys machine transmission mechanism wafer anti-skidding protection device, its feature as claimed in claim 2 or claim 3
It is, the wooden partition of the corresponding described cassette side of described push pedal is provided with soft bed course.
5. machine transmission mechanism wafer anti-skidding protection device surveyed by pin as claimed in claim 4, it is characterised in that
Described soft bed course is any one in spongy layer or rubber layer or layer of silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620418417.4U CN205595314U (en) | 2016-05-09 | 2016-05-09 | Needle is surveyed antiskid of quick -witted transmission device wafer and is gone out protection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620418417.4U CN205595314U (en) | 2016-05-09 | 2016-05-09 | Needle is surveyed antiskid of quick -witted transmission device wafer and is gone out protection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205595314U true CN205595314U (en) | 2016-09-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201620418417.4U Active CN205595314U (en) | 2016-05-09 | 2016-05-09 | Needle is surveyed antiskid of quick -witted transmission device wafer and is gone out protection device |
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| Country | Link |
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| CN (1) | CN205595314U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810561A (en) * | 2016-05-09 | 2016-07-27 | 安徽晶新微电子有限公司 | Sliding prevention protection device and protection method for wafer of prober transfer mechanism |
| CN109637946A (en) * | 2017-10-09 | 2019-04-16 | 长鑫存储技术有限公司 | Semiconductor batch processing production equipment and semiconductor batch processing system |
-
2016
- 2016-05-09 CN CN201620418417.4U patent/CN205595314U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810561A (en) * | 2016-05-09 | 2016-07-27 | 安徽晶新微电子有限公司 | Sliding prevention protection device and protection method for wafer of prober transfer mechanism |
| CN109637946A (en) * | 2017-10-09 | 2019-04-16 | 长鑫存储技术有限公司 | Semiconductor batch processing production equipment and semiconductor batch processing system |
| CN109637946B (en) * | 2017-10-09 | 2020-09-08 | 长鑫存储技术有限公司 | Semiconductor batch processing production equipment and semiconductor batch processing system |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200415 Address after: 221000 north side of Liaohe Road and west side of Huashan Road, Pizhou Economic Development Zone, Pizhou City, Xuzhou City, Jiangsu Province Patentee after: JIANGSU AOXIN MICROELECTRONIC Co.,Ltd. Address before: 234000 Administrative Committee of hi tech Zone, 8 hi tech tower, Suzhou Road, Anhui Patentee before: ANHUI JINGXIN MICROELECTRONICS Co.,Ltd. |