CN205458703U - Flexible electrode of implanting - Google Patents
Flexible electrode of implanting Download PDFInfo
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- CN205458703U CN205458703U CN201520900038.4U CN201520900038U CN205458703U CN 205458703 U CN205458703 U CN 205458703U CN 201520900038 U CN201520900038 U CN 201520900038U CN 205458703 U CN205458703 U CN 205458703U
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Abstract
The utility model provides an electrode, including implanting end and contact connection district, implant the hand ladle and draw together base plate layer, conducting layer, working electrode layer, reference electrode layer and protective layer, the base plate layer is made by polyimide, polytetrafluoroethylene, polyethylene, polycarbonate or poly(ethylene terephthalate), the conducting layer set up in on the base plate layer, the conducting layer is gold layer or copper layer, working electrode layer and reference electrode layer set up in on the conducting layer, the protective layer set up in on on the working electrode layer and the reference electrode layer, the contact connection district includes the base plate, sets up working electrode layer contact and reference electrode layer contact on the base plate, the working electrode layer of implanting the end pass through the conducting layer with working electrode layer contact connection, the reference electrode layer of implanting the end pass through the conducting layer with reference electrode layer contact connection.
Description
Technical field
This utility model relates to technical field of electrochemical detection, particularly to a kind of electrode.
Background technology
The detection of implantable glucose detection sensor at least needs two electrodes, and one as work electricity
Pole, one as reference electrode.The electrode preparing sensor at present has two kinds of methods: one is to use crosspointer
Bipolar electrode or the multielectrode electrode design of spininess, needle body material is platinum filament, platinoiridita silk, and tantalum wire is stainless
Just, the metal such as nitinol alloy wire.Another is by the electrode design of single needle bipolar electrode, is mostly cylinder
Shape structure, nook closing member tantalum wire, rustless steel, nitinol alloy wire, platinoiridita silk, platinum filament etc., then at nook closing member
Outer layer arranges active layer, is wound around chlorination filamentary silver layer and residue insulating regions, and insulating regions is used for separating activation
Layer and chlorination filamentary silver layer.
In prior art, in single needle bipolar electrode structure, nook closing member mostly uses rigid matrix material, implant
The comfort level inside worn is bad, easily damages human body, have impact on its application.Meanwhile, existing
Fixed structure is required higher by the structure of technology after not only implanting, relative movement easily occurs, and in work
District's deposition enzyme easily causes loss, thus the accuracy of joint effect measurement result.
Utility model content
In view of this, this utility model provides a kind of electrode, and this electrode is used for preparing single-needle electrodes sensing
Device, the electrode wear comfort that implants that this utility model provides is good, will not damage human body also
And measurement result is accurate.
This utility model provides a kind of electrode, including implanting end and bonding pad, contact；
Described implantation end includes substrate layer, conductive layer, electrode layer, reference electrode layer and protective layer；
Described substrate layer is by polyimides, politef, polyethylene, Merlon or poly terephthalic acid second
Diester is made；Described conductive layer is arranged on described substrate layer；Described conductive layer is layer gold or layers of copper；Work
Make electrode layer and reference electrode layer is arranged on described conductive layer；Described protective layer is arranged at described work electricity
On the layer of pole and on reference electrode layer；
Bonding pad, described contact includes substrate, be arranged on substrate electrode layer contact and reference electrode
Layer contact；
The electrode layer of described implantation end is connected with described electrode layer contact by conductive layer；Described
The reference electrode layer implanting end is connected with described reference electrode layer contact by conductive layer.
Preferably, described substrate layer and the thickness of described conductive layer are than being (50～300): (15～25).
Preferably, described conductive layer includes the first bonding pad and the second bonding pad, the work of described implantation end
Electrode layer is connected with described electrode layer contact by the first bonding pad of conductive layer；Described implantation end
Reference electrode layer is connected with described reference electrode layer contact by the second bonding pad of conductive layer.
Preferably, described protective layer is made up of polyimides, Parylene or politef.
Preferably, described protective layer is arranged on described electrode layer upper surface two ends and reference electrode layer
Two ends, surface.
Preferably, described conductive layer is layers of copper, also includes the nickel dam being arranged in described layers of copper, is arranged on
Layer gold on described nickel dam.
Preferably, the thickness of described nickel dam is 1～3 μm, and the thickness of described layer gold is 5～20 μm.
Preferably, described electrode layer includes catalytic activation layer, by platinum, gold, palladium, carbon, graphite or
Graphene is made.
This utility model additionally provides a kind of sensor, including the electrode described in technique scheme.
Compared with prior art, this utility model provides a kind of electrode, including implanting end and contact connection
District；Described implantation end includes substrate layer, conductive layer, electrode layer, reference electrode layer and protective layer；
Described substrate layer is by polyimides, politef, polyethylene, Merlon or poly terephthalic acid second
Diester is made；Described conductive layer is arranged on described substrate layer；Described conductive layer is layer gold or layers of copper；Work
Make electrode layer and reference electrode layer is arranged on described conductive layer；Described protective layer is arranged at described work electricity
On the layer of pole and on reference electrode layer；The work electricity that bonding pad, described contact includes substrate, is arranged on substrate
Layer contact, pole and reference electrode layer contact；The electrode layer of described implantation end is by conductive layer and described work
Make electrode layer contact to connect；The reference electrode layer of described implantation end is by conductive layer and described reference electrode layer
Contact connects.This utility model uses polyimides, politef, polyethylene, Merlon or poly-
PETP flexible material prepares electrode as base material, and the electrode finally prepared is planted
Enter internal wear comfort good, human body will not be damaged, and use the design of above-mentioned ad hoc structure
Make measurement result accuracy good.
Accompanying drawing explanation
The structure sectional view implanting end of the electrode that Fig. 1 provides for this utility model；
The electrode structure schematic diagram that Fig. 2 provides for this utility model；
Fig. 3 is the corresponding current test results of electrode glucose that this utility model embodiment 4 prepares；
Fig. 4 is the corresponding current test results of electrode glucose that this utility model embodiment 5 prepares；
Fig. 5 is the corresponding current test results of electrode glucose that this utility model embodiment 6 prepares.
Detailed description of the invention
This utility model provides a kind of electrode, including implanting end and bonding pad, contact；
Described implantation end includes substrate layer, conductive layer, electrode layer, reference electrode layer and protective layer；
Described substrate layer is by polyimides, politef, polyethylene, Merlon or poly terephthalic acid second
Diester is made；Described conductive layer is arranged on described substrate layer；Described conductive layer is layer gold or layers of copper；Work
Make electrode layer and reference electrode layer is arranged on described conductive layer；Described protective layer is arranged at described work electricity
On the layer of pole and on reference electrode layer；
Bonding pad, described contact includes substrate, be arranged on substrate electrode layer contact and reference electrode
Layer contact；
The electrode layer of described implantation end is connected with described electrode layer contact by conductive layer；Described
The reference electrode layer implanting end is connected with described reference electrode layer contact by conductive layer.
This utility model provide electrode include implant end, described implantation end include substrate layer, conductive layer,
Electrode layer, reference electrode layer and protective layer:
Described substrate layer is by polyimides, politef, polyethylene, Merlon or poly-terephthaldehyde
Acid second diester is made；
Described conductive layer is arranged on described substrate layer；Described conductive layer is layer gold or layers of copper；
Electrode layer and reference electrode layer are arranged on described conductive layer；
Described protective layer is arranged in described electrode layer and on reference electrode layer.
The implantation end of electrode that this utility model provides includes substrate layer, described substrate layer by polyimides,
Politef, polyethylene, Merlon or polyethylene terephthalate are made.
In this utility model, the thickness of described substrate layer is preferably 0.05～3mm, more preferably
0.1～2.5mm；The width of described substrate layer is preferably 0.1～0.5mm, more preferably 0.2～0.4mm；Institute
State the length of substrate layer and be preferably 1～15mm, more preferably 2～14mm, most preferably 3～13mm.
In this utility model, described conductive layer is arranged on described substrate layer；Preferably, this practicality is new
Conductive layer described in type includes the first conductive layer and the second conductive layer；
It is furthermore preferred that described first conductive layer and the second conductive layer are respectively arranged at described substrate layer both sides；
Described first conductive layer is layer gold or layers of copper, and described second conductive layer is layer gold or layers of copper.
In this utility model, the thickness of described first conductive layer is preferably 15～25 μm, more preferably
17～23 μm；The width of described first conductive layer is preferably 0.1～0.5mm, more preferably 0.2～0.4mm.
When described first conductive layer is layers of copper, also include the nickel dam being arranged in described layers of copper, described nickel
The thickness of layer is 1～3 μm；Being arranged on the layer gold on described nickel dam, the thickness of described layer gold is 5～20 μm；
Described layers of copper is provided with nickel dam and layer gold effect is corrosion protection, increase electric conductivity, also simultaneously
It is possible to prevent the interference to test of the layers of copper of bottom.
In this utility model, the thickness of described second conductive layer is preferably 15～25 μm, more preferably
17～23 μm；The width of described second conductive layer is preferably 0.1～0.5mm, more preferably 0.2～0.4mm.
In this utility model, described substrate layer is preferably with the thickness ratio of described first conductive layer
(50～300): (15～25).
The implantation end electrode layer of electrode that this utility model provides and reference electrode layer are arranged at described the
On one conductive layer.
In this utility model, described electrode layer is catalytic activation layer, preferably by platinum, gold, palladium,
Carbon, graphite or Graphene are made.In this utility model, the thickness of described electrode layer is preferably 20～50
μm, more preferably 22～48 μm, most preferably 25～45 μm.
In this utility model, described reference electrode layer is preferably silver chloride layer.In this utility model,
Described reference electrode layer is preferably 20～50 μm, more preferably 22～48 μm, most preferably 25～45 μm.
In this utility model, the length of described working electrode and reference electrode is than preferably 1:(1～10)；
More preferably 1:(2～9).
In this utility model, described electrode layer and reference electrode layer are not attached to.Described working electrode
The spacing of layer and reference electrode layer is preferably 0.1～2mm.
In this utility model, the most also include being arranged at described electrode layer upper surface two ends and reference
The protective layer at electrode layer upper surface two ends.Described protective layer is preferably by polyimides, Parylene or poly-
Tetrafluoroethene is made.
Described protective layer to cover electrode layer edges at two ends and described reference electrode layer edges at two ends is
Preferably, the described length often holding protective layer is preferably 50～100 μm, more preferably 55～95 μm.Described guarantor
The thickness of sheath is preferably 10～50 μm.
In this utility model, the most also include the protective layer being arranged at described second conductive layer upper surface,
Described preferably it is made up of polyimides, Parylene or politef.The thickness of described protective layer is excellent
Elect 10～50 μm as.The length of this protective layer is advisable with the length covering the whole upper surface of substrate.
This utility model provides above-mentioned protective layer, can protect the edge of conversion zone, eliminates edge effect,
The recessed area convenient deposition enzyme that protective layer is formed in working area can be utilized simultaneously, reduce losing of enzyme, mention
The Stability and veracity of determination of electrode result.
The concrete structure implanting end of the electrode that this utility model embodiment provides is as it is shown in figure 1, Fig. 1 is
The structure sectional view implanting end of the electrode that this utility model provides；
Wherein, 1 is working electrode area, and 2 is reference electrode region, and 10 is substrate, and 12 is work electricity
Pole layer, 13 is reference electrode layer；14 is protective layer,
This utility model provides the preparation method implanting end of a kind of electrode, including:
First conductive layer and the second conductive layer are adhered to described substrate layer both sides respectively；Described first conduction
Layer is layer gold or layers of copper, and described second conductive layer is layer gold or layers of copper；Described substrate layer by polyimides,
Politef, polyethylene, Merlon or polyethylene terephthalate are made；
Described first conductive layer deposits electrode layer and reference electrode layer；Protective layer is deposited on institute
State in electrode layer and on reference electrode layer.
This utility model the most just first conductive layer and the second conductive layer adhere to described substrate layer two respectively
Side；Described substrate layer is by polyimides, politef, polyethylene, Merlon or poly-terephthaldehyde
Acid second diester is made；Described first conductive layer is layer gold or layers of copper.Described second conductive layer is layer gold or copper
Layer.
Substrate layer, the first conductive layer and the second conductive layer are explicitly described, at this not herein
Repeat again.
In this utility model, described adherent fashion is not defined, well known to those skilled in the art
Adherent fashion.The concrete grammar of described adhesion is not defined by this utility model, directly adheres to spy
Set pattern lattice, or overall adhesion carries out cutting to required specification again, and this utility model people be not defined.
In this utility model, described first conductive layer is layers of copper, is additionally included in described layers of copper deposition nickel
Layer, deposition thereof on described nickel dam；Described second conductive layer is layers of copper, is additionally included in described layers of copper
Deposited nickel layer, deposition thereof on described nickel dam.The thickness of described nickel dam is preferably 1～3 μm, described gold
The thickness of layer is preferably 5～20 μm.
Deposition described in the utility model can be preferably by sputtering, plating, electroless deposition.This practicality
Novel above-mentioned concrete step and parameter are not defined, technological parameter well known to those skilled in the art
?.
In this utility model, at described first conductive layer upper surface deposition electrode layer and reference electrode
Layer, described electrode layer and reference electrode layer are not attached to.
Above-mentioned carry out clearly describing, at this no longer to described electrode layer and reference electrode layer
Repeat.
Deposition described in the utility model can be preferably by sputtering, plating, electroless deposition.This practicality
Novel above-mentioned concrete step and parameter are not defined, technological parameter well known to those skilled in the art
?.
In this utility model, also include being deposited on protective layer described electrode layer upper surface two ends and
Reference electrode layer upper surface two ends.
Described protective layer to cover electrode layer edges at two ends and described reference electrode layer edges at two ends is
Preferably, the described length often holding protective layer is preferably 50～100 μm, more preferably 55～95 μm.Described guarantor
The thickness of sheath is preferably 10～50 μm.
In this utility model, the most also include the protective layer being arranged at described second conductive layer upper surface,
Described preferably it is made up of polyimides, Parylene or politef.The thickness of described protective layer is excellent
Elect 10～50 μm as.The length of this protective layer is advisable with the length covering the whole upper surface of substrate.
In this utility model, the mode of described deposition protective layer can be preferably by sputtering, plating,
Electroless deposition.Above-mentioned concrete step and parameter are not defined by this utility model, art technology
Technological parameter known to personnel.
The concrete grammar of described deposition protective layer is not defined by this utility model, the specific rule of Direct precipitation
Lattice, or overall deposition carries out cutting to required specification again, and this utility model people be not defined.Described
Cutting can be preferably cut or chemical attack.
This utility model provides electrode to include that bonding pad, contact, bonding pad, described contact include substrate, setting
Electrode layer contact on substrate and reference electrode layer contact；
The electrode layer of described implantation end is connected with described electrode layer contact by the first conductive layer；
The reference electrode layer of described implantation end is connected with described reference electrode layer contact by the first conductive layer.
In this utility model, described electrode the most also includes the fixing device of fixing described electrode.
Contact described in the utility model effect is to connect with emitter.
In this utility model, described first conductive layer includes the first bonding pad and the second bonding pad, described
Implant the electrode layer of end by the first bonding pad of the first conductive layer with described electrode layer contact even
Connect；The reference electrode layer of described implantation end is by the second bonding pad of the first conductive layer and described reference electrode
Layer contact connects.Described first bonding pad and the second bonding pad are not attached to.
The electrode structure that one of them technical scheme of this utility model provides is as in figure 2 it is shown, Fig. 2 is this reality
With the electrode structure schematic diagram of novel offer.
Wherein, 4 is reference electrode layer contact, and 3 is electrode layer contact, and 5 is substrate, and 6 is fixing
Device.
This utility model provides a kind of sensor, including the electrode described in technique scheme.
This utility model provides the preparation method of a kind of electrode, including:
Substrate is implanted end, implants end coupling part, implantation end and work with reference electrode layer contact
The side of the coupling part of electrode layer contact, electrode layer contact and reference electrode layer contact adheres to the 3rd
Conductive layer；The opposite side implanting end on substrate adheres to the 4th conductive layer；Described substrate layer by polyimides,
Politef, polyethylene, Merlon or polyethylene terephthalate are made, described 3rd conduction
Layer is layer gold or layers of copper；Described 4th conductive layer is layer gold or layers of copper；
3rd conductive layer of described implantation end deposits electrode layer and reference electrode layer；By protective layer
It is deposited in described electrode layer and on reference electrode layer.
This utility model first implant on substrate end, the coupling part implanting end and reference electrode layer contact,
Implant end and the coupling part of electrode layer contact, electrode layer contact and reference electrode layer contact
Side adheres to the 3rd conductive layer；The opposite side implanting end on substrate adheres to the 4th conductive layer；Described substrate
Layer is made up of polyimides, politef, polyethylene, Merlon or polyethylene terephthalate,
Described 3rd conductive layer is layer gold or layers of copper；Described 4th conductive layer is layer gold or layers of copper.
In this utility model, described implantation end is the implantation end described in technique scheme.
In this utility model, described substrate thickness is preferably 0.05～3mm, more preferably 0.1～2.5mm.
In this utility model, the thickness of described 3rd conductive layer is preferably 15～25 μm, more preferably
17～23 μm.
When described 3rd conductive layer is layers of copper, in described layers of copper, preferably it is provided with nickel dam, described nickel dam
Thickness be 5～8 μm；Being provided with layer gold on described nickel dam, the thickness of described layer gold is 5～20 μm；
Described layers of copper is provided with nickel dam and layer gold effect is corrosion protection, increase electric conductivity, also simultaneously
It is possible to prevent the interference to test of the layers of copper of bottom.
In this utility model, described adherent fashion is not defined, well known to those skilled in the art
Adherent fashion.The concrete grammar of described adhesion is not defined by this utility model, directly adheres to spy
Set pattern lattice, or overall adhesion carries out cutting to required specification again, and this utility model people be not defined.
In this utility model, described 4th conductive layer is layer gold or layers of copper.In this utility model, institute
The thickness stating the 4th conductive layer is preferably 15～25 μm, more preferably 17～23 μm.
In this utility model, described adherent fashion is not defined, well known to those skilled in the art
Adherent fashion.The concrete grammar of described adhesion is not defined by this utility model, directly adheres to spy
Set pattern lattice, or overall adhesion carries out cutting to required specification again, and this utility model people be not defined.
In this utility model, described implantation end the 3rd conductive layer upper surface deposition electrode layer and
Reference electrode layer.Described electrode layer and reference electrode layer are not attached to；
Above-mentioned carry out clearly describing, at this no longer to described electrode layer and reference electrode layer
Repeat.
Deposition described in the utility model can be preferably by sputtering, plating, electroless deposition.This practicality
Novel above-mentioned concrete step and parameter are not defined, technological parameter well known to those skilled in the art
?.
In this utility model, it is additionally included in above-mentioned 3rd conductive layer, the 4th conductive layer and residue and exposes
The surface of substrate layer all deposits protective layer.
Described preferably it is made up of polyimides, Parylene or politef.The thickness of described protective layer
Degree is preferably 10～50 μm.
In this utility model, the mode of described deposition protective layer can be preferably by sputtering, plating,
Electroless deposition.Above-mentioned concrete step and parameter are not defined by this utility model, art technology
Technological parameter known to personnel.
This utility model uses polyimides, politef, polyethylene, Merlon or poly-to benzene two
Formic acid second diester flexible material prepares electrode as base material, and the electrode finally prepared implants
Wear comfort is good, will not damage human body, and uses the design of above-mentioned ad hoc structure to make to survey
Determine result accuracy good.
In order to further illustrate this utility model, electrode this utility model provided below in conjunction with embodiment
It is described in detail.
Embodiment 1
Thickness 10 μm, adhering to respectively for layers of copper of a length of 15mm are made thickness by Merlon
For 0.3mm, width is 0.5mm, a length of 15mm substrate layer upper and lower surface.In layers of copper
Surface deposit thickness is the nickel dam of 5 μm, in the layer gold that upper surface deposit thickness is 5 μm of nickel dam.?
The electrode layer that thickness is 50 μm and thickness that the upper surface sputtering sedimentation of layer gold is prepared by Graphene are
The silver chloride reference electrode layer of 50 μm, the distance between electrode layer and reference electrode layer is 1.5mm；
Electrode layer prepared by Graphene and silver chloride reference electrode layer length are than for 1:6.Prepare electrode
Implantation end.Use Parylene to cover edge length 80 μm at the two ends of electrode layer,
The two ends of reference electrode layer use politef to cover edge length 80 μm, at base lower surface
The protective layer of the lower surface deposition politef of layer gold, prepares the implantation end of electrode.
Embodiment 2
Thickness 15 μm, adhering to respectively for layer gold of a length of 13mm are made thickness by Merlon
For 0.2mm, width is 0.3mm, a length of 15mm substrate layer upper and lower surface.In layer gold
The thickness that upper surface sputtering sedimentation is prepared by Graphene is the electrode layer of 30 μm and thickness is 30 μm
Silver chloride reference electrode layer, the distance between electrode layer and reference electrode layer is 1.5mm；Graphite
Electrode layer prepared by alkene and silver chloride reference electrode layer length, than for 1:8, prepare planting of electrode
Enter end.Use Parylene to cover edge length 80 μm, at reference at the two ends of electrode layer
The two ends of electrode layer use Parylene to cover edge length 80 μm, in the layer gold of base lower surface
The protective layer of lower surface coated with parylene, prepare the implantation end of electrode.
Embodiment 3
Thickness 20 μm, adhering to respectively for layers of copper of a length of 15mm are made thickness by polyimides
For 0.3mm, width is 0.5mm, a length of 15mm substrate layer upper and lower surface.In layers of copper
Surface deposit thickness is the nickel dam of 5 μm, in the layer gold that upper surface deposit thickness is 5 μm of nickel dam.?
The electrode layer that thickness is 50 μm and thickness that the upper surface sputtering sedimentation of layer gold is prepared by Graphene are
The silver chloride reference electrode layer of 50 μm, the distance between electrode layer and reference electrode layer is 1.5mm；
Electrode layer prepared by Graphene and silver chloride reference electrode layer length, than for 1:5, prepare electrode
Implantation end.Use politef to cover edge length 80 μm at the two ends of electrode layer,
The two ends of reference electrode layer use politef to cover edge length 80 μm, at base lower surface
The protective layer of the lower surface deposition politef of layer gold, prepares the implantation end of electrode.
Embodiment 4
The silver chloride reference electrode layer implanting end and reference electrode layer at the substrate layer being made up of polyimides
The coupling part of contact, implant the electrode layer of end and coupling part, electrode layer contact, implant end,
Electrode layer contact, the layer gold of upper surface adhesive thickness 10 μm of reference electrode layer contact；Implanting
End lower surface adhesive thickness 10 μm layer gold；The thickness prepared by platinum is deposited at the layer gold upper surface implanting end
Be the electrode layer of 30 μm and silver chloride reference electrode layer that thickness is 30 μm, electrode layer and
Distance between reference electrode layer is 1mm；Electrode layer and silver chloride reference electrode layer prepared by platinum are long
Degree ratio is 1:10.Politef is all deposited on the surface of above-mentioned layer gold and the polyimides of residue exposure
Protective layer, prepares electrode.
The electrode prepared is coated with glucoseoxidase on the working electrode (s, and above-mentioned enzyme is handed over through glutaraldehyde
After connection and carry out conventional film, the electrode of preparation being measured glucose, result is as it is shown on figure 3, figure
The corresponding current test results of electrode glucose that 3 prepare for this utility model embodiment 4, permissible by Fig. 3
Find out intuitively, apply the response current of sensor test prepared by this electrode and glucose linear relationship very
Good (linearly dependent coefficient is 99.81%), greatly improves the accuracy of sensor.
Embodiment 5
The substrate layer being made up of polyethylene terephthalate implant end silver chloride reference electrode layer with
The coupling part of reference electrode layer contact, implant end, electrode layer contact, reference electrode layer contact
The layers of copper of upper surface adhesive thickness 10 μm；Implanting the electrode layer of end with electrode layer contact even
Connect part and implant end lower surface adhesive thickness 10 μm layers of copper；In layers of copper corresponding to electrode layer and
Reference electrode layer upper surface deposit thickness is the nickel dam of 5 μm, and the upper surface deposit thickness at nickel dam is 10
The layer gold of μm；In layers of copper corresponding to electrode layer contact and reference electrode layer contact upper surface deposition of thick
Degree is the nickel dam of 5 μm, in the layer gold that upper surface deposit thickness is 1 μm of nickel dam；At the gold implanting end
Layer upper surface deposits the electrode layer that thickness is 30 μm prepared by platinum and the chlorination that thickness is 30 μm
Silver reference electrode layer, the surface exposing polyethylene terephthalate in above-mentioned layer gold and residue all deposits
Politef protective layer, prepares electrode.
The electrode prepared is coated with glucoseoxidase on the working electrode (s, and above-mentioned enzyme is handed over through glutaraldehyde
After connection and carry out conventional film, glucose is measured by the electrode of preparation, result as shown in Figure 4, figure
The corresponding current test results of electrode glucose that 4 prepare for this utility model embodiment 5, permissible by Fig. 4
Find out intuitively, apply the response current of sensor test prepared by this electrode and glucose linear relationship very
Good (linearly dependent coefficient is 99.8%), greatly improves the accuracy of sensor.
Embodiment 6
The silver chloride reference electrode layer implanting end and reference electrode layer at the substrate layer being made up of polyimides
The coupling part of contact, implantation end, electrode layer contact, the upper surface of reference electrode layer contact adhere to
The layers of copper of thickness 10 μm；Implanting electrode layer and the coupling part, electrode layer contact of end and planting
Enter to hold lower surface adhesive thickness 10 μm layers of copper；Corresponding to electrode layer and reference electrode layer in layers of copper
Upper surface deposit thickness is the nickel dam of 3 μm, in the layer gold that upper surface deposit thickness is 15 μm of nickel dam；
It is 7 μm in layers of copper corresponding to electrode layer contact and reference electrode layer contact upper surface deposit thickness
Nickel dam, in the layer gold that upper surface deposit thickness is 0.8 μm of nickel dam；Sink at the layer gold upper surface implanting end
The long-pending electrode layer that thickness is 30 μm prepared by platinum and the silver chloride reference electrode that thickness is 30 μm
Layer, the surface exposing polyethylene terephthalate in above-mentioned layer gold and residue all deposits politef
Protective layer, prepares electrode.
The electrode prepared is coated with glucoseoxidase on the working electrode (s, and above-mentioned enzyme is handed over through glutaraldehyde
After connection and carry out conventional film, the electrode of preparation being measured glucose, result is as it is shown in figure 5, figure
The corresponding current test results of electrode glucose that 5 prepare for this utility model embodiment 6, permissible by Fig. 5
Find out intuitively, apply the response current of sensor test prepared by this electrode and glucose linear relationship very
Good (linearly dependent coefficient is 99.9%), greatly improves the accuracy of sensor.
The above is only preferred implementation of the present utility model, it is noted that for the art
Those of ordinary skill for, on the premise of without departing from this utility model principle, it is also possible to make some
Improvements and modifications, these improvements and modifications also should be regarded as protection domain of the present utility model.
Claims (9)
1. a flexible implant electrode, including implanting end and bonding pad, contact；
Described implantation end includes substrate layer, conductive layer, electrode layer, reference electrode layer and protective layer；Described substrate layer is made up of polyimides, politef, polyethylene, Merlon or polyethylene terephthalate；Described conductive layer is arranged on described substrate layer；Described conductive layer is layer gold or layers of copper；Electrode layer and reference electrode layer are arranged on described conductive layer；Described protective layer is arranged in described electrode layer and on reference electrode layer；
Bonding pad, described contact includes substrate, be arranged on substrate electrode layer contact and reference electrode layer contact；
The electrode layer of described implantation end is connected with described electrode layer contact by conductive layer；The reference electrode layer of described implantation end is connected with described reference electrode layer contact by conductive layer.
Flexible implant electrode the most according to claim 1, it is characterised in that described substrate layer is (50～300) with the thickness ratio of described conductive layer: (15～25).
Flexible implant electrode the most according to claim 1, it is characterised in that described conductive layer includes the first bonding pad and the second bonding pad, and the electrode layer of described implantation end is connected with described electrode layer contact by the first bonding pad of conductive layer；The reference electrode layer of described implantation end is connected with described reference electrode layer contact by the second bonding pad of conductive layer.
Flexible implant electrode the most according to claim 1, it is characterised in that described protective layer is made up of polyimides, Parylene or politef.
Flexible implant electrode the most according to claim 1, it is characterised in that described protective layer is arranged at described electrode layer upper surface two ends and reference electrode layer upper surface two ends.
Flexible implant electrode the most according to claim 1, it is characterised in that described conductive layer is layers of copper, also includes the nickel dam being arranged in described layers of copper, is arranged on the layer gold on described nickel dam.
Flexible implant electrode the most according to claim 6, it is characterised in that the thickness of described nickel dam is 1～3 μm, and the thickness of described layer gold is 5～20 μm.
Flexible implant electrode the most according to claim 1, it is characterised in that described electrode layer includes catalytic activation layer, is made up of platinum, gold, palladium, carbon, graphite or Graphene.
9. a sensor, including the flexible implant electrode described in claim 1～8 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520900038.4U CN205458703U (en) | 2015-11-12 | 2015-11-12 | Flexible electrode of implanting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520900038.4U CN205458703U (en) | 2015-11-12 | 2015-11-12 | Flexible electrode of implanting |
Publications (1)
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