CN205510533U - Link board subassembly and connector module - Google Patents
Link board subassembly and connector module Download PDFInfo
- Publication number
- CN205510533U CN205510533U CN201620113233.7U CN201620113233U CN205510533U CN 205510533 U CN205510533 U CN 205510533U CN 201620113233 U CN201620113233 U CN 201620113233U CN 205510533 U CN205510533 U CN 205510533U
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- CN
- China
- Prior art keywords
- circuit board
- multilayer circuit
- layer
- multilayer
- ora terminalis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a link board subassembly and connector module, the subassembly of winning in succession contains 1 the 1st multilayer circuit board, 1 the 2nd multilayer circuit board and a softness circuit board. A multilayer circuit board contains the first circuit layer of multilayer of range upon range of configuration. The 2nd multilayer circuit board contains the multilayer second circuit layer of range upon range of configuration. A first ora terminalis of softness circuit board by the centre gripping wherein between the two -layer first circuit layer, and a second ora terminalis of softness circuit board is by the centre gripping wherein between the two -layer second circuit layer. Consequently, the softness circuit board does not occupy the space on a multilayer circuit board or the 2nd multilayer circuit board surface, can be for intensive configuration electronic component the effective volume of control connection ware module.
Description
Technical field
This utility model is related to adapter, a kind of can the connecting plate assembly of intensive configuration electronic building brick and connector modules.
Background technology
Connecting plate assembly is a kind of by flexible circuit board (Flexible Print Circuit；FPC) structure of two rigid circuit boards, it often uses within electronic installation or connector modules.Owing to circuit and electronic building brick can only be configured at grade by rigid circuit board, therefore the corresponding circuits of electronic building brick is separately positioned on multiple circuit board, it is connected with each other with flexible circuit board again, electronic installation can be overcome whereby or connector modules inner space limits.
It is said that in general, the one of which connected mode that flexible circuit board connects rigid circuit board is that the edge of flexible circuit board is welded on the surface of rigid circuit board；Another kind of connected mode then at the surface configuration soft board connector of rigid circuit board for flexible circuit board grafting.Aforesaid connected mode all can take the space surface of rigid circuit board and the electronic building brick layout that affects on rigid circuit board, particularly apply when connector modules, connector modules volume is little and be standard size, therefore, it is difficult to the size extending rigid circuit board for welding or arranges soft board connector, cannot be for arranging other electronic building bricks in place of welding or arrange soft board connector so that the most limited circuit board space is narrower.
Utility model content
This utility model provides a kind of connecting plate assembly and connector modules, for a kind of can the connecting plate assembly of intensive configuration electronic building brick and connector modules.
This utility model provides a kind of connecting plate assembly, comprises:
One first multilayer circuit board, comprises multilamellar first circuit layer of laminated configuration；
One second multilayer circuit board, comprises the multilamellar second circuit layer of laminated configuration；And
One flexible circuit board, one first ora terminalis of this flexible circuit board is clamped in wherein between this first circuit layer of two-layer, and one second ora terminalis of this flexible circuit board is clamped in wherein between this second circuit layer of two-layer.
Wherein the surface configuration of this first multilayer circuit board has an electronic building brick, and the position that arranges of this electronic building brick is stacked with this first ora terminalis and overlaps.
Wherein the surface configuration of this second multilayer circuit board has an electronic building brick, and the position that arranges of this electronic building brick is stacked with this second ora terminalis and overlaps.
This utility model also provides for a kind of connector modules, including:
One first multilayer circuit board, comprises multilamellar first circuit layer of stack arrangement；
One second multilayer circuit board, comprises the multilamellar second circuit layer of stack arrangement；
One flexible circuit board, one first ora terminalis of this flexible circuit board is clamped in wherein between this first circuit layer of two-layer, and one second ora terminalis of this flexible circuit board is clamped in wherein between this second circuit layer of two-layer；
One first adapter, is located at this first multilayer circuit board；And
One second adapter, configures with this first connector stack.
Wherein the surface configuration of this first multilayer circuit board has an electronic building brick, and the position that arranges of this electronic building brick is stacked with this first ora terminalis and overlaps.
Wherein the surface configuration of this second multilayer circuit board has an electronic building brick, and the position that arranges of this electronic building brick is stacked with this second ora terminalis and overlaps.
Wherein this first multilayer circuit board and this second multilayer circuit board are mutually perpendicular to configuration, and the bending configuration of this flexible circuit board.
Wherein this first multilayer circuit board and this second multilayer circuit board are parallel to each other to fold and set, and the bending configuration of this flexible circuit board.
Wherein it is provided with multiple first leg on this second multilayer circuit board.
Wherein this second adapter includes multiple second legs configured side by side with the plurality of first leg.
Also including an insulating base, this first multilayer circuit board, this second multilayer circuit board and this second adapter are arranged on this insulating base.
Wherein this first adapter comprises printing and is arranged on multiple the first terminals on this first multilayer circuit board surface.
This utility model has advantages in that
The connector modules of this utility model offer and connecting plate assembly, first ora terminalis and second ora terminalis of flexible circuit board are clamped in wherein between two layers of first circuit layer being stacked and second circuit layer respectively, and then prevent take up the first multilayer circuit board or the space on the second multilayer circuit board surface.Therefore, it can for intensive configuration electronic building brick can the volume of effective control connector module.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of the connecting plate assembly of this utility model first embodiment.
Fig. 2 is the sectional view of the connecting plate assembly of this utility model first embodiment.
Fig. 3 is the schematic perspective view of the connector modules of this utility model the second embodiment.
Fig. 4 is the sectional view of the connector modules of this utility model the second embodiment.
Fig. 5 is the schematic perspective view of the connector modules of this utility model the 3rd embodiment.
Fig. 6 is the schematic diagram of the connector modules of this utility model the 4th embodiment.
In figure:
100 insulating bases；
200 connecting plate assemblies；
210 first multilayer circuit boards；
211a/211b the first circuit layer；
220 second multilayer circuit boards；
221a/221b second circuit layer；
222 first legs；
230 flexible circuit boards；
231 first ora terminalis；
232 second ora terminalis；
240 electronic building bricks；
310 first adapters；
311 the first terminals；
320 second adapters；
321 second legs.
Detailed description of the invention
The utility model is described in further detail with specific embodiment below in conjunction with the accompanying drawings, so that those skilled in the art can be better understood from this utility model and can be practiced, but illustrated embodiment is not as to restriction of the present utility model.
Refering to Fig. 1 and Fig. 2, first embodiment of the present utility model provides a kind of connecting plate assembly 200, and it comprises one first multilayer circuit board 210 (Multi-Layer；PCB), one second multilayer circuit board 220 and a flexible circuit board 230.
In the present embodiment, the first multilayer circuit board 210 comprises multilamellar the first circuit layer 211a, 211b of laminated configuration；Second multilayer circuit board 220 comprises multilamellar second circuit layer 221a, 221b of laminated configuration.
In the present embodiment, flexible circuit board 230 is flexible strip circuit board, and it can be monolayer or multi-layer configuration, impracticable novel is not limited.Two ends of flexible circuit board 230 are respectively provided with one first ora terminalis 231 and one second ora terminalis 232.Flexible circuit board 230 first ora terminalis 231 is clamped in wherein between two layers of first circuit layer 211a, 211b being stacked, and each first circuit layer 211a, 211b that flexible circuit board 230 is electrically connected with in the first multilayer circuit board 210 whereby.Second ora terminalis 232 of flexible circuit board 230 is clamped between second circuit layer 221a, 221b that wherein two layers are stacked, and each second circuit layer 221a, 221b that flexible circuit board 230 is electrically connected with in the second multilayer circuit board 220 whereby.First multilayer circuit board 210 and the second multilayer circuit board 220 are electrically connected with each other by flexible circuit board 230.
In the present embodiment, the first ora terminalis 231 and second ora terminalis 232 of flexible circuit board 230 are clamped in wherein between two layers of first circuit layer 211a, 211b being stacked and second circuit layer 221a, 221b by connecting plate assembly 200 of the present utility model respectively.Therefore, the first ora terminalis 231 and the second ora terminalis 232 are not take up the first multilayer circuit board 210 and space of the second multiple-level surface when connecting the first multilayer circuit board 210 and the second multilayer circuit board 220.The surface of the first multilayer circuit board 210 and the first ora terminalis 231 are stacked overlapping position can be for arranging electronic building brick 240, the surface of the second multilayer circuit board 220 and the second ora terminalis 232 are stacked overlapping position equally for arranging electronic building brick 240, therefore, connecting plate assembly 200 of the present utility model can be for intensive configuration electronic building brick 240.
Refering to Fig. 3 and Fig. 4, the second embodiment of the present utility model provides a kind of connector modules, comprises insulating base 100, connecting plate assembly 200,1 first adapter 310 and one second adapter 320.
In the present embodiment, the pedestal that insulating base 100 is made for plastics, insulating base 100 is for arranging connecting plate assembly the 200, first adapter 310 and the second adapter 320.
Connecting plate assembly 200 comprises one first multilayer circuit board 210,1 second multilayer circuit board 220 and a flexible circuit board 230.In the present embodiment, the first multilayer circuit board 210 comprises multilamellar the first circuit layer 211a, 211b of laminated configuration；Second multilayer circuit board 220 comprises multilamellar second circuit layer 221a, 221b of laminated configuration, and the second multilayer circuit board 220 is provided with multiple first leg 222, and each first leg 222 is electrically connected with each second circuit layer 221a, 221b.In the present embodiment, flexible circuit board 230 is flexible strip circuit board, and it can be monolayer or multi-layer configuration, impracticable novel is not limited.Two ends of flexible circuit board 230 are respectively provided with one first ora terminalis 231 and one second ora terminalis 232.Flexible circuit board 230 first ora terminalis 231 is clamped in wherein between two layers of first circuit layer 211a, 211b being stacked, and each first circuit layer 211a, 211b that flexible circuit board 230 is electrically connected with in the first multilayer circuit board 210 whereby.Second ora terminalis 232 of flexible circuit board 230 is clamped between second circuit layer 221a, 221b that wherein two layers are stacked, and each second circuit layer 221a, 221b that flexible circuit board 230 is electrically connected with in the second multilayer circuit board 220 whereby.First multilayer circuit board 210 and the second multilayer circuit board 220 are electrically connected with each other by flexible circuit board 230, and further such that each first leg 222 on the second multilayer circuit board 220 can be electrically connected with the first multilayer circuit board 210 by the second multilayer circuit board 220 and flexible circuit board 230.
First multilayer circuit board 210 and the second adapter 320 stack arrangement are at insulating base 100, and the first adapter 310 is located at this first multilayer circuit board 210 and is made the first adapter 310 and the second adapter 320 stack arrangement, and make each first leg 222 on the second multilayer circuit board 220 can be electrically connected with the first adapter 310 by connecting plate assembly 200.Flexible circuit board 230 bending configuration, to allow that the first multilayer circuit board 210 is mutually perpendicular to configuration with this second multilayer circuit board 220, makes the first leg 222 on the second multilayer circuit board 220 can configure side by side with the second leg 321 of the second adapter 320 whereby.
In the present embodiment, the first ora terminalis 231 and second ora terminalis 232 of flexible circuit board 230 are clamped in wherein between two layers of first circuit layer 211a, 211b being stacked and second circuit layer 221a, 221b by connector modules of the present utility model its connecting plate assembly 200 respectively.Therefore, the first ora terminalis 231 and the second ora terminalis 232 are not take up the first multilayer circuit board 210 and space of the second multiple-level surface when connecting the first multilayer circuit board 210 and the second multilayer circuit board 220.The surface of the first multilayer circuit board 210 and the first ora terminalis 231 are stacked overlapping position can be for arranging electronic building brick 240, the surface of the second multilayer circuit board 220 and the second ora terminalis 232 are stacked overlapping position equally for arranging electronic building brick 240, therefore, connecting plate assembly 200 of the present utility model can the volume of effective control connector module for intensive configuration electronic building brick 240.
Refering to Fig. 5, the 3rd embodiment of the present utility model provides a kind of connector modules, comprises insulating base 100, connecting plate assembly 200,1 first adapter 310 and at least one second adapter 320.
In the present embodiment, the pedestal that insulating base 100 is made for plastics, insulating base 100 is for arranging connecting plate assembly the 200, first adapter 310 and the second adapter 320.
Connecting plate assembly 200 comprises one first multilayer circuit board 210,1 second multilayer circuit board 220 and a flexible circuit board 230.In the present embodiment, the first multilayer circuit board 210 comprises multilamellar the first circuit layer 211a, 211b of laminated configuration；Second multilayer circuit board 220 comprises multilamellar second circuit layer 221a, 221b of laminated configuration, and the second multilayer circuit board 220 is provided with multiple first leg 222, and each first leg 222 is electrically connected with each second circuit layer 221a, 221b.In the present embodiment, flexible circuit board 230 is flexible strip circuit board, and it can be monolayer or multi-layer configuration, impracticable novel is not limited.Two ends of flexible circuit board 230 are respectively provided with one first ora terminalis 231 and one second ora terminalis 232.Flexible circuit board 230 first ora terminalis 231 is clamped in wherein between two layers of first circuit layer 211a, 211b being stacked, and each first circuit layer 211a, 211b that flexible circuit board 230 is electrically connected with in the first multilayer circuit board 210 whereby.Second ora terminalis 232 of flexible circuit board 230 is clamped between second circuit layer 221a, 221b that wherein two layers are stacked, and each second circuit layer 221a, 221b that flexible circuit board 230 is electrically connected with in the second multilayer circuit board 220 whereby.First multilayer circuit board 210 and the second multilayer circuit board 220 are electrically connected with each other by flexible circuit board 230, and further such that each first leg 222 on the second multilayer circuit board 220 can be electrically connected with the first multilayer circuit board 210 by the second multilayer circuit board 220 and flexible circuit board 230.
In the present embodiment, first adapter 310 and multiple second adapter 320 stack arrangement are welded the first multilayer circuit board 210 at insulating base 100, the first adapter 310 and are made each first leg 222 on the second multilayer circuit board 220 can be electrically connected with the first adapter 310 by connecting plate assembly 200.Flexible circuit board 230 doubling configuration is stacked allowing that the first multilayer circuit board 210 is paralleled with this second multilayer circuit board 220, and the first leg 222 on the second multilayer circuit board 220 is configured side by side with the second leg of the second adapter 320.
In the present embodiment, the first ora terminalis 231 and second ora terminalis 232 of flexible circuit board 230 are clamped in wherein between two layers of first circuit layer 211a, 211b being stacked and second circuit layer 221a, 221b by connector modules of the present utility model its connecting plate assembly 200 respectively.Therefore, the first ora terminalis 231 and the second ora terminalis 232 are not take up the first multilayer circuit board 210 and space of the second multiple-level surface when connecting the first multilayer circuit board 210 and the second multilayer circuit board 220.The surface of the first multilayer circuit board 210 and the first ora terminalis 231 are stacked overlapping position can be for arranging electronic building brick 240, the surface of the second multilayer circuit board 220 and the second ora terminalis 232 are stacked overlapping position equally for arranging electronic building brick 240, therefore, connecting plate assembly 200 of the present utility model can the volume of effective control connector module for intensive configuration electronic building brick 240.
Refering to Fig. 6, the 4th embodiment of the present utility model provides a kind of connector modules, comprises insulating base 100, connecting plate assembly 200,1 first adapter 310 and at least one second adapter 320.Its structure is roughly as aforementioned third embodiment, its something in common repeats no more in this, the present embodiment and the 3rd embodiment difference are that the first adapter 310 comprises printing and is arranged on multiple the first terminals 311 on the first multilayer circuit board 210 surface, in the present embodiment, those the first terminals 311 are laid on two of the first multilayer circuit board 210 the most respectively, and therefore the first multilayer circuit board 210 can use for grafting as the tongue of the first adapter 310.
Embodiment described above is only the preferred embodiment lifted by absolutely proving this utility model, and protection domain of the present utility model is not limited to this.The equivalent that those skilled in the art are made on the basis of this utility model substitutes or conversion, all within protection domain of the present utility model.Protection domain of the present utility model is as the criterion with claims.
Claims (12)
1. a connecting plate assembly, it is characterised in that comprise:
One first multilayer circuit board, comprises multilamellar first circuit layer of laminated configuration；
One second multilayer circuit board, comprises the multilamellar second circuit layer of laminated configuration；And
One flexible circuit board, one first ora terminalis of this flexible circuit board is clamped in wherein between this first circuit layer of two-layer, and one second ora terminalis of this flexible circuit board is clamped in wherein between this second circuit layer of two-layer.
Connecting plate assembly the most according to claim 1, it is characterised in that wherein the surface configuration of this first multilayer circuit board has an electronic building brick, and the position that arranges of this electronic building brick is stacked with this first ora terminalis and overlaps.
Connecting plate assembly the most according to claim 1, it is characterised in that wherein the surface configuration of this second multilayer circuit board has an electronic building brick, and the position that arranges of this electronic building brick is stacked with this second ora terminalis and overlaps.
4. a connector modules, it is characterised in that including:
One first multilayer circuit board, comprises multilamellar first circuit layer of stack arrangement；
One second multilayer circuit board, comprises the multilamellar second circuit layer of stack arrangement；
One flexible circuit board, one first ora terminalis of this flexible circuit board is clamped in wherein between this first circuit layer of two-layer, and one second ora terminalis of this flexible circuit board is clamped in wherein between this second circuit layer of two-layer；
One first adapter, is located at this first multilayer circuit board；And
One second adapter, configures with this first connector stack.
Connector modules the most according to claim 4, it is characterised in that wherein the surface configuration of this first multilayer circuit board has an electronic building brick, and the position that arranges of this electronic building brick is stacked with this first ora terminalis and overlaps.
Connector modules the most according to claim 4, it is characterised in that wherein the surface configuration of this second multilayer circuit board has an electronic building brick, and the position that arranges of this electronic building brick is stacked with this second ora terminalis and overlaps.
Connector modules the most according to claim 4, it is characterised in that wherein this first multilayer circuit board and this second multilayer circuit board are mutually perpendicular to configuration, and the bending configuration of this flexible circuit board.
Connector modules the most according to claim 4, it is characterised in that wherein this first multilayer circuit board and this second multilayer circuit board are parallel to each other to fold and set, and the bending configuration of this flexible circuit board.
Connector modules the most according to claim 4, it is characterised in that be wherein provided with multiple first leg on this second multilayer circuit board.
Connector modules the most according to claim 9, it is characterised in that wherein this second adapter includes multiple second legs configured side by side with the plurality of first leg.
11. connector modules according to claim 4, it is characterised in that also include an insulating base, this first multilayer circuit board, this second multilayer circuit board and this second adapter are arranged on this insulating base.
12. connector modules according to claim 4, it is characterised in that wherein this first adapter comprises printing and is arranged on multiple the first terminals on this first multilayer circuit board surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620113233.7U CN205510533U (en) | 2016-02-04 | 2016-02-04 | Link board subassembly and connector module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620113233.7U CN205510533U (en) | 2016-02-04 | 2016-02-04 | Link board subassembly and connector module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205510533U true CN205510533U (en) | 2016-08-24 |
Family
ID=56724194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620113233.7U Expired - Fee Related CN205510533U (en) | 2016-02-04 | 2016-02-04 | Link board subassembly and connector module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205510533U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108777912A (en) * | 2018-06-26 | 2018-11-09 | 芜湖纯元光电设备技术有限公司 | A kind of bent circuit board |
| CN116600524A (en) * | 2023-07-11 | 2023-08-15 | 惠科股份有限公司 | Connection mechanism and display device |
-
2016
- 2016-02-04 CN CN201620113233.7U patent/CN205510533U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108777912A (en) * | 2018-06-26 | 2018-11-09 | 芜湖纯元光电设备技术有限公司 | A kind of bent circuit board |
| CN116600524A (en) * | 2023-07-11 | 2023-08-15 | 惠科股份有限公司 | Connection mechanism and display device |
| CN116600524B (en) * | 2023-07-11 | 2023-11-21 | 惠科股份有限公司 | Connection mechanism and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160824 Termination date: 20170204 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |