CN205579182U - LED is radiator, LED lamps and lanterns for lamps and lanterns - Google Patents

LED is radiator, LED lamps and lanterns for lamps and lanterns Download PDF

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Publication number
CN205579182U
CN205579182U CN201620218101.0U CN201620218101U CN205579182U CN 205579182 U CN205579182 U CN 205579182U CN 201620218101 U CN201620218101 U CN 201620218101U CN 205579182 U CN205579182 U CN 205579182U
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China
Prior art keywords
led lamp
led
main body
thermal vias
radiator
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Active
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CN201620218101.0U
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Chinese (zh)
Inventor
张骏
周长坡
宋庆林
薛肖楠
严飞
蔡泰民
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SHANGHAI BINY ELECTRIC Co Ltd
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SHANGHAI BINY ELECTRIC Co Ltd
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Priority to CN201620218101.0U priority Critical patent/CN205579182U/en
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  • Led Device Packages (AREA)

Abstract

The utility model discloses a LED is radiator, LED lamps and lanterns for lamps and lanterns. The LED lamps and lanterns include LED radiator and LED chip for the lamps and lanterns. LED for the lamps and lanterns radiator include main part, radiating fin and heat dissipation through -hole. This main part has upper surface and lower surface, the upper surface of main part is used for setting up the LED chip. Radiating fin is outstanding to be set up on the lower surface of main part. The heat dissipation through -hole runs through the upper surface and the lower surface of main part. Radiating fin with the heat dissipation through -hole is followed the length direction dislocation set of main part. The utility model discloses simple structure dispels the heat, and the thermal resistance is little, simple process.

Description

LED lamp radiator, LED lamp
Technical field
This utility model relates to the radiator structure of a kind of field of LED illumination, particularly a kind of LED lamp radiator and LED lamp.
Background technology
Along with the increasing lighting field of development of science and technology selects to use LED product, especially heavy-power LED product.Due to advantages such as LED have specular removal, and the life-span is long, environmental protection, Based Intelligent Control, become the lighting source of a new generation.The most single LEDs graininess module power is little, and thermal resistance is big, and heat dispersion is poor, and production process is complicated.COB module heat is concentrated, and light efficiency is low, and thermal resistance is big, and light decay is big, and the life-span is short, waits a series of shortcoming, causes LED illumination lagging in development.
Utility model content
One of the purpose of this utility model is to overcome deficiency of the prior art, it is provided that LED lamp radiator that a kind of simple in construction, heat dispersion are strong and LED lamp.
For realizing object above, this utility model is achieved through the following technical solutions:
A kind of LED lamp radiator, it is characterised in that: described LED lamp radiator includes:
Main body, this main body has upper surface and lower surface, and the upper surface of described main body is used for arranging LED chip;
Radiating fin, described radiating fin is projecting on the lower surface of described main body;
Thermal vias, described thermal vias runs through upper surface and the lower surface of described main body;
Described radiating fin shifts to install along the length direction of described main body with described thermal vias.
Preferably, described radiating fin is multiple, and the plurality of radiating fin presses array spread configuration.
Preferably, described thermal vias is multiple, and the plurality of thermal vias presses array spread configuration.
Preferably, described thermal vias along the size of the width of described main body more than the size of length direction along this main body.
This utility model also provides for a kind of LED lamp.Described LED lamp includes the LED lamp radiator of LED chip and aforementioned any one;Described LED chip is arranged on described LED lamp radiator.
Preferably, described LED lamp also includes that circuit board, described circuit board offer the circuit board through-hole faced with described thermal vias;Described LED chip electrically connects with described circuit board.
Preferably, described LED lamp also includes that sealing gasket, described sealing gasket mate setting with described circuit board.
Preferably, described LED lamp also includes that lens module, described lens module include lens unit, and described lens unit and described LED chip are the most just to setting;Described lens module is further opened with lens through hole, and described lens through hole and described thermal vias are just to setting.
Preferably, the upper surface of described main body is provided with installing hole or installs depressed part;Described LED chip is arranged in described installing hole or depressed part.
Preferably, described LED chip is that COB is arranged with encapsulating
Compared with prior art, this utility model simple in construction, good heat dissipation, thermal resistance is little, and technique is simple.Preferably, it is also equipped with the optical lens used according to varying environment, uses quick and convenient, be suitable to wide popularization and application.
Accompanying drawing explanation
The structural representation of a kind of LED lamp radiator that Fig. 1 provides for this utility model.
The sectional view of a kind of LED lamp that Fig. 2 provides for this utility model.
Fig. 3 is the three-dimensional exploded view of the LED lamp of Fig. 2.
Detailed description of the invention
Below in conjunction with the accompanying drawings this utility model is described in detail:
Embodiment one:
Refer to Fig. 1, the structural representation of its a kind of LED lamp radiator 1 provided for this utility model.Described radiator 1 includes body 11, radiating fin 12 and thermal vias 13.In order to strengthen mechanical strength, in the present embodiment, described radiator 1 is integrated part.Described radiator 1 can use any heat sink material to make.Described body 11 substantially tabular.In the present embodiment, in order to obtain higher heat conductivity, described radiator 1 forges and presses integral piece for aluminium alloy.Described radiating fin 12 is multiple rows of.Each package includes multiple radiating fin 12.That is to say, described radiating fin 12 is arranged in lattice-like by array.Accordingly, described thermal vias 13 is arranged in lattice-like by array.In the present embodiment, described fin 12 is set to the array of 6*20.Described thermal vias 13 is set to the array of 2*9.Described thermal vias 13 is extended along the width of described body 11, and described thermal vias 13 along the width of described body 11 from size more than the size of length direction along this body 11.The described substantially rectangular hole of thermal vias 13.Described radiating fin 12 shifts to install with described thermal vias 13.That is to say, the heat dissipation channel that described adjacent two radiating fins 12 are just being formed by described thermal vias 13, thus heat radiation performance.That is to say, LED lamp radiator uses the structure that needle-like formula and honeycomb fashion combine.
The body 11 of described radiator 1 has the upper surface and lower surface being oppositely arranged.Described thermal vias 13 runs through body 11, that is to say and runs through described upper and lower surface.Described radiating fin 12 is arranged on the lower surface of described body 11.In order to strengthen contact area with heat radiation performance, and providing firm setting, the upper surface of described body 11 also offers the installing hole 14 for arranging following LED chip 2 simultaneously.Described installing hole 14 is set to the array of 3*8.Certainly, the upper surface of described body 11 can also offer installation depressed part for arranging following LED chip 2.
Embodiment two:
See also Fig. 2 and Fig. 3, the structural representation of its a kind of LED lamp 100 provided for this utility model.Described LED lamp 100 includes described LED lamp radiator 1 and LED chip 2.It is envisioned that the abbreviation of LED, i.e. Lighting Emitting Diode mentioned in this utility model, Chinese is light emitting diode.In order to promote condenser performance, in the present embodiment, described LED chip uses COB (Chip on Board) to be packaged.Described LED chip 2 is arranged in described installing hole 14.
Described LED lamp 100 includes circuit board 3.Described circuit board 3 electrically connects with described LED chip, to drive LED chip to light luminescence.In order to obtain more preferably heat dispersion, described circuit board 3 offers the circuit board through-hole 31 faced with thermal vias 13.Each circuit board through-hole 31 and each thermal vias 13 are just to setting.
In order to strengthen sealing property, described LED lamp 100 also includes sealing gasket 4.The described label 4 that seal can use waterproof and dustproof material to make.In the present embodiment, described sealing gasket 4 uses silica gel to make, and sealing can not only be provided to absorb heat.The shape of described sealing gasket 4 adapts to described thermal vias 13 and the layout of installing hole 14 and meets seal request.
Distributing for the ease of light regulating, described LED lamp 100 also includes lens module 5.Described lens module 5 includes lens unit 51.Described lens module 5 can use transparent or semitransparent plastics to be formed integrally part.Each lens unit 51 described is arranged with each LED chip 3 one_to_one corresponding.In order to strengthen heat dispersion, described lens module 5 offers the lens through hole 52 faced with thermal vias 13.In this embodiment, described lens through hole 52 is just to described circuit board through-hole 31, and described Sa heat through-hole 13 is just arranged by described circuit board through-hole 31.
When manufacturing assembling, described LED lamp radiator 1 uses aluminium alloy forging forming technology, is carrying out product finishing through machining after molding, and radiator package position, through chemical treatment, is prepared for follow-up encapsulation.In encapsulation, factory is directly encapsulated into Led Chip on radiator through encapsulation technology.Sealed silicon rubber gasket plays the effect of water proof and dust proof, optical lens is covered on LED, lock screw.
These are only this utility model preferred embodiment, be not used to limit to protection domain of the present utility model, any amendment, equivalent or improvement etc. in this utility model spirit, all contain in right of the present utility model.

Claims (10)

1. a LED lamp radiator, it is characterised in that: described LED lamp radiator includes:
Main body, this main body has upper surface and lower surface, and the upper surface of described main body is used for arranging LED chip;
Radiating fin, described radiating fin is projecting on the lower surface of described main body;
Thermal vias, described thermal vias runs through upper surface and the lower surface of described main body;
Described radiating fin shifts to install along the length direction of described main body with described thermal vias.
LED lamp radiator the most according to claim 1, it is characterised in that: described radiating fin is multiple, and the plurality of radiating fin presses array spread configuration.
LED lamp radiator the most according to claim 1, it is characterised in that: described thermal vias is multiple, and the plurality of thermal vias presses array spread configuration.
LED lamp radiator the most according to claim 1, it is characterised in that: described thermal vias along the size of the width of described main body more than the size of length direction along this main body.
5. a LED lamp, it is characterised in that: described LED lamp includes the LED lamp radiator according to any one of LED chip and Claims 1-4;Described LED chip is arranged on described LED lamp radiator.
LED lamp the most according to claim 5, it is characterised in that: described LED lamp also includes that circuit board, described circuit board offer the circuit board through-hole faced with described thermal vias;Described LED chip electrically connects with described circuit board.
LED lamp the most according to claim 6, it is characterised in that: described LED lamp also includes that sealing gasket, described sealing gasket mate setting with described circuit board.
LED lamp the most according to claim 5, it is characterised in that: described LED lamp also includes that lens module, described lens module include lens unit, and described lens unit and described LED chip are the most just to setting;Described lens module is further opened with lens through hole, and described lens through hole and described thermal vias are just to setting.
LED lamp the most according to claim 5, it is characterised in that: the upper surface of described main body is provided with installing hole or installs depressed part;Described LED chip is arranged in described installing hole or depressed part.
10. according to the LED lamp according to any one of claim 5 to 9, it is characterised in that: described LED chip is that COB is arranged with encapsulating.
CN201620218101.0U 2016-03-21 2016-03-21 LED is radiator, LED lamps and lanterns for lamps and lanterns Active CN205579182U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620218101.0U CN205579182U (en) 2016-03-21 2016-03-21 LED is radiator, LED lamps and lanterns for lamps and lanterns

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620218101.0U CN205579182U (en) 2016-03-21 2016-03-21 LED is radiator, LED lamps and lanterns for lamps and lanterns

Publications (1)

Publication Number Publication Date
CN205579182U true CN205579182U (en) 2016-09-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620218101.0U Active CN205579182U (en) 2016-03-21 2016-03-21 LED is radiator, LED lamps and lanterns for lamps and lanterns

Country Status (1)

Country Link
CN (1) CN205579182U (en)

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