CN205504516U - Easy -radiating LED lamp - Google Patents
Easy -radiating LED lamp Download PDFInfo
- Publication number
- CN205504516U CN205504516U CN201620234083.5U CN201620234083U CN205504516U CN 205504516 U CN205504516 U CN 205504516U CN 201620234083 U CN201620234083 U CN 201620234083U CN 205504516 U CN205504516 U CN 205504516U
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- shell
- heat
- led
- heat radiation
- easy
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Abstract
The utility model discloses an easy -radiating LED lamp, include: the substrate with fix LED wafer on the substrate, the LED lamp still includes a shell, the shell is made by the heat conduction material, in be equipped with the louvre on the shell, be equipped with the heat dissipation fan in the shell afterbody of keeping away from the printing opacity piece, the heat dissipation fan pass is crossed the embedding and is connected on the shell, the heat dissipation fan is equipped with a speed control unit, speed control unit includes: temperature sensor, control chip and gear shift switch, temperature sensor and gear shift switch pass through the wire with control chip and are connected, the utility model discloses an easy -radiating LED lamp of structure dispels the heat in LED lamp work production of heat through multiple radiating mode, has increased the heat dissipation way, has improved radiating effect, can change radiating dynamics according to the temperature moreover, and the practicality is practiced thrift in the environmental protection.
Description
Technical field
This utility model relates to LED field, particularly to a kind of easy heat radiation LED.
Background technology
LED directly can be converted into light electricity, and the heart of LED is the LED wafer of a quasiconductor.In prior art, LED wafer is attached on a lead frame, and this lead frame includes that two parts, a portion extend the negative electrode connecting power cathode, and another part extends the anelectrode connecting positive source；The positive pole of middle LED wafer is connected with anelectrode by reflector, and the negative pole of LED wafer is then connected with negative electrode by wire (typically using conductive gold wire).In order to protect LED wafer, whole LED wafer is encapsulated by the light transmission piece using epoxy resin to make, and only exposes anelectrode and negative electrode.At least there are the following problems to use existing LED encapsulation technology: owing to LED wafer exists resistance, certain heat can be produced during electric current is by LED wafer, these heats are collected in around LED wafer for a long time, cannot discharge in being closed in the epoxy resin of encapsulation LED, cause LED wafer environment temperature higher.If lighting LED for a long time, being affected by higher temperature around LED wafer, LED wafer and fluorescent material accelerate loss, cause LED life to be decayed, and luminance-reduction even cannot meet normal illumination and optics needs.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of easy heat radiation LED, to solve the above-mentioned multinomial defect caused in prior art.
For achieving the above object, the technical scheme that this utility model offer is following: a kind of easy heat radiation LED, including: substrate and fixing LED wafer on the substrate, a light transmission piece it is provided with before described LED wafer, described light transmission piece is made from a material that be thermally conductive, described LED also includes a shell, and described shell is made from a material that be thermally conductive, and is provided with louvre in described shell；Being provided with heat emission fan in the shell afterbody away from light transmission piece, described heat emission fan is connected on shell by embedding, and described heat emission fan is provided with a speed control unit, and described speed control unit includes: temperature sensor, control chip and varying speed switch；Described temperature sensor and varying speed switch are all connected by wire with control chip.
Preferably, the Heat Conduction Material of described light transmission piece and shell includes: heat-conducting silicone grease, heat conduction mica sheet or thermal conductive ceramic plate.
Preferably, also including at least one seal wire that dispels the heat, described heat radiation seal wire one end is arranged at the inside of described LED, the other end is connected to described light transmission piece.
Preferably, the material of described heat radiation seal wire includes: gold, copper, aluminum or heat-conducting resin.
Preferably, described control chip is single-chip microcomputer.
Above technical scheme is used to provide the benefit that: a kind of easy heat radiation LED of this utility model structure, dispel the heat LED work produces heat when by the way of multiple heat radiation, compared to technology before, dispelled the heat by more mode, add sinking path, improve the effect of heat radiation, and the dynamics of heat radiation can be changed according to temperature, environmental protection, saves, practical.
Accompanying drawing explanation
Fig. 1 is a kind of easy heat radiation LED lamp structure schematic diagram of the present utility model.
Fig. 2 is the partial schematic diagram of stent foot of the present utility model.
Wherein: 1, substrate, 2, LED wafer, 3, light transmission piece, 4, shell, 5, louvre, 6, heat emission fan, 7, speed control unit, 71, temperature sensor, 72, control chip, 73, varying speed switch, 8, heat radiation seal wire.
Detailed description of the invention
Describe preferred implementation of the present utility model below in conjunction with the accompanying drawings in detail.
Shown in Fig. 1, a kind of easy heat radiation LED, including: substrate 1 and the LED wafer 2 being fixed on described substrate 1, a light transmission piece 3 it is provided with before described LED wafer 2, described light transmission piece 3 is made from a material that be thermally conductive, described LED also includes that a shell 4, described shell 4 are made from a material that be thermally conductive, and is provided with louvre 5 in described shell 4；Being provided with heat emission fan in the shell afterbody away from light transmission piece 3, described heat emission fan 5 is connected on shell 4 by embedding, and described heat emission fan 5 is provided with a speed control unit 7, and described speed control unit 7 includes: temperature sensor 71, control chip 72 and varying speed switch 73；Described temperature sensor 71 and varying speed switch 72 are all connected by wire with control chip 73.Owing to LED wafer exists resistance, can produce certain heat during electric current is by LED wafer, these heats are collected in around LED wafer for a long time, cannot discharge, cause LED wafer environment temperature higher in being closed in the epoxy resin of encapsulation LED.If lighting LED for a long time, being affected by higher temperature around LED wafer, LED wafer and fluorescent material accelerate loss, cause LED life to be decayed, and luminance-reduction even cannot meet normal illumination and optics needs.In the present embodiment, use a kind of easy heat radiation LED, dispel the heat LED work produces heat when by the way of multiple heat radiation, compared to technology before, dispelled the heat by more mode, add sinking path, improve the effect of heat radiation, and the dynamics of heat radiation, environmental protection can be changed according to temperature, save, practical.It should be noted that the Heat Conduction Material of described light transmission piece 3 and shell uses thermal conductive ceramic plate, be so easier plasticity, exquisite appearance.And heat-conducting effect is good.
Additionally, also include at least one seal wire 8 that dispels the heat, described heat radiation seal wire 8 one end is arranged at the inside of described LED, the other end is connected to described light transmission piece 3, and such design can be delivered to outside by the convenient heat sent by LED.And the material of described heat radiation seal wire is gold, described control chip is single-chip microcomputer.Disclosure satisfy that needs.
Above-described is only preferred implementation of the present utility model; it should be pointed out that, for the person of ordinary skill of the art, on the premise of creating design without departing from this utility model; can also make some deformation and improvement, these broadly fall into protection domain of the present utility model.
Claims (5)
1. an easy heat radiation LED, including: substrate and fixing LED wafer on the substrate, it is characterized in that, a light transmission piece it is provided with before described LED wafer, described light transmission piece is made from a material that be thermally conductive, described LED also includes a shell, and described shell is made from a material that be thermally conductive, and is provided with louvre in described shell；Being provided with heat emission fan in the shell afterbody away from light transmission piece, described heat emission fan is connected on shell by embedding, and described heat emission fan is provided with a speed control unit, and described speed control unit includes: temperature sensor, control chip and varying speed switch；Described temperature sensor and varying speed switch are all connected by wire with control chip.
A kind of easy heat radiation LED the most according to claim 1, it is characterised in that the Heat Conduction Material of described light transmission piece and shell includes: heat-conducting silicone grease, heat conduction mica sheet or thermal conductive ceramic plate.
A kind of easy heat radiation LED the most according to claim 1, it is characterised in that also including at least one seal wire that dispels the heat, described heat radiation seal wire one end is arranged at the inside of described LED, the other end is connected to described light transmission piece.
A kind of easy heat radiation LED the most according to claim 3, it is characterised in that the material of described heat radiation seal wire includes: gold, copper, aluminum or heat-conducting resin.
A kind of easy heat radiation LED the most according to claim 1, it is characterised in that described control chip is single-chip microcomputer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620234083.5U CN205504516U (en) | 2016-03-24 | 2016-03-24 | Easy -radiating LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620234083.5U CN205504516U (en) | 2016-03-24 | 2016-03-24 | Easy -radiating LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205504516U true CN205504516U (en) | 2016-08-24 |
Family
ID=56732489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620234083.5U Expired - Fee Related CN205504516U (en) | 2016-03-24 | 2016-03-24 | Easy -radiating LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205504516U (en) |
-
2016
- 2016-03-24 CN CN201620234083.5U patent/CN205504516U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160824 Termination date: 20170324 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |