CN205452331U

CN205452331U - LED chip

Info

Publication number: CN205452331U
Application number: CN201620007735.1U
Authority: CN
Inventors: 郑国光
Original assignee: Goertek Inc
Current assignee: Goertek Microelectronics Inc
Priority date: 2016-01-04
Filing date: 2016-01-04
Publication date: 2016-08-10
Anticipated expiration: 2026-01-04

Abstract

The utility model relates to a LED chip, which comprises a substrate, the substrate has first surface, the second surface that is located different planes to and extend to a plurality of inclined planes on the second surface from first surface edge slope, be provided with the functional layer of sending out light zone as LED chip on these a plurality of inclined planes. The utility model discloses a LED chip is provided with a plurality of inclined planes that lie in on not equidirectional on its substrate, set up respectively to be used for the functional layer that gives off light on these a plurality of inclined planes, makes functional layer on these a plurality of inclined planes of LED chip accessible gives out light, has realized single chip's multi -direction light emission function to LED chip's applied environment has been improved.

Description

A kind of LED chip

Technical field

This utility model relates to semiconductor diode field, more specifically, this utility model relates to a kind of LED chip.

Background technology

Light emitting diode is a kind of semi-conductor electronic device converting electrical energy into luminous energy, due to the advantage such as its life-span length, volume vibration strength little, high, heating degree are little and power consumption is low, has been widely used in household electrical appliances and the display lamp of each instrument or light source.

Along with the development of optical pickocff, LED chip, as the luminous source of optical pickocff, is gradually applied in the smart machines such as mobile phone, such as ambient light sensor or close to optical sensor etc..LED chip generally comprises substrate and arranges the light emitting functional layer above substrate, owing to its structure limits so that LED chip of the prior art can only send the light in single direction, in the integrated application that some is concrete, is difficult to meet use requirement.

Utility model content

A purpose of the present utility model there is provided a kind of LED chip.

According to an aspect of the present utility model, it is provided that a kind of LED chip, including substrate, described substrate has and is positioned at the first surface of Different Plane, second surface, and extends to the multiple inclined planes second surface from first surface edge tilt；Described the plurality of inclined plane is provided with the functional layer as LED chip luminous zone.

Preferably, described first surface is circular, and the plurality of inclined plane extends to second surface from the circumferential edges of first surface；Described first surface, inclined plane, second surface define frustum cone structure.

Preferably, described inclined plane is provided with four, extends to second surface from the edge of first surface respectively；Described first surface, inclined plane, second surface define truncated rectangular pyramids structure or the trapezoid groove structure mated with the truncated rectangular pyramids stood upside down.

Preferably, described substrate is the single crystal silicon material with<100>crystal orientation, and described inclined plane is obtained by the anisotropic etch of monocrystal silicon.

Preferably, the multiple functional layers being arranged on described in multiple inclined plane are connected together.

Preferably, multiple functional layers of being arranged on described in multiple inclined plane are isolated from one another to be opened.

Preferably, described functional layer extends at least part of first surface, second surface from inclined plane.

Preferably, described functional layer includes p type semiconductor layer, n type semiconductor layer.

Preferably, the position at described first surface or second surface is provided with the pad being respectively turned on p type semiconductor layer, n type semiconductor layer.

Preferably, it is additionally provided with cushion between described first surface, second surface, inclined plane and functional layer.

LED chip of the present utility model, multiple inclined plane being positioned on different directions it is provided with on its substrate, the plurality of inclined plane is respectively arranged to the functional layer of luminescence, make described LED chip can carry out luminescence by the functional layer in the plurality of inclined plane, achieve the multi-direction lighting function of single chips, thus improve the applied environment of LED chip.

By detailed description to exemplary embodiment of the present utility model referring to the drawings, further feature of the present utility model and advantage thereof will be made apparent from.

Accompanying drawing explanation

The accompanying drawing of the part constituting description describes embodiment of the present utility model, and is used for together with the description explaining principle of the present utility model.

Fig. 1 is the structural representation of this utility model LED chip.

Fig. 2 is the top view of Fig. 1.

Fig. 3 is the structural representation of this utility model another embodiment of LED chip.

Detailed description of the invention

Various exemplary embodiment of the present utility model is described in detail now with reference to accompanying drawing.It should also be noted that unless specifically stated otherwise, the parts illustrated the most in these embodiments and positioned opposite, the numerical expression of step and numerical value are not intended to scope of the present utility model.

Description only actually at least one exemplary embodiment is illustrative below, never as to this utility model and application thereof or any restriction of use.

May be not discussed in detail for technology and equipment known to person of ordinary skill in the relevant, but in the appropriate case, described technology and equipment should be considered a part for description.

In shown here and all examples of discussing, any occurrence should be construed as merely exemplary rather than as limiting.Therefore, other example of exemplary embodiment can have different values.

It should also be noted that similar label and letter represent similar terms in following accompanying drawing, therefore, the most a certain Xiang Yi accompanying drawing is defined, then need not it is further discussed in accompanying drawing subsequently.

With reference to Fig. 1, Fig. 2, this utility model provides a kind of LED chip, it includes substrate 1 and the functional layer 9 as LED chip luminous zone, wherein, described substrate 1 has and is positioned at the first surface 5 of Different Plane, second surface 6, and the multiple inclined plane 7 second surface 6 is extended to from first surface 5 edge tilt, the plurality of inclined plane 7 is positioned on different directions.Wherein, the functional layer 9 of described LED chip is arranged in the inclined plane 7 of the plurality of different directions.

With reference to the view direction of Fig. 1, first surface 5, second surface 6 can be the horizontal planes being parallel to each other, and second surface 6 is positioned at the lower section of first surface 5, and inclined plane 7 extends obliquely downward to second surface 6 from the marginal position of first surface 5；This inclined plane 7 can be the plane of an inclination, it is also possible to be to tilt, from first surface 5, the curved surface extending to second surface 6.

In one specific embodiment of this utility model, described first surface 5 is circular, the most the plurality of inclined plane 7 extends to second surface 6 from the circumferential edges of first surface 5, making the plurality of inclined plane 7 surround the taper surface of a tubular, described first surface 5, inclined plane 7, second surface 6 define the frustum cone structure that upper end is little, lower end is big jointly.

In another specific embodiment of this utility model, described first surface 5 is rectangle, and now, described inclined plane 7 is provided with four, and from the edge of first surface 5, extension extends obliquely downward to second surface 6 these four inclined planes 7 respectively；It is to say, these four inclined planes 7 intersect a rectangular configuration on second surface 6；Described first surface 5, inclined plane 7, second surface 6 is made to define the truncated rectangular pyramids structure that upper end is little, lower end is big；Can certainly regard as, this substrate 1 has a truncated rectangular pyramids structure, four inclined planes are positioned on the outside side wall of this truncated rectangular pyramids structure, and this allows for optical signal that in each inclined plane 7, functional layer 9 sends and transmits, with reference to Fig. 1 towards the lateral direction of truncated rectangular pyramids structure.

In another specific embodiment of this utility model, described first surface 5, inclined plane 7, second surface 6 define trapezoid groove structure, this trapezoid groove structure and the truncated rectangular pyramids mating shapes of handstand.Can certainly regard as, substrate 1 has a trapezoid groove structure, four inclined planes 7 are positioned in the inside side walls of this trapezoid groove structure so that be positioned at optical signal that in inclined plane 7, functional layer 9 sends and transmit, with reference to Fig. 3 towards the direction, inner side of trapezoid groove structure.

In this embodiment, substrate 1 can use the single crystal silicon material with<100>crystal orientation, aforementioned four inclined plane 7 can be obtained by the anisotropic etch of monocrystal silicon, wherein, the angle that inclined plane tilts is 54.74 °, the method that this monocrystal silicon to<100>crystal orientation carries out anisotropic etch belongs to the common knowledge of those skilled in the art, no longer illustrates at this.

LED chip of the present utility model, the functional layer 9 of its luminous zone includes p type semiconductor layer 3, n type semiconductor layer 4, and this p type semiconductor layer 3, n type semiconductor layer 4 can use GaN material.P type semiconductor layer 3, n type semiconductor layer 4 can be arranged in inclined plane 7 by the way of being sequentially depositing；Such as can first deposit p type semiconductor layer 3, then deposited n-type semiconductor layer 4 on p type semiconductor layer 3；Can certainly be, first deposited n-type semiconductor layer 4 in inclined plane 7 then to deposit p type semiconductor layer 3 on n type semiconductor layer 4, the PN junction of LED be formed in inclined plane 7 the most at last.The method of above layers deposition belongs to the common knowledge of those skilled in the art, no longer illustrates at this.

Preferably, the functional layer 9 of described LED chip extends at least part of first surface 5, second surface 6 from inclined plane 7 this utility model so that this functional layer 9 can preferably combine with inclined plane 7.The terminals of LED chip can also be set in the position of first surface 5, second surface 6 simultaneously.Specifically, on described first surface 5 or the position of second surface 6 is provided with the pad 8 being respectively turned on p type semiconductor layer 3, n type semiconductor layer 4.Pad 8 is arranged on first surface 5 or the position of second surface 6, and turns on respective semiconductor layer so that pad 8 does not interferes with and is positioned at the functional layer 9 of inclined plane 7 position and works.

LED chip of the present utility model, in order to make together with the functional layer 9 of LED chip preferably mates with the lattice of substrate 1, is additionally provided with cushion 2 between first surface 5, second surface 6, inclined plane 7 and functional layer 9.Manufacturing when, in the first surface 5 of substrate 1, second surface 6, inclined plane 7, first deposit one layer of cushion 2, on this cushion 2, then form functional layer 9.The material of cushion 2 selects according to the material of substrate 1 and functional layer 9, and this belongs to the common knowledge of those skilled in the art, no longer illustrates at this.

This utility model one preferred embodiment in, the described functional layer 9 being arranged in multiple inclined plane 7 is connected together, say, that the functional layer 9 in multiple inclined planes 7 is one, turned on by single pad so that whole functional layer 9 is the most luminous.In another preferred embodiment, the described functional layer 9 being arranged in multiple inclined plane 7 is isolated from one another to be opened, make each functional layer 9 can be individually luminous, now need to arrange independent pad 8 in each functional layer 9, turn on corresponding functional layer 9 by respective pad 8, work alone such that it is able to control each functional layer 9.

Although being described in detail specific embodiments more of the present utility model by example, but it should be appreciated by those skilled in the art, above example is merely to illustrate rather than in order to limit scope of the present utility model.It should be appreciated by those skilled in the art, in the case of without departing from scope and spirit of the present utility model, above example can be modified.Scope of the present utility model is defined by the following claims.

Claims

1. a LED chip, it is characterized in that: include substrate (1), described substrate (1) has and is positioned at the first surface (5) of Different Plane, second surface (6), and extends to the multiple inclined planes (7) second surface (6) from first surface (5) edge tilt；Described the plurality of inclined plane (7) is provided with the functional layer (9) as LED chip luminous zone.

LED chip the most according to claim 1, it is characterised in that: described first surface (5) is circular, and the plurality of inclined plane (7) extends to second surface (6) from the circumferential edges of first surface (5)；Described first surface (5), inclined plane (7), second surface (6) define frustum cone structure.

LED chip the most according to claim 1, it is characterised in that: described inclined plane (7) is provided with four, and the edge from first surface (5) extends to second surface (6) respectively；Described first surface (5), inclined plane (7), second surface (6) define truncated rectangular pyramids structure or the trapezoid groove structure mated with the truncated rectangular pyramids stood upside down.

LED chip the most according to claim 3, it is characterised in that: described substrate (1) is the single crystal silicon material with<100>crystal orientation, and described inclined plane (7) is obtained by the anisotropic etch of monocrystal silicon.

5. according to the LED chip described in any one of Claims 1-4, it is characterised in that the multiple functional layers (9) being arranged on described in: in multiple inclined plane (7) are connected together.

6. according to the LED chip described in any one of Claims 1-4, it is characterised in that multiple functional layers (9) of being arranged on described in: in multiple inclined plane (7) are isolated from one another to be opened.

LED chip the most according to claim 6, it is characterised in that: described functional layer (9) extends at least part of first surface (5), second surface (6) from inclined plane (7).

LED chip the most according to claim 7, it is characterised in that: described functional layer (9) includes p type semiconductor layer (3), n type semiconductor layer (4).

LED chip the most according to claim 8, it is characterised in that: the pad (8) being respectively turned on p type semiconductor layer (3), n type semiconductor layer (4) it is provided with in the position of described first surface (5) or second surface (6).

LED chip the most according to claim 7, it is characterised in that: it is additionally provided with cushion (2) between described first surface (5), second surface (6), inclined plane (7) and functional layer (9).