CN205581710U - Improvement structure of DRAM - Google Patents

Improvement structure of DRAM Download PDF

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Publication number
CN205581710U
CN205581710U CN201620110411.0U CN201620110411U CN205581710U CN 205581710 U CN205581710 U CN 205581710U CN 201620110411 U CN201620110411 U CN 201620110411U CN 205581710 U CN205581710 U CN 205581710U
Authority
CN
China
Prior art keywords
circuit board
memory bar
dram
gib block
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620110411.0U
Other languages
Chinese (zh)
Inventor
王三虎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Luliang University
Original Assignee
Luliang University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Luliang University filed Critical Luliang University
Priority to CN201620110411.0U priority Critical patent/CN205581710U/en
Application granted granted Critical
Publication of CN205581710U publication Critical patent/CN205581710U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides an improvement structure of DRAM, including circuit board and the memory chip group and golden finger part of assembly on the circuit board, be equipped with on the bottom end of circuit board to the constant head tank that its top end is sunken, be equipped with a gib block respectively at the both ends of golden finger part, the gib block includes a vertical portion and the hook -type portion that is connected rather than the bottom, still be equipped with the dust cover in the outside that memory chip organized, the dust cover comprises the connecting strip that covers the somatic part branch and connect rather than the marginal facies. Can avoid too much making emergence memory chip group damage with electronic component because of the dust to can be very easy insert the DRAM slot of mainboard with the DRAM, prevent effectively that the DRAM from damaging in inserting processes, and can prevent effectively that the DRAM from returning the phenomenon of pulling out and taking place.

Description

The structure-improved of memory bar
Technical field
This utility model relates to a kind of memory bar, the structure-improved of a kind of memory bar.
Background technology
Memory bar is directly plugged on the memory bar slot of mainboard as the requisite ingredient of computer In.But, owing to the length of memory bar is longer, the length of the memory bar slot on mainboard and memory bar Length is the most identical, and during grafting, memory bar is not easy to be plugged in slot, it is often necessary to use Power pressing is pressed in slot, but this mode, it is easy to make memory bar damage, cause waste money Source and cost.
It addition, memory bar is during life-time service, dust easily can adsorb under the effect of electrostatic attraction On the electronic component and storage chip of memory bar, it is easy to make memory bar generate heat, thus cause memory bar It is damaged.
Summary of the invention
For weak point present in the problems referred to above, this utility model provides one can avoid because of dust mistake Many and make generation groups of memory chips and electronic component damage, and can easily memory bar be inserted main The memory bar slot of plate, effectively prevents the structure-improved of the memory bar that memory bar damages during insertion.
For achieving the above object, this utility model provides the structure-improved of a kind of memory bar, including circuit Plate (1) and the groups of memory chips (2) that is assemblied on described circuit board (1) and golden finger portion Divide (3), the bottom end face of described circuit board (1) is provided with the location to its top sunken end face Groove (4), described golden finger part (3) be respectively arranged at two ends with a gib block (5), institute State gib block (5) and include a longitudinal part (51) and the hook portion (52) being connected with bottom it ;
Dust cover (6), described dust cover (6) it is additionally provided with in the outside of described groups of memory chips (2) It is made up of enclosure portion (61) and the connection strap (62) that is connected with its edge.
The structure-improved of above-mentioned memory bar, wherein, the end face outside of described longitudinal part (51) is with described The end face outside of circuit board (1) is in same level.
The structure-improved of above-mentioned memory bar, wherein, described hook portion (52) away from described longitudinal part ( 51) one end is pyramidal structure.
The structure-improved of above-mentioned memory bar, wherein, described gib block (5) uses plastic plate to make, Its thickness is identical with the thickness of described circuit board (1).
The structure-improved of above-mentioned memory bar, wherein, described enclosure portion (61) is by described connection Bar (62) is connected with the outer surface of described circuit board (1), and described connection strap (62) sets respectively Put in the top position of described enclosure portion (61) and bottom margin position or be separately positioned on institute State the position, both sides of the edge of enclosure portion (61).
Compared with prior art, this utility model has the advantage that
Groups of memory chips can be set with electronic component cover on circuit board surface by this utility model by enclosure portion Therein, to avoid dust to be attached to the surface of groups of memory chips and electronic component, effectively prevent internal memory Bar too much generates heat because of dust, thus the damage that groups of memory chips and electronic component are caused;
It addition, by the dust cover being arranged on circuit board both side surface, it is also possible to improve memory bar entirety Intensity;
Owing to gib block has certain pliability, and it is cone structure at one end head, it is possible to be easy to The memory bar slot that memory bar is inserted mainboard, effectively prevent what memory bar from damaging during insertion to show As occurring, and also can effectively prevent memory bar from returning the phenomenon generation pulled out.
Accompanying drawing explanation
Fig. 1 is the front view of the present embodiment;
Fig. 2 is the side view of Fig. 1.
Main Reference Numerals is described as follows:
1-circuit board;2-storage chip;3-golden finger part;4-locating slot;5-gib block;51-indulges To bar;52-hook portion;6-dust cover;61-enclosure portion;62-connection strap
Detailed description of the invention
As shown in Figures 1 and 2, the present embodiment includes circuit board 1 and assembling storage on the circuit card 1 Chipset and golden finger part 3, be provided with determining to its top sunken end face on the bottom end face of circuit board 1 Position groove 4.Groups of memory chips is made up of multiple storage chips 2.
Wherein, the outside mask in groups of memory chips 2 is provided with dust cover 6, Dust cover 6 is made up of enclosure portion 61 and the connection strap 62 that is connected with its edge.
Enclosure portion 61 is connected by the outer surface of connection strap 62 with circuit board 1, and connection strap 62 is respectively It is arranged on top position and the bottom margin position of enclosure portion 61 or is separately positioned on cover body portion Divide the position, both sides of the edge of 61.
In the present embodiment, two connection straps 62 be separately mounted to enclosure portion 61 position, both sides of the edge and Bottom margin position, the inner surface of connection strap is connected with the outer surface of circuit board.
Can groups of memory chips be located at inside it with electronic component on circuit board surface by enclosure portion, To avoid dust to be attached to the surface of groups of memory chips and electronic component, effectively prevent memory bar because of dust mistake Many and generate heat, thus the damage that groups of memory chips and electronic component are caused.
Golden finger part 3 be respectively arranged at two ends with a gib block 5, gib block 5 uses plastic plate system Becoming, its thickness is identical with the thickness of circuit board 1.Gib block 5 include a longitudinal part 51 and with its bottom The hook portion 52 being connected.
Wherein, the end face outside of longitudinal part 51 is in same level with the end face outside of circuit board 1.
Hook portion 52 is pyramidal structure away from one end of longitudinal part 51.
When memory bar is arranged in the memory bar slot of mainboard, directly the gib block of its both sides is first inserted Enter in the memory bar slot of mainboard, owing to gib block has certain pliability, and for cone at one end head Shape structure, it is possible to memory bar inserts the memory bar slot of mainboard easily, effectively prevents memory bar from existing The phenomenon damaged in insertion process occurs, and also can effectively prevent memory bar from returning the phenomenon generation pulled out.
These are only preferred embodiment of the present utility model, be merely illustrative for invention, rather than Restrictive.Those skilled in the art understands, can in the spirit and scope that invention claim is limited It is carried out many changes, amendment, even equivalence, but falls within protection domain of the present utility model In.

Claims (5)

1. the structure-improved of a memory bar, the groups of memory chips (2) including circuit board (1) and being assemblied on described circuit board (1) and golden finger part (3), the bottom end face of described circuit board (1) is provided with the locating slot (4) to its top sunken end face, it is characterized in that, being respectively arranged at two ends with a gib block (5) described golden finger part (3), described gib block (5) includes a longitudinal part (51) and the hook portion (52) being connected with bottom it;
Be additionally provided with dust cover (6) in the outside of described groups of memory chips (2), described dust cover (6) is made up of enclosure portion (61) and the connection strap (62) that is connected with its edge.
The structure-improved of memory bar the most according to claim 1, it is characterised in that the end face outside of described longitudinal part (51) is in same level with the end face outside of described circuit board (1).
The structure-improved of memory bar the most according to claim 2, it is characterised in that described hook portion (52) is pyramidal structure away from one end of described longitudinal part (51).
The structure-improved of memory bar the most according to claim 3, it is characterised in that described gib block (5) uses plastic plate to make, and its thickness is identical with the thickness of described circuit board (1).
The structure-improved of memory bar the most according to claim 1, it is characterized in that, described enclosure portion (61) is connected by the outer surface of described connection strap (62) with described circuit board (1), and described connection strap (62) is separately positioned on the top position of described enclosure portion (61) and bottom margin position or is separately positioned on the position, both sides of the edge of described enclosure portion (61).
CN201620110411.0U 2016-02-03 2016-02-03 Improvement structure of DRAM Expired - Fee Related CN205581710U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620110411.0U CN205581710U (en) 2016-02-03 2016-02-03 Improvement structure of DRAM

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620110411.0U CN205581710U (en) 2016-02-03 2016-02-03 Improvement structure of DRAM

Publications (1)

Publication Number Publication Date
CN205581710U true CN205581710U (en) 2016-09-14

Family

ID=56869816

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620110411.0U Expired - Fee Related CN205581710U (en) 2016-02-03 2016-02-03 Improvement structure of DRAM

Country Status (1)

Country Link
CN (1) CN205581710U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112947701A (en) * 2021-02-25 2021-06-11 深圳市智微智能软件开发有限公司 Memory bank slot with good contact and small abrasion and server

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112947701A (en) * 2021-02-25 2021-06-11 深圳市智微智能软件开发有限公司 Memory bank slot with good contact and small abrasion and server
CN112947701B (en) * 2021-02-25 2024-04-09 深圳市智微智能软件开发有限公司 Memory bank slot with good contact and small abrasion and server

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160914

Termination date: 20180203