CN205416696U - Solder paste printing process evaluation system structure - Google Patents
Solder paste printing process evaluation system structure Download PDFInfo
- Publication number
- CN205416696U CN205416696U CN201520979682.5U CN201520979682U CN205416696U CN 205416696 U CN205416696 U CN 205416696U CN 201520979682 U CN201520979682 U CN 201520979682U CN 205416696 U CN205416696 U CN 205416696U
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- solder paste
- printing
- optical inspection
- paste printing
- automated optical
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
Abstract
The utility model discloses a solder paste printing process evaluation system structure, including solder paste printing machine, evaluation steel mesh and AOI automated optical inspection appearance, this evaluation steel mesh sets up on solder paste printing machine, and this AOI automated optical inspection appearance sets up in the back of solder paste printing machine's work piece delivery outlet. By this, through evaluation steel screen print brush solder paste on the PCB board, PCB board rethread AOI automated optical inspection appearance utilizes the AOI automated optical inspection appearance to carry out detection and analysis and statistics to the PCB board that solder paste printing machine prints out, mainly can appraise printing formability, the release property of solder paste, homogeneity, anti the collapsing nature of printing thickness, does not link interval and dry tolerance. This solder paste printing process evaluation system can realize the evaluation of all printing performances of tin cream, effectively monitors the soldering paste printing quality to carry out assay to defect quantity and kind, thus for research and development solder paste provider to.
Description
Technical field
This utility model relates to tin cream apparatus field technology, refers in particular to a kind of paste solder printing and evaluates system structure.
Background technology
Solder(ing) paste printing is the initial link of SMT, and current solder(ing) paste printing uses stencil printer to complete, modern stencil printer typically by dress plate, add the mechanisms such as tin cream, impressing, defeated circuit board and form.Its operation principle is: the circuit board that first will print is fixed on printing positioning table, then by the left and right scraper of stencil printer, tin cream is bitten in corresponding pad by steel mesh, to the uniform PCB that bites, carries out automatic chip mounting by band to band transfer module input to chip mounter.
The printing performance of solder(ing) paste plays vital effect to tin cream quality, therefore the printing performance to solder(ing) paste is evaluated most important, but, there is presently no complete set system can be evaluated paste solder printing, thus makes troubles to the research and development of solder(ing) paste.
Utility model content
In view of this, this utility model is for the disappearance of prior art existence, and its main purpose is to provide a kind of paste solder printing and evaluates system structure, and paste solder printing can be evaluated by it, and the research and development for solder(ing) paste bring convenience.
For achieving the above object, this utility model uses such as purgation technical scheme:
A kind of paste solder printing evaluates system structure, includes stencil printer, evaluates steel mesh and AOI automated optical inspection；This evaluation steel mesh is arranged on stencil printer, and this AOI automated optical inspection is arranged at after the workpiece delivery outlet of stencil printer.
As a kind of preferred version, described stencil printer is full-automatic stencil printing machine or semi-automatic solder paste printer.
As a kind of preferred version, described evaluation steel mesh offers multiple difformity the mesh arranged in difformity.
This utility model compared with prior art has clear advantage and beneficial effect, specifically, as shown from the above technical solution:
By evaluating steel mesh printed solder paste on pcb board, pcb board is again by AOI automated optical inspection, the pcb board utilizing AOI automated optical inspection to print stencil printer carries out detection and analyzes and statistics, mainly can evaluate the printing mouldability of solder(ing) paste, release property, the uniformity of print thickness, collapse resistance, not connect interval and dry tolerance.This paste solder printing evaluates system can realize the evaluation of all printing performances of tin cream, effective monitoring Solder-Paste Printing quality, and is analyzed defects count and kind, thus provides direction for research and development solder(ing) paste.
For more clearly illustrating architectural feature of the present utility model and effect, with specific embodiment, this utility model is described in detail below in conjunction with the accompanying drawings.
Accompanying drawing explanation
Fig. 1 is the structural representation of the preferred embodiment of this utility model；
Fig. 2 be this utility model preferred embodiment in evaluate the front view of steel mesh.
Accompanying drawing identifier declaration:
10, stencil printer 20, evaluation steel mesh
21, mesh 30, AOI automated optical inspection.
Detailed description of the invention
Refer to shown in Fig. 1 and Fig. 2, that show the concrete structure of the preferred embodiment of this utility model, include stencil printer 10, evaluate steel mesh 20 and AOI automated optical inspection 30.
Described stencil printer 10 is full-automatic stencil printing machine or semi-automatic solder paste printer, and the concrete structure of stencil printer 10 and operation principle are prior art, and at this, concrete structure and operation principle to stencil printer 10 describe the most in detail.
This evaluation steel mesh 20 is arranged on stencil printer 30, by evaluation steel mesh 20 printed solder paste on pcb board, as in figure 2 it is shown, offer multiple difformity the mesh 21 arranged in difformity on described evaluation steel mesh 20, different pcb boards can be carried out paste solder printing, it is achieved multi-functional purpose.
This AOI automated optical inspection 30 is arranged at after the workpiece delivery outlet of stencil printer 10, the concrete structure of this AOI automated optical inspection 30 and operation principle are prior art, and at this, concrete structure and operation principle to AOI automated optical inspection 30 describe the most in detail.
The work process that the present embodiment is described in detail in detail is as follows:
During work, the tin cream of known quality part is placed on stencil printer 10, then, start stencil printer 10, by evaluating steel mesh 20 printed solder paste on pcb board, complete the pcb board output of paste solder printing, then, AOI automated optical inspection 30 the paste solder printing quality of pcb board is carried out detection and analyze and statistics.
Design focal point of the present utility model is: by evaluating steel mesh printed solder paste on pcb board, pcb board is again by AOI automated optical inspection, the pcb board utilizing AOI automated optical inspection to print stencil printer carries out detection and analyzes and statistics, mainly can evaluate the printing mouldability of solder(ing) paste, release property, the uniformity of print thickness, collapse resistance, not connect interval and dry tolerance.This paste solder printing evaluates system can realize the evaluation of all printing performances of tin cream, effective monitoring Solder-Paste Printing quality, and is analyzed defects count and kind, thus provides direction for research and development solder(ing) paste.
The above, it it is only preferred embodiment of the present utility model, not technical scope of the present utility model is imposed any restrictions, therefore every any trickle amendment, equivalent variations and modification above example made according to technical spirit of the present utility model, all still fall within the range of technical solutions of the utility model.
Claims (2)
1. a paste solder printing evaluates system structure, it is characterised in that: include stencil printer, evaluate steel mesh and AOI automated optical inspection；This evaluation steel mesh is arranged on stencil printer, and this AOI automated optical inspection is arranged at after the workpiece delivery outlet of stencil printer.
Paste solder printing the most according to claim 1 evaluates system structure, it is characterised in that: described stencil printer is full-automatic stencil printing machine or semi-automatic solder paste printer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520979682.5U CN205416696U (en) | 2015-12-01 | 2015-12-01 | Solder paste printing process evaluation system structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520979682.5U CN205416696U (en) | 2015-12-01 | 2015-12-01 | Solder paste printing process evaluation system structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205416696U true CN205416696U (en) | 2016-08-03 |
Family
ID=56536691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520979682.5U Expired - Fee Related CN205416696U (en) | 2015-12-01 | 2015-12-01 | Solder paste printing process evaluation system structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205416696U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109657718A (en) * | 2018-12-19 | 2019-04-19 | 广东省智能机器人研究院 | SPI defect classification intelligent identification Method on a kind of SMT production line of data-driven |
| CN115484753A (en) * | 2022-11-04 | 2022-12-16 | 四川易景智能终端有限公司 | Electronic component detection method used in SMT (surface mount technology) chip mounting process |
-
2015
- 2015-12-01 CN CN201520979682.5U patent/CN205416696U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109657718A (en) * | 2018-12-19 | 2019-04-19 | 广东省智能机器人研究院 | SPI defect classification intelligent identification Method on a kind of SMT production line of data-driven |
| CN109657718B (en) * | 2018-12-19 | 2023-02-07 | 广东省智能机器人研究院 | Data-driven SPI defect type intelligent identification method on SMT production line |
| CN115484753A (en) * | 2022-11-04 | 2022-12-16 | 四川易景智能终端有限公司 | Electronic component detection method used in SMT (surface mount technology) chip mounting process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160803 Termination date: 20211201 |