CN205378202U - Module is handled to audio frequency - Google Patents

Abstract

The utility model relates to an audio transmission field especially relates to a module is handled to audio frequency. Module is handled to audio frequency central processing module, DSP module and a wireless transmitting module, the DSP module respectively with a central processing module and a wireless transmitting module link to each other, last audio frequency input interface, the audio output interface of still being provided with of module is handled to audio frequency. The utility model provides an among the module is handled to audio frequency, because will central processing module, DSP module and a wireless transmitting module compile on a module, and be small, is favorable to miniaturizing and the improvement of the degree of integrating of audio frequency device, in addition, among this embodiment a wireless transmitting module can go out bass signal, middle pitch signal or high pitch signal wireless transmitting, consequently, need not the cable to subwoofer or rearmounted sound equipment and connects, can put at will, wrong problem also can not appear connecing, moreover, owing to integrate the degree height, be favorable to reducing the secondary development degree of difficulty among the module is handled to audio frequency that this embodiment provided.

Description

A kind of Audio Processing module

Technical field

This utility model relates to audio transmission field, particularly relates to a kind of Audio Processing module.

Background technology

Along with the development of logical technology and audio frequency and video technology, and the release of various audio frequency and video service, people do not turn off and send various mode conveniently to transmit audio/video information.Such as, release along with high definition television service, people hanker after the household audio and video system building 5.1 sound channels or 7.1 sound channels to obtain more perfect seeing and hearing enjoyment, in such household audio and video system, for 6 or 8 speakers of configuration, at least a part of which to configure two even more rearmounted circulating loudspeakers, if taking traditional wireline audio transmission means, connect up placement location extremely inconvenient, speaker and can be influenced by restriction, and indoor beauty can be affected.

At present, wireless audio frequency transmission function mode is adopted to solve the problems referred to above.But, the current ANTENNAUDIO processing apparatus multiple modules of needs have coacted and have been wirelessly transferred work, and development process is slow, and bulky, is unfavorable for the miniaturization of audio parts and the raising of integration degree.

Utility model content

In view of this, this utility model provides a kind of miniaturization being conducive to audio parts and improves the audio processing modules of integration degree.

The described Audio Processing module that this utility model provides includes central processing module, DSP module and the first wireless transmitter module, described DSP module is connected with described central processing module and the first wireless transmitter module respectively, and described Audio Processing module is additionally provided with audio input interface, audio output interface.

In the described Audio Processing module that this utility model provides, described first wireless transmitter module is 2.4G ANTENNAUDIO transmitter module.

In the described Audio Processing module that this utility model provides, described 2.4G ANTENNAUDIO transmitter module is the module based on Bluetooth communication protocol or WIFI communication protocol.

In the described Audio Processing module that this utility model provides, described audio input interface includes circuit audio interface, IC bus input interface, mike input interface.

In the described Audio Processing module that this utility model provides, described audio output interface includes IC bus output interface, quiet output interface.

In the described Audio Processing module that this utility model provides, described PCB substrate is additionally provided with serial line interface, serial communication interface.

In the described Audio Processing module that this utility model provides, described Audio Processing module also includes a screening cover and PCB substrate, central processing module, DSP module and the first wireless transmitter module are arranged in described PCB substrate, and described screening cover at least covers the central processing module in described PCB substrate, DSP module and the first wireless transmitter module.

In the described Audio Processing module that this utility model provides, the length range of described Audio Processing module is 30mm-40mm, and width range is 20mm-30mm.

In the described Audio Processing module that this utility model provides, the length of described Audio Processing module is 36mm, and width is 26mm.

In the described Audio Processing module that this utility model provides, described Audio Processing module also includes the second wireless communication module, and described second wireless communication module is connected with described DSP module.

In the Audio Processing module that this utility model provides, owing to described central processing module, DSP module and the first wireless transmitter module being collected on a module, volume is little, is conducive to the miniaturization of audio parts and the raising of integration degree；In addition, bass signal, midrange signals or high pitched signal wireless transmit can be gone out by described first wireless transmitter module in present embodiment, therefore, connect without cable for subwoofer or rearmounted stereo set, can arbitrarily put, the problem also not havinging wrong；Furthermore, owing to integration degree is high in the Audio Processing module that present embodiment provides, be conducive to reducing secondary development difficulty.

Accompanying drawing explanation

Below in conjunction with drawings and Examples, the utility model is described in further detail, in accompanying drawing:

The structural representation of the Audio Processing module 100 of the better embodiment that Fig. 1 provides for this utility model；

The structural representation of the Audio Processing module 200 of another better embodiment that Fig. 2 provides for this utility model；

The Audio Processing module 300 of the better embodiment that Fig. 3 provides for this utility model is applied to the application block diagram of integrated 5.1 home audio systems.

Detailed description of the invention

For the Audio Processing module that this utility model provides is described, it is described in detail below in conjunction with Figure of description and explanatory note.

In description of the present utility model, it is necessary to explanation, unless otherwise clearly defined and limited, term " being connected ", " connection " should be interpreted broadly, it is possible to be the electric connection of two element internals；Can be joined directly together, it is also possible to be indirectly connected to by intermediary, for the ordinary skill in the art, it is possible to understand the concrete meaning of above-mentioned term as the case may be.Additionally, term " first ", " second " are only for descriptive purposes, and it is not intended that indicate or imply relative importance or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or implicitly include one or more these features.

As shown in Figure 1, the structural representation of the Audio Processing module 100 of its better embodiment provided for this utility model, described Audio Processing module 100 includes PCB substrate 101, be encapsulated in central processing module 104, DSP module 103 and first wireless transmitter module 102 of in described PCB substrate 101, described DSP module 103 is connected with described central processing module 104 and the first wireless transmitter module 102 respectively, and described PCB substrate 101 is additionally provided with the audio input interface 105, the audio output interface 106 that are connected with described DSP module 103.

Described central processing module 104 is used for exporting various work order；Described central processing module 104 is used for the audio signal to input of the work order according to described central processing module 104, and the such as signal of Doby coded format, the signal of digital cinema system (DTS) coded format, two-channel stereo acoustic simulation multichannel carry out audio decoder process around the signal of coded format (SRS)；Described first wireless transmitter module 102 is for going out the audio signal wireless transmit handled well.

In present embodiment, described first wireless transmitter module 102 is 2.4G ANTENNAUDIO transmitter module, and described 2.4G ANTENNAUDIO transmitter module is the module based on Bluetooth communication protocol or WIFI communication protocol.In other embodiments, the first wireless transmitter module can be other frequency ranges to described first wireless transmitter module 102, or the wireless transmitter module based on other communication protocols.Bass signal, midrange signals or high pitched signal wireless transmit can be gone out by described first wireless transmitter module 102, therefore, connect without cable for subwoofer or rearmounted stereo set, can arbitrarily put, the problem also not havinging wrong.

Corresponding with described first wireless transmitter module 102, described PCB substrate 101 is additionally provided with the antenna being connected with described first wireless transmitter module 102.

In present embodiment, described audio input interface 105 includes AUX interface, IC bus input interface, mike input interface.Described IC bus input interface includes Bluetooth signal input interface, WIFI signal input interface, circuit audio input interface, fiber-optic signal input interface, HDMI.Namely described IC bus input interface may be used for the audio signal that input blue-tooth device, WIFI device etc. are wirelessly transferred, it is also possible to is used for inputting TV HDMI signal, optical fiber audio signal etc..Described audio output interface 106 includes IC bus output interface, quiet output interface.Accordingly, described IC bus output interface can export audio digital signals or analogue signal etc. after all kinds of corresponding decoding.Described PCB substrate is additionally provided with serial line interface, serial communication interface etc..It is opposing in the one side of described central processing module 104 that described each class interface can be arranged in described PCB substrate, it is also possible in the one side that to be arranged in described PCB substrate identical with described central processing module 104.

In present embodiment, described Audio Processing module 100 also includes a screening cover, and described screening cover at least covers the central processing module 104 in described PCB substrate, DSP module 103 and the first wireless transmitter module 102.The length range of described Audio Processing module 100 is 30mm-40mm, and width range is 20mm-30mm.Preferably, the length of described Audio Processing module 100 is 36mm, and width is 26mm.

In the Audio Processing module 100 that present embodiment provides, owing to described central processing module 104, DSP module 103 and the first wireless transmitter module 102 are collected in a module, volume is little, is conducive to the miniaturization of audio parts and the raising of integration degree；In addition, bass signal, midrange signals or high pitched signal wireless transmit can be gone out by described first wireless transmitter module 102 in present embodiment, therefore, connect without cable for subwoofer or rearmounted stereo set, can arbitrarily put, the problem also not havinging wrong；Furthermore, owing to integration degree is high in the Audio Processing module 100 that present embodiment provides, be conducive to reducing secondary development difficulty.

As in figure 2 it is shown, the structural representation of the Audio Processing module of its another better embodiment provided for this utility model.Described Audio Processing module 100 includes PCB substrate 201, be encapsulated in central processing module 204, DSP module the 203, first wireless transmitter module 202 and second wireless transmitter module 207 of in described PCB substrate 201, described DSP module 203 is connected with described central processing module the 204, first wireless transmitter module 202 and the second wireless transmitter module 207 respectively, and described PCB substrate 201 is additionally provided with the audio input interface 205, the audio output interface 206 that are connected with described DSP module 203.

Described Audio Processing module 200 in present embodiment is relative to above-mentioned audio processing modules 100, newly increase second wireless transmitter module 207, described first wireless transmitter module 202 and the second wireless transmitter module 207 can be shared out the work and help one another and bass signal and alt signal be launched respectively, thus removing when a certain audio signal is wirelessly transferred away the interference to another kind of audio signal from.

As it is shown on figure 3, the Audio Processing module 300 of its better embodiment provided for this utility model is applied to the application block diagram of integrated 5.1 home audio systems.Central authorities in this Audio Processing module 300 process and wireless communication module and premise central processing module the 204, first wireless transmitter module 102 and the second wireless transmitter module 207 same or similar, for better describing the problem, the central authorities in this Audio Processing module 300 process and wireless communication module omits.

These integrated 5.1 home audio systems include Audio Processing module 300, front-located power amplifier (left and right), rearmounted power amplifier (left and right), mid-power amplifier, subwoofer and control panel.The input switch key entered through on control panel of a certain audio signal is realized by these integrated 5.1 home audio systems.

DSP module in this Audio Processing module 300 is for being decoded the microphone signal of input, circuit audio signal, Bluetooth audio signals, WIFI audio signal, optical fiber audio signal or HDMI audio signal processing.Described front-located power amplifier is (left, right), mid-power amplifier is connected by wired mode, rearmounted power amplifier is (left, right), subwoofer wirelessly connects, described DSP module is when receiving arbitrary audio signal of input, this audio signal is carried out audio decoder process, and front-located power amplifier is (left, right), it is (left that mid-power amplifier signal passes to described front-located power amplifier by wired mode, right), mid-power amplifier, and by (left for rearmounted power amplifier, right) signal, bass signal is wirelessly launched, so that rearmounted power amplifier is (left, right), this signal of subwoofer wireless receiving.

In other embodiments, front-located power amplifier (left and right) signal, mid-power amplifier signal by the modulation of wireless communication module, wirelessly can also be launched, thus thoroughly exempting wired brought negative effect.

The better embodiment of the Audio Processing module provided for this utility model above; the restriction to this utility model rights protection scope can not be interpreted as; those skilled in the art should know; without departing from the concept of the premise utility; also can do multiple improvement or replacement; all of such improvement or replacement all should within the scope of rights protections of the present utility model, and namely rights protection scope of the present utility model should be as the criterion with claim.

Claims (10)

1. an Audio Processing module, it includes central processing module, DSP module and the first wireless transmitter module, described DSP module is connected with described central processing module and the first wireless transmitter module respectively, and described Audio Processing module is additionally provided with audio input interface, audio output interface.

2. Audio Processing module as claimed in claim 1, it is characterised in that: described first wireless transmitter module is 2.4G ANTENNAUDIO transmitter module.

3. Audio Processing module as claimed in claim 2, it is characterised in that: described 2.4G ANTENNAUDIO transmitter module is the module based on Bluetooth communication protocol or WIFI communication protocol.

4. Audio Processing module as claimed in claim 1, it is characterised in that: described audio input interface includes IC bus input interface, mike input interface；Described audio output interface includes IC bus output interface, quiet output interface.

5. Audio Processing module as claimed in claim 4, it is characterised in that: described IC bus input interface includes Bluetooth signal input interface, WIFI signal input interface, circuit audio input interface, fiber-optic signal input interface, HDMI.

6. Audio Processing module as claimed in claim 1, it is characterised in that: described Audio Processing module is additionally provided with serial line interface, serial communication interface.

7. Audio Processing module as claimed in claim 1, it is characterized in that: described Audio Processing module also includes a screening cover and PCB substrate, central processing module, DSP module and the first wireless transmitter module are arranged in described PCB substrate, and described screening cover at least covers the central processing module in described PCB substrate, DSP module and the first wireless transmitter module.

8. Audio Processing module as claimed in claim 1, it is characterised in that: the length range of described Audio Processing module is 30mm-40mm, and width range is 20mm-30mm.

9. Audio Processing module as claimed in claim 8, it is characterised in that: the length of described Audio Processing module is 36mm, and width is 26mm.

10. Audio Processing module as claimed in claim 1, it is characterised in that: described Audio Processing module also includes the second wireless communication module, and described second wireless communication module is connected with described DSP module.