CN205406515U - Circuit protection device - Google Patents
Circuit protection device Download PDFInfo
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- CN205406515U CN205406515U CN201620053862.5U CN201620053862U CN205406515U CN 205406515 U CN205406515 U CN 205406515U CN 201620053862 U CN201620053862 U CN 201620053862U CN 205406515 U CN205406515 U CN 205406515U
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- pin
- hole
- chip component
- linear element
- circuit brake
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Abstract
The utility model provides a circuit protection device, include: the base plate, the lower surface of base plate is equipped with the three pin that electrically conducts at least, is called first pin, second pin and third pin respectively, arrange in at least one chip type element on the base plate is called first chip type element, first chip type element has upper surface and the lower surface that can make the electrode, the lower surface of first chip type element with first pin is electrically conductive to be connected, the upper surface with the second pin is electrically conductive to be connected, arrange in the alloy threadiness on the base plate or the electric current guard block of slice formula, end of electric current guard block with the last surface conductance of first chip type element connects, another end with the third pin is electrically conductive to be connected. The utility model discloses a circuit protection device is together integrated with the electric current guard block of chip type element and alloy threadiness or slice formula, and compact structure is small and exquisite, easily encapsulation, and overall cost reduces, and very simple and convenient during external circuit.
Description
Technical field
This utility model relates to over-voltage over-current protection product scope, particularly relates to a kind of circuit brake.
Background technology
In prior art, various sheet-shaped circuit brakes in use general all can an external electric fuse so that when crossing stream to certain threshold value, blown fuse and open a way, thus other devices protected in subsequent conditioning circuit.Its shortcoming is, sheet-shaped circuit brake general appearance is less, it is impossible to enter integrated for general insurance silk; need external electric fuse when therefore using, cause circuit components to increase, be unfavorable for that the miniaturization of circuit is integrated; and external circuits is cumbersome, causes inconvenience to the user.
Utility model content
The purpose of this utility model is in that to provide a kind of compact conformation small and exquisite, it is easy to encapsulation, and the circuit brake that external circuits is easy.
In view of this, this utility model embodiment provides a kind of circuit brake, including:
Substrate, the lower surface of described substrate is provided with the conductive pin of at least three, is called the first pin, the second pin and the 3rd pin；
It is placed at least one chip component on described substrate, it is called first linear element, described first linear element has the upper surface and lower surface that can make electrode, and the lower surface of described first linear element and described first pin are conductively connected, and upper surface and described second pin are conductively connected；
Being placed in the current protection parts of the alloy wire on described substrate or piece-shape type, a termination of described current protection parts and the upper surface of described first linear element are conductively connected, and another termination and described 3rd pin are conductively connected.
Preferably, described first linear element is the integration slice linear element that at least two chip component is laminated together to form.
Preferably, described substrate is provided with another chip component, it is called the second chip component, described second chip component has the upper surface and lower surface that can make electrode, the lower surface of described second chip component and described second pin are conductively connected, and the upper surface of described first linear element is connected by the first lead-in wire with the upper surface of described second chip component.
Preferably, the lower surface of described substrate is provided with the 4th pin, and the upper surface of described first linear element is conductively connected with described 4th pin by the second lead-in wire.
Preferably, described current protection parts are current insurance silk or current protector.
Preferably, described chip component is one or more in elements below: electric capacity, resistance, inductance, pressure-sensitive, temperature-sensitive, semiconductor chip.
Preferably, described substrate is three-decker, is called lower plate, upper plate and dividing plate from top to bottom；
Described lower plate is provided with the first through hole and the second through hole, the position that the lower surface with described first linear element of described lower plate contacts is provided with, with the position being provided with described first through hole, the first conductive layer being connected, described first pin is drawn from described first through hole, the position that the lower surface with described second chip component of described lower plate contacts is provided with the second conductive layer being connected with the position being provided with described second through hole, and described second pin is drawn from described second through hole；
Described upper plate is provided with two hollow region, described first linear element and described second chip component and is respectively arranged in two described hollow region；
Described dividing plate is the frame clsss structure of hollow.
Preferably; described upper plate is provided with the third through-hole through with described lower plate; the position that the other end with described current protection parts of described upper plate contacts is provided with the 3rd conductive layer being connected with the position being provided with described third through-hole, and described 3rd pin is drawn from described third through-hole.
Preferably, described upper plate is provided with the fourth hole through with described lower plate, and the position contacted with described second lead-in wire of described upper plate is provided with the 4th conductive layer being connected with the position being provided with described fourth hole, and described 4th pin is drawn from described fourth hole.
Preferably, also including cover plate, described cover plate is placed in described surface.
Preferably, described substrate is ceramic substrate.
The current protection parts of chip component with alloy wire or piece-shape type are integrated by circuit brake of the present utility model; compact conformation is small and exquisite, it is easy to encapsulation, and holistic cost reduces; and very easy during external circuits, it is adapted at integrated level being required, higher application scenarios uses.
Accompanying drawing explanation
In order to make content of the present utility model be more likely to be clearly understood, below according to specific embodiment of the utility model and in conjunction with accompanying drawing, this utility model is described in further detail, wherein
Fig. 1 is the explosive view of the circuit brake that this utility model embodiment provides, and shows the upper surface of each building block；
Fig. 2 is the explosive view of the circuit brake that this utility model embodiment provides, and shows the upper surface of each building block, and each element on upper plate presents connection status；
Fig. 3 is the explosive view of the circuit brake that this utility model embodiment provides, and shows the lower surface of each building block；
Fig. 4 is the equivalent circuit diagram of the circuit brake that this utility model embodiment provides.
Detailed description of the invention
Below with reference to accompanying drawing, use following example that this utility model is further elaborated.Objective and easy for setting forth, accompanying drawing and in corresponding embodiment all for two chip components integrated on substrate.If integrated plural chip component, then its structure is similar to illustrations and corresponding embodiment thereof with line, is only to increase several chip component and coupled leading foot, lead-in wire and conductive layer, and figure is slightly.If a chip component, then have only to save the second chip component and coupled lead-in wire, conductive layer in illustrations and corresponding embodiment thereof, its scheme is: substrate, the lower surface of described substrate is provided with the conductive pin of at least three, is called the first pin, the second pin and the 3rd pin；It is placed at least one chip component on described substrate, it is called first linear element, described first linear element has the upper surface and lower surface that can make electrode, and the lower surface of described first linear element and described first pin are conductively connected, and upper surface and described second pin are conductively connected；Being placed in the current protection parts of the alloy wire on described substrate or piece-shape type, a termination of described current protection parts and the upper surface of described first linear element are conductively connected, and another termination and described 3rd pin are conductively connected.Preferably, described first linear element is the integration slice linear element that at least two chip component is laminated together to form, and its circuit can be equivalent to the series connection of described at least two chip component.Further; these two chip component surface size are different; time stacked together; the bigger chip component in surface has part lamination surface to be exposed; other elements can be accessed again in its exposed portion, for instance, a termination of the described current protection parts in the present embodiment is connected in the lamination surface exposed of described first linear element; another termination and described 3rd pin are conductively connected, and figure is slightly.
Incorporated by reference to consulting Fig. 1-Fig. 4, the circuit brake of the present embodiment includes:
Substrate, the lower surface of described substrate is provided with the conductive pin of at least three, is called the first pin the 111, second pin 112 and the 3rd pin 113；
It is placed in the first linear element 121 on described substrate and the second chip component 122, described first linear element 121 and described second chip component 122 are respectively provided with the upper surface and lower surface that can make electrode, the lower surface of described first linear element 121 is connected with described first pin 111, the lower surface of described second chip component 122 is connected with described second pin 122, and the upper surface of described first linear element 121 is connected by the first lead-in wire 125 with the upper surface of described second chip component 122；
Be placed on described substrate alloy wire or piece-shape type current protection parts 123, a termination of described current protection parts 123 and the upper surface of described first linear element 121 are conductively connected, and another termination is connected with described 3rd pin 113；
Cover plate 14, described cover plate 14 is placed in described surface.Described cover plate 14 is mainly used in, by all element covers in described circuit brake, playing the effect protecting this element.In certain embodiments, this cover plate 14 can omit.
Preferably, described substrate is ceramic substrate, both insulate, high temperature resistant again.
Preferably, described chip component is one or more in elements below: electric capacity, resistance, inductance, pressure-sensitive, temperature-sensitive, semiconductor chip.
In a preferred embodiment, the lower surface of described substrate is provided with the 4th pin 114, and the upper surface of described first linear element 121 is connected with described 4th pin 114 by the second lead-in wire 124.Its advantage is, draws described 4th pin 114 as test foot, be used for detecting in this circuit brake each element whether normal operation.
In another preferred embodiment, described first linear element is TVS chip, described second chip component is diode chip for backlight unit.Please specifically checking that Fig. 4, Fig. 4 are the equivalent circuit diagrams of the circuit brake that the present embodiment provides, figure acceptance of the bid illustrates the first pin 111 of knowing clearly, the second pin 112, the position at the 3rd pin 113 and the 4th pin 114 place.The circuit brake of the present embodiment is in the application; having extreme high reliability, be embodied in following three aspects: when standing Lightning Over-voltage, its TVS can play the performance of overvoltage protection; rapidly overvoltage is clamped to a fixed voltage, makes follow-up protected normal circuit operation；When standing long-time overcurrent, its current protection parts cause fusing because of heating up, and this circuit brake is opened a way, thus cutting off overcurrent；It is additionally, since in this device and is connected to diode D, there is the performance of reversely cut-off, can prevent backward voltage from accessing in protected circuit.
In another preferred embodiment, described current protection parts 123 are current insurance silk fuse-link or current protector fuse-link, and it to fusing time to a certain degree, causes this circuit brake to be opened a way, thus cutting off overcurrent heating up.
In another preferred embodiment, described substrate is three-decker, is called lower plate 11, upper plate 12 and dividing plate 13 from top to bottom.
Preferably, it is provided with solder layer 15 between described lower plate 11 and described upper plate 12, the position that described solder layer 15 is corresponding with described chip component is provided with hollow region, and this hollow region is used for arranging solder, and described solder is for by sealing smooth with corresponding conductive layer for chip component together.
Concrete, described lower plate 11 is provided with the first through hole 117 and the second through hole 110, the position that the lower surface with described first linear element 121 of described lower plate 11 contacts is provided with, with the position being provided with described first through hole 117, the first conductive layer 115 being connected, described first pin 111 is drawn from described first through hole 117, the position that the lower surface with described second chip component 122 of described lower plate 11 contacts is provided with, with the position being provided with described second through hole 110, the second conductive layer 116 being connected, and described second pin 112 is drawn from described second through hole 110.
Described upper plate 12 is provided with two hollow region, described first linear element 121 and described second chip component 122 and is respectively arranged in two described hollow region.
Described upper plate 12 is provided with the third through-hole 119 through with described lower plate 11; the position that the other end with described current protection parts 123 of described upper plate 12 contacts is provided with, with the position being provided with described third through-hole 119, the 3rd conductive layer 127 being connected, and described 3rd pin 113 is drawn from described third through-hole 119.
Described upper plate 12 is provided with the fourth hole 118 through with described lower plate 11,124 positions contacted that go between with described second of described upper plate 12 are provided with, with the position being provided with described fourth hole 118, the 4th conductive layer 126 being connected, and described 4th pin 114 is drawn from described fourth hole 118.
Described dividing plate 13 is the frame clsss structure of hollow, and the dividing plate 13 of described hollow is mainly used in providing the motion space of a safety for described current protection parts 123.
The present embodiment has the advantage that
The current protection parts of chip component with alloy wire or piece-shape type are integrated by circuit brake of the present utility model; compact conformation is small and exquisite, it is easy to encapsulation, and holistic cost reduces; and very easy during external circuits, it is adapted at integrated level being required, higher application scenarios uses.
Obviously, above-described embodiment is only for clearly demonstrating example, and is not the restriction to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here without also cannot all of embodiment be given exhaustive.And the apparent change thus extended out or variation still in this utility model create protection domain among.
Claims (10)
1. a circuit brake, it is characterised in that including:
Substrate, the lower surface of described substrate is provided with the conductive pin of at least three, is called the first pin, the second pin and the 3rd pin；
It is placed at least one chip component on described substrate, it is called first linear element, described first linear element has the upper surface and lower surface that can make electrode, and the lower surface of described first linear element and described first pin are conductively connected, and upper surface and described second pin are conductively connected；
Being placed in the current protection parts of the alloy wire on described substrate or piece-shape type, a termination of described current protection parts and the upper surface of described first linear element are conductively connected, and another termination and described 3rd pin are conductively connected.
2. circuit brake according to claim 1, it is characterised in that: described first linear element is the integration slice linear element that at least two chip component is laminated together to form.
3. circuit brake according to claim 1; it is characterized in that: described substrate is provided with another chip component; it is called the second chip component; described second chip component has the upper surface and lower surface that can make electrode; the lower surface of described second chip component and described second pin are conductively connected, and the upper surface of described first linear element is connected by the first lead-in wire with the upper surface of described second chip component.
4. circuit brake according to claim 3, it is characterised in that: the lower surface of described substrate is provided with the 4th pin, and the upper surface of described first linear element is conductively connected with described 4th pin by the second lead-in wire.
5. circuit brake according to claim 1, it is characterised in that: described current protection parts are current insurance silk fuse-link or current protector fuse-link.
6. circuit brake according to claim 1, it is characterised in that described chip component is one or more in elements below: electric capacity, resistance, inductance, pressure-sensitive, temperature-sensitive, semiconductor chip.
7. circuit brake according to claim 4, it is characterised in that:
Described substrate is three-decker, is called lower plate, upper plate and dividing plate from top to bottom；
Described lower plate is provided with the first through hole and the second through hole, the position that the lower surface with described first linear element of described lower plate contacts is provided with, with the position being provided with described first through hole, the first conductive layer being connected, described first pin is drawn from described first through hole, the position that the lower surface with described second chip component of described lower plate contacts is provided with the second conductive layer being connected with the position being provided with described second through hole, and described second pin is drawn from described second through hole；
Described upper plate is provided with two hollow region, described first linear element and described second chip component and is respectively arranged in two described hollow region；
Described dividing plate is the frame clsss structure of hollow.
8. circuit brake according to claim 7; it is characterized in that: described upper plate is provided with the third through-hole through with described lower plate; the position that the other end with described current protection parts of described upper plate contacts is provided with the 3rd conductive layer being connected with the position being provided with described third through-hole, and described 3rd pin is drawn from described third through-hole.
9. circuit brake according to claim 7; it is characterized in that: described upper plate is provided with the fourth hole through with described lower plate; the position contacted with described second lead-in wire of described upper plate is provided with the 4th conductive layer being connected with the position being provided with described fourth hole, and described 4th pin is drawn from described fourth hole.
10. circuit brake according to claim 1, it is characterised in that: also including cover plate, described cover plate is placed in described surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620053862.5U CN205406515U (en) | 2016-01-20 | 2016-01-20 | Circuit protection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620053862.5U CN205406515U (en) | 2016-01-20 | 2016-01-20 | Circuit protection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205406515U true CN205406515U (en) | 2016-07-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620053862.5U Active CN205406515U (en) | 2016-01-20 | 2016-01-20 | Circuit protection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205406515U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105552064A (en) * | 2016-01-20 | 2016-05-04 | 深圳市槟城电子有限公司 | Circuit protection device |
-
2016
- 2016-01-20 CN CN201620053862.5U patent/CN205406515U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105552064A (en) * | 2016-01-20 | 2016-05-04 | 深圳市槟城电子有限公司 | Circuit protection device |
| WO2017124793A1 (en) * | 2016-01-20 | 2017-07-27 | 深圳市槟城电子有限公司 | Circuit protection device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518116 Shenzhen, Longgang, Guangdong province Longgang Street Baolong community Baolong four road 3 Lan Pu Yuan Industrial Zone 1 Factory A501 Patentee after: Shenzhen Penang Electronics Co.,Ltd. Address before: 518116 Shenzhen, Longgang, Guangdong province Longgang Street Baolong community Baolong four road 3 Lan Pu Yuan Industrial Zone 1 Factory A501 Patentee before: Shenzhen Bencent Electronics Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |