CN205426862U - Supersound guided wave signal excitation collection moulding piece - Google Patents
Supersound guided wave signal excitation collection moulding piece Download PDFInfo
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- CN205426862U CN205426862U CN201521030075.0U CN201521030075U CN205426862U CN 205426862 U CN205426862 U CN 205426862U CN 201521030075 U CN201521030075 U CN 201521030075U CN 205426862 U CN205426862 U CN 205426862U
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Abstract
The utility model discloses a supersound guided wave signal excitation collection moulding piece, including many waveform generator, ultrasonic guided -wave probe signal excitation power supply and ultrasonic guided -wave probe, many waveform generator's output connect in ultrasonic guided -wave probe signal excitation power supply's input, ultrasonic guided -wave probe signal excitation power supply's output is connected in ultrasonic guided -wave probe's input, many waveform generator comprise phase accumulator, waveform controller, waveform memory group, sigma -Delta modulator, butterworth wave filter and data transmission and control interface. The utility model discloses utilize waveform memory group and waveform controller configuration solid dielectric china super -league matches acoustic conductance wave -wave shape, realize the high commonality of many wave forms supersound guided wave signal excitation.
Description
Technical field
The present invention relates to field of non destructive testing and the communications field, particularly to a kind of ultrasonic guided wave signals excitation integration module.
Background technology
Twisted wire is the flexible member being crafted by strands of metal wire, is widely used in material carrying machine or the building structure of the industries such as civil engineering, traffic, electric power.In use, metallic cable, due to various damages, such as fracture of wire, deformation, corrosion, abrasion etc., easily causes fracture failure, thus causes industrial accident.Pipeline, as the fluid conveying member of hollow, is widely used in the fluid delivery device of the industries such as chemical industry, transport, civil engineering.Environment residing for transport pipeline is generally of microcorrosion with liquid or the gas of transport, if inner and outer walls of pipeline is corroded until rupture, internal high pressure fluid is spouting, and people life property safety will be on the hazard.
For the large-sized solid structure being made up of the component of the slim appearance such as twisted wire and pipeline, such as electrical network, oil refining tower etc., only do not ensure that long lasting for military service by good workmanship, and existing regular defect inspection method can destroy its continuous working condition.Along with ultrasonic in field of non destructive testing research and the development of application, supersonic guide-wave Dynamic Non-Destruction Measurement system is progressively set up.Ultrasonic probe is utilized to encourage ultrasonic guided wave signals in solid dielectric, it is possible to achieve distance, undamaged defects detection.
Supersonic guide-wave excitation integration module is typically made up of signal generator, power amplifier and ultrasonic probe three part.Signal generator is used for producing and specifically drives signal, this driving signal amplified by power amplifier after for driving ultrasonic probe, solid dielectric encourages supersonic guide-wave.
Existing ultrasonic guided wave signals excitation integration module is only capable of motivating the specific supersonic guide-wave of waveform in solid dielectric, and different defects is different to the sensitivity of different supersonic guide-wave waveforms, restriction due to supersonic guide-wave waveform, segmental defect in structure cannot accurately detect, and limits the popularization and application of supersonic guide-wave Dynamic Non-Destruction Measurement.Meanwhile, a large amount of structural intergrity information utilizing supersonic guide-wave to obtain need to take measures be transferred to data terminal storage and utilize.Conventional communication mode, such as radio communication, fiber optic communication, cable communication etc., can be used for data transmission, but cannot be at extreme environment, as communicated in deep soil, closed metal structure etc..
Summary of the invention
It is an object of the invention to overcome in prior art ultrasonic guided wave signals excitation integration module can only the specific supersonic guide-wave of excitation waveform for detecting the shortcoming of ad hoc structure defect with not enough, and transmit for structural intergrity information in view of combining supersonic guide-wave communication, it is provided that a kind of novel ultrasonic guided wave signals excitation integration module.
The purpose of the present invention is achieved through the following technical solutions: a kind of ultrasonic guided wave signals excitation integration module, including: many waveform generators, ultrasonic probe signal excitation power supply and ultrasonic probe, the outfan of described many waveform generators is connected to the input of described ultrasonic probe signal excitation power supply, and the outfan of described ultrasonic probe signal excitation power supply is connected to the input of ultrasonic probe；Described many waveform generators are made up of with controlling interface the transmission of phase accumulator, waveshape monitor, wave memorizer group, Sigma-Delta modulator, Butterworth wave filter and data；Described phase accumulator, waveshape monitor, wave memorizer group, Sigma-Delta modulator and Butterworth wave filter are sequentially connected with.
Preferably, described ultrasonic guided wave signals excitation integration module has communication operation mode, and under described communication operation mode, described waveshape monitor is connected with telecommunication circuit.
Preferably, described wave memorizer group stores multiple basic digital waveform signal, including sine wave, triangular wave, square wave.
Preferably, described wave memorizer stores User Defined waveshape signal and structural intergrity information.
Preferably, described ultrasonic probe signal excitation power supply includes that small signal amplifier, high-voltage power amplifier and high-voltage circuit breaker changer, wherein said small signal amplifier and described high-voltage circuit breaker changer are all connected with described high-voltage power amplifier.
The present invention compared with prior art, has the advantage that and beneficial effect:
1, supersonic guide-wave waveform during the present invention utilizes wave memorizer group and waveshape monitor configuration solid dielectric, it is achieved the highly versatile of many wave ultrasound guided wave signals excitation.
2, the present invention utilizes Sigma-Delta modulator and Butterworth wave filter to complete the digital waveform signal transformation process to analog waveform signal, it is not necessary to extra digital to analog converter.
3, the present invention uses small signal amplifier and the form of high-voltage power amplifier dual-stage amplifier, it is achieved the high-voltage power of faint analog waveform signal amplifies.
Accompanying drawing explanation
Fig. 1 is the structural schematic block diagram of ultrasonic guided wave signals of the present invention excitation integration module.
Fig. 2 is through power amplification and the binary phase shift keying signal waveforms of structure integrity information of having carried a load on the back.
Element numbers explanation
Waveform generator more than 1
2 ultrasonic probe signal excitation power supplies
3 ultrasonic probes
11 phase accumulators
12 waveshape monitors
13 wave memorizer groups
14Sigma-Delta manipulator
15Butterworth wave filter
16 data transmission and control interface
21 high-voltage circuit breaker changers
22 small signal amplifiers
23 high-voltage power amplifiers
Detailed description of the invention
Below in conjunction with embodiment and accompanying drawing, the present invention is described in further detail, but embodiments of the present invention are not limited to this.
Fig. 1 is the structural schematic block diagram of ultrasonic guided wave signals of the present invention excitation integration module.Described ultrasonic guided wave signals excitation integration module includes: many waveform generators 1, ultrasonic probe signal excitation power supply 2 and ultrasonic probe 3, the outfan of described many waveform generators is connected to the input of described ultrasonic probe signal excitation power supply, and the outfan of described ultrasonic probe signal excitation power supply is connected to the input of ultrasonic probe.
Many waveform generators 1 are made up of with controlling interface 16 transmission of phase accumulator (PA) 11, waveshape monitor (WSC) 12, wave memorizer group (WSMG) 13, Sigma-Delta modulator (SDM) 14, Butterworth wave filter (BF) 15 and data.Wave memorizer group (WSMG) 13 stores multiple basic waveform, including sine wave, triangular wave, square wave etc., by waveshape monitor (WSC) 12 by specific waveforms, such as the various detection pulses generated by computer, the structural intergrity information etc. that utilizes supersonic guide-wave to obtain, it is stored in wave memorizer group (WSMG) 13, then is selected the waveform needing to occur by waveshape monitor (WSC) 12.Due to supersonic guide-wave dependence wave memorizer group (WSMG) 13 and the configuration of waveshape monitor (WSC) 12 of follow-up excitation in solid dielectric, it is achieved that many waveform stimulus of supersonic guide-wave.Phase accumulator (PA) 11 is connected to wave memorizer group (WSMG) 13 input, phase accumulator (PA) 11 constantly carries out phase-accumulated operation, it is output as wave memorizer group (WSMG) 13 stores the phase place of digital waveform signal, table lookup operation is carried out, the amplitude of the corresponding digital waveform signal of output by this phase place.The outfan of wave memorizer group (WSMG) 13 is connected to the input of Sigma-Delta modulator (SDM) 14, the digital waveform signal of multidigit is modulated through Sigma-Delta in Sigma-Delta modulator (SDM) 14, exports the binary system Sigma-Delta modulated signal of 1.The outfan of Sigma-Delta modulator (SDM) 14 is connected to the input of Butterworth wave filter (BF) 15, Butterworth wave filter (BF) 15 carries out smooth bandpass filtering operation to 1 binary system Sigma-Delta modulated signal of input, low frequency component in 1 binary system Sigma-Delta modulated signal and high fdrequency component are filtered, obtains required analog waveform signal.
Specifically, in the present embodiment, except outside Butterworth wave filter (BF) 15, remaining all uses altera corp CycloneII series EP2C8Q208C8 type FPGA design, Butterworth wave filter (BF) 15 and small signal amplifier (WSA) 22 to use integrated transporting discharging OP482 design to many waveform generators 1.
Further, in the present embodiment, after integration module energising, the mode of operation of ultrasonic guided wave signals excitation integration module, i.e. detection pattern or communication pattern are selected.In a detection mode, waveshape monitor (WSC) 12 is connected with computer with controlling interface 16 by data transmission, the digital waveform signal that host computer generates is stored in a wave memorizer in wave memorizer group (WSMG) 13 through data transmission with controlling interface 16 under the control of waveshape monitor (WSC) 12, and phase accumulator (PA) (11) is connected with this wave memorizer, it is also possible to select the basic waveform in wave memorizer group (WSMG) 13.In a communication mode, waveshape monitor (WSC) 12 is connected with telecommunication circuit with controlling interface 16 by data transmission, telecommunication circuit act as process structural intergrity information, including being grouped, encode, modulate, framing etc..Structural intergrity information after telecommunication circuit processes, including the three-dimensional position of defect, three-dimensional shape and volume in solid structure, and the temperature of solid structure each several part, stress state etc., the wave memorizer being stored under the control of waveshape monitor (WSC) 12 in wave memorizer group (WSMG) 13, and phase accumulator (PA) (11) is connected with this wave memorizer.
Specifically, in the present embodiment, phase accumulator (PA) (11) constantly carries out phase-accumulated operation, output waveform memorizer group (WSMG) 13 stores the phase place of digital waveform signal, table lookup operation is carried out, the amplitude of the corresponding digital waveform signal of output by this phase place.In a detection mode, User Defined waveshape signal or some basic waveform selected it are output as；In a communication mode, it is output as treated structural intergrity information.This output amplitude is the binary signal of multidigit, needs just can be converted to analogue signal after digital-to-analogue conversion, otherwise cannot be directly used to high-voltage power and amplifies.
Further, in the present embodiment, the outfan of wave memorizer group (WSMG) 13 is connected to the input of Sigma-Delta modulator (SDM) 14, the digital waveform signal of multidigit is modulated through Sigma-Delta in Sigma-Delta modulator (SDM) 14, exports the binary system Sigma-Delta modulated signal of 1.This Sigma-Delta modulated signal comprises all information of analog waveform signal, include substantial amounts of low-frequency noise and high-frequency noise simultaneously, this Sigma-Delta modulated signal is sent into Butterworth wave filter (BF) 15, carry out smooth bandpass filtering operation, low frequency component in 1 binary system Sigma-Delta modulated signal and high fdrequency component are filtered, obtains required analog waveform signal.Through Sigma-Delta modulator (SDM) 14 and Butterworth wave filter (BF) 15, digital-to-analogue conversion process terminates, and therefore need not extra digital to analog converter.
Ultrasonic probe signal excitation power supply 2 is made up of high-voltage circuit breaker changer (HVPSC) 21, small signal amplifier (WSA) 22 and high-voltage power amplifier (HVPA) 23.Wherein high-voltage circuit breaker changer (HVPSC) 21 is for being converted to high voltage-small current unidirectional current by low-voltage, high-current unidirectional current by on-off circuit, the little circuit DC of this high pressure is the power supply of high-voltage power amplifier (HVPA) 23, make this ultrasonic guided wave signals excitation integration module can depart from electrical network in particular circumstances, use battery operation.Many waveform generators 1 are connected to the input of ultrasonic probe signal excitation power supply 2.Analog waveform signal through Butterworth wave filter (BF) 15 acquisition is first fed into small signal amplifier (WSA) 22 in ultrasonic probe signal excitation power supply 2 and carries out amplitude amplification, obtains amplitude and amplifies signal.The outfan of small signal amplifier (WSA) 22 is connected to the input of high-voltage power amplifier (HVPA) 23.23 pairs of amplitudes of high-voltage power amplifier (HVPA) are amplified signal and are carried out power amplification, so that the power amplified signal obtained has enough voltage and power to drive ultrasonic probe 3, in order to promote the stability of high-voltage power amplifier (HVPA) 23, between input and the outfan of high-voltage power amplifier (HVPA) 23, it is configured with capacitive feedback network.
Further, in the present embodiment, the amplification of regulation small signal amplifier (WSA) 22, make small signal amplifier (WSA) 22 be operated in the range of linearity.Analog waveform signal through Butterworth wave filter (BF) 15 acquisition is first fed into small signal amplifier (WSA) 22 in ultrasonic probe signal excitation power supply 2 and carries out amplitude amplification, obtains amplitude and amplifies signal.The amplification of regulation high-voltage power amplifier (HVPA) 23, and regulate the capacitance size of capacitive feedback network so that ultrasonic probe 3 is in steady statue.23 pairs of amplitudes of high-voltage power amplifier (HVPA) are amplified signal and are carried out power amplification, so that the power amplified signal obtained has enough voltage and power to drive ultrasonic probe 3.Low-voltage, high-current unidirectional current is converted to high voltage-small current unidirectional current by on-off circuit by high-voltage circuit breaker changer (HVPSC) 21, this high voltage-small current unidirectional current is the power supply of high-voltage power amplifier (HVPA) 23, make ultrasonic guided wave signals excitation integration module can depart from electrical network in particular circumstances, use battery operation.Fig. 2 is through power amplification and the binary phase shift keying signal waveforms of structure integrity information of having carried a load on the back, and its amplitude is ± 140V.
Further, in the present embodiment, small signal amplifier (WSA) 22 uses integrated transporting discharging OP482 design, and high-voltage power amplifier (HVPA) 23 uses the high pressure power amplifier PA78EU design of Apex company.
Ultrasonic probe signal excitation power supply 2 is connected to the input of ultrasonic probe 3.For making power amplified signal utilization rate reach maximum, inside ultrasonic probe 3, it is configured with impedance matching network with the impedance of piezoelectric ceramic piece equivalent circuit in balance ultrasonic guided wave probe 3.
Further, in the present embodiment, described ultrasonic probe 3 comprises piezoelectric ceramic piece, semi-hermetic can and encapsulants, to completely cut off radiation interference in piezoelectric patches encapsulation and can, can opening part encapsulants is airtight to completely cut off external environment, ultrasonic probe 3 can pass through ultrasonic coupling agent, as oil base couplant, water base couplant etc. are in close contact with solid structure, and it is fixed on solid structure surface, keeps solid structure static and do not vibrate because occurring under the effect of ultrasonic probe (3).
Further, in the present embodiment, the piezoelectric ceramics sheet material that ultrasonic probe 3 is comprised is PZT-5, and integration module uses 12V lithium iron phosphate dynamic battery to power.
The ultrasonic probe 3 driven by high-voltage power signal i.e. motivates supersonic guide-wave in solid structure, and supersonic guide-wave waveform is determined by the digital waveform signal in wave memorizer group (WSMG) 13, thus achieves the excitation of many wave ultrasound guided wave.
Above-described embodiment is the present invention preferably embodiment; but embodiments of the present invention are also not restricted to the described embodiments; the change made under other any spirit without departing from the present invention and principle, modify, substitute, combine, simplify; all should be the substitute mode of equivalence, within being included in protection scope of the present invention.
Claims (4)
1. a ultrasonic guided wave signals excitation integration module, it is characterized in that, including many waveform generators, ultrasonic probe signal excitation power supply and ultrasonic probe, the outfan of described many waveform generators is connected to the input of described ultrasonic probe signal excitation power supply, and the outfan of described ultrasonic probe signal excitation power supply is connected to the input of ultrasonic probe；Described many waveform generators are made up of with controlling interface the transmission of phase accumulator, waveshape monitor, wave memorizer group, Sigma-Delta modulator, Butterworth wave filter and data；Described phase accumulator, waveshape monitor, wave memorizer group, Sigma-Delta modulator and Butterworth wave filter are sequentially connected with；The transmission of described data is connected with waveshape monitor and wave memorizer group with controlling interface.
Ultrasonic guided wave signals the most according to claim 1 excitation integration module, it is characterised in that described wave memorizer group stores multiple basic digital waveform signal, including sine wave, triangular wave, square wave.
Ultrasonic guided wave signals the most according to claim 1 excitation integration module, it is characterised in that described wave memorizer stores User Defined waveshape signal and structural intergrity information.
Ultrasonic guided wave signals the most according to claim 1 excitation integration module, it is characterized in that, described ultrasonic probe signal excitation power supply includes that small signal amplifier, high-voltage power amplifier and high-voltage circuit breaker changer, wherein said small signal amplifier and described high-voltage circuit breaker changer are all connected with described high-voltage power amplifier.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521030075.0U CN205426862U (en) | 2015-12-10 | 2015-12-10 | Supersound guided wave signal excitation collection moulding piece |
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| CN201521030075.0U CN205426862U (en) | 2015-12-10 | 2015-12-10 | Supersound guided wave signal excitation collection moulding piece |
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| CN205426862U true CN205426862U (en) | 2016-08-03 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111919388A (en) * | 2018-03-27 | 2020-11-10 | 皇家飞利浦有限公司 | System and method for performing analog-to-digital conversion across multiple spatially separated stages |
| WO2022023316A1 (en) * | 2020-07-30 | 2022-02-03 | Universite Paris-Saclay | Device and method for supplying power to an ultrasound transducer |
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2015
- 2015-12-10 CN CN201521030075.0U patent/CN205426862U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111919388A (en) * | 2018-03-27 | 2020-11-10 | 皇家飞利浦有限公司 | System and method for performing analog-to-digital conversion across multiple spatially separated stages |
| CN111919388B (en) * | 2018-03-27 | 2024-02-20 | 皇家飞利浦有限公司 | System and method for performing analog-to-digital conversion across multiple spatially separated stages |
| WO2022023316A1 (en) * | 2020-07-30 | 2022-02-03 | Universite Paris-Saclay | Device and method for supplying power to an ultrasound transducer |
| FR3113148A1 (en) * | 2020-07-30 | 2022-02-04 | Universite Paris-Saclay | Device and method for supplying an ultrasonic transducer |
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