CN205539596U - Miniaturized optical fiber amplifier - Google Patents

Miniaturized optical fiber amplifier Download PDF

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Publication number
CN205539596U
CN205539596U CN201620160988.2U CN201620160988U CN205539596U CN 205539596 U CN205539596 U CN 205539596U CN 201620160988 U CN201620160988 U CN 201620160988U CN 205539596 U CN205539596 U CN 205539596U
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CN
China
Prior art keywords
circuit board
printed circuit
module base
optical fiber
pcb
Prior art date
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Active
Application number
CN201620160988.2U
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Chinese (zh)
Inventor
陈金龙
侯建华
沈晓峰
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Wuxi dekeli Optoelectronic Technology Co.,Ltd.
Original Assignee
Wuxi Zhongxing Optoelectronics Technology Co ltd
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Priority to CN201620160988.2U priority Critical patent/CN205539596U/en
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Publication of CN205539596U publication Critical patent/CN205539596U/en
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Abstract

The utility model provides a miniaturized optical fiber amplifier, include the casing and set up at casing internal electric circuit device and light path device, the casing includes that module base and lid close the apron on the module base, the accommodation space has in the module base, the circuit device includes printed circuit board, printed circuit board has arranged laser instrument and photoelectric detector in last one side towards the apron, the light path device is located the printed circuit board top, there is the heat shrinkage bush that is used for the cover to establish at optic fibre fusing point to separate between printed circuit board and the light path device, printed circuit board has arranged the electrical interface in last one side towards the module base, the electrical interface stretches out from the bottom surface of module base. The utility model discloses compact structure can satisfy the desired miniaturized overall dimension of optical transmission of new generation net 100G transmission system.

Description

Miniature optical fiber amplifier
Technical field
This utility model relates to a kind of Optical Transmission Network OTN equipment, a kind of intelligent earth culture plant growing cultivation system based on plantation expert's cloud.
Background technology
Fiber amplifier is the revolutionary product of communication industry development, and it is widely used in the fields such as optic communication, optical-fiber network, cable television and national defence, is the new industry of 21 century.Fiber amplifier includes doped optical fibre amplifier, fiber nonlinear effect amplifier etc., and it is the Primary Component in optical transport, wherein erbium-doped fiber amplifier (Erbium Doped Fiber Amplifier EDFA) utilize Er-doped fiber that optical signal is directly amplified, thoroughly eradicate the electronics " bottleneck " formed in Traditional photovoltaic repeater;Because of its have that gain is high, noise is low, power is big, working band width, polarize unrelated, channel interference is little, to good characteristics such as transmission code rate and form and system upgrade are transparent, the ideal optical amplifier in high speed fibre transmission network, wavelength-division multiplex (WDM) transmission technology become because of the support of EDFA realize now two-forty, high-capacity optical fiber communicate maximally effective means.
Along with modern communication is fast-developing, the Optical Transmission Network OTN 100G of a new generation transmits system, requires more and more higher to image intensifer (EDFA) overall volume;The most common EDFA overall dimensions is the biggest, and stock size is 130 × 180 × 20mm;The miniaturization EDFA module overall dimensions that MSA agreement specifies is: 90 × 70 × 15mm.The 100G optical transmission system of a new generation is 55 × 35 × 10mm to the shape requirement of EDFA at present, more much smaller than the most common EDFA overall dimensions, i.e. half as large many compared with the MSA agreement small-sized EDFA overall dimensions of regulation;Therefore circuit, light path, frame for movement are all challenged by the miniaturization EDFA of new generation: must overturn the original conventional mentality of designing of EDFA, components and parts selection principle, all are premised on the minimum dimension meeting performance, minimum profile.
Summary of the invention
For the deficiencies in the prior art, this utility model provides a kind of Miniature optical fiber amplifier, compact conformation, it is possible to meet the miniaturization overall dimensions required by New Generation Optical transmission network 100G transmission system;The technical solution adopted in the utility model is:
A kind of Miniature optical fiber amplifier, including housing be arranged on housing internal circuit device and light path devices, described housing includes module base and the cover plate covering on module base;There is in module base accommodation space;Described circuit devcie includes printed circuit board (PCB), and on described printed circuit board (PCB), the side towards cover plate is disposed with laser instrument and photodetector;Light path devices is positioned at above printed circuit board (PCB);Have between described printed circuit board (PCB) and light path devices and separate for the heat-shrinkable T bush being set in optical fiber fusion welding point;
On described printed circuit board (PCB), the side towards module base is disposed with electrical interface;Electrical interface stretches out from the bottom surface of module base.
Further, the longitudinal direction of described light path devices and heat-shrinkable T bush and the vertical consistency of described module base.
Further, described laser instrument and the parallel longitudinal layout of described photodetector, with the vertical consistency of described module base.
Further, described electrical interface lateral arrangement.
Further, described laser instrument uses 8 pins without refrigeration series pumping.
Further, described printed circuit board (PCB) uses four laminate designs, by top layer, stratum, bus plane, the sequential arrangement of bottom.
The utility model has the advantage of: by light path devices being placed on indirectly on printed circuit board (PCB) electronic devices and components, in order to prevent short circuit, nonconducting optical fiber fusion welding point heat-shrinkable T bush is first placed on printed circuit board (PCB), then light path devices is positioned on heat-shrinkable T bush, so can farthest save space, making product meet the requirement of a new generation 100G transmission system, its overall dimensions only has 55 × 35 × 10 mm.
Accompanying drawing explanation
Fig. 1 is that structure of the present utility model forms schematic diagram.
Fig. 2 is cross section view of the present utility model.
Detailed description of the invention
Below in conjunction with concrete drawings and Examples, the utility model is described in further detail.
As shown in Figure 1 and Figure 2, Miniature optical fiber amplifier, including cover plate 1 light path devices 2 module base 3 printed circuit board (PCB) 4 photodetector 5 laser instrument 6 electrical interface 7 heat-shrinkable T bush 8 etc..This utility model is the erbium-doped fiber amplifier that a kind of structure is improved, and in Fig. 1, Er-doped fiber is not drawn into;
The housing of this Miniature optical fiber amplifier is made up of cover plate 1 module base 3, has accommodation space in module base 3;Circuit devcie and light path devices 2 it is provided with in housing;Cover plate 1 is screwed on module base 3, and the overall dimensions of housing only has 55 × 35 × 10 mm, can meet the follow-on 100G optical transmission system shape requirement to EDFA.
In order to realize the miniaturization of amplifier, light path devices 2 is placed on printed circuit board (PCB) 4 electronic devices and components by whole product indirectly, in order to prevent short circuit, nonconducting optical fiber fusion welding point heat-shrinkable T bush 8 is first placed on printed circuit board (PCB) 4, then light path devices 2 is positioned on heat-shrinkable T bush 8, so can farthest save space.Concrete structure is as follows:
Circuit devcie includes printed circuit board (PCB) 4, and on described printed circuit board (PCB) 4, the side towards cover plate 1 is disposed with laser instrument 6 and photodetector 5;Light path devices 2 is positioned at above printed circuit board (PCB) 4;Have between described printed circuit board (PCB) 4 and light path devices 2 and separate for the heat-shrinkable T bush 8 being set in optical fiber fusion welding point;On described printed circuit board (PCB) 4, the side towards module base 3 is disposed with electrical interface 7;Electrical interface 7 stretches out from the bottom surface of module base 3.
Described electrical interface 7 lateral arrangement;Photodetector 5 heat-shrinkable T bush 8 described in described laser instrument 6 and the parallel longitudinal layout of light path devices 2, all with the vertical consistency of module base 3.In order to reduce bulk, microdevice all selected by the device used.
Owing to the output of this amplifier is not the biggest, and owing to the overall dimensions of module only has 55 × 35 × 10 mm, small-sized nothing refrigeration pumping can only be selected, laser instrument 6 uses 8 pins without refrigeration series pumping, owing to product is less in normal work schedule heat, heat radiation is convenient will not be problematic, can meet product reliability requirement.
At printed circuit board (PCB) (PCB) 4 design aspect, use device positive negative side paster to place, as much as possible reduce PCB size;In layout, analog circuit, digital circuit are placed according to function Relatively centralized respectively, it is to avoid the numerical portion interference effect to analog circuit, especially avoid input, the detection impact of output signal light;PCB uses 4 laminates to design: top layer, stratum, bus plane, the sequential arrangement of bottom.
This fiber amplifier interiors of products structure have employed single layer designs, the most indirectly placed light path devices, in order to prevent short circuit, nonconducting optical fiber fusion welding point heat-shrinkable T bush is first placed on printed circuit board (PCB), then light path devices is positioned on heat-shrinkable T bush, so can farthest save space.By optimizing interiors of products layout, adjust the design requirement to meet product such as device position the highest on printed circuit board (PCB).

Claims (6)

1. a Miniature optical fiber amplifier, including housing and be arranged on housing internal circuit device and light path devices (2), it is characterised in that:
Described housing includes module base (3) and the cover plate (1) covered on module base (3);Module base has accommodation space in (3);Described circuit devcie includes printed circuit board (PCB) (4), and on described printed circuit board (PCB) (4), the side towards cover plate (1) is disposed with laser instrument (6) and photodetector (5);Light path devices (2) is positioned at printed circuit board (PCB) (4) top;The heat-shrinkable T bush (8) for being set in optical fiber fusion welding point is had to separate between described printed circuit board (PCB) (4) and light path devices (2);
On described printed circuit board (PCB) (4), the side towards module base (3) is disposed with electrical interface (7);Electrical interface (7) stretches out from the bottom surface of module base (3).
2. Miniature optical fiber amplifier as claimed in claim 1, it is characterised in that:
The longitudinal direction of described light path devices (2) and heat-shrinkable T bush (8) and the vertical consistency of described module base (3).
3. Miniature optical fiber amplifier as claimed in claim 2, it is characterised in that:
Described laser instrument (6) and described photodetector (5) parallel longitudinal layout, with the vertical consistency of described module base (3).
4. Miniature optical fiber amplifier as claimed in claim 1, it is characterised in that:
Described electrical interface (7) lateral arrangement.
5. Miniature optical fiber amplifier as claimed in claim 1, it is characterised in that:
Described laser instrument (6) uses 8 pins without refrigeration series pumping.
6. Miniature optical fiber amplifier as claimed in claim 1, it is characterised in that:
Described printed circuit board (PCB) (4) uses four laminate designs, by top layer, stratum, bus plane, the sequential arrangement of bottom.
CN201620160988.2U 2016-03-02 2016-03-02 Miniaturized optical fiber amplifier Active CN205539596U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620160988.2U CN205539596U (en) 2016-03-02 2016-03-02 Miniaturized optical fiber amplifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620160988.2U CN205539596U (en) 2016-03-02 2016-03-02 Miniaturized optical fiber amplifier

Publications (1)

Publication Number Publication Date
CN205539596U true CN205539596U (en) 2016-08-31

Family

ID=56780575

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620160988.2U Active CN205539596U (en) 2016-03-02 2016-03-02 Miniaturized optical fiber amplifier

Country Status (1)

Country Link
CN (1) CN205539596U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: 214028 Wuxi New District Science and Technology Industrial Park, Jiangsu, No. 93 -C block

Patentee after: WUXI TACLINK OPTOELECTRONICS TECHNOLOGY CO., LTD.

Address before: 214028 Wuxi New District Science and Technology Industrial Park, Jiangsu, No. 93 -C block

Patentee before: Wuxi Zhongxing Optoelectronics Technology Co., Ltd.

CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 214028 -C plot 93, science and Technology Industrial Park, Wuxi New District, Jiangsu

Patentee after: Wuxi dekeli Optoelectronic Technology Co.,Ltd.

Address before: 214028 -C plot 93, science and Technology Industrial Park, Wuxi New District, Jiangsu

Patentee before: WUXI TACLINK OPTOELECTRONICS TECHNOLOGY Co.,Ltd.

CP01 Change in the name or title of a patent holder