CN205592253U - A bonding equipment for treating piece that bonds and handling device thereof - Google Patents
A bonding equipment for treating piece that bonds and handling device thereof Download PDFInfo
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- CN205592253U CN205592253U CN201620367600.6U CN201620367600U CN205592253U CN 205592253 U CN205592253 U CN 205592253U CN 201620367600 U CN201620367600 U CN 201620367600U CN 205592253 U CN205592253 U CN 205592253U
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- fixture
- base
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- handler
- substrate
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Abstract
The utility model is suitable for a bonding means field provides the bonding equipment waiting to bond of being used for that is used for bonding connection's handling device and uses this handling device. The handling device that should be used for bonding connection is including the base and the splint that are the branch body structure, and the base is including the holding surface that is used for supporting the anchor clamps that the installation remained to be bonded, the holding surface of splint and base is mutually supported to detachably centre gripping base plate and anchor clamps, install the guide bar of perpendicular to holding surface on the base, be equipped with the slide opening that supplies the guide bar to pass on the splint. Through setting up base and splint, back is installed in anchor clamps when waiting to bond, can install on the base, again with the base plate rotation on anchor clamps, through behind base and splint clamp clip utensil and the base plate, can bond on the base plate waiting to bond, separate bottom plate and splint again to the messenger treats the bonding piece and installs on the base plate, and is efficient, with low costs.
Description
Technical field
This utility model belongs to binding appts field, particularly relate to a kind of handler for bonding connection and
Use the bonding apparatus for treating bond of this handler.
Background technology
In industry manufactures, in sensor encapsulation, electronic components, substrate is installed some annulars
Part waits bond, as installed viscous lid etc. on substrate.Installing when bond on substrate, being usually will
Treat that the end face of bond is bonded on substrate.The mounting means of prior art is: arrange the first fixture, by base
Plate is fixed in the first fixture;Second fixture is set, treats that bond is arranged in the second fixture by some, then
By point gum machine to the end face point glue respectively treating bond in the second fixture, then the first fixture is placed on second
On fixture, and the first fixture and the second fixture are toasted, make to treat the adhesive curing of bond end face, will treat
Bond is bonded on substrate, then takes off the first fixture and the second fixture.But, when glue, if pin
Head translational speed is fast, and figure the most for dispensing glue is imperfect, and the bonding quality of bond is treated in impact, thus gluing is imitated
Rate is low;Simultaneously when baking, typically will organize the first fixture more and the second fixture will toast simultaneously, need a large amount of folder
Tool, cost is high.
Utility model content
The purpose of this utility model is to provide a kind of handler for bonding connection, it is intended to solve existing
When bond is adhered on substrate, the problem that efficiency is low, cost is high.
The purpose of this utility model is to provide a kind of handler for bonding connection, described handler
Including the base in Split type structure and clamping plate, described base includes needing the fixture of bond for supporting to install
Supporting surface;The described supporting surface of described clamping plate and described base cooperates, and removably clamps base
Plate and described fixture;The guide post being perpendicular to described supporting surface is installed on described base, described clamping plate set
There is the slide opening passed for described guide post.
Further, each described slide opening is provided with the axle sleeve coordinated with described guide post.
Further, described guide post is two, and is respectively arranged at the opposite sides of described base.
Further, described base is provided with some for positioning described fixture and the alignment pin of described substrate,
Some described alignment pins are positioned at the position on described base for each side pair of substrate described in backstop;Described clamping plate
On offer for each described alignment pin insert jack.
Further, described base is in the shape of a frame.
Further, the opposite sides of described clamping plate offers for expose described substrate edges first lack
Mouthful.
Further, the opposite sides of described clamping plate offers the second breach for exposing described substrate edges.
Further, described clamping plate are provided with some legs in one side away from described base.
Further, described handler is a hand-operating device.
This utility model is by arranging base and clamping plate, after being arranged in fixture until bond, can install
On base, then substrate is rotated on fixture, after base and clamping plate clamping fixture and substrate, permissible
To treat that bond is bonded on substrate, then base plate will be separated with clamping plate, so that treating that bond is arranged on substrate
On, efficiency is high, low cost.
Another purpose of the present utility model is to provide a kind of bonding apparatus for treating bond, including as above
Described handler, and for loading the fixture treating bond;Described fixture and described handler in
Split type structure, and be releasably supported on described base;Described fixture and described clip board engagement, clamp institute
State and treat bond.
Further, described fixture offers some through holes treating bond described in accommodating, described logical
Hole is provided with described in support the step surface treating bond.
Further, described step surface apart from the height of the end face of described fixture be less than described in treat the length of bond
Degree 0.2mm-0.3mm.
Further, each described through hole includes epimere and hypomere, and the diameter of described epimere is more than described hypomere
Diameter, the upper surface of described hypomere is described step surface.
Further, described fixture includes lower plate and the upper plate being installed in described lower plate, each described through hole
Epimere is opened in described lower plate, and the epimere of each described through hole is opened on described upper plate.
Further, on described fixture, correspondence offers the perforate passed for described guide post.
Further, described base is provided with some alignment pins for positioning described fixture and substrate, some
Described alignment pin is positioned at the position on described base for each side pair of backstop substrate;Offer on described clamping plate
The jack inserted for each described alignment pin.
Further, described fixture offers respectively with the hole, location of each described detent fit.
This utility model supports treat bond by arranging fixture, and offers through hole on fixture, by respectively
Through hole positions treats bond, such that it is able to respectively treating gluing on bond easily, in order to bonding by respectively treating
Part is bonded on substrate, and efficiency is high.It addition, by arranging handler, when until bond after gluing,
By fixture and wherein each treat that bond is connected with substrate bonding by handler, then by substrate and respectively wait to glue
Fitting removes from fixture, thus completes respectively to treat that bond is bonding with substrate and be connected, and efficiency is high, and needs
Fixture few, low cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of bonding apparatus for treating bond that this utility model embodiment provides
Figure;
Fig. 2 is the structural representation of fixture in the bonding apparatus treat bond of Fig. 1;
Fig. 3 is the decomposition texture schematic diagram of fixture in Fig. 2;
Fig. 4 be Fig. 1 for treat the bonding apparatus of bond coordinate by treat that bond is bonded on substrate point
Solution structure schematic diagram;
Fig. 5 is the knot when fixture in the bonding apparatus of bond and substrate are installed on base of Fig. 1
Structure schematic diagram;
Fig. 6 is that the clamping plate of handler in the bonding apparatus treat bond of Fig. 1 clamp with base engagement
Structural representation when fixture and substrate;
Fig. 7 be the handler of Fig. 6 clamping plate and base engagement clamping fixture and substrate after structure when being inverted
Schematic diagram;
Fig. 8 be Fig. 7 handler in base and fixture take out after the structural representation of substrate and clamping plate,
Figure shows on substrate one and treats bond.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing
And embodiment, this utility model is further elaborated.Should be appreciated that described herein specifically
Embodiment, only in order to explain this utility model, is not used to limit this utility model.
Referring to Fig. 1 to Fig. 8, it is a kind of for treating that the bonding of bond sets that this utility model embodiment provides
Standby 100, including for the handler 50 of bonding connection and fixture 20;Fixture 20 and handler 50
In Split type structure.Wherein, fixture 20 treats bond 91 for support.Above-mentioned handler 50 includes base
51 and clamping plate 52.Base 51 and clamping plate 52 are in Split type structure;Base 51 includes needing for supporting installation
The supporting surface 510 of the fixture 20 of bond 91, is arranged on fixture 20 on base 51 to facilitate.Clamping plate
52 and the supporting surface 510 of base 51 cooperate, and removably clamping substrate 92 and fixture 20.The end
Being provided with guide post 511 on seat 51, guide post 511 is perpendicular to the supporting surface 510 of base 51, clamping plate 52
On offer the slide opening passed for guide post 511.
Support treat bond 91 by arranging fixture 20, good for glue being coated in can be treated bond 91
End face on, it is ensured that glue-line is good, and can be simultaneously to multiple end face gluings treating bond 91, it is achieved fast
Speed is to treating the end face gluing of bond 91, and efficiency is high.
Handler 50 for respectively treating that bond 91 is adhered to substrate 92 after gluing in fixture 20,
And the bonding substrate 92 needing bond 91 is taken out from fixture 20, in order to subsequent cure processes.Work as dress
Handler 50, respectively after the end face gluing of bond 91, will can respectively treat that bond 91 is together with fixture 20 1
Rise and be arranged in handler 50, then installation base plate on fixture 20, make substrate and fixture 20 are respectively waited to glue
Fitting 91 is bonding to be connected.Then by bonding all-in-one-piece substrate 92 and bond is treated by handler 50
91 separate with fixture 20, and can take out from fixture 20, complete to treat that bond 91 is bonded in base by some
On plate.Subsequently, the bonding substrate needing bond 91 taken out can be positioned in stove baking, so that treating
Glue solidification on bond 91, makes to treat that bond 91 is firmly bonded on substrate.
By handler 50, after the gluing that will arrange in fixture 20, respectively treat bond 91 and substrate bonding
It is connected, then by bonding all-in-one-piece substrate and respectively treat that bond 91 separates with fixture 20 and from handler 50
Upper removal, thus complete respectively to treat that bond 91 is bonding with substrate and be connected, efficiency is high.Use this utility model
Handler 50 during separating clamp 20, can avoid affecting substrate 92 and respectively treating bond
Connection between 91, thus keep the adhesive effect that it is good.After separating with fixture 20, bonding integral
Substrate 92 and respectively treat that bond 91 can carry out follow-up cured independently, and without fixture 20 or its
Its fixture is supported.Accordingly, it would be desirable to fixture 20 quantity few, low cost.
Further, refer to Fig. 2 and Fig. 3, fixture 20 offer some through holes 23, in order to install and
Bond 91 is treated in support.Each through hole 23 is provided with step surface 233, when treating that bond 91 is arranged on by some
Time in fixture 20, can treat that bond 91 is separately mounted in each through hole 23, by each through hole by some
Step surface 233 in 23 supports respectively treats bond 91, in order to respectively treating to carry out on bond 91 gluing.
In an example of the present utility model, treating that bond 91 is cylindrical, one of its axial end face is for bonding
Face.
Further, step surface 233 apart from the height of the end face of fixture 20 less than treating the length of bond 91
Degree 0.2mm-0.3mm.The height of step surface 233 to fixture 20 end face is arranged less than treating bond 91
Length 0.2mm-0.3mm, can make to treat that the end face of bond 91 protrudes the end face of fixture 20, thus just
In to the end face gluing treating bond 91.Alternatively, it is also possible to conveniently substrate is placed on these treats bond 91
On, bond 91 is bonded on substrate to make these treat.
Further, in the present embodiment, on fixture 20, each through hole 23 includes epimere 231 and hypomere 232,
The diameter of epimere 231 is more than the diameter of hypomere 232, and the upper surface of hypomere 232 is above-mentioned step surface 233.
When being placed in through hole 23 until bond 91, treat that bond 91 is placed in the epimere 231 of through hole 23, and lead to
Cross step surface 233 to support and treat bond 91.
Further, in embodiment as shown in Figure 3, fixture 20 includes lower plate 22 and is installed on lower plate 22
On upper plate 21, the hypomere 232 of each through hole 23 is opened in lower plate 22, the epimere 231 of each through hole 23
It is opened on upper plate 21.Fixture 20 uses upper plate 21 and lower plate 22 form, upper plate 21 is offered some
Upper hole, lower plate 22 is offered some lower opening, and when upper plate 21 is fixed in lower plate 22, upper hole is divided with lower opening
Not corresponding, combination forms above-mentioned through hole 23, wherein, the epimere that upper hole is this through hole 23 231 on upper plate 21,
Lower opening in lower plate 22 is the hypomere 232 of this through hole 23.The structure of this fixture 20 is arranged is easy to processing, with
As long as time control the thickness of upper plate 21 well, i.e. can control well step surface 233 apart from fixture 20 end face away from
From.It addition, when fixture 20 is stained with glue, it is also possible to convenient for cleaning, so that step surface 233 keeps dry
Only.Upper plate 21 can be fixed by screws in lower plate 22.
Refer to Fig. 4, Fig. 5 and Fig. 6, in an example of the present utility model, when fixture 20 is respectively treated
After bond 91 gluing, can be by fixture 20 and thereon treat that bond 91 entirety moves on base 51.
Afterwards, then substrate 92 is covered on fixture 20, make substrate 92 and fixture 20 treats bond 91 end face
Contact.And treat that the end face of bond 91 is provided with glue-line, such that it is able to bonding with substrate 92.Then by clamping plate
52 are arranged on base 51, so that base 51 and clamping plate 52 clamp fixture 20 and substrate thereon 92,
Make respectively to treat that bond 91 is preferably bonded on substrate 92.
Referring to Fig. 2, Fig. 4 and Fig. 5, in an example of the present utility model, on fixture 20, correspondence is opened
It is provided with the perforate 24 passed for guide post 511.Enterprising when fixture 20 is arranged on base 51, can make to lead
To bar 511 through the perforate 24 on fixture 20, thus conveniently fixture 20 is positioned and is arranged on base 51
On.In another example of the present utility model, clamping plate 52 offer respectively and supplies guide post 511 to pass
Slide opening (does not marks in figure).When clamping plate 52 are installed, guide post 511 can be made through the cunning on clamping plate 52
Hole, thus clamping plate 52 are guided, make clamping plate 52 preferably be arranged on base 51.
See also Fig. 6, Fig. 7 and Fig. 8, after being bonded on substrate 92 until bond 91, can be by
It is clamped with fixture 20, treats that the handler 50 of bond 91 and substrate 92 reverses, make setting need bonding
The fixture 20 of part 91 is placed on substrate 92.As shown in Figure 7, now clamping plate 52 support substrate respectively
92, arrange and need the fixture 20 of bond 91 and base 51.Subsequently, then by base 51 and fixture 20 1
Rise and take out from clamping plate 52, thus obtain bonding all-in-one-piece and treat bond 91 and substrate 92.In this practicality
In a novel example, base 51 and fixture 20 are kept one, and makes it together along vertical substrate 92
Direction, opposing clamping plate 52 is gradually disengaged.In uninstall process, by the guide effect of guide post 511,
Bond 91 and substrate 92 swing to be possible to prevent the most bonding all-in-one-piece of fixture 20 to treat.Therefore, taking out
When fixture 20 and base 51, can make to be arranged in fixture 20 through hole 23 treat bond 91 smoothly from
The through hole 23 of fixture 20 spins off, thus avoids fixture 20 in uninstall process to destroy and treat bond 91
And the bonding connection between substrate 92, make to treat good being bonded on substrate 92 of bond 91.
Further, each slide opening is provided with the axle sleeve 521 coordinated with guide post 511.Cunning at clamping plate 52
Mounting sleeve 521 in hole, can facilitate the processing of slide opening, improve axle sleeve 521 and guide post 511 simultaneously
Quality of fit, so that guide post 511 coordinates with axle sleeve 521 guides base 51 and clamping plate 52 smoothly
Between relative movement.
Further, in the present embodiment, guide post 511 is two, and is respectively arranged at the relative of base 51
Both sides.Opposite sides at base 51 arranges guide post 511, to ensure that guide post 511 steadily guides base
Relative movement between 51 and clamping plate 52.In other embodiments, guide post 511 can also arrange more
Root.
Further, base 51 is provided with some alignment pins 512.In an example of the present utility model,
The hole, location 26 coordinated respectively is offered with each alignment pin 512 on fixture 20.When fixture 20 is arranged on base
Time on 51, by alignment pin 512 being inserted in hole 26, corresponding location, thus fixture 20 can be positioned.
It addition, when substrate 92 is arranged on fixture 20, some alignment pins 512 can be with each side of backstop substrate 92
Limit, thus substrate 92 is positioned, then these alignment pins 512 are positioned on base 51 for backstop substrate
The position of 92 each sides pair.In another example of the present utility model, clamping plate 52 are arranged for each location
The jack 522 that pin 512 inserts.Alignment pin 512 when clamping plate 52 are arranged on base 51, on base 51
Clamping plate 52 can be positioned.In some other embodiment, it is also possible to support shelves by each alignment pin 512
The four side of fixture 20, to position fixture 20.
Further, in the present embodiment, base 51 is in the shape of a frame.Base 51 is arranged in the shape of a frame, works as fixture
20 when being arranged on base 51, base 51 can be made to support four limits of fixture 20, and make fixture 20
On each through hole 23 be positioned at the shaped as frame hollow position of base 51, when needs take out base 51 and fixture 20,
The state treating bond 91 can be checked, in order to treat that bond 91 is preferably from the through hole 23 of fixture 20
Come off, it is ensured that treat that bond 91 is bonded on substrate 92.
Further, the opposite sides of clamping plate 52 offers the first breach for exposing substrate 92 edge
523.When clamping plate 52 are arranged on base 51, when clamping substrate 92, the first breach 523 can be passed through
Check the state of substrate 92, prevent folder bad and moving substrate 92.In like manner, the opposite sides of clamping plate 52 is opened
It is provided with the second breach 524 for exposing substrate 92 edge.
Further, clamping plate 52 are provided with some legs 525 in one side away from base 51.Work as base
51 with clamping plate 52 clamping fixture 20 and substrate 92 after, when upset base 51 is with clamping plate 52, can pass through
Leg 525 supports clamping plate 52 and fixture 20, treats bond 91 and substrate 92, it is ensured that clamping plate 52
Steadily.In the present embodiment, leg 525 is four, is separately positioned on the corner of clamping plate 52.
Refer to Fig. 1 and Fig. 2, being used for when the bonding apparatus 100 of bond uses of the present embodiment, can
Will treat that bond 91 is arranged in the through hole 23 of fixture 20.Again to treating bond 91 on fixture 20
End face gluing.Refer to Fig. 4 and Fig. 5, on fixture 20 respectively after the end face gluing of bond 91,
Setting needs bond 91 fixture 20 to be arranged on base 51, then is placed on fixture 20 by substrate 92,
With in fixture 20 arrange treat that bond 91 contacts.Refer to Fig. 6 and Fig. 7, then clamping plate 52 are pacified
It is contained on base 51, makes clamping plate 52 coordinate with base 51 and clamp substrate 92 and setting needs bond 91
Fixture 20 so that substrate 92 with in fixture 20 arrange treat that bond 91 contacts further, bonding
Connect.Refer to Fig. 7 and Fig. 8, clamping plate 52 overturn with base 51, make clamping plate 52 support base 51,
Again base 51 is removed along guide post 511 with fixture 20 from clamping plate 52, make to treat that bond 91 is from fixture
The through hole 23 of 20 comes off, it is ensured that treat that bond 91 is bonded on substrate 92, complete to treat bond 91
It is arranged on substrate 92.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model,
All any amendment, equivalent and improvement etc. made within spirit of the present utility model and principle, all should
Within being included in protection domain of the present utility model.
Claims (17)
1. the handler for bonding connection, it is characterised in that described handler includes in split
The base of structure and clamping plate, described base includes needing the supporting surface of fixture of bond for supporting to install;
The described supporting surface of described clamping plate and described base cooperates, and removably clamping substrate and described folder
Tool;Being provided with the guide post being perpendicular to described supporting surface on described base, described clamping plate are provided with described in confession and lead
The slide opening passed to bar.
2. handler as claimed in claim 1, it is characterised in that be provided with and institute in each described slide opening
State the axle sleeve that guide post coordinates.
3. handler as claimed in claim 1, it is characterised in that described guide post is two, and point
It is not arranged at the opposite sides of described base.
4. the handler as described in any one of claim 1-3, it is characterised in that described base is provided with
Some for positioning described fixture and the alignment pin of described substrate, some described alignment pins are positioned on described base
Position for each side pair of substrate described in backstop;Offer on described clamping plate for the insertion of each described alignment pin
Jack.
5. the handler as described in any one of claim 1-3, it is characterised in that described base is in the shape of a frame.
6. the handler as described in any one of claim 1-3, it is characterised in that described clamping plate relative
The first breach for exposing described substrate edges is offered on both sides.
7. the handler as described in any one of claim 1-3, it is characterised in that described clamping plate relative
Both sides offer the second breach for exposing described substrate edges.
8. the handler as described in any one of claim 1-3, it is characterised in that on described clamping plate away from
Some legs are installed in the one side of described base.
9. the handler as described in any one of claim 1-3, it is characterised in that described handler is
One hand-operating device.
10. one kind for treating the bonding apparatus of bond, it is characterised in that include such as claim 1-3 and
Handler according to any one of 5-9, and for loading the fixture treating bond;Described fixture and institute
Stating handler is Split type structure, and is releasably supported on described base;Described fixture and described clamping plate
Coordinate, described in clamping, treat bond.
11. bonding apparatus as claimed in claim 10, it is characterised in that offer some on described fixture
Treat the through hole of bond described in accommodating, described through hole is provided with described in support the step treating bond
Face.
12. bonding apparatus as claimed in claim 11, it is characterised in that described step surface is apart from described folder
The height of end face of tool treats length 0.2mm-0.3mm of bond described in being less than.
13. bonding apparatus as described in claim 11 or 12, it is characterised in that each described through hole includes
Epimere and hypomere, the diameter of described epimere is more than the diameter of described hypomere, and the upper surface of described hypomere is described
Step surface.
14. bonding apparatus as claimed in claim 13, it is characterised in that described fixture includes lower plate and peace
Being loaded on the upper plate in described lower plate, the epimere of each described through hole is opened in described lower plate, each described through hole
Epimere is opened on described upper plate.
15. bonding apparatus as described in claim 11 or 12, it is characterised in that corresponding on described fixture
Offer the perforate passed for described guide post.
16. bonding apparatus as described in claim 11 or 12, it is characterised in that described base is provided with
Some alignment pins for positioning described fixture and substrate, some described alignment pins be positioned on described base for
The position of each side pair of backstop substrate;The jack inserted for each described alignment pin is offered on described clamping plate.
17. bonding apparatus as claimed in claim 16, it is characterised in that offer on described fixture respectively
Hole, location with each described detent fit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201620367600.6U CN205592253U (en) | 2016-04-27 | 2016-04-27 | A bonding equipment for treating piece that bonds and handling device thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201620367600.6U CN205592253U (en) | 2016-04-27 | 2016-04-27 | A bonding equipment for treating piece that bonds and handling device thereof |
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Publication Number | Publication Date |
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CN205592253U true CN205592253U (en) | 2016-09-21 |
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CN201620367600.6U Active CN205592253U (en) | 2016-04-27 | 2016-04-27 | A bonding equipment for treating piece that bonds and handling device thereof |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107956775A (en) * | 2017-12-19 | 2018-04-24 | 广东美的厨房电器制造有限公司 | The panel assembly of fitting device and gas kitchen ranges |
CN109926948A (en) * | 2017-12-19 | 2019-06-25 | 宁波方太厨具有限公司 | For the adhesive tool with fluted workpiece |
CN110604357A (en) * | 2018-06-14 | 2019-12-24 | 广州碧绿丝生物科技有限公司 | Wig bonding device and wig bonding method |
-
2016
- 2016-04-27 CN CN201620367600.6U patent/CN205592253U/en active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107956775A (en) * | 2017-12-19 | 2018-04-24 | 广东美的厨房电器制造有限公司 | The panel assembly of fitting device and gas kitchen ranges |
CN109926948A (en) * | 2017-12-19 | 2019-06-25 | 宁波方太厨具有限公司 | For the adhesive tool with fluted workpiece |
CN107956775B (en) * | 2017-12-19 | 2024-02-20 | 广东美的厨房电器制造有限公司 | Tool equipment and panel assembly of gas cooker |
CN110604357A (en) * | 2018-06-14 | 2019-12-24 | 广州碧绿丝生物科技有限公司 | Wig bonding device and wig bonding method |
CN110604357B (en) * | 2018-06-14 | 2022-07-22 | 广州碧绿丝生物科技有限公司 | Wig bonding device and wig bonding method |
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