CN108401212B - Device and method for realizing 3D surround sound effect - Google Patents
Device and method for realizing 3D surround sound effect Download PDFInfo
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- CN108401212B CN108401212B CN201810074720.0A CN201810074720A CN108401212B CN 108401212 B CN108401212 B CN 108401212B CN 201810074720 A CN201810074720 A CN 201810074720A CN 108401212 B CN108401212 B CN 108401212B
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- 230000005236 sound signal Effects 0.000 claims description 65
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R5/00—Stereophonic arrangements
- H04R5/04—Circuit arrangements, e.g. for selective connection of amplifier inputs/outputs to loudspeakers, for loudspeaker detection, or for adaptation of settings to personal preferences or hearing impairments
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R5/00—Stereophonic arrangements
- H04R5/033—Headphones for stereophonic communication
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Abstract
The invention relates to a 3D surround sound effect realizing device and a method thereof, wherein the 3D surround sound effect device adopts I/O equipment, an audio decoding/digital-to-analog conversion unit, a 3D sound effect analyzing unit, a power amplifier, a power management unit and a selection unit; the I/O equipment is sequentially connected with the audio decoding/digital-to-analog conversion unit, the 3D sound effect analysis unit and the power amplifier; in addition, the I/O device is respectively connected with the power management unit, the 3D sound effect analysis unit and the selection unit. The invention distinguishes the normal function and the 3D surround function of the earphone to a certain extent by arranging the normal I/O unit and the multifunctional I/O unit on the I/O device, and realizes the stereo 3D surround sound effect around the listener by controlling the output of the 3D surround sound when the 3D surround sound function is needed.
Description
Technical Field
The invention relates to the technical field of acoustoelectric, in particular to a device and a method for realizing 3D surround sound effect.
Background
In the current implementation scheme of portable audio equipment such as headphones and the like, the processing of left and right direction sense and sound size is mainly enhanced by using left and right double-drive speaker units, namely, two or more speakers with certain angles are placed in space, the speakers with different angles provide signals by one or two sound channels, and the human ears capture the position or direction of a sound source (human ear biology principle) in a mode of signal phase difference so as to enhance the stereoscopic perception of a listener on the sound source. However, the earphone currently on the market has no function of converting the traditional 2D audio signal into the 3D audio signal, so that the user cannot experience the 3D surround sound effect in real time. Therefore, the hearing demand of the user on the 3D audio signal is not enough, and the user experience is poor.
Disclosure of Invention
First, the technical problem to be solved
The invention provides a device and a method for realizing 3D surround sound effect, which are used for solving the problems that the traditional earphone cannot provide 3D surround sound effect, cannot meet the hearing requirement of a user on the 3D audio sound effect and is poor in user experience.
(II) technical scheme
In order to solve the technical problems, the invention provides a 3D surround sound device, which comprises an I/O device, an audio decoding/digital-to-analog conversion unit, a 3D sound analysis unit, a power amplifier, a power management unit and a selection unit; the I/O equipment is sequentially connected with the audio decoding/digital-to-analog conversion unit, the 3D sound effect analysis unit and the power amplifier; in addition, the I/O device is respectively connected with the power management unit, the 3D sound effect analysis unit and the selection unit.
Optionally, the I/O device includes a general I/O unit and a multifunctional I/O unit.
Optionally, the power management unit includes a detection unit, and when the detection unit detects that one end of the selection unit is connected with the I/O device and the other end of the selection unit is connected with the speaker, the 3D surround sound device is a common sound device; when the detection unit detects that one end of the selection unit is connected with the I/O equipment and the other end of the selection unit is connected with the power management unit, the 3D surrounding sound effect device is a 3D sound effect device.
Optionally, when the 3D surround sound device is a 3D sound device, the 2D audio signal is amplified and output by the speaker after being processed into a 3D audio signal by the 3D sound analysis unit and the power amplifier.
Optionally, the power management unit is connected with an external battery module to realize power supply.
Optionally, when the multifunctional I/O unit of the I/O device is in a working state, the I/O device is connected to an external device, and the external device directly supplies power to the audio decoding/digital-to-analog conversion unit, the 3D sound effect analysis unit and the power amplifier; the 2D audio signal is converted into an analog signal by the audio decoding/digital-to-analog conversion unit, is processed into a 3D audio signal by the 3D sound effect analysis unit and the power amplifier, and is amplified and output by the loudspeaker.
Optionally, the external device is an audio output device.
The embodiment of the invention also provides a processing method for realizing the 3D surround sound effect through the 3D surround sound effect device, which comprises the following steps:
the I/O device judges which of the common I/O unit or the multifunctional I/O unit is in a working state;
when the common I/O unit is in a working state, the power management unit judges whether the power management unit is conducted with the selection unit or not; if not, the 2D audio signal output by the I/O equipment is directly output through a loudspeaker after passing through the selection unit; if the audio signal is conducted, the 2D audio signal output by the I/O equipment is processed into a 3D surrounding audio signal through the 3D sound effect analysis unit and the power amplifier, and then the 3D audio signal is output after being amplified through the loudspeaker.
Optionally, if the power management unit is turned on, the external battery module is implemented as the 3D sound effect analysis unit and the power amplifier to supply power.
Optionally, when the multifunctional I/O unit is in a working state, the I/O device directly supplies power to the audio decoding/digital-to-analog conversion unit, the 3D sound effect analysis unit and the power amplifier which are sequentially connected through the connected external device; the 2D audio signal is converted into an analog signal through the audio decoding/digital-to-analog conversion unit, is processed into a 3D surround audio signal through the 3D sound effect analysis unit and the power amplifier, and is amplified through the loudspeaker to output a 3D audio signal.
(III) beneficial effects
Compared with the prior art, the technical scheme of the invention has the following advantages: the invention distinguishes the normal function and the 3D surround function of the earphone to a certain extent by arranging the normal I/O unit and the multifunctional I/O unit on the I/O device, and realizes the stereo 3D surround sound effect around the listener by controlling the output of the 3D surround sound when the 3D surround sound function is needed.
Drawings
FIG. 1 is a schematic diagram of a circuit implementation of a 3D surround sound device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a middle wire gear of an earphone according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a 3D surround sound device according to an embodiment of the present invention;
fig. 4 is a flowchart of a method for implementing 3D surround sound according to an embodiment of the present invention.
In the drawings, the list of components represented by the various numbers is as follows:
1. an external device; 2. an I/O device; 3. an audio decoding/digital-to-analog conversion unit; 4. a power management unit; 5. a 3D sound effect analysis unit; 6. a selection unit; 7. a power amplifier; 1. an external device; 2. an I/O device; 3. an audio decoding/digital-to-analog conversion unit; 4. a power management unit; 5. a 3D sound effect analysis unit; 6. a selection unit; 7. a power amplifier; 8. a microphone; 9. A speaker; 10. externally connecting a battery module; 11. an earplug; 12. a first transmission line; 13. a second transmission line; 14. an earphone body; 41. a lower housing; 42. an upper housing; 43. a circuit board; 44. Insulating waterproof material; 45. and (3) a switch.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1, a 3D surround sound device includes an I/O device 2, an audio decoding/digital-to-analog conversion unit 3, a 3D sound analysis unit 5, a power amplifier 7, a power management unit 4, and a selection unit 6.
In this embodiment, the I/O device 2 is sequentially connected to the audio decoding/digital-to-analog conversion unit 3, the 3D sound effect analysis unit 5, and the power amplifier 7.
In addition, in the present embodiment, the I/O device 2 is connected to the power management unit 4, the 3D sound effect analysis unit 5, and the selection unit 6, respectively.
In this embodiment, the I/O device 2 is connected to the external device 1, and the audio decoding/digital-to-analog conversion unit 3, the 3D sound effect analysis unit 5 and the power amplifier 7 are used to convert 2D sound effects into 3D sound effects, and the speaker 9 is used to output 3D sound effects, so as to realize stereo 3D surround sound effects around the listener.
As shown in fig. 2 and 3, in the present embodiment, the carrier of the 3D surround sound device is a circuit board 43, and when the circuit board 43 is disposed on a wired earphone, the wired earphone includes an earplug 11, a speaker 9, a first transmission line 12, an earphone body 14, a second transmission line 13, and an I/O device 2, which are sequentially connected, where the earplug 11 is a hanging-up or in-ear earplug; the earphone body 14 includes: a housing including an upper housing 42 and a lower housing 41 detachably connected; the circuit board 43 that sets up in the shell, this circuit board 43 surface is provided with insulating waterproof material 44 and switch 45, and this switch 45 can set up to the touch-sensitive board as required, at this moment, be provided with on the circuit board 43 in the above-mentioned 3D surround sound device audio decoding/digital analog conversion unit 3, 3D audio parsing unit 5, power amplifier 7, power management unit 4 and selection unit 6.
In this embodiment, the carrier of the 3D surround sound device is a circuit board 43, and when the circuit board 43 is disposed on a wireless earphone, the wireless earphone includes: the earphone body 14 and the I/O device 2 disposed in the earphone body 14, the speaker 9 and the earplug 11 are disposed on the earphone body 14, the earplug 11 is a hanging-in or in-ear earplug, and the earphone body 14 includes: a housing including an upper housing 42 and a lower housing 41 detachably connected; the circuit board 43 is arranged in the shell, the outer surface of the circuit board 43 is provided with an insulating waterproof material 44 and a switch 45, the switch 45 can be arranged as a touch pad according to requirements, and at the moment, the circuit board 43 is provided with the audio decoding/digital-to-analog conversion unit 3, the 3D sound effect analysis unit 5, the power amplifier 7, the power management unit 4 and the selection unit 6 in the 3D surrounding sound effect device; the external device 1 is wirelessly connected with the earphone main body 14, and the wireless connection mode includes bluetooth connection, ZIGBEE connection or WIFI connection.
In this embodiment, the 3D sound effect analysis unit 5 includes a multi-stage filtering circuit, a frequency response adjustment circuit and a signal audio parameter adjustment compensation circuit, when the 3D sound effect analysis unit 5 is in a working state, the audio signals a-R/a-L are used as input, the filtering circuit filters the miscellaneous signals of the planar sound, and at the same time, the frequency response adjustment circuit and the signal audio parameter adjustment compensation circuit perform parameter adjustment and compensation of reverberation, tone variation, echo and delay based on the HRTF head related transfer model, so as to construct audio parameters in a vertical space, so as to simulate sound information of positions, frequencies, delay and loudness that can be heard by human ears, and construct a stereo 3D surrounding audio signal, and the reconstructed audio parameters are the audio signals a_l_3D/a_r_3d output in the 3D sound effect analysis module in this scheme.
In a specific embodiment, for the I/O device 2 shown in fig. 1, a 3D surround sound device is provided in this embodiment, which is different in that: the I/O device 2 includes a general I/O unit and a multi-function I/O unit.
In this embodiment, only one of the normal I/O unit and the multi-function I/O unit is in an operational state, and the interference between the normal I/O unit and the multi-function I/O unit is negligible.
In a specific embodiment, the power management unit 4 comprises a detection unit.
In this embodiment, when the normal I/O unit of the I/O device 2 is in a working state, at this time, the external battery module 10 and the power management unit 4 are required to supply power to the 3D audio device, and the detection unit detects that one end of the selection unit 6 is connected to the I/O device 2 and the other end is connected to the speaker 9, the 3D surround audio device is a normal audio device, at this time, the selection unit 6 is not connected to the power management unit 4, and the 3D surround audio device is a normal audio device, and directly outputs the received audio signal through the speaker 9;
in this embodiment, when the detection unit detects that one end of the selection unit 6 is connected to the I/O device 2 and the other end is connected to the power management unit 4, the 3D surround sound device is a 3D sound device, at this time, the selection unit 6 is connected to the power management unit 4, and the power management unit 4 supplies power to the audio decoding/digital-to-analog conversion unit 3, the 3D sound analysis unit 5 and the power amplifier 7 through the external battery module 10, so that the power management unit 4 works, and the received 2D audio signal is amplified and output through the speaker 9 after being processed into a 3D audio signal by the 3D sound analysis unit 5 and the power amplifier 7.
In this embodiment, the power management unit 4 includes a charging circuit, a discharging circuit and a detecting circuit, where the detecting circuit is the detecting unit, and the charging and discharging operations to the external battery module 10 are implemented through the charging circuit and the discharging circuit, and the monitoring is connected with the a_r or the a_l of the audio signal. When the audio signal A_R/A_L is transmitted, a signal pulse is generated, the audio signal A_R or A_L connected to the power management module generates a certain voltage, when the selection unit 6 works in the state A, namely the audio signal A_R/A_L is directly connected to the loudspeaker 9, in the detection circuit, the detection circuit judges the non-discharge state when the audio signals A_R and A_L are not collected at the selection unit 6, at this time, the 3D sound effect analysis module does not supply power and does not work, the resistance value of the internal circuit in the state is infinite, the audio signal drives the loudspeaker 9 to work through the direct connection path so as to achieve the effect of playing a sound source, and in the embodiment, the working state is defined as bypass mode; when the selection unit 6 is switched to the B state, i.e. the audio signals a_r/a_l and the speaker 9 are in a direct disconnection mode, the voltages of the audio signals a_r and a_l are collected at the selection unit 6, the detection circuit forms a loop through the two paths of voltage differences, so that the battery provides discharge, the 3D sound effect analysis module and the power amplification module provide power and work, the audio signals are processed by the 3D sound effect analysis module and amplified by the power amplification module to drive the speaker 9 to work, and the effect of playing the sound source is achieved.
In a specific embodiment, when the multifunctional I/O unit of the I/O device 2 is in a working state, the I/O device 2 is connected to an external device 1, the external device 1 directly supplies power to the audio decoding/digital-to-analog conversion unit 3, the 3D sound effect analysis unit 5 and the power amplifier 7, and specifically, supplies power to the audio decoding/digital-to-analog conversion unit 3, the 3D sound effect analysis unit 5 and the power amplifier 7 in an OTG mode of the external device 1; the 2D audio signal is converted into an analog signal by the audio decoding/digital-to-analog conversion unit 3, and is amplified and output by the speaker 9 after being processed into a 3D audio signal by the 3D sound effect analysis unit 5 and the power amplifier 7.
In this embodiment, the external device 1 is an audio output apparatus, and the audio output apparatus includes: a microphone 8, a computer, a television or a mobile phone, etc. has an audio output interface.
As shown in fig. 4, the embodiment of the present invention further provides a method for implementing 3D surround sound effects by using the 3D surround sound device, where the method includes:
the I/O device 2 determines which of the normal I/O unit or the multi-function I/O unit is in an operating state.
In this embodiment, when the normal I/O unit is in the working state, the power management unit 4 determines whether or not to conduct itself with the selection unit 6; if not, the 2D audio signal output by the I/O device 2 is directly output through the speaker 9 after passing through the selection unit 6, and at this time, the selection unit 6 is not connected to the power management unit 4, and the 3D surround sound device is a normal sound device, and the received audio signal is directly output through the speaker 9.
In this embodiment, when the normal I/O unit is in the working state, the power management unit 4 determines whether or not to conduct itself with the selection unit 6; if the 3D surround sound device is a 3D surround sound device, the selection unit 6 is connected to the power management unit 4, and the power management unit 4 supplies power to the audio decoding/digital-to-analog conversion unit 3, the 3D surround sound analysis unit 5 and the power amplifier 7 through the external battery module 10, so that the audio decoding/digital-to-analog conversion unit is operated, and the 2D audio signal output by the I/O device 2 is processed into a 3D surround audio signal by the 3D surround sound analysis unit 5 and the power amplifier 7, and then amplified by the speaker 9, and then the 3D audio signal is output.
Specifically, in this embodiment, the 3D sound effect analysis unit 5 includes a multi-stage filtering circuit, a frequency response adjustment circuit, and a signal audio parameter adjustment compensation circuit, when the 3D sound effect analysis unit 5 is in a working state, the audio signals a-R/a-L are used as input, the filtering circuit filters the miscellaneous signals of the planar sound, and at the same time, the frequency response adjustment circuit and the signal audio parameter adjustment compensation circuit perform parameter adjustment and compensation of reverberation, tone variation, echo, and delay based on the HRTF head association transfer model, so as to construct audio parameters in a vertical space, so as to simulate the sound information of the position, frequency, delay, and loudness that can be heard by human ears, and construct a stereo 3D surrounding audio signal, and the reconstructed audio parameters are the audio signals a_l_3D/a_r_3D output in the 3D sound effect analysis module in this scheme.
Specifically, in this embodiment, the power management unit 4 includes a charging circuit, a discharging circuit, and a detecting circuit, where the detecting circuit is the detecting unit, and the charging and discharging operations to the external battery module 10 are implemented through the charging circuit and the discharging circuit, and the monitoring is connected with the a_r or the a_l of the audio signal. When the audio signal A_R/A_L is transmitted, a signal pulse is generated, the audio signal A_R or A_L connected to the power management module generates a certain voltage, when the selection unit 6 works in the state A, namely the audio signal A_R/A_L is directly connected to the loudspeaker 9, in the detection circuit, the detection circuit judges the non-discharge state when the audio signals A_R and A_L are not collected at the selection unit 6, at this time, the 3D sound effect analysis module does not supply power and does not work, the resistance value of the internal circuit in the state is infinite, the audio signal drives the loudspeaker 9 to work through the direct connection path so as to achieve the effect of playing a sound source, and in the embodiment, the working state is defined as bypass mode; when the selection unit 6 is switched to the B state, i.e. the audio signals a_r/a_l and the speaker 9 are in a direct disconnection mode, the voltages of the audio signals a_r and a_l are collected at the selection unit 6, the detection circuit forms a loop through the two paths of voltage differences, so that the battery provides discharge, the 3D sound effect analysis module and the power amplification module provide power and work, the audio signals are processed by the 3D sound effect analysis module and amplified by the power amplification module to drive the speaker 9 to work, and the effect of playing the sound source is achieved.
In this embodiment, when the multifunctional I/O unit is in a working state, the I/O device 2 directly supplies power to the audio decoding/digital-to-analog conversion unit 3, the 3D sound effect analysis unit 5 and the power amplifier 7, which are sequentially connected, through the connected external device 1, specifically, supplies power to the audio decoding/digital-to-analog conversion unit 3, the 3D sound effect analysis unit 5 and the power amplifier 7 through an external device 1OTG mode; the 2D audio signal is converted into an analog signal by the audio decoding/digital-to-analog conversion unit 3, and is amplified and output by the speaker 9 after being processed into a 3D surround audio signal by the 3D sound effect analysis unit 5 and the power amplifier 7.
In this embodiment, the I/O device 2 is connected with the external device 1 in a limited or wireless manner, where the external device 1 is an audio output apparatus, and the audio output apparatus includes: a microphone 8, a computer, a television, a mobile phone, or other devices having an audio output interface; the wireless connection mode comprises the following steps: bluetooth connection, ZIGBEE connection, or WIFI connection.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (7)
1. A3D surround sound effect device comprises an I/O device (2), an audio decoding/digital-to-analog conversion unit (3), a 3D sound effect analysis unit (5), a power amplifier (7), a power management unit (4) and a selection unit (6); it is characterized in that the method comprises the steps of,
the I/O equipment (2) is sequentially connected with the audio decoding/digital-to-analog conversion unit (3), the 3D sound effect analysis unit (5) and the power amplifier (7); in addition, the I/O device (2) is respectively connected with the power management unit (4), the 3D sound effect analysis unit (5) and the selection unit (6);
the I/O device (2) comprises a common I/O unit and a multifunctional I/O unit;
the power management unit (4) comprises a detection unit, and when the common I/O unit of the I/O equipment (2) is in a working state, the detection unit detects that one end of the selection unit (6) is connected with the I/O equipment (2) and the other end of the selection unit is connected with the loudspeaker (9), the 3D surrounding sound effect device is a common sound effect device; when the detection unit detects that one end of the selection unit (6) is connected with the I/O equipment (2) and the other end of the selection unit is connected with the power management unit (4), the 3D surrounding sound effect device is a 3D sound effect device;
the 3D sound effect analysis unit (5) comprises a multistage filter circuit, a frequency response adjustment circuit and a signal audio parameter adjustment compensation circuit, when the 3D sound effect analysis unit (5) is in a working state, audio signals A-R/A-L are used as input, the filtering circuit is used for filtering noise signals of plane sound, meanwhile, the frequency response adjustment circuit and the signal audio parameter adjustment compensation circuit are used for carrying out parameter adjustment and compensation of reverberation, tone variation, echo and delay based on an HRTF head association transfer model, audio parameters in a vertical space are constructed, so that sound information of positions, frequencies, delay and loudness which can be heard by human ears is simulated, and audio signals A_L_3D/A_R_3D of three-dimensional 3D surrounding are constructed, wherein the audio signals A_L_3D are output in the 3D sound effect analysis unit (5);
when the multifunctional I/O unit of the I/O device (2) is in a working state, the I/O device (2) is connected with an external device (1), and the external device (1) directly supplies power to the audio decoding/digital-to-analog conversion unit (3), the 3D sound effect analysis unit (5) and the power amplifier (7); the 2D audio signal is converted into an analog signal by the audio decoding/digital-to-analog conversion unit (3), is processed into a 3D audio signal by the 3D sound effect analysis unit (5) and the power amplifier (7), and is amplified and output by the loudspeaker (9).
2. The 3D surround sound device according to claim 1, wherein: when the 3D surrounding sound effect device is a 3D sound effect device, 2D audio signals are processed into 3D audio signals through the 3D sound effect analysis unit (5) and the power amplifier (7), and then amplified and output through the loudspeaker (9).
3. The 3D surround sound device according to claim 1, wherein: the power management unit (4) is connected with an external battery module (10) to realize power supply.
4. The 3D surround sound device according to claim 1, wherein: the external equipment (1) is an audio output device.
5. A method of processing a 3D surround sound effect by the 3D surround sound device of claim 1, the method comprising:
the I/O device (2) judges which of the common I/O unit and the multifunctional I/O unit is in a working state;
when the common I/O unit is in a working state, the power management unit judges whether the power management unit is conducted with the selection unit (6) or not; if not, the 2D audio signal output by the I/O equipment (2) is directly output through a loudspeaker (9) after passing through the selection unit (6); if the power amplifier is conducted, the 2D audio signal output by the I/O equipment (2) is processed into a 3D surrounding audio signal through the 3D sound effect analysis unit (5) and the power amplifier (7), and then the 3D surrounding audio signal is amplified through the loudspeaker (9) and output.
6. A processing method according to claim 5, characterized in that: and if the power supply is conducted, the power supply management unit (4) realizes the external battery module (10) to supply power for the 3D sound effect analysis unit (5) and the power amplifier (7).
7. A processing method according to claim 5, characterized in that: when the multifunctional I/O unit is in a working state, the I/O device (2) directly supplies power to the audio decoding/digital-to-analog conversion unit (3), the 3D sound effect analysis unit (5) and the power amplifier (7) which are connected in sequence through the connected external device (1); the 2D audio signal is converted into an analog signal through the audio decoding/digital-to-analog conversion unit (3), is processed into a 3D surround audio signal through the 3D sound effect analysis unit (5) and the power amplifier (7), and is amplified through the loudspeaker (9) to output the 3D audio signal.
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| CN101014211A (en) * | 2007-01-12 | 2007-08-08 | 颜聪裕 | 5.1 track earphone with USB interface |
| CN105763990A (en) * | 2010-10-02 | 2016-07-13 | 张沈平 | Earphone, corresponding sound source device and control method |
| CN107493543A (en) * | 2016-06-12 | 2017-12-19 | 深圳市奥尼电子工业有限公司 | 3D sound effect processing circuit for earphone earplug and processing method thereof |
| CN206212237U (en) * | 2016-11-14 | 2017-05-31 | 佳禾智能科技股份有限公司 | A kind of Bypass devices of active noise reduction earphone |
| CN207968840U (en) * | 2018-01-25 | 2018-10-12 | 深圳聆迈科技有限公司 | A kind of circular audio devices of 3D |
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