CN205579718U - Floor heating structure based on graphite alkene heat -conducting plate - Google Patents
Floor heating structure based on graphite alkene heat -conducting plate Download PDFInfo
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- CN205579718U CN205579718U CN201620373853.4U CN201620373853U CN205579718U CN 205579718 U CN205579718 U CN 205579718U CN 201620373853 U CN201620373853 U CN 201620373853U CN 205579718 U CN205579718 U CN 205579718U
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Abstract
The utility model discloses a floor heating structure based on graphite alkene heat -conducting plate, its characterized in that: including subaerial base plate, graphite alkene heat -conducting plate, heating element and subsurface base plate, in the heating element embedding subsurface base plate, graphite alkene heat -conducting plate is located on the heating element, subaerial base plate is located on the graphite alkene heat -conducting plate, graphite alkene heat -conducting plate includes a bottom plate and an apron, the bottom plate has graphene films's copper foil for growing, the bottom plate sculpture has the capillary recess of patterning, the capillary groove phase intercrosses to ally oneself with and forms network structure, capillary recessed wall still grows there is the cupric oxide nano wire, the apron has graphene films's copper foil for growing, the relative lid of apron and bottom plate closes and forms an airtight cavity, airtight cavity intussuseption is filled with working fluid. Floor heating structure have good thermal conductivity, thermal stability and deformation resistance can, have the environmental protection simultaneously concurrently, pollution -free, the energy saving.
Description
Technical field
This utility model relates to the technical field of floor heating, is related specifically to a kind of based on Graphene heat-conducting plate
Floor heating structure.
Background technology
In cold winter, the particularly north, temperature can reach subzero several years even tens degrees Celsius, room
Inside typically requiring and use heating system, in existing heating system, prevailing predominantly collective supplies
Warm up or air-conditioning.But collective's heating and air-conditioning, broadly fall into local upwards heat riser, and steam is from radiator mouth
Or air-conditioner air outlet is out, and air-flow moves upward, flows to ceiling, and surface temperature height is slow, shape
Becoming room temperature skewness, simultaneously because heating outlet temperature is too high, people are usually because of imprudence quilt
Scald, so there is potential safety hazard.
Floor heating, is the abbreviation of floor panel heating, is with whole ground as radiator, by flooring radiation layer
In heating agent, uniformly heat whole ground, utilize rule that the accumulation of heat on ground self and heat upwards radiate by
Conduct on down to, reach the purpose of heating.Low-temperature ground heating agent indoor formation sole to head by
The thermograde gradually successively decreased, thus give the warm cool comfort of foot." temperature that ground radiation heating meets the traditional Chinese medical science
Foot top cool " fitness theory, be the heating system of current the most comfortable, thus floor heating be referred to as modern house life
Heating first-selection.
Existing frequently-used floor heating is warmed up electricity floor heating with being mostly water, and water floor heating is to be not higher than the heat of 60 DEG C with temperature
Water is heating agent, is adding heat pipe internal circulation flow, heating floor, by ground to radiate (mainly) and convection current
The heat transfer type of (secondary) is to the heating system of indoor heating, but owing to the material thermal conductivity of water pipe is poor, and institute
Relatively slow to heat up, in cold winter, need to reach comfortable temperature, need with ten several hours, even
It it is couple of days.Electricity floor heating employing heating cable or Electric radiant Heating Film are as pyrotoxin, then are passed by heat-conduction even temperature plate
It is delivered to floor surface.Its conventional heat-conduction even temperature plate many employings metal heat-conducting layer as heat-conduction even temperature plate, but golden
The speed of the heat transmission belonging to heat-conducting layer is relatively slow, and reaches comfortable temperature, it is also desirable to three or four hours.Institute
So that the life style of the convenient and efficient quality of modern people can not be met.
Utility model content
The purpose of this utility model is to propose a kind of floor heating structure based on Graphene heat-conducting plate, has excellent
Heat-conductive characteristic, thermal stability and anti-deformation, have environmental protection concurrently simultaneously, pollution-free, save the energy.
To this end, the present invention is by the following technical solutions:
A kind of floor heating structure based on Graphene heat-conducting plate, including ground upper substrate, Graphene heat-conducting plate, adds
Thermal element and subsurface substrate, described heating element heater embeds in subsurface substrate, described Graphene heat-conducting plate position
On heating element heater；Described ground upper substrate is positioned on Graphene heat-conducting plate；Described Graphene heat-conducting plate
Including a base plate and a cover plate, described base plate is the Copper Foil that growth has graphene film, and described base plate is etched with
The capillary grooves of patterning, described capillary grooves is cross-linked with each other formation network structure, described capillary grooves inwall
Also growth has oxidation copper nano-wire, described cover plate to be the Copper Foil that growth has graphene film, described cover plate and the end
Plate covers formation one airtight cavity relatively, is filled with working fluid in described airtight cavity.
Preferably, described ground upper substrate is solid wooden floor board, multi-layer solid wood composite floor, bamboo-wood floor, soft
Timber floor, plastic floor or tile floor.
Preferably, institute's subsurface substrate is that wood moulds layer or high-density glass fibrous layer.
Preferably, described heating element heater is heating cable or Electric radiant Heating Film.
Preferably, the thickness of described Copper Foil is 100～500 μm.
Preferably, described graphene film thickness is 0.335nm～3.35nm, i.e. 1～10 layer carbon atom.
Preferably, the groove width of described capillary grooves is 10 μm～100 μm, and groove depth is 10 μm～100 μm.
Preferably, a diameter of 25nm～50nm of described cupric oxide nano line, a length of 1 μm～5 μm.
Preferably, at least one during described working fluid is water or ethanol.
This utility model uses above technical scheme, uses and has the Copper Foil of graphene film to perform etching growth
Forming the capillary grooves of patterning, described capillary grooves is cross-linked with each other formation network structure, and capillary grooves again
Grown on interior walls has oxidation copper nano-wire to add the heat conduction specific surface area of groove, utilizes dredging of Graphene simultaneously
Aqueous and the hydrophilic of cupric oxide nano line, the steam making working fluid evaporate at heating end is circulated to condensation end
After be condensed into liquid, it is possible to rapidly deposition is in capillary grooves, and is cross-linked with each other formation by capillary grooves
Network structure circulating reflux to heating end to realize the steam-condensate circulating of fluid, to reach the purpose of high heat conduction.Will
It is as the heat-conducting plate of floor heating structure, it is possible to quickly the heat that heating element heater produces is transferred to base on ground
Plate, and uniformity of temperature profile is stable, i.e. has excellent heat-conductive characteristic and thermal stability.Except also have
There are excellent anti-deformation and environmental-protecting performance.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of this utility model floor heating structure based on Graphene heat-conducting plate.
Fig. 2 is the cross-sectional view of this utility model Graphene heat-conducting plate.
Fig. 3 is the STRUCTURE DECOMPOSITION schematic diagram of this utility model Graphene heat-conducting plate.
Fig. 4 is the base plate plane structural representation of this utility model Graphene heat-conducting plate.
Fig. 5 is the conduction of heat schematic diagram of this utility model floor heating structure based on Graphene heat-conducting plate.
Detailed description of the invention
In order to make the purpose of this utility model, feature and advantage more clear, below in conjunction with accompanying drawing and enforcement
Example, makes more detailed description to detailed description of the invention of the present utility model, in the following description, explains
State a lot of concrete details so that sufficiently understanding this utility model, but this utility model can be with very
Other modes being different from description are implemented more.Therefore, this utility model is not embodied as by following discloses
Restriction.
A kind of floor heating structure based on Graphene heat-conducting plate, as it is shown in figure 1, include ground upper substrate 1, graphite
Alkene heat-conducting plate 2, heating element heater 3 and subsurface substrate 4, described heating element heater 3 embeds in subsurface substrate 4, institute
State Graphene heat-conducting plate 2 to be positioned on heating element heater 3；Described ground upper substrate 1 be positioned at Graphene heat-conducting plate 2 it
On；As shown in Figure 2, Figure 3, Figure 4, described Graphene heat-conducting plate 2 includes base plate 21 and a cover plate 22, an institute
Stating base plate 21 is the Copper Foil 212 that growth has graphene film 211, and the capillary that described base plate is etched with patterning is recessed
Groove 213, described capillary grooves 213 is cross-linked with each other formation network structure, and described capillary grooves 213 inwall also grows
Having oxidation copper nano-wire 214, described cover plate 22 is the Copper Foil 222 that growth has graphene film 221, described cover plate
22 cover relative with base plate 21 form an airtight cavity, are filled with working fluid in described airtight cavity.
Wherein, described ground upper substrate 1 is solid wooden floor board, multi-layer solid wood composite floor, bamboo-wood floor, cork
Floor, plastic floor or tile floor.
Wherein, institute's subsurface substrate 4 moulds layer or high-density glass fibrous layer for wood.
Wherein, described heating element heater 3 is heating cable or Electric radiant Heating Film.
Wherein, the thickness of described Copper Foil is 100～500 μm.
Wherein, described graphene film thickness is 0.335nm～3.35nm, i.e. 1～10 layer carbon atom.
Wherein, the groove width of described capillary grooves is 10 μm～100 μm, and groove depth is 10 μm～100 μm.
Wherein, a diameter of 25nm～50nm of described cupric oxide nano line, a length of 1 μm～5 μm.
Wherein, at least one during described working fluid is water or ethanol.
Growth is had the Copper Foil of graphene film to perform etching the capillary grooves forming patterning by this utility model,
Described capillary grooves is cross-linked with each other formation network structure, and capillary grooves upper growth of facing the wall and meditating has oxidation copper nano-wire
Add the heat radiation specific surface area of groove.As it is shown in figure 5, utilize Graphene conducting strip as floor heating structure
Heat-conducting plate, heating element heater transfers heat to Graphene heat-conducting plate lower surface, makes the working fluid in heat-conducting plate
The evaporation current that is heated is condensed into liquid after passing to condensation end, heat is rapidly transferred to Graphene heat-conducting plate upper surface,
Conduct again to ground upper substrate.Recycle hydrophobicity and the hydrophilic of cupric oxide nano line of Graphene simultaneously,
Working fluid is enable to deposit to capillary grooves rapidly, and the network of the formation that is cross-linked with each other by capillary grooves
Structured loop is back to heating end to realize the steam-condensate circulating of fluid, to reach the purpose of high heat conduction, and temperature
It is evenly distributed stable, i.e. there is excellent heat-conductive characteristic and thermal stability.Except also have excellent anti-
Deformation performance and environmental-protecting performance.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model,
All any amendment, equivalent and improvement etc. made within spirit of the present utility model and principle, all should
Within being included in protection domain of the present utility model.
Claims (9)
1. a floor heating structure based on Graphene heat-conducting plate, it is characterised in that: include ground upper substrate, stone
Ink alkene heat-conducting plate, heating element heater and subsurface substrate, described heating element heater embeds in subsurface substrate, described
Graphene heat-conducting plate is positioned on heating element heater；Described ground upper substrate is positioned on Graphene heat-conducting plate；Institute
Stating Graphene heat-conducting plate and include a base plate and a cover plate, described base plate is the Copper Foil that growth has graphene film,
Described base plate is etched with the capillary grooves of patterning, and described capillary grooves is cross-linked with each other formation network structure, institute
Stating capillary grooves inwall also to grow and have oxidation copper nano-wire, described cover plate is the Copper Foil that growth has graphene film,
Described cover plate is relative with base plate covers formation one airtight cavity, is filled with working fluid in described airtight cavity.
A kind of floor heating structure based on Graphene heat-conducting plate the most according to claim 1, it is characterised in that:
Described ground upper substrate is solid wooden floor board, multi-layer solid wood composite floor, bamboo-wood floor, cork flooring, plastic cement
Floor or tile floor.
A kind of floor heating structure based on Graphene heat-conducting plate the most according to claim 1, it is characterised in that:
Institute's subsurface substrate is that wood moulds layer or high-density glass fibrous layer.
A kind of floor heating structure based on Graphene heat-conducting plate the most according to claim 1, it is characterised in that:
Described heating element heater is heating cable or Electric radiant Heating Film.
A kind of floor heating structure based on Graphene heat-conducting plate the most according to claim 1, it is characterised in that:
The thickness of described Copper Foil is 100～500 μm.
A kind of floor heating structure based on Graphene heat-conducting plate the most according to claim 1, it is characterised in that:
Described graphene film thickness is 0.335nm～3.35nm, i.e. 1～10 layer carbon atom.
A kind of floor heating structure based on Graphene heat-conducting plate the most according to claim 1, it is characterised in that:
The groove width of described capillary grooves is 10 μm～100 μm, and groove depth is 10 μm～100 μm.
A kind of floor heating structure based on Graphene heat-conducting plate the most according to claim 1, it is characterised in that:
A diameter of 25nm～50nm of described cupric oxide nano line, a length of 1 μm～5 μm.
A kind of floor heating structure based on Graphene heat-conducting plate the most according to claim 1, it is characterised in that:
Described working fluid is at least one in water or ethanol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620373853.4U CN205579718U (en) | 2016-04-28 | 2016-04-28 | Floor heating structure based on graphite alkene heat -conducting plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620373853.4U CN205579718U (en) | 2016-04-28 | 2016-04-28 | Floor heating structure based on graphite alkene heat -conducting plate |
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| CN205579718U true CN205579718U (en) | 2016-09-14 |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106313287A (en) * | 2016-11-03 | 2017-01-11 | 景德镇全球亮科技有限公司 | Multifunctional ceramic tile and manufacturing method thereof |
| CN106705723A (en) * | 2016-12-08 | 2017-05-24 | 苏州鸿凌达电子科技有限公司 | Heat pipe core, heat pipe and sputtering process of heat pipe |
| CN108001631A (en) * | 2017-12-14 | 2018-05-08 | 芜湖市皖南造船有限公司 | A kind of dredger living area composite floor board |
| CN108184277A (en) * | 2018-02-05 | 2018-06-19 | 张家港市科兴炭纤维制品有限公司 | A kind of graphene superconduction floor heating film and preparation method thereof |
| WO2019061727A1 (en) * | 2017-09-30 | 2019-04-04 | 戴明 | Instantly heated floor structure based on graphene-based heat transfer panel |
| CN109646180A (en) * | 2019-02-02 | 2019-04-19 | 广州生美生物科技有限公司 | A kind of graphene steam eye patch and preparation method thereof |
| CN110425918A (en) * | 2019-07-24 | 2019-11-08 | 南京航空航天大学 | A kind of ultrathin flexible flat-plate heat pipe |
| CN110469082A (en) * | 2019-09-16 | 2019-11-19 | 张寒晶 | A kind of timber floor damp-proof membrane of floor heating |
| WO2020100364A1 (en) * | 2018-11-16 | 2020-05-22 | 株式会社村田製作所 | Vapor chamber and vapor chamber production method |
| CN111442676A (en) * | 2020-05-12 | 2020-07-24 | 苏州路熙光电科技有限公司 | Capillary super heat conducting plate |
| CN112703359A (en) * | 2018-06-11 | 2021-04-23 | 科罗拉多大学董事会,法人团体 | Single and multi-layer mesh screen structures for enhanced heat transfer |
| TWI736221B (en) * | 2020-04-14 | 2021-08-11 | 創新服務股份有限公司 | Thermal guide plate and its manufacturing method |
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2016
- 2016-04-28 CN CN201620373853.4U patent/CN205579718U/en active Active
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106313287A (en) * | 2016-11-03 | 2017-01-11 | 景德镇全球亮科技有限公司 | Multifunctional ceramic tile and manufacturing method thereof |
| CN106705723A (en) * | 2016-12-08 | 2017-05-24 | 苏州鸿凌达电子科技有限公司 | Heat pipe core, heat pipe and sputtering process of heat pipe |
| WO2019061727A1 (en) * | 2017-09-30 | 2019-04-04 | 戴明 | Instantly heated floor structure based on graphene-based heat transfer panel |
| CN108001631A (en) * | 2017-12-14 | 2018-05-08 | 芜湖市皖南造船有限公司 | A kind of dredger living area composite floor board |
| CN108184277A (en) * | 2018-02-05 | 2018-06-19 | 张家港市科兴炭纤维制品有限公司 | A kind of graphene superconduction floor heating film and preparation method thereof |
| US11306983B2 (en) | 2018-06-11 | 2022-04-19 | The Regents Of The University Of Colorado, A Body Corporate | Single and multi-layer mesh structures for enhanced thermal transport |
| CN112703359A (en) * | 2018-06-11 | 2021-04-23 | 科罗拉多大学董事会,法人团体 | Single and multi-layer mesh screen structures for enhanced heat transfer |
| CN112703359B (en) * | 2018-06-11 | 2022-12-02 | 科罗拉多大学董事会,法人团体 | Single and multi-layer mesh screen structures for enhanced heat transfer |
| US11898807B2 (en) | 2018-06-11 | 2024-02-13 | The Regents Of The University Of Colorado, A Body Corporate | Single and multi-layer mesh structures for enhanced thermal transport |
| WO2020100364A1 (en) * | 2018-11-16 | 2020-05-22 | 株式会社村田製作所 | Vapor chamber and vapor chamber production method |
| US11566851B2 (en) | 2018-11-16 | 2023-01-31 | Murata Manufacturing Co., Ltd. | Vapor chamber and method of manufacturing vapor chamber |
| CN109646180A (en) * | 2019-02-02 | 2019-04-19 | 广州生美生物科技有限公司 | A kind of graphene steam eye patch and preparation method thereof |
| CN110425918A (en) * | 2019-07-24 | 2019-11-08 | 南京航空航天大学 | A kind of ultrathin flexible flat-plate heat pipe |
| CN110469082A (en) * | 2019-09-16 | 2019-11-19 | 张寒晶 | A kind of timber floor damp-proof membrane of floor heating |
| TWI736221B (en) * | 2020-04-14 | 2021-08-11 | 創新服務股份有限公司 | Thermal guide plate and its manufacturing method |
| CN111442676A (en) * | 2020-05-12 | 2020-07-24 | 苏州路熙光电科技有限公司 | Capillary super heat conducting plate |
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