CN205522539U - Synergistic flexible electron of multistation preparation system - Google Patents
Synergistic flexible electron of multistation preparation system Download PDFInfo
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- CN205522539U CN205522539U CN201620243912.6U CN201620243912U CN205522539U CN 205522539 U CN205522539 U CN 205522539U CN 201620243912 U CN201620243912 U CN 201620243912U CN 205522539 U CN205522539 U CN 205522539U
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Abstract
The utility model discloses a synergistic flexible electron of multistation preparation system, this system include that rotary disk module and last infrabasal plate module, basement electron spray module, 3D printing bottom insulating layer module, electric spinning module, the 3D of distribution around it print top layer insulating layer module, laser is peeled off the module and is got the material module, and the rotary disk module is used for fixed base plate and station exchange, it is used for picking up and shifting the base plate to go up the infrabasal plate module, basement electron spray module is used for preparing the basement, 3D printing bottom and top layer insulating layer module are used for printing the insulating layer of bottom and top layer respectively, electricity spinning module is used for the textile circuit, laser is peeled off the module and is used for the basement of ablating, makes base plate and flexible electron autosegregation, it is used for taking off the flexible electron that is separated from the base plate to get the material module. The utility model discloses a whole system can the recycle, and production efficiency is high, with low costs, the precision is high.
Description
Technical field
This utility model belongs to flexible device and manufactures field, works in coordination with more particularly, to a kind of multistation
Flexible electronic preparation system.
Background technology
Flexible electronic (Flexible Electronics) is the common name of a kind of technology, is also called plastics
Electronics, printed electronic, organic electronic etc..Flexible electronic can be summarized as being by organic or inorganic material electricity
Sub-element manufacturing new electronic technology on flexible, Drawability plastics or thin metal matrix plate, only with it
Special flexible ductility and efficient, low cost manufacturing process, in information, the energy, medical treatment, national defence
In field, there is wide application prospect, such as flexible electronic displays, Organic Light Emitting Diode OLED, print
Brush RFID, thin-film solar cell panel, electronics surface mount (Skin Patches) etc..
As traditional IC technology, manufacturing process and equipment are also mainly driving of flexible electronic technology development
Power.Flexible electronic manufacturing technology level index includes chip feature sizes and substrate area size, its
It is crucial that how to produce, with lower cost, the flexibility that characteristic size is less on the substrate of more large format
Electronic device.In recent years, flexible electronic device and wearable device development are swift and violent, cause flexible electrical
The demand of son is constantly expanding, and traditional preparation method has been difficult to meet the demand grown with each passing day, because of
This seeks a kind of efficient flexible electronic preparation system and carrys out expanding production power and become current popular research
Point.
Utility model content
For disadvantages described above or the Improvement requirement of prior art, this utility model provides a kind of multistation
Collaborative flexible electronic preparation system, it uses fully-automatic production mode, and utilize advanced person electron spray,
The method that Electrospun, the 3D printing increasing technique such as material manufacture and laser lift-off is changed with rotary work station combines,
Drastically increasing production efficiency, whole system can be with iterative cycles, and production efficiency is high, low cost,
And there is higher precision.
For achieving the above object, prepared by the flexible electronic that the utility model proposes a kind of multistation collaborative
System, this system includes that rotating disk module, upper and lower base plate module, substrate electron spray module, 3D print
Bottom insulating barrier module, Electrospun module, 3D print top insulating layer module, laser lift-off module and
Feeding module, wherein:
Described rotating disk module includes that a rotating disk and several are distributed in the fixture on rotating disk circumference,
Described fixture is used for fixing substrate, and described rotating disk is used for carrying out station conversion;
Described upper and lower base plate module, substrate electron spray module, 3D print bottom insulating barrier module, electrospinning
Silk module, 3D print top insulating layer module, laser lift-off module and feeding module and are sequentially distributed in rotation
Around turntable module;Described upper and lower base plate module is used for picking up substrate and being seated to fixture, and
Put in ash can for fetching substrate on fixture;Described substrate electron spray module is at substrate
Electron spray goes out one layer of substrate with stickiness;Described 3D prints bottom insulating barrier module in substrate
Print the insulating barrier of bottom;Described Electrospun module is for spinning out circuit on bottom insulating barrier;
Described 3D prints top insulating layer module for printing the insulating barrier of top layer on circuit;Described laser
Strip module is for the substrate ablation gone out by substrate electron spray module spray printing so that substrate and flexible electronic
It is automatically separated;Described feeding module is for taking off the flexible electronic separated from substrate.
As it is further preferred that described 3D prints bottom insulating barrier module (400) and Electrospun mould
Block (500) forms a set of printing Electrospun module, and described printing Electrospun module is one or more sets,
All can realize single or multiple lift flexible electronic to prepare;When arranging a set of, to prepare layer flexible electricity
Son, need to make rotating disk frequently invert in preparation process, then need not reversion when arranging many sets, soft
Property electronics is connected by the spun electrode of Electrospun between layers.
As it is further preferred that described upper and lower base plate module includes mechanical arm, hopper and ash can,
Described mechanical arm is for pickup and transfer base substrate, and it has three degree of freedom, described hopper and ash can
Substrate before being respectively used to deposit use and after use.
As it is further preferred that described substrate electron spray module includes electron spray moving cell and installation
Spray nozzle thereon, described spray nozzle realizes XYZ side under the drive of electron spray moving cell
To movement, its connection has spray solution container, and this spray solution container is used for providing preparation substrate knot
The material solution of structure, is provided with spraying high tension generator between described spray nozzle and fixture, in spray
High voltage electric field is formed between atomizing nozzle and fixture;It is additionally provided with for vision on described electron spray moving cell
Camera is regarded under the electron spray of location.
As it is further preferred that described 3D print bottom insulating barrier module include basic motion unit and
Bottom printhead, described bottom printhead is arranged on basic motion unit, and it is at basic motion unit
Drive under realize the movement in XYZ direction;It is provided with under bottom on described basic motion unit and regards camera,
Camera is regarded for vision localization under this bottom.
As it is further preferred that described Electrospun module includes Electrospun moving cell and is arranged on it
On spinning-nozzle, described spinning-nozzle realizes the shifting in XYZ direction under Electrospun moving cell drives
Dynamic, it is connected with spinning solution container, and the material that this spinning solution container prepares circuit for offer is molten
Liquid, is provided with spinning high tension generator between described spinning-nozzle and fixture;The motion of described Electrospun is single
It is additionally provided with in unit under the spinning of vision localization and regards camera.
As it is further preferred that described 3D print top insulating layer module include top layer moving cell and
Top layer printhead, described top layer printhead is arranged on top layer moving cell, and it is at top layer moving cell
Drive under realize the movement in XYZ direction;It is provided with under top layer on described top layer moving cell and regards camera,
Camera is regarded for vision localization under this top layer.
As it is further preferred that described laser lift-off module includes peeling motion unit and laser instrument,
Described laser instrument is arranged on peeling motion unit, and realizes XYZ under the drive of peeling motion unit
Direction is moved, and it is used for producing laser by substrate ablation so that substrate is automatically separated with flexible electronic;
Stripping is installed lower regarding camera and optoelectronic distance sensor on described peeling motion unit, regards under this stripping
Camera is used for vision localization, and optoelectronic distance sensor is used for detecting substrate and divides the most completely with flexible electronic
From.
As it is further preferred that described feeding module includes feeding moving cell and rotating lift head,
Described rotating lift head is arranged on feeding moving cell, and it realizes under the drive of feeding moving cell
The movement in XYZ direction, the circular arc external surface of described rotating lift head cavity body is provided with vacuum absorption holes;Institute
State to be additionally provided with under the feeding of vision localization on feeding moving cell and regard camera.
In general, by the contemplated above technical scheme of this utility model compared with prior art,
Mainly possess following technological merit:
Substrate the most of the present utility model is placed on the fixture of a rotating disk, and rotating disk rotates necessarily every time
Angle arrive a station, stay for some time, treat that all modules have worked, be then rotated further
Certain angle, enters next station, circulates and so forth, drastically increase production efficiency.
The rotating disk of rotating disk module the most of the present utility model is possible not only to rotate switching station around single direction,
Can also select to invert the angle of one or several station around a direction during rotating, it is achieved
Duplication of production on certain or certain several stations, and 3D prints bottom insulating barrier module and Electrospun module
Layout can be repeated several times, thus prepare multilamellar or more complicated flexible electronic.
Substrate spray module the most of the present utility model uses electrospray techniques spray on substrate to go out one layer of base
The end, this substrate can be reliably connected with substrate, and the material manufacturing substrate can be by laser ablation, this
Sample be achieved that substrate spraying and laser lift-off with the use of.
4. there is on the substrate that this utility model is used the labelling point for vision localization;Substrate EFI
Mist module, 3D print bottom insulating barrier module, Electrospun module, 3D print top insulating layer module,
Laser lift-off module and feeding module are equipped with visual system, each module before work by visual system
First identify the labelling point on substrate, have common anchor point, thus realize manufacture process high accuracy
Location.
Laser lift-off module the most of the present utility model is furnished with optoelectronic distance sensor, due to substrate spraying mould
Block spray printing go out substrate ablated after position because separate with substrate, flexible electronic has and slightly lifts,
And optoelectronic distance sensor is for catching the change of this distance, and to judge substrate, whether ablation is complete, from
And guarantee that substrate can be kept completely separate with flexible electronic.
Electron spray the most of the present utility model and Electrospun all pass through high tension generator at respective nozzle and gold
Belong to the voltage applied between fixture, the electric field that the voltage applied is formed can destroy at nozzle solution from
The surface tension of body, thus solution is ejected in substrate.
Fixture the most of the present utility model uses the form of vac sorb, and clamp face plate has many vacuum
The aperture of absorption, overcomes flexible membrane and is difficult to a difficult problem for clamping;And the aperture of vac sorb can be used
Fixed reference feature in vision localization, it is achieved position faster.
Accompanying drawing explanation
Fig. 1 is the installation diagram of the flexible electronic preparation system that this utility model multistation is worked in coordination with;
Fig. 2 is the structural representation of this utility model upper and lower base plate module;
Fig. 3 is the structural representation of this utility model substrate electron spray module;
Fig. 4 is the structural representation that this utility model 3D prints bottom insulating barrier module;
Fig. 5 is the structural representation of this utility model Electrospun module;
Fig. 6 is the structural representation that this utility model 3D prints top insulating layer module;
Fig. 7 is the structural representation of this utility model laser lift-off module;
Fig. 8 is the structural representation of this utility model feeding module;
Fig. 9 (a)-(h) is this utility model flexible electronic preparation process schematic diagram.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with
Drawings and Examples, are further elaborated to this utility model.Should be appreciated that this place is retouched
The specific embodiment stated, only in order to explain this utility model, is not used to limit this utility model.This
Outward, if technical characteristic involved in each embodiment of this utility model disclosed below that
The conflict of not constituting between this just can be mutually combined.
As it is shown in figure 1, the flexible electronic system that a kind of multistation that this utility model embodiment provides is worked in coordination with
Standby system, it mainly includes rotating disk module 100, upper and lower base plate module 200, substrate electron spray module
300,3D printing bottom insulating barrier module 400, Electrospun module 500,3D print top insulating layer mould
Block 600, laser lift-off module 700 and feeding module 800, wherein, rotating disk module 100 be used for into
The switching of row station, upper and lower base plate module 200, substrate electron spray module 300,3D print bottom insulation
Layer module 400, Electrospun module 500,3D print top insulating layer module 600, laser lift-off module
700 and feeding module 800 be evenly distributed on rotating disk module 100 successively around;Upper and lower base plate module
200 for picking up substrate from hopper and being seated to fixture 102, and for fetching substrate from fixture
Put in ash can, substrate has the labelling point for vision localization;Substrate electron spray module 300
One layer of substrate with stickiness is gone out for electron spray on substrate;3D prints bottom insulating barrier module 400
For printing the insulating barrier of bottom in substrate;Electrospun module 500 is at bottom insulating barrier
Spin out circuit;3D prints top insulating layer module 600 for printing the insulation of top layer on circuit
Layer;Laser lift-off module 700 is for the substrate ablation gone out by substrate electron spray module spray printing so that base
Plate is automatically separated with flexible electronic;The flexible electronic that feeding module 800 is used for being separated is from substrate
Take off and put into feed bin.In native system, substrate is placed in rotating disk module, and rotating disk module often rotates
Once arrive a station, stay for some time, when the module of this station has worked, then continue
Rotate certain angle and enter next station, circulate and so forth, it is achieved that fully-automatic production, pole
Big improves production efficiency.
Modules will be described in detail and describe below.
Rotating disk module 100 is mainly used in fixing substrate and changes with station, and it includes a rotating disk 101
Being distributed in the fixture 102 on rotating disk 101 circumference with several, fixture 102 was for preparing whole
Fixing substrate in journey, rotating disk 101 is used for carrying out station conversion, upper and lower base plate module 200, substrate electricity
Spray module 300,3D printing bottom insulating barrier module 400, Electrospun module 500,3D print top layer
Insulating barrier module 600, laser lift-off module 700 and feeding module 800 are the most uniform
Be distributed in rotating disk 101 around, with this formed upper and lower base plate station, substrate electron spray station,
3D printing bottom insulating barrier station, Electrospun station, 3D print top insulating layer station, laser lift-off
Station and feeding station.Wherein, 3D prints bottom insulating barrier module and Electrospun module can repeat many
Secondary layout, i.e. it is multiple that 3D prints bottom insulating barrier module 400 and Electrospun module 500, successively between
Every layout, first arrange that 3D prints bottom insulating barrier module, then arrange Electrospun module, then arrange again
3D prints bottom insulating barrier mould, the like, can realize printing layer flexible electronics or more with this
Complicated flexible electronic, flexible electronic is connected by the spun electrode of Electrospun between layers.Its
In, first 3D prints bottom insulating barrier module and is used for printing the insulating barrier of bottom in substrate, after
Continuous 3D prints bottom insulating barrier module and is used for printing the insulating barrier in intermediate layer on circuit, can be described as
3D prints interlayer insulating layer module.It is a kind of based on mathematical model file that described 3D prints,
Using the 3D printing i.e. one of rapid shaping technique described in powdered gold, its genus or plastics etc. can bond
Material, carrys out the technology of constructed object by the way of successively printing.
Concrete, the rotating disk 101 of rotating disk module 100 is possible not only to rotate switching around single direction
Station, it is also possible to select to invert the angle of one or several station around a direction during rotating,
Realize duplication of production on certain or certain several stations, thus prepare multilamellar or more complicated flexible electrical
Son.
Further, the fixture 102 of rotating disk module 100 uses the form of vac sorb to fix base
Plate, and can by regulation sucker in X to the baffle plate with Y-direction change absorption scope thus
Realize the fixing of the substrate to different size and shape.
As in figure 2 it is shown, upper and lower base plate module 200 for being placed to the folder of rotating disk from hopper pickup substrate
Fetch substrate on tool and from fixture and put into ash can, this module by the mechanical arm 201 of a Three Degree Of Freedom,
Hopper 202 and ash can 203 form, and wherein mechanical arm can have degree of freedom about the z axis, around X1
Axle and the degree of freedom of X2 axle, be used for realizing mechanical arm in spatial displacement, mechanical arm 201 defeated
Going out end can be a vacuum cup, is used for the pickup realizing substrate and lays;Hopper 202 and waste material
Substrate before case 203 is respectively used to deposit use and after use.
As it is shown on figure 3, substrate electron spray module 300 goes out one layer with glutinous for electron spray on substrate
Property substrate, including electron spray moving cell 301 and spray nozzle 304 mounted thereto, spraying spray
Mouth 304 realizes the movement in XYZ direction under the drive of electron spray moving cell 301, and its connection has spray
Mist solution container 303, this spray solution container 303 is used for providing the material solution of preparation underlying structure,
This solution can be polarized by high-voltage field and spray, and the spouting velocity of solution and flow are by flow pump control;
Spraying high tension generator 305 it is provided with, high tension generator of spraying between spray nozzle 304 and fixture 102
One end wire of 305 is connected with spray nozzle 304, and other end wire is connected with metal fixture 102, uses
In forming high voltage electric field between spray nozzle 304 and fixture 102;On electron spray moving cell 301
It is additionally provided with under the electron spray of vision localization and regards camera 302.
As shown in Figure 4,3D prints bottom insulating barrier module 400 for printing bottom in substrate
Insulating barrier, it includes basic motion unit 401 and bottom printhead 403, and bottom printhead 403 is installed
On basic motion unit 401, it realizes XYZ direction under the drive of basic motion unit 401
Mobile, it is used for spraying solution and makes insulating barrier;It is provided with on basic motion unit 401 under bottom and regards
Camera 402, regards camera 402 for vision localization under this bottom.
As it is shown in figure 5, Electrospun module 500 is for spinning out circuit on the insulating barrier of bottom, its
Including Electrospun moving cell 501 and spinning-nozzle 504 mounted thereto, spinning-nozzle 504 is at electricity
Spinning moving cell 501 realizes the movement in XYZ direction, itself and spinning solution container 503 phase under driving
Even, the material solution of circuit prepared by this spinning solution container 503 for offer, and this solution can be by high pressure
Field polarization is also sprayed, and the spouting velocity of solution and flow are by flow pump control;Spinning-nozzle 504
And being provided with spinning high tension generator 505 between fixture 102, one end of spinning high tension generator 505 is led
Line is connected with spinning-nozzle 504, and other end wire is connected with metal fixture 102, for spraying in spinning
High voltage electric field is formed between mouth 504 and metal fixture 102;It is additionally provided with on Electrospun moving cell 501
Camera 502 is regarded under the spinning of vision localization.The structure of Electrospun module 500 and electron spray structure phase
Seemingly, difference is the distance between solution material, electric field level, nozzle and substrate, by changing
These parameters can be achieved with electron spray and Electrospun.
As shown in Figure 6,3D prints top insulating layer module 600 for printing top layer on circuit
Insulating barrier, its structure printing bottom insulating barrier module 400 with 3D is identical, and it includes that top layer motion is single
Unit 601 and top layer printhead 603, top layer printhead 603 is arranged on top layer moving cell 601, its
Realizing the movement in XYZ direction under the drive of top layer moving cell 601, it is used for spraying solution and makes
Insulating barrier;It is provided with under top layer on top layer moving cell 601 and regards camera 602, under this top layer, regard camera
602 are used for vision localization.
As it is shown in fig. 7, laser lift-off module 700 is burnt for the substrate gone out by substrate spray module spray printing
Erosion, so that substrate is automatically separated with flexible electronic, it includes peeling motion unit 701 and laser
Device 703, laser instrument 703 is arranged on peeling motion unit 701, and at peeling motion unit 701
Realizing XYZ direction under drive to move, it is used for producing laser by substrate ablation so that substrate is with flexible
Electronics is automatically separated;Stripping is installed lower regarding camera 702 and optoelectronic distance on peeling motion unit 701
Sensor 704, regards camera 702 and is used for vision localization under this stripping, optoelectronic distance sensor 704 is used for
Whether detection substrate is kept completely separate with flexible electronic.Described laser lift-off technique is that one is not being destroyed
In the case of substrate and product, irradiate corresponding region with laser, make middle special material layer ablation
And lose stickiness, so that substrate is automatically separated with flexible electronic.
As shown in Figure 8, feeding module 800 is for taking off the flexible electronic separated also from substrate
Putting into feed bin, it includes feeding moving cell 801 and rotating lift head 803, and rotating lift head 803 is pacified
Being contained on feeding moving cell 801, it realizes XYZ direction under the drive of feeding moving cell 801
Movement;Rotating lift head 803 has degree of freedom about the z axis, for realizing pick-up head about the z axis
Rotate, the circular arc external surface of its cavity be machined with the vacuum absorption holes of array both axially and radially,
And this pick-up head can be according to the size of flexible electronic and position from the spatial attitude of main modulation pick device
Size with absorption active section, it is achieved accurately absorption migration;It is additionally provided with use on feeding moving cell 801
Camera 802 is regarded under the feeding of vision localization.
Fig. 9 (a)-(h) is flexible electronic preparation process schematic diagram, and wherein A represents substrate, B table
Show that substrate, C1 represent that bottom insulating barrier, D1 indication circuit, C2 represent interlayer insulating layer, D2 table
Show that circuit, C3 represent that top insulating layer, E represent electrode, below in conjunction with Fig. 9 (a)-(h) explanation
Once utilizing this utility model system to prepare the detailed process of Double-layer flexible electronics, it mainly includes following
Step:
1) upper and lower base plate module 100 by substrate A pickup and is correctly placed on the fixture 102 of rotating disk;
2) rotating disk rotates certain angle and arrives substrate electron spray module 300, and this module is at substrate A
Upper electron spray goes out one layer of substrate B;
3) rotating disk rotates certain angle and arrives 3D printing bottom insulating barrier module 400, and this module exists
The insulating barrier C1 of bottom is printed on substrate B;
4) rotating disk rotates certain angle and arrives Electrospun module 500, and this module is on insulating barrier C1
Spin the circuit D1 of needs;
5) rotating disk rotates certain angle and arrives 3D printing interlayer insulating layer module, and this module exists
Interlayer insulating layer C2 is printed on circuit layer;
6) rotating disk rotates certain angle and arrives Electrospun module, and this module is spun on insulating barrier C2
Go out the circuit D2 needed;
7) rotating disk rotates certain angle and arrives 3D printing top insulating layer module 600, and this module exists
Top insulating layer C3 is printed on circuit layer D2;
8) rotating disk rotates certain angle and arrives laser lift-off module 700, and this module is by substrate EFI
The substrate B ablation that mist module electron spray goes out so that substrate A is automatically separated with the flexible electronic prepared;
9) rotating disk rotates certain angle and arrives feeding module 800, the flexibility that this module will be separated
Electronics takes off from substrate A and puts into feed bin;
10) rotating disk rotates certain angle and returns to upper and lower base plate module 200, and this module is by use
Substrate A takes off and puts into reject bin;
This flow process is the preparation flow of Double-layer flexible electronics, for monolayer or the system of layer flexible electronics
Standby, it is only necessary to 3D to be increased or decreased accordingly and prints interlayer insulating layer and the number of repetition of Electrospun module
Can realize.
As it will be easily appreciated by one skilled in the art that and the foregoing is only preferred embodiment of the present utility model
, not in order to limit this utility model, all made within spirit of the present utility model and principle
Any amendment, equivalent and improvement etc., within should be included in protection domain of the present utility model.
Claims (9)
1. the flexible electronic preparation system that a multistation is collaborative, it is characterised in that this system includes rotation
Turntable module (100), upper and lower base plate module (200), substrate electron spray module (300), 3D beat
Print bottom insulating barrier module (400), Electrospun module (500), 3D print top insulating layer module
(600), laser lift-off module (700) and feeding module (800), wherein:
Described rotating disk module (100) include a rotating disk (101) and several be distributed in rotation
Fixture (102) on dish (101) circumference, described fixture (102) is used for fixing substrate, described rotation
Rotating disk (101) is used for carrying out station conversion;
Described upper and lower base plate module (200), substrate electron spray module (300), 3D print bottom exhausted
Edge layer module (400), Electrospun module (500), 3D printing top insulating layer module (600),
Laser lift-off module (700) and feeding module (800) are sequentially distributed in rotating disk module (100)
Around;Described upper and lower base plate module (200) is used for picking up substrate and being seated to fixture (102),
And put in ash can for fetching substrate from fixture;
Described substrate electron spray module (300) goes out one layer of base with stickiness for electron spray on substrate
The end;Described 3D prints bottom insulating barrier module (400) for printing the insulation of bottom in substrate
Layer;Described Electrospun module (500) is for spinning out circuit on bottom insulating barrier;Described 3D beats
Print top insulating layer module (600) is for printing the insulating barrier of top layer on circuit;Described laser is shelled
From module (700) for the substrate ablation that substrate electron spray module spray printing is gone out so that substrate is with flexible
Electronics is automatically separated;Described feeding module (800) is for taking the flexible electronic separated from substrate
Under.
2. the flexible electronic preparation system that multistation as claimed in claim 1 is collaborative, it is characterised in that
Described 3D prints bottom insulating barrier module (400) and Electrospun module (500) forms a set of printing electricity
Spin block, described printing Electrospun module is one or more sets, all can realize single or multiple lift flexible
Prepared by electronics;When arranging a set of, to prepare layer flexible electronics, rotating disk need to be made to prepare
Frequently inverting in journey, then need not reversion when arranging many sets, flexible electronic is between layers by electricity
The spun electrode of spinning is connected.
3. the flexible electronic preparation system that multistation as claimed in claim 1 or 2 is collaborative, its feature
Being, described upper and lower base plate module (200) includes mechanical arm (201), hopper (202) and waste material
Case (203), described mechanical arm (201) is for pickup and transfer base substrate, and it has three degree of freedom,
Substrate before described hopper (202) and ash can (203) are respectively used to deposit use and after use.
4. the flexible electronic preparation system that multistation as claimed in claim 3 is collaborative, it is characterised in that
Described substrate electron spray module (300) includes electron spray moving cell (301) and mounted thereto
Spray nozzle (304), the described spray nozzle (304) drive in electron spray moving cell (301)
The lower movement realizing XYZ direction, its connection has spray solution container (303), this spray solution container
(303) for providing the material solution of preparation underlying structure, described spray nozzle (304) and fixture
(102) spraying high tension generator (305) it is provided with between, at spray nozzle (304) and fixture
(102) high voltage electric field is formed between;It is additionally provided with for regarding on described electron spray moving cell (301)
Camera (302) is regarded under the electron spray of feel location.
5. the flexible electronic preparation system that multistation as claimed in claim 4 is collaborative, it is characterised in that
Described 3D prints bottom insulating barrier module (400) and includes that basic motion unit (401) and bottom print
Head (403), described bottom printhead (403) is arranged on basic motion unit (401), its
The movement in XYZ direction is realized under the drive of basic motion unit (401);Described basic motion unit (401)
On be provided with under bottom and regard camera (402), regard camera (402) under this bottom for vision localization.
6. the flexible electronic preparation system that multistation as claimed in claim 5 is collaborative, it is characterised in that
Described Electrospun module (500) includes Electrospun moving cell (501) and spinning mounted thereto
Nozzle (504), described spinning-nozzle (504) realizes under Electrospun moving cell (501) drives
The movement in XYZ direction, it is connected with spinning solution container (503), this spinning solution container (503)
The material solution of circuit is prepared, between described spinning-nozzle (504) and fixture (102) for offer
It is provided with spinning high tension generator (505);It is additionally provided with use on described Electrospun moving cell (501)
Camera (502) is regarded under the spinning of vision localization.
7. the flexible electronic preparation system that multistation as claimed in claim 6 is collaborative, it is characterised in that
Described 3D prints top insulating layer module (600) and includes that top layer moving cell (601) and top layer print
Head (603), described top layer printhead (603) is arranged on top layer moving cell (601), its
The movement in XYZ direction is realized under the drive of top layer moving cell (601);Described top layer moving cell (601)
On be provided with under top layer and regard camera (602), regard camera (602) under this top layer for vision localization.
8. the flexible electronic preparation system that multistation as claimed in claim 7 is collaborative, it is characterised in that
Described laser lift-off module (700) includes peeling motion unit (701) and laser instrument (703), institute
State laser instrument (703) to be arranged on peeling motion unit (701), and in peeling motion unit (701)
Drive under realize XYZ direction and move, it is used for producing laser by substrate ablation so that substrate is with soft
Property electronics is automatically separated;Stripping is installed lower regarding camera (702) on described peeling motion unit (701)
With optoelectronic distance sensor (704), regard camera (702) under this stripping for vision localization, photoelectricity
Range sensor (704) is used for detecting whether substrate is kept completely separate with flexible electronic.
9. the flexible electronic preparation system that multistation as claimed in claim 8 is collaborative, it is characterised in that
Described feeding module (800) includes feeding moving cell (801) and rotating lift head (803), institute
Stating rotating lift head (803) to be arranged on feeding moving cell (801), it is at feeding moving cell
(801) movement in XYZ direction, the circle of described rotating lift head (803) cavity are realized under drive
Arc outer surface is provided with vacuum absorption holes;It is additionally provided with for vision on described feeding moving cell (801)
Camera (802) is regarded under the feeding of location.
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CN201620243912.6U CN205522539U (en) | 2016-03-28 | 2016-03-28 | Synergistic flexible electron of multistation preparation system |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105711099A (en) * | 2016-03-28 | 2016-06-29 | 华中科技大学 | System and method for multistation cooperation preparation of flexible electronics |
CN106626803A (en) * | 2016-09-09 | 2017-05-10 | 华中科技大学 | Flexible electron electronic injection equipment having electric field adaptive characteristic and method |
CN107414298A (en) * | 2017-08-31 | 2017-12-01 | 武汉光迅科技股份有限公司 | A kind of device and application method of multistation automatic clamping and placing fixture |
WO2018233202A1 (en) * | 2017-06-22 | 2018-12-27 | 华南理工大学 | Reverse polarity plasma arc robot additive manufacturing system and implementation method therefor |
CN111106267A (en) * | 2019-12-31 | 2020-05-05 | 华中科技大学 | Flexible display electrofluid atomization film packaging system and process |
-
2016
- 2016-03-28 CN CN201620243912.6U patent/CN205522539U/en not_active Withdrawn - After Issue
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105711099A (en) * | 2016-03-28 | 2016-06-29 | 华中科技大学 | System and method for multistation cooperation preparation of flexible electronics |
CN105711099B (en) * | 2016-03-28 | 2017-12-12 | 华中科技大学 | A kind of the flexible electronic preparation system and method for multistation collaboration |
CN106626803A (en) * | 2016-09-09 | 2017-05-10 | 华中科技大学 | Flexible electron electronic injection equipment having electric field adaptive characteristic and method |
WO2018233202A1 (en) * | 2017-06-22 | 2018-12-27 | 华南理工大学 | Reverse polarity plasma arc robot additive manufacturing system and implementation method therefor |
CN107414298A (en) * | 2017-08-31 | 2017-12-01 | 武汉光迅科技股份有限公司 | A kind of device and application method of multistation automatic clamping and placing fixture |
CN107414298B (en) * | 2017-08-31 | 2019-06-04 | 武汉光迅科技股份有限公司 | A kind of device and application method of multistation automatic clamping and placing fixture |
CN111106267A (en) * | 2019-12-31 | 2020-05-05 | 华中科技大学 | Flexible display electrofluid atomization film packaging system and process |
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