CN205584499U - Packaging structure and microphone - Google Patents
Packaging structure and microphone Download PDFInfo
- Publication number
- CN205584499U CN205584499U CN201620180726.2U CN201620180726U CN205584499U CN 205584499 U CN205584499 U CN 205584499U CN 201620180726 U CN201620180726 U CN 201620180726U CN 205584499 U CN205584499 U CN 205584499U
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- China
- Prior art keywords
- plated
- pcb board
- encapsulating structure
- hole
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title abstract 5
- 239000004020 conductor Substances 0.000 claims description 23
- 239000007943 implant Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 claims 2
- 239000002305 electric material Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 238000004891 communication Methods 0.000 abstract description 3
- 230000005611 electricity Effects 0.000 abstract description 2
- 125000004122 cyclic group Chemical group 0.000 abstract 5
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model relates to a packaging structure and microphone. This packaging structure includes: PCB board and become sealed cavity's shell with the PCB plate -type is provided with cyclic annular conducting layer on the PCB board, the shell is fixed on the PCB board through this ring -type conducting layer, the PCB inboard is provided with the earthing terminal, and the position that lies in cyclic annular conducting layer on the PCB board is provided with a plurality of plated -through holes that have a perfect understanding cyclic annular conducting layer and earthing terminal, and a plurality of plated -through holes distribute on the extending direction of cyclic annular conducting layer, and cyclic annular conducting layer links together through plated -through hole and earthing terminal electricity. This microphone is equipped with above -mentioned packaging structure. This packaging structure is equipped with a plurality of plated -through holes, and these a plurality of plated -through holes make the shell realize electromagnetic shield's effect on not only can being electrically connected to the earthing terminal with the shell, but also can be in PCB plate thickness orientation form effective shielding to the electromagnetism noise of external communication.
Description
Technical field
This utility model relates to acoustic energy switch technology field, more specifically, this utility model relates to one
Encapsulating structure and apply the mike of this encapsulating structure.
Background technology
Mike is in use easily subject to the impact of external electromagnetic noise, produces noise, reduces
The experience sense of user.At present, the encapsulating structure of mike by connecting realization by earth terminal with shell
The shielding of external electromagnetic noise, general first punching on pcb board, then by lead-in wire by this hole, will
Shell electrically connects with the earth terminal on pcb board, and electromagnetic noise is eliminated by earth terminal.But,
This encapsulating structure integrated level is low, additionally, this structual shield effect is poor, electromagnetic noise can pass through
The thickness direction of pcb board enters in mike.
Utility model content
A purpose of the present utility model is to provide the new solution of a kind of encapsulating structure.
According to first aspect of the present utility model, it is provided that a kind of encapsulating structure.This encapsulating structure includes:
Including: pcb board and the shell with pcb board formation sealing inner chamber, described pcb board is provided with ring
Shape conductive layer, described shell is fixed on described pcb board by this annular conductive layer；Described pcb board
Inside being provided with earth terminal, the position that described pcb board is positioned at annular conductive layer is provided with through described ring
Shape conductive layer and multiple plated-through holes of described earth terminal, the plurality of plated-through hole is led ring-type
Being distributed on the bearing of trend of electric layer, described annular conductive layer is electrically connected with earth terminal by plated-through hole
Together.
Preferably, the plurality of plated-through hole is evenly distributed in described annular conductive layer.
Preferably, described shell is electrically connected with described annular conductive layer by conducting resinl.
Preferably, described plated-through hole includes the conductor layer being positioned at plated-through hole inwall.
Preferably, the material of described conductor layer is gold, silver, copper or aluminum.
Preferably, in described plated-through hole, it is provided with implant.
Preferably, described implant is non-conducting material.
Preferably, described non-conducting material is resin.
Preferably, described implant is conductive material, and described conductive material and conductor layer are one.
A kind of mike is provided according to second aspect of the present utility model.This mike includes: be subject to
The encapsulating structure that words device and this utility model provide, described receiver is arranged in described inner chamber, described
Receiver is connected with described pcb board signal.
One of the present utility model has technical effect that, this encapsulating structure is provided with multiple plated-through hole,
Shell not only can be electrically connected to ground on end by the plurality of plated-through hole, makes shell realize electromagnetic screen
The effect covered；But also on the thickness direction of pcb board, the electromagnetic noise of external communication can be formed
Effective shielding.This mike has feature anti-interference, that low noise, sound effect are good.
By detailed description to exemplary embodiment of the present utility model referring to the drawings, this practicality
Novel further feature and advantage thereof will be made apparent from.
Accompanying drawing explanation
The accompanying drawing of the part constituting description describes embodiment of the present utility model, and together with saying
Bright book is used for explaining principle of the present utility model together.
Fig. 1: the sectional view of the encapsulating structure of this utility model embodiment.
Fig. 2: the structural representation of the pcb board of this utility model embodiment.
The partial enlarged drawing of Fig. 3: Fig. 1.
Detailed description of the invention
Various exemplary embodiment of the present utility model is described in detail now with reference to accompanying drawing.It should be noted that
Arrive: unless specifically stated otherwise, the relative cloth of the parts illustrated the most in these embodiments and step
Put, numerical expression and numerical value are not intended to scope of the present utility model.
Description only actually at least one exemplary embodiment is illustrative below, never makees
For to this utility model and application thereof or any restriction of use.
May be not discussed in detail for technology and equipment known to person of ordinary skill in the relevant, but
In the appropriate case, described technology and equipment should be considered a part for description.
Shown here with in all examples discussed, any occurrence should be construed as merely example
Property rather than as limit.Therefore, other example of exemplary embodiment can have different
Value.
It should also be noted that similar label and letter represent similar terms, therefore, one in following accompanying drawing
A certain Xiang Yi the accompanying drawing of denier is defined, then need not it is carried out further in accompanying drawing subsequently
Discuss.
With reference to Fig. 1-2, this utility model provides a kind of encapsulating structure, and this encapsulating structure may be used for
The electronic equipment such as mike, earphone.This encapsulating structure includes: shell 1 and pcb board 2.Shell 1
It is fixed together with pcb board 2, to form the inner chamber 3 sealed.
Specifically, the upper surface at described pcb board 2 is provided with one for the position being connected with shell 1
Loop conductive layer 21, described shell 1 is fixed on described pcb board 2 by this annular conductive layer 21
On.Can be by mode well-known to those skilled in the art, such as conductive adhesive, soldering
Etc. mode, the lower end of shell 1 is fixedly attached in annular conductive layer 21.It is understood that it is ring-type
The shape of conductive layer 21 and the mating shapes of shell 1, such as rectangular ring, circular annular form, ellipse
Ring-type etc..
With reference to Fig. 1, in described pcb board 2, it is provided with earth terminal 4.It is positioned at ring on described pcb board 2
The position of shape conductive layer 21 is provided with the multiple of through described annular conductive layer 21 and described earth terminal 4
Plated-through hole 211, the plurality of plated-through hole 211 is on the bearing of trend of annular conductive layer 21
Distribution, described annular conductive layer 21 is electrically connected with earth terminal 4 by plated-through hole 211.
In a specific embodiment of the present utility model, described plated-through hole 211 includes position
In the conductor layer 212 of plated-through hole inwall, this belongs to the common knowledge of those skilled in the art, logical
Crossing conductor layer 212 makes this plated-through hole 211 have electric action, to realize annular conductive layer 21
Electrical connection with earth terminal 4.
Further, the material of conductor layer 212 can select the conducting metals such as gold, silver, copper or aluminum,
The materials such as conductivity ceramics, electro-conductive glass, electrically conductive graphite can also be selected.In one of the present utility model
In specific embodiment, such as, can pass through the electric plating method inwall at described plated-through hole 211
Upper formation conductor layer 212.Electric plating method has easy to operate feature.Additionally, electric plating method
The coating setting thickness can be formed according to actual needs, and coating is strong for the adhesion of inwall.
Coating is controlled and does not easily cause raw-material waste.It is understood that the thickest then electric conductivity of coating
Can be the best, otherwise, coating is the thinnest, and electric conductivity is the poorest.
In another kind of specific embodiment of the present utility model, can be by the method for chemical plating in institute
State and on the inwall of plated-through hole 211, form described conductor layer 212.The mode of chemical plating has equally
Feature easy to operate, that thickness of coating is controlled and adhesion is strong.Certainly, conductor layer 212 can also be adopted
With existing aluminium foil, Copper Foil etc., it is fixedly attached to by the way of bonding plated-through hole 211
Inwall on.The method is widely used, and does not repeats at this.
With reference to Fig. 3, the position of earth terminal 4 can be carried out by those skilled in the art according to actual needs
Arranging, as being arranged on the lower surface of pcb board 2, the most now plated-through hole 211 should be arranged to pass through
It is through at the thickness direction of pcb board 2, to realize the conducting of annular conductive layer 21 and earth terminal 4.Also may be used
Earth terminal 4 to be arranged by the technology of stacking the inside of pcb board 2 base material.
The encapsulating structure that this utility model provides, is positioned at annular conductive layer 21 on described pcb board 2
Position be provided with along annular conductive layer 21 bearing of trend distribution multiple plated-through holes 211, pass through
Shell 1 not only can be electrically connected to ground on end by the plurality of plated-through hole 211, makes shell 1 real
The effect of existing electromagnetic shielding；But also can on the thickness direction of pcb board 2 electricity to external communication
Magnetic noise forms effective shielding.It is high that this encapsulating structure also has integrated level, feature easy for installation.
It is understood that the quantity of plated-through hole 211, distribution density, area coverage, whether
Uniformly etc. the shield effectiveness of the factor external electromagnetic noise for transmitting along pcb board 2 thickness direction has
Important impact.Plated-through hole 211 be distributed the most uniform, quantity is the most, distribution density is the biggest, single
The area coverage of individual plated-through hole 211 is the biggest, and the shield effectiveness of the most whole pcb board 2 is the best.
In order to reach more preferable shield effectiveness, in some instances, multiple plated-through holes 211 are uniform
Be distributed on the bearing of trend of annular conductive layer 21.This distribution form can be to the thickness along pcb board 2
Spend the shielding that the formation of the electromagnetic noise propagated in direction is good.Those skilled in the art can be according to reality
Need the quantity to plated-through hole 211, plated-through hole 211 spacing, distribution density, coverage rate
Long-pending etc. being designed, this is not limited by this utility model.
This utility model one preferred embodiment in, multiple owing to being provided with on pcb board 2
Plated-through hole 211, when this encapsulating structure is applied in acoustic enclosure structure, this plated-through hole
211 resonant cavities that may constitute acoustic enclosure structure, thus affect its acoustical behavior.
In order to solve this problem, one of the present utility model preferred embodiment in, with reference to Fig. 3,
It is provided with implant 22, such that it is able to prevent the formation of resonant cavity, greatly in described plated-through hole 211
Decrease greatly the generation of noise, improve the acoustic efficiency of encapsulating structure.
Further, described implant 22 can be conductive material or non-conducting material.Wherein, adopt
During with conductive material as implant 22, the material identical with conductor layer 212 can be selected, to metal
While change through hole 211 carries out metalized, form described implant 22；This structure is all right
Improve the electric conductivity of plated-through hole, so that encapsulating structure is to the shield effectiveness of outside electromagnetic noise more
Good.Described implant 22 can also use non-conductive material, including, but not limited to resin, foam,
The material such as rubber, plastic cement etc..
This utility model additionally provides a kind of mike, and this mike includes: receiver and above-mentioned encapsulation
Structure, described receiver is arranged in described inner chamber 3, described receiver and described pcb board 2 signal
Connect.This mike has feature anti-interference, that low noise, sound effect are good.
Although specific embodiments more of the present utility model being described in detail by example,
But it should be appreciated by those skilled in the art, above example is merely to illustrate rather than be
Restriction scope of the present utility model.It should be appreciated by those skilled in the art, can be without departing from this reality
In the case of novel scope and spirit, above example is modified.Model of the present utility model
Enclose and be defined by the following claims.
Claims (10)
1. an encapsulating structure, it is characterised in that including: pcb board (2) and with pcb board (2)
Form the shell (1) sealing inner chamber (3), described pcb board (2) be provided with annular conductive layer (21),
Described shell (1) is fixed on described pcb board (2) by described annular conductive layer (21)；Institute
Being provided with earth terminal (4) in stating pcb board (2), described pcb board is positioned at annular conductive layer on (2)
(21) position is provided with the multiple of through described annular conductive layer (21) and described earth terminal (4)
Plated-through hole (211), the plurality of plated-through hole (211) is in annular conductive layer (21)
Being distributed on bearing of trend, described annular conductive layer (21) passes through plated-through hole (211) and earth terminal
It is electrically connected.
Encapsulating structure the most according to claim 1, it is characterised in that the plurality of metallization
Through hole (211) is evenly distributed in described annular conductive layer (21).
Encapsulating structure the most according to claim 1, it is characterised in that described shell (1) leads to
Cross conducting resinl to electrically connect with described annular conductive layer (21).
Encapsulating structure the most according to claim 1, it is characterised in that described plated-through hole
(211) the conductor layer (212) being positioned at plated-through hole inwall is included.
Encapsulating structure the most according to claim 4, it is characterised in that described conductor layer (212)
Material be gold, silver, copper or aluminum.
Encapsulating structure the most according to claim 5, it is characterised in that lead in described metallization
Implant (22) it is provided with in hole (211).
Encapsulating structure the most according to claim 6, it is characterised in that described implant (22)
For non-conducting material.
Encapsulating structure the most according to claim 7, it is characterised in that described non-conducting material
For resin.
Encapsulating structure the most according to claim 6, it is characterised in that described implant is for leading
Electric material, described conductive material and conductor layer (212) are one.
10. a mike, it is characterised in that including: receiver and as claim 1-9 is any
One described encapsulating structure, described receiver is arranged in described inner chamber (3), described receiver with
Described pcb board (2) signal connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620180726.2U CN205584499U (en) | 2016-03-09 | 2016-03-09 | Packaging structure and microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620180726.2U CN205584499U (en) | 2016-03-09 | 2016-03-09 | Packaging structure and microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205584499U true CN205584499U (en) | 2016-09-14 |
Family
ID=56869092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620180726.2U Active CN205584499U (en) | 2016-03-09 | 2016-03-09 | Packaging structure and microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205584499U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108808139A (en) * | 2018-08-27 | 2018-11-13 | 华霆（合肥）动力技术有限公司 | Battery management module and battery modules |
| CN108811285A (en) * | 2018-07-16 | 2018-11-13 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN110856063A (en) * | 2019-10-29 | 2020-02-28 | 歌尔科技有限公司 | Microphone electrostatic protection structure and electronic equipment |
-
2016
- 2016-03-09 CN CN201620180726.2U patent/CN205584499U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108811285A (en) * | 2018-07-16 | 2018-11-13 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN108808139A (en) * | 2018-08-27 | 2018-11-13 | 华霆（合肥）动力技术有限公司 | Battery management module and battery modules |
| CN110856063A (en) * | 2019-10-29 | 2020-02-28 | 歌尔科技有限公司 | Microphone electrostatic protection structure and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200611 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |