CN205452551U - High frequency board carries antenna bridging structure - Google Patents
High frequency board carries antenna bridging structure Download PDFInfo
- Publication number
- CN205452551U CN205452551U CN201620178967.3U CN201620178967U CN205452551U CN 205452551 U CN205452551 U CN 205452551U CN 201620178967 U CN201620178967 U CN 201620178967U CN 205452551 U CN205452551 U CN 205452551U
- Authority
- CN
- China
- Prior art keywords
- sheet metal
- cob
- chip
- high frequency
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 62
- 239000002184 metal Substances 0.000 claims abstract description 62
- 230000005611 electricity Effects 0.000 claims abstract description 11
- 150000001875 compounds Chemical class 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000011889 copper foil Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 230000003245 working effect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Details Of Aerials (AREA)
Abstract
The utility model relates to a high frequency board carries antenna bridging structure. High frequency board carries antenna bridging structure includes the base load board and pastes the metal coil on base load board surface that be planar coil. A pad is connected to head equal electricity in metal coil's both ends, and one of them pad is in metal coil's outer lane, and another pad is at metal coil's inner circle, and the COB chip has two pin sheetmetals, and the COB chip is established in the metal coil top, and pin sheetmetal and the pad of COB chip are laminated electric the connection one by one. This novel both ends head through the direct bridging metal coil of integrated COB chip carries out the braid lapping on the COB with whole encapsulation of chip earlier again, equally goes together the SMT chip mounter with electric capacity and once only accomplishes SMT paster processing production in the one side, only need process in the one side of base load board, and processing complexity obtains reducing, has promoted working effect. Reduce metal coil's material, reduced the adoption and the processing of copper foil promptly, therefore reduced the production and processing cost, done benefit to the marketing.
Description
Technical field
This utility model relates to the onboard antenna of the high frequency in non-contact radio frequency cards, particularly relates to a kind of high frequency onboard antenna bridging structure.
Background technology
Radio-frequency card conventional in daily life have IC-card, subway card, iron coin, sensing class game or game money, mass transit card and access card etc., its internal structure is mainly made up of a high frequency coil antenna and a chip.Radio-frequency card work ultimate principle is: frequency read/write sends out the electromagnetic wave of one group of fixed frequency to radio-frequency card, and coil antenna is produced as chip and provides electric energy, and data inside chips is launched or accepted the data of read write line.
Original high frequency coil antenna mainly uses two-sided PCB, the most back-shaped coil (such as Fig. 1), another side single line passes a bridge (such as Fig. 2), centre is attached in the way of via plating conducting, and after first carrying out double-sided wiring board, on double-sided wiring board, single only carrying out binds bonding chip again.Binding bonding chip carries out SMT patch capacitor after completing again.This structure needs to carry out binding bonding chip in the circuit board and carries out SMT paster processing again, adds production and processing cost and complexity, is unfavorable for reducing selling cost and marketing.
Utility model content
The purpose of this utility model is the defect for overcoming prior art, and provides a kind of high frequency onboard antenna bridging structure, to reduce production and processing cost and to reduce processed complex degree.
For achieving the above object, this utility model is by the following technical solutions:
A kind of high frequency onboard antenna bridging structure, including base load plate and the wire coil that is attached to base load plate surface, wire coil is planar coil;Also include COB chip, the two ends of wire coil all electrically connects a pad, one of them pad is in the outmost turns of wire coil, another pad is in the innermost circle of wire coil, COB chip includes two pin sheet metals, COB chip is located at above wire coil, and the pin sheet metal of COB chip is fitted one by one with pad and electrically connected.
Further, pad be shaped as flat, rectangular.(can according to physical location size and need adjust bond pad shapes).In addition to two pads need bare metal, other coil line is required for being coated with ink.To prevent circuit oxidation or leak electricity short-circuit.
Further, COB chip also includes that COB support plate, master chip and two connect sheet metal, pin sheet metal is attached to the back side of COB support plate, connect sheet metal and be attached to the front of COB support plate, pin sheet metal electrically connects with being connected sheet metal one_to_one corresponding, and master chip is attached to COB support plate front and is connected sheet metal electrical connection with two.
Further, connect sheet metal corresponding in the position at the COB support plate back side with pin sheet metal in the position in COB support plate front, COB chip is provided with for electrical connection pins sheet metal and connect sheet metal cross electricity hole, cross electricity hole and sequentially pass through connection sheet metal, COB support plate and pin sheet metal.
Further, connect sheet metal for a pair and pin sheet metal is provided with two and crosses electricity hole.
Further, black compound protective layer it is covered with outside master chip.
Further, wire coil is planar spiral winding.
This utility model compared with prior art provides the benefit that:
This utility model is by the two ends of integrated COB chip direct bridge metal line circle, first chip is all encapsulated on COB and carries out braid rolling again, together with the same with electric capacity, upper SMT chip mounter disposably completes SMT paster processing in one side, have only to be processed in the one side of base load plate, disposably complete SMT paster processing technique in one side, processed complex degree is reduced, decrease the material of wire coil, i.e. decrease the employing of Copper Foil, thus decrease production and processing cost, beneficially marketing.
Accompanying drawing explanation
Fig. 1 is the high frequency coil antenna lapping structure front of prior art;
Fig. 2 is the high frequency coil antenna lapping structured rear surface of prior art;
Fig. 3 is high frequency coil antenna lapping structure front of the present utility model (omitting COB chip);
Fig. 4 is COB chip front side of the present utility model;
Fig. 5 is COB chip back of the present utility model;
Fig. 6 is high frequency coil antenna lapping structure cross-sectional schematic of the present utility model.
Detailed description of the invention
In order to more fully understand technology contents of the present utility model, below in conjunction with specific embodiment the technical solution of the utility model it is described further and illustrates.
The concrete structure of this utility model embodiment is as shown in Figures 3 to 6.
As shown in Figures 3 to 6, the high frequency of the present embodiment onboard antenna bridging structure includes base load plate 10, is attached to the wire coil 20 and COB chip 30 on base load plate 10 surface.
Because wire coil 20 is attached to base load plate 10 surface by exposure imaging etch process, therefore wire coil 20 is planar coil, as it is shown on figure 3, i.e. wire coil 20 only one layer in the normal direction on base load plate 10 surface.In the present embodiment, wire coil 20 is planar spiral winding, and wire coil 20 uses Copper Foil to make.
As it is shown on figure 3, the two ends of wire coil 20 is electrically connected pad 21,22, wherein pad 21 is in the outmost turns of wire coil 20, and another pad 22 is in the innermost circle of wire coil 20.The effect of pad 21,22 is electrical connection COB chip 30.The electric energy that wire coil 20 produces under the effect of electromagnetic wave is by pad 21,22 transmission to COB chip 30.Pad 21,22 be shaped as flat, rectangular, allow the width of pad 21,22 increase preferably to fit with length and contact COB chip 30.
As shown in Figure 4 and Figure 5, COB chip 30 includes that COB support plate 31, master chip (not shown), two pin sheet metals 32 and two connect sheet metal 33.As it is shown in figure 5, pin sheet metal 32 is attached to the back side of COB support plate 31.As shown in Figure 4, connect sheet metal 33 and be attached to the front of COB support plate 31, and be connected sheet metal 33 with two and electrically connect.Specifically, master chip is attached to the centre position 311 in COB support plate 31 front, chip welding spot on master chip 311 is connected the electrical connection of sheet metal 33 by being connected respectively to connect the right and left (Fig. 4) of sheet metal 33 about binding aluminum steel or gold thread to realize master chip with both sides, while conducting chip, also achieve the function that conducting of passing a bridge connects.
As shown in Figure 4 and Figure 5, pin sheet metal 32 be connected 33 two metal level one_to_one corresponding of sheet metal and a pair and connect sheet metal 33 and pin sheet metal 32 is electrically connected to each other.Specifically, sheet metal 33 is connected corresponding in the position at COB support plate 31 back side with pin sheet metal 32 in the position in COB support plate 31 front.COB chip 30 is provided with for electrical connection pins sheet metal 32 and connect sheet metal 33 cross electricity hole 34, cross electricity hole 34 and sequentially pass through connection sheet metal 33, COB support plate 31 and pin sheet metal 32.In the present embodiment, connect sheet metal 33 for a pair and pin sheet metal 32 is provided with two and crosses electricity hole 34.
When assembling COB chip 30, as shown in Figure 6, COB chip 30 is attached to above wire coil 20 by the way of SMT paster, and the pin sheet metal 32 of COB chip 30 electrically connects with pad 21,22 laminating respectively.COB chip 30 carries out full-automatic braider after finishing chip bonding encapsulation and carries out braid, and to adapt to the production of SMT chip mounter, the braid of similar SMT patch capacitor or Chip-R is the same.While conducting COB chip, also achieve the function that conducting of passing a bridge connects.
Additionally, be covered with black compound protective layer outside the master chip of the present embodiment.
Set forth above only further illustrate technology contents of the present utility model with embodiment; so that reader is easier to understand; but not representing embodiment of the present utility model and be only limitted to this, any technology done according to this utility model extends or recreation, all by protection of the present utility model.
Claims (7)
1. a high frequency onboard antenna bridging structure, including base load plate and the wire coil that is attached to base load plate surface, described wire coil is planar coil, it is characterized in that, also include COB chip, the two ends of described wire coil all electrically connects a pad, one of them pad is in the outmost turns of wire coil, another pad is in the innermost circle of wire coil, described COB chip includes two pin sheet metals, described COB chip is located at above wire coil, and the pin sheet metal of described COB chip is fitted one by one with pad and electrically connected.
2. high frequency onboard antenna bridging structure as claimed in claim 1, it is characterised in that described pad be shaped as flat, rectangular.
3. high frequency onboard antenna bridging structure as claimed in claim 1, it is characterized in that, described COB chip also includes that COB support plate, master chip and two connect sheet metal, described pin sheet metal is attached to the back side of COB support plate, described connection sheet metal is attached to the front of COB support plate, described pin sheet metal electrically connects with being connected sheet metal one_to_one corresponding, and described master chip is attached to COB support plate front and is connected sheet metal electrical connection with two.
4. high frequency onboard antenna bridging structure as claimed in claim 3, it is characterized in that, described connection sheet metal is corresponding in the position at the COB support plate back side with pin sheet metal in the position in COB support plate front, COB chip is provided with for electrical connection pins sheet metal and connect sheet metal cross electricity hole, described electricity hole of crossing sequentially passes through connection sheet metal, COB support plate and pin sheet metal.
5. high frequency onboard antenna bridging structure as claimed in claim 4, it is characterised in that connect sheet metal described in a pair and described pin sheet metal is provided with two and crosses electricity hole.
6. high frequency onboard antenna bridging structure as claimed in claim 3, it is characterised in that be covered with black compound protective layer outside described master chip.
7. high frequency onboard antenna bridging structure as claimed in claim 1, it is characterised in that described wire coil is planar spiral winding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620178967.3U CN205452551U (en) | 2016-03-09 | 2016-03-09 | High frequency board carries antenna bridging structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201620178967.3U CN205452551U (en) | 2016-03-09 | 2016-03-09 | High frequency board carries antenna bridging structure |
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CN205452551U true CN205452551U (en) | 2016-08-10 |
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CN201620178967.3U Expired - Fee Related CN205452551U (en) | 2016-03-09 | 2016-03-09 | High frequency board carries antenna bridging structure |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111150406A (en) * | 2020-04-07 | 2020-05-15 | 成都思悟革科技有限公司 | Electromagnetic wave position measuring sensor device resisting biological organism interference |
-
2016
- 2016-03-09 CN CN201620178967.3U patent/CN205452551U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111150406A (en) * | 2020-04-07 | 2020-05-15 | 成都思悟革科技有限公司 | Electromagnetic wave position measuring sensor device resisting biological organism interference |
CN111150406B (en) * | 2020-04-07 | 2020-08-04 | 成都思悟革科技有限公司 | Electromagnetic wave position measuring sensor device resisting biological organism interference |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160810 |
|
CF01 | Termination of patent right due to non-payment of annual fee |