CN205545767U

CN205545767U - Ultra -thin microphone

Info

Publication number: CN205545767U
Application number: CN201620148475.XU
Authority: CN
Inventors: 叶菁华
Original assignee: Yutaixin Microelectronics Technology Shanghai Co Ltd; Zilltek Technology Corp
Current assignee: Yutaixin Microelectronics Technology Shanghai Co Ltd; Zilltek Technology Corp
Priority date: 2016-02-26
Filing date: 2016-02-26
Publication date: 2016-08-31
Anticipated expiration: 2026-02-26

Abstract

The utility model relates to an electronic equipment field especially relates to an ultra -thin microphone. An ultra -thin microphone, ultra -thin microphone includes: first base plate is equipped with the blind hole, the second base plate, with first base plate fixed connection, the 2nd substrate connection has integrated circuit device and a sensor, and first base plate with during second base plate fixed connection, the 2nd substrate connection's sensor portion branch is placed in in the blind hole.

Description

A kind of ultra-thin mike

Technical field

This utility model relates to electronic device field, particularly relates to a kind of ultra-thin mike.

Background technology

Current electronic equipment develops to the most frivolous direction, but frivolous electronic equipment Can be limited by mike thickness, and the thickness of mike is suffered from the limit of sensor thickness System, in prior art, the thickness of mike pcb board is commonly greater than 1mm, adds sensor With the thickness of the cavity that integrated circuit (IC) takies, ultra-thin (the ultra slim) of mike sets Want to be restricted.

Utility model content

For problems of the prior art, this utility model provides a kind of ultra-thin Mike Wind, greatly reduces the thickness of mike, decreases what mike took in the electronic device Space.

This utility model adopts the following technical scheme that

A kind of ultra-thin mike, described ultra-thin mike includes:

First substrate, is provided with blind hole；

Second substrate, fixes with described first substrate and is connected, and the connection of described second substrate has integrated Circuit devcie and sensor, and

Described first substrate is fixed with described second substrate when being connected, a part for described sensor Or be all placed in described blind hole.

Preferably, described ultra-thin mike also includes:

MIC, is arranged on described second substrate, one end of described MIC and described sensing Device connects, and the opposite other end of described MIC is connected with the extraneous of described ultra-thin mike.

Preferably, described first substrate is connected with described second substrate by column.

Preferably, the thickness of described first substrate is 0.3-0.4mm.

Preferably, the thickness of described second substrate is 0.6-0.7mm.

Preferably, described IC-components is connected with described sensor circuit.

The beneficial effects of the utility model are:

This utility model, by the blind hole being provided with in first substrate, will compare the biography taken up space Sensor is located in blind hole, reduces the space between first substrate and second substrate, and then reduces wheat The thickness of gram wind, it is achieved the ultrathin of electronic equipment.

Accompanying drawing explanation

Fig. 1, Fig. 2 are the structural representation of a kind of ultra-thin mike of this utility model.

Detailed description of the invention

It should be noted that in the case of not conflicting, following technical proposals, technical characteristic it Between can be mutually combined.

Below in conjunction with the accompanying drawings detailed description of the invention of the present utility model is further described:

As it is shown in figure 1, present embodiments provide a kind of ultra-thin mike, ultra-thin mike includes: First substrate and second substrate, wherein first substrate and second substrate can be pcb board, the Two substrates can also be metal cap, and above-mentioned first substrate is provided with blind hole, blind in the present embodiment The manufacturing process in hole uses existing blind hole manufacturing process, the most no longer manufacturing process to blind hole Repeat.

Ultra-thin mike in the present embodiment also includes: second substrate, second substrate and the first base Plate is fixing to be connected, and second substrate connects IC-components and sensor, and

First substrate is fixed with second substrate when being connected, and the sensor that second substrate connects is placed in blind Kong Zhong.

In the present embodiment, the sensor ratio that second substrate connects relatively occupies first substrate and second Cavity thickness between substrate, in order to reduce the distance between first substrate and second substrate, this Embodiment uses the method preparing blind hole on the first substrate, and higher sensor is located at blind hole In, thus reducing the volume of mike, it is achieved the height of ultra-thin mike, i.e. sensor is usual Be greater than the height of IC-components, in order to reduce between first substrate and second substrate away from From, it is the area reducing cavity, so the highest sensor is placed in first substrate In blind hole, thus reduce sensor height in cavity, and then make whole mike It is relatively thin that volume all becomes.

In one preferred embodiment of this utility model, ultra-thin mike also includes:

MIC, is arranged on second substrate, is positioned at the top of sensor, MIC one end with Extraneous link, one end is connected with sensor, and extraneous sound enters sensor by MIC.

In the present embodiment, the top that MIC is arranged at ultra-thin mike facilitates sensor external The sound on boundary carries out direct mobile phone.

In one preferred embodiment of this utility model, first substrate passes through column and second substrate Connect.

In the present embodiment, if as in figure 2 it is shown, by vertical between first substrate and second substrate Post is fixing to be connected, then similar with the method in above-described embodiment, is also blind at first substrate Placing the sensor that second substrate connects in hole, its central post can also be pcb board, so The present embodiment is applicable not only to common pcb board, is also applied for the pcb board of stacking.

In one preferred embodiment of this utility model, the thickness of first substrate is 0.3-0.4mm.

In one preferred embodiment of this utility model, the thickness of second substrate is 0.6-0.7mm.

Thickness between current first substrate and second substrate is added and tends to exceed 1mm, If the thickness plus sensor may be bigger, mike in the present embodiment is so that wheat The thickness of gram wind is maintained at about 1mm, i.e. the thickness of first substrate and second substrate add and.

In one preferred embodiment of this utility model, the electric elements in integrated circuit and sensing Device carries out circuit connection according to practical situation.

By explanation and accompanying drawing, give typical case's enforcement of the ad hoc structure of detailed description of the invention Example, based on this utility model spirit, also can make other conversion.Although above-mentioned utility model carries Go out existing preferred embodiment, but, these contents are not intended as limitation.

For a person skilled in the art, after reading described above, various changes and modifications Will be apparent to undoubtedly.Therefore, appending claims should be regarded as and contains this utility model True intention and whole variations and modifications of scope.Any and institute in Claims scope There are scope and the content of equivalence, are all considered as still belonging in intention of the present utility model and scope.

Claims

1. a ultra-thin mike, it is characterised in that described ultra-thin mike includes:

First substrate, is provided with blind hole；

Ultra-thin mike the most according to claim 1, it is characterised in that described ultra-thin wheat Gram wind also includes:

Ultra-thin mike the most according to claim 1, it is characterised in that described first base Plate is connected with described second substrate by column.

Ultra-thin mike the most according to claim 1, it is characterised in that described first base The thickness of plate is 0.3-0.4mm.

Ultra-thin mike the most according to claim 1, it is characterised in that described second base The thickness of plate is 0.6-0.7mm.

Ultra-thin mike the most according to claim 1, it is characterised in that described integrated electricity Road device is connected with described sensor circuit.