CN205447298U - LED luminescence unit and module - Google Patents
LED luminescence unit and module Download PDFInfo
- Publication number
- CN205447298U CN205447298U CN201590000128.6U CN201590000128U CN205447298U CN 205447298 U CN205447298 U CN 205447298U CN 201590000128 U CN201590000128 U CN 201590000128U CN 205447298 U CN205447298 U CN 205447298U
- Authority
- CN
- China
- Prior art keywords
- substrate
- luminescence unit
- led
- led luminescence
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Abstract
The application discloses LED luminescence unit and module, the LED luminescence unit includes: the base plate, set up in LED chip on the base plate, and cover and locate encapsulation glue film on the LED chip, its characterized in that, seted up on the base plate with the butt joint of encapsulation glue film is in order to adsorb the gluey recess of some encapsulation. Like this, a part of recess that can pour into the base plate into of encapsulation glue film to form more contacts with the base plate, because the adhesion effect of recess cell wall and encapsulation glue film, after the thermal expansion was glued in the encapsulation, the recess can be stereotyped to encapsulating to glue, obstructs partly inflation, thereby even long -time the use can not cause the encapsulation glue film to drop from the base plate yet, had guaranteed LED luminescence unit and module's normal use.
Description
Technical field
The application relates to light emitting diode field, particularly relates to a kind of LED luminescence unit and module.
Background technology
Light emitting diode (LightEmittingDiode, LED) is a kind of green energy conservation technology, and it is widely used in the fields such as illumination, signal designation, display.
General LED module is to be packaged together by multiple LED luminescence units, thus provides overall display performance.And LED luminescence unit generally includes the structures such as substrate, LED chip, encapsulation glue-line.Encapsulation glue-line covers outside LED chip generally by gluing process, thus the light sent by LED chip excites the fluorescent material of encapsulation glue-line, thus improves light efficiency.
But, when LED chip luminescence, LED chip, substrate are different from outer enclosure glue-line thermal coefficient of expansion, and outside encapsulation glue-line understands expanded by heating faster, and use for a long time can cause encapsulating glue-line and come off from substrate, loses a part of light efficiency.
Summary of the invention
The application is intended to solve one of above-mentioned technical problem the most to a certain extent.
First aspect according to the application, the application provides a kind of LED luminescence unit, including: substrate, the LED chip being arranged on described substrate, and cover the encapsulation glue-line in described LED chip, described substrate offers and docks with the groove of absorbed portion packaging plastic with described encapsulation glue-line.
Further, described groove has: the main body extended to the direction being perpendicular to described substrate, and the branch that the direction being parallel to described substrate is extended from described main body.
Further, described groove has branch described at least two.
Further, described branch is located parallel in the Different Plane of described substrate.
Further, described branch is located parallel in the approximately the same plane of described substrate.
Further, described groove is opened in described LED chip side.
Further, described groove is opened in described LED chip at least both sides.
Second aspect according to the application, the application provides a kind of LED module, it is provided with some LED luminescence units, described LED luminescence unit includes: substrate, the LED chip being arranged on described substrate, and cover the encapsulation glue-line in described LED chip, described substrate offers and docks with the groove of absorbed portion packaging plastic with described encapsulation glue-line.
Further, described groove has: the main body extended to the direction being perpendicular to described substrate, and the branch that the direction being parallel to described substrate is extended from described main body.
Further, described groove has branch described at least two.
The application provides the benefit that:
By providing a kind of LED luminescence unit and module, LED luminescence unit includes: substrate, the LED chip being arranged on described substrate, and cover the encapsulation glue-line in described LED chip, described substrate offers and docks with the groove of absorbed portion packaging plastic with described encapsulation glue-line.So, an encapsulation glue-line part can be injected in the groove of substrate, thus formed with substrate and more contact, adhesive attraction due to groove cell wall with encapsulation glue-line, after packaging plastic expanded by heating, packaging plastic can be shaped by groove, hinders a part to expand, even if thus long-time use does not results in encapsulation glue-line yet and comes off from substrate, it is ensured that LED luminescence unit and the normal use of module.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED luminescence unit of the embodiment of the present application.
Fig. 2 is the cross-sectional view of substrate in the embodiment of the present application.
Detailed description of the invention
Embodiments herein is described below in detail, and the example of described embodiment is shown in the drawings, and the most same or similar label represents same or similar element or has the element of same or like function.The embodiment described below with reference to accompanying drawing is exemplary, it is intended to be used for explaining the application, and it is not intended that restriction to the application.
In the description of the present application, it will be appreciated that, term " " center ", " longitudinally ", " laterally ", " length ", " width ", " thickness ", on " ", D score, " front ", " afterwards ", " left ", " right ", " vertically ", " level ", " push up ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of the instruction such as " counterclockwise " are based on orientation shown in the drawings or position relationship, it is for only for ease of description the application and simplifies description, rather than indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that restriction to the application.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or implicitly include one or more this feature.In the description of the present application, " multiple " are meant that two or more, unless otherwise expressly limited specifically.
In this application, unless otherwise clearly defined and limited, term " is installed ", " being connected ", " connection ", the term such as " fixing " should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or be integrally connected；Can be to be mechanically connected, it is also possible to be electrical connection；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, can be the connection of two element internals.For the ordinary skill in the art, above-mentioned term concrete meaning in this application can be understood as the case may be.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can include that the first and second features directly contact, it is also possible to include that the first and second features are not directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " include that fisrt feature directly over second feature and oblique upper, or is merely representative of fisrt feature level height higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " include that fisrt feature immediately below second feature and obliquely downward, or is merely representative of fisrt feature level height less than second feature.
Combine accompanying drawing below by detailed description of the invention the application is described in further detail.
Refer to Fig. 1-2, present embodiments provide a kind of LED module, be provided with some LED luminescence units, the most multiple, thus the splicing between adjacent LED module can be realized, composition display screen shows.Certainly, single LED luminescence unit can also be integrated in the equipment such as LED illumination lamp or signal lights.
The LED chip 2 that LED luminescence unit specifically includes that substrate 1, is arranged on substrate 1, and cover the encapsulation glue-line 3 in LED chip 2.Substrate can be copper-clad base plate, ceramic substrate or other substrates.LED chip can be the chip of the light color such as blue light, HONGGUANG.Encapsulation glue-line can be single fluorescent adhesive layer, or the combination glue-line formed by fluorescent adhesive layer and substratum transparent superposition.For realizing the application purpose, substrate 1 offers and encapsulates glue-line 3 and dock the groove 11 with absorbed portion packaging plastic.
So, an encapsulation glue-line part can be injected in the groove of substrate, thus formed with substrate and more contact, adhesive attraction due to groove cell wall with encapsulation glue-line, after packaging plastic expanded by heating, packaging plastic can be shaped by groove, hinders a part to expand, even if thus long-time use does not results in encapsulation glue-line yet and comes off from substrate, it is ensured that LED luminescence unit and the normal use of module.
In the present embodiment, groove 11 has: the main body 111 extended to the direction being perpendicular to substrate 1, and the branch 112 that the direction being parallel to substrate 1 is extended from main body.So, main body can offset the expansive force effect being parallel to orientation substrate of encapsulation glue-line, and branch can offset the expansive force effect being perpendicular to orientation substrate of encapsulation glue-line, thus ensures that long-time use does not results in encapsulation glue-line yet and comes off from substrate further.Certainly, in other embodiments, groove can also be only made up of main body, or, the bearing of trend of main body/branch can be in a certain angle with substrate etc..
In the present embodiment, groove 11 has Liang Ge branch, and Liang Ge branch is located parallel in the Different Plane of substrate 1.In other embodiments, groove can have one, three, four or the branch of other quantity.Branch can be located in the approximately the same plane being parallel to substrate.
In the present embodiment, groove 11 is opened in LED chip 2 side.In other embodiments, groove 11 may be configured as multiple, and groove 11 can be opened in LED chip 2 at least both sides, so, makes encapsulation glue-line be combined with substrate tightr.
It is further to note that encapsulation glue-line can keep at a certain distance away with LED chip, or it is attached at above LED chip.Groove can use drilling technology to be formed when substrate is formed, and its branch, movable extension can be set on grooved bit to form branch.
In the description of this specification, the description of reference term " embodiment ", " some embodiments ", " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means that the specific features, structure, material or the feature that combine this embodiment or example description are contained at least one embodiment or the example of the application.In this manual, the schematic representation to above-mentioned term is not necessarily referring to identical embodiment or example.And, the specific features of description, structure, material or feature can combine in any one or more embodiments or example in an appropriate manner.
Above content is to combine the further description that the application is made by specific embodiment, it is impossible to assert the application be embodied as be confined to these explanations.For the application person of an ordinary skill in the technical field, on the premise of conceiving without departing from the application, it is also possible to make some simple deduction or replace.
Claims (10)
1. a LED luminescence unit, including: substrate, the LED chip being arranged on described substrate, and cover the encapsulation glue-line in described LED chip, it is characterised in that offer on described substrate and dock with the groove of absorbed portion packaging plastic with described encapsulation glue-line.
2. LED luminescence unit as claimed in claim 1, it is characterised in that described groove has: the main body extended to the direction being perpendicular to described substrate, and the branch that the direction being parallel to described substrate is extended from described main body.
3. LED luminescence unit as claimed in claim 2, it is characterised in that described groove has branch described at least two.
4. LED luminescence unit as claimed in claim 3, it is characterised in that described branch is located parallel in the Different Plane of described substrate.
5. LED luminescence unit as claimed in claim 3, it is characterised in that described branch is located parallel in the approximately the same plane of described substrate.
6. LED luminescence unit as claimed in claim 1, it is characterised in that described groove is opened in described LED chip side.
7. LED luminescence unit as claimed in claim 1, it is characterised in that described groove is opened in described LED chip at least both sides.
8. a LED module, it is provided with some LED luminescence units, it is characterized in that, described LED luminescence unit includes: substrate, the LED chip being arranged on described substrate, and cover the encapsulation glue-line in described LED chip, it is characterized in that, described substrate offers and docks with the groove of absorbed portion packaging plastic with described encapsulation glue-line.
9. LED module as claimed in claim 8, it is characterised in that described groove has: the main body extended to the direction being perpendicular to described substrate, and the branch that the direction being parallel to described substrate is extended from described main body.
10. LED module as claimed in claim 9, it is characterised in that described groove has branch described at least two.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2015/091510 WO2017059574A1 (en) | 2015-10-09 | 2015-10-09 | Led light emitting unit and module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205447298U true CN205447298U (en) | 2016-08-10 |
Family
ID=56601795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201590000128.6U Expired - Fee Related CN205447298U (en) | 2015-10-09 | 2015-10-09 | LED luminescence unit and module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205447298U (en) |
| WO (1) | WO2017059574A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116360159A (en) * | 2023-06-02 | 2023-06-30 | 惠科股份有限公司 | Light-emitting module and display device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4205135B2 (en) * | 2007-03-13 | 2009-01-07 | シャープ株式会社 | Semiconductor light emitting device, multiple lead frame for semiconductor light emitting device |
| US20100127288A1 (en) * | 2008-11-25 | 2010-05-27 | Visera Technologies Company Limited | Light-emitting diode devices and methods for fabricating the same |
| CN102760824B (en) * | 2011-04-29 | 2016-06-08 | 展晶科技(深圳)有限公司 | Package structure for LED |
| TW201431127A (en) * | 2013-01-29 | 2014-08-01 | Hon Hai Prec Ind Co Ltd | LED package and a method for manufacturing the same |
| CN204538082U (en) * | 2015-05-12 | 2015-08-05 | 福建省鼎泰光电科技有限公司 | LED support |
-
2015
- 2015-10-09 CN CN201590000128.6U patent/CN205447298U/en not_active Expired - Fee Related
- 2015-10-09 WO PCT/CN2015/091510 patent/WO2017059574A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116360159A (en) * | 2023-06-02 | 2023-06-30 | 惠科股份有限公司 | Light-emitting module and display device |
| CN116360159B (en) * | 2023-06-02 | 2023-09-05 | 惠科股份有限公司 | Light-emitting module and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017059574A1 (en) | 2017-04-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160810 Termination date: 20171009 |