CN205374509U - Restrain sensitive structure of micromechanics acceleration of crosstalking among little accelerometer of high accuracy unipolar optics - Google Patents
Restrain sensitive structure of micromechanics acceleration of crosstalking among little accelerometer of high accuracy unipolar optics Download PDFInfo
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- CN205374509U CN205374509U CN201520995615.2U CN201520995615U CN205374509U CN 205374509 U CN205374509 U CN 205374509U CN 201520995615 U CN201520995615 U CN 201520995615U CN 205374509 U CN205374509 U CN 205374509U
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Abstract
The utility model discloses a restrain sensitive structure of micromechanics acceleration of crosstalking among little accelerometer of high accuracy unipolar optics, the sensitive structure of micromechanics acceleration includes the sensitive quality piece of an individual silicon, and the crab foot type cantilever beam of four symmetric distributions is connected the silicon fundus of cantilever beam and is plated the reflectance coating at sensitive quality block list face, the focus of the sensitive quality piece little processing technology through special design can ensure to be located the midplane of cantilever beam, sensitive this midplane of axle direction perpendicular to of the little accelerometer of unipolar optics, and the adjustment fundamentally through centre of gravity place has restrained the off -axis and has crosstalked, the sensitive ligand of micromechanics acceleration can effectively suppress the off -axis under the prerequisite of guaranteeing high acceleration measuring sensitivity in the little accelerometer of diffraction grating's optics and crosstalk, the little processing technology in surface that uses also can with IC compatible, realize big preparation in batches.
Description
Technical field
This utility model belongs to optics micro-acceleration sensor technical field, relates to the micro-machine acceleration sensitive structure suppressing crosstalk in a kind of high-precise uniaxial optics micro-acceleration gauge.
Background technology
Accelerometer is a kind of sensor measuring this fundamental physical quantity of acceleration, its fundamental measurement principle is based on newton second theorem, accelerometer generally comprises mechanical acceleration sensory system and displacement measurement system, extraneous acceleration makes the mass in mechanical acceleration sensory system produce one has, with input acceleration size, the displacement determining relation, and displacement measurement system obtains the size of input acceleration by measuring this displacement.The performance of accelerometer is determined by the two system simultaneously.The performance indications weighing accelerometer have: sensitivity, resolution, dynamic range, bandwidth of operation and off-axis crosstalk size etc..The impact that wherein acceleration analysis that accelerometer sensitive is axial is brought by the acceleration being consequently exerted at non-sensitive direction of off-axis crosstalk reflection.
Compared to traditional mechanical electricity formula accelerometer, micro electro mechanical system accelerator has the advantages such as higher sensitivity, low noise, volume are little, lightweight, cost is low, easy of integration, has now become an important development direction of accelerometer.And compared to conventional microelectromechanical systems accelerometer, such as condenser type, piezoelectric type or pressure resistance type, optics micro-acceleration gauge can provide again higher acceleration analysis precision, electromagnetism interference, Larger Dynamic scope and respond the advantages such as fast.Therefore, optics micro-acceleration gauge is currently increasingly becoming a brand-new accelerometer Hot spots for development.
Optics micro-acceleration gauge based on diffraction grating combines the micro-machine acceleration sensory system having high-precision optical displacement measurement system with high acceleration-displacement sensitivity, acceleration analysis resolution [the 12.S.Zhao of the acceleration analysis sensitivity more than 1000V/g and μ g rank can be provided, J.Zhang, C.Hou, J.BaiandG.Yang, " Opticalaccelerometerbasedongratinginterferometerwithphas emodulationtechnique; " Appl.Opt.51,7,005 7010 (2011) .]." Micromachinedforce-balancefeedbackaccelerometerwithoptic aldisplacementdetection " that U.S. Patent number is US8783106B1 discloses a kind of force feedback optical accelerometer based on diffraction grating with the micro-machine acceleration sensory system being implemented on SOI, the sensitive-mass block of this accelerometer and framework establishment are on a three layers SOI, sensitive-mass block is opened with framework apart by etching groove dorsad and adopts suspension spring to be connected with framework, when this accelerometer is subject to extraneous acceleration, mass can move up and down, by can complete the measurement of acceleration based on the displacement of the displacement measurement system out-going quality block of diffraction grating.Although the existing optics micro-acceleration gauge based on diffraction grating can provide significantly high acceleration analysis precision, if but micro-machine acceleration sensory system therein does not make improvement, off-axis crosstalk increases as well as the lifting of acceleration analysis precision for the impact of accelerometer.And off-axis crosstalk is as the important performance indexes weighing accelerometer, especially should reduce for high-precision accelerometer, to avoid its impact on overall performance.
In current world wide, certain research is made that for the off-axis crosstalk in micro electro mechanical system accelerator, it is also proposed the means of many clutter reductions for micro-acceleration gauges such as condenser type, piezoelectric type and pressure resistance types.Beijing University achieves the capacitance microaccelerator [Q.Hu of a kind of low crosstalk by designing a kind of high symmetrical sandwich structure based on double; two device layer SOI Substrate, C.Gao, Y.Hao, Y.ZhangandG.Yang, " Lowcross-axissensitivitymicro-gravitymicroelectromechani calsystemsandwichcapacitanceaccelerometer; " Micro&NanoLetters.6,510-514 (2011) .].A.RaviSankara of Wei Luoer Polytechnics of India et al. by adjusting the position of centre of gravity of mass in the mode of mass gold deposited above, reduce the crosstalk [A.RaviSankaraandS.Dasb in piezoelectric microaccelerometer, " Avery-lowcross-axissensitivitypiezoresistiveacceleromete rwithanelectroplatedgoldlayeratopathicknessreducedproofm ass; " SensorsandActuatorsA:Physical.189,125-133 (2013) .].But, optics micro-acceleration gauge, being based especially on the optics micro-acceleration gauge of diffraction grating, its crosstalk Forming Mechanism is distinct with conventional microelectromechanical systems accelerometer, is not related to the systematic study of optics micro-acceleration gauge crosstalk and relevant suppression structure in current world wide yet.
High-precise uniaxial optics micro-acceleration gauge is applied to inertial navigation or microgravimetry field more, measure the acceleration that can there are all directions in environment in reality, the measurement result of the high-precision accelerometer that there is off-axis crosstalk can be brought very big impact by non-sensitive axial acceleration.In order to solve based on the off-axis cross-interference issue existed in the high-precise uniaxial optics micro-acceleration gauge of diffraction grating, the utility model proposes a kind of high symmetrical micro-machine acceleration sensitive structure based on five layers of SOI Substrate and micro Process manufacture method thereof, while ensureing the original certainty of measurement of optics micro-acceleration gauge, greatly inhibit off-axis crosstalk.
Summary of the invention
This utility model provides the micro-machine acceleration sensitive structure suppressing crosstalk in a kind of high-precise uniaxial optics micro-acceleration gauge, the purpose of this utility model is the off-axis crosstalk suppressing to cause owing to mass center of gravity and cantilever beam central plane exist certain deviation in high-precise uniaxial optics micro-acceleration gauge micro-machine acceleration sensitive structure, under the premise ensureing original acceleration analysis precision, reduce or eliminate the impact on the axial acceleration analysis of sensitivity of the non-sensitive axial acceleration.
In order to achieve the above object, this utility model provides clutter reduction structure in a kind of high-precise uniaxial optics micro-acceleration gauge, i.e. a kind of high symmetrical micro-machine acceleration sensitive structure suppressing crosstalk based on five layers of SOI Substrate, described micro-machine acceleration sensitive structure includes:
One piece of longitudinal thickness is the sensitive-mass block of five layers of SOI Substrate thickness, and its center of gravity is positioned on the central plane of SOI Substrate, namely on the central plane of device layer；
Four are symmetrically distributed in mass surrounding the crab-leg cantilever being connected with outer ring silicon base, and its thickness is equal to device layer thickness, and central plane overlaps with the central plane of SOI Substrate, and sensitive-mass block center of gravity is positioned on the central plane of cantilever beam in theory；
One longitudinal thickness is the silicon base of five layers of SOI Substrate thickness, and cantilever beam is connected with silicon base by anchor point；
It is plated in metal and the deielectric-coating of sensitive-mass block upper surface, serves as reflectance coating；
Described micro-machine acceleration sensitive structure is positioned at immediately below diffraction grating in optics micro-acceleration gauge, can with diffraction grating integration packaging, for passive device；
Described micro-machine acceleration sensitive structure includes: mass, and the crab-leg cantilever that described mass is connected, the silicon base that cantilever beam end connects, and is plated in mass top surface and serves as metal and the media coating of reflectance coating；
Wherein, the thickness of mass and silicon base is equal to the thickness of five layers of SOI Substrate, and the thickness of cantilever beam is equal to the thickness of single-crystal silicon device layer；Single-crystal silicon device layer is positioned at the central authorities of SOI Substrate, and described micro-machine acceleration sensitive structure is being encapsulated under actual acceleration timing to be connected together to the suspension structure of sensitive-mass block and cantilever beam with a substrate.
Described micro-machine acceleration sensitive structure is made by a kind of five layers of symmetrical SOI Substrate, described substrate from top to bottom respectively the first basal layer, the first oxygen buried layer, device layer, the second oxygen buried layer, the second basal layer, wherein the first basal layer and the second basal layer are the monocrystal silicon that thickness is identical, device layer is the monocrystal silicon in crystal orientation 100, and the first oxygen buried layer and the second oxygen buried layer are the silicon dioxide that thickness is identical.
Mass center of gravity is accurately located on cantilever beam central plane, and optics micro-acceleration gauge acceleration sensitive direction of principal axis is vertical with cantilever beam central plane.
The rete of mass top surface plating is divided into two-layer, and upper strata is deielectric-coating, and lower floor is gold.
Sensitive-mass block and cantilever beam can be made unsettled after described micro-machine acceleration sensitive structure and a substrate encapsulation, and be applied in high-precise uniaxial optics micro-acceleration gauge；In high-precise uniaxial optics micro-acceleration gauge, this micro-machine acceleration sensitive structure is positioned at immediately below diffraction grating, mass top surface reflectance coating constitutes a grating interference diffraction cavity with diffraction grating, and the optical displacement measurement system thus constituted can obtain the acceleration magnitude of extraneous applying by detecting the displacement of sensitive-mass block；
Four cantilever beams of described micro-machine acceleration sensitive structure are all be made with a device layer, have identical central plane, and the center of gravity of mass is positioned on the central plane of cantilever beam, the acceleration sensitive direction of optics micro-acceleration gauge is perpendicular to the central plane of cantilever beam, therefore non-sensitive axial acceleration will not cause the extra displacement in accelerometer sensitive direction of the sensitive-mass block and additional rotation, thus will not make non-sensitive axial acceleration that follow-up optical displacement measurement and acceleration analysis are produced impact, reach to suppress the purpose of off-axis crosstalk；Simultaneously as described device layer thickness is only small relative to SOI thickness, therefore can obtain much smaller than the cantilever beam of mass thickness and bigger sensitive-mass block, it is ensured that micro-machine acceleration sensitive structure has bigger acceleration-displacement sensitivity；
Compared to prior art, the beneficial effects of the utility model are in that:
1, for the high-precise uniaxial optics micro-acceleration gauge based on diffraction grating, under the premise not changing micro-machine acceleration sensory system acceleration-displacement sensitivity, by designing five layers of SOI Substrate distribution and cantilever beam, the mass position in SOI Substrate, by on the centre of gravity adjustment of mass to cantilever beam central plane, achieve the high degree of symmetry of micro-machine acceleration sensory system, the mass sensitivity axial displacement owing to non-sensitive axial acceleration causes and rotation are inherently eliminated it, it is suppressed that off-axis crosstalk；
2, the micro fabrication adopted mostly is ripe photoetching and etching technics, it is to avoid the problems such as the convex corner compensation in the deep silicon etching of wet method, it is ensured that higher depth-to-width ratio and verticality of side wall, and can with IC process compatible, it is achieved batch production；
3, optimize and remove photoresist and scribing flow process avoids micro-machine acceleration sensitive structure in the process of etching and release owing to pressure reduction is excessive or the reason such as stress mismatch is damaged, under the premise ensuring a suppression of crosstalk, improve the success rate of flow.
Accompanying drawing explanation
Fig. 1 is the structural representation of high-precise uniaxial optics micro-acceleration gauge；
Fig. 2 is former micro-machine acceleration sensitive structure schematic diagram, wherein (a) former micro-machine acceleration sensitive structure top view；(b) former micro-machine acceleration sensitive structure profile；
Fig. 3 is five layers of SOI Substrate generalized section that this utility model adopts；
Fig. 4 is the micro-machine acceleration sensitive structure schematic diagram of suppression crosstalk of the present utility model；
Fig. 5-Figure 12 is the schematic flow sheet of the produced by micro processing method of the micro-machine acceleration sensitive structure of suppression crosstalk of the present utility model, wherein Fig. 5. the reflectance coating of fabricating quality block upper surface；Fig. 6. fabricating quality block and substrate the first half；Fig. 7. remove the first oxygen buried layer 16；Fig. 8. make cantilever beam figure；Fig. 9. pre-etching the second oxygen buried layer 18；Figure 10. fabricating quality block and substrate the latter half；Figure 11. remove the second oxygen buried layer 18；Figure 12. remove photoresist, anneal, connect substrate pedestal；
Figure 13 is the experiment test platform schematic diagram of uniaxial optical micro-acceleration gauge；
Figure 14 is the graph of relation of the sensitive axially loaded acceleration of uniaxial optical micro-acceleration gauge and the output voltage that have employed former micro-machine acceleration sensitive structure；
Figure 15 is the graph of relation of the non-sensitive axially loaded acceleration of uniaxial optical micro-acceleration gauge and the output voltage that have employed former micro-machine acceleration sensitive structure；
Figure 16 is the uniaxial optical micro-acceleration gauge sensitive axially loaded acceleration graph of relation with output voltage of the micro-machine acceleration sensitive structure that have employed suppression crosstalk of the present utility model；
Figure 17 is the uniaxial optical micro-acceleration gauge non-sensitive axially loaded acceleration graph of relation with output voltage of the micro-machine acceleration sensitive structure that have employed suppression crosstalk of the present utility model；
Figure comprises optically-based displacement measurement system 1, micro-machine acceleration sensory system 2, laser instrument 3, diffraction grating 4, piezoelectric ceramics 5, photodetector 6, photodetector 7, incoming laser beam 8, first-order diffraction interference signal light 9, sensitive-mass block 10, crab-leg cantilever 11, silicon base 12, reflectance coating 13, substrate 14, the first basal layer 15 in SOI Substrate, first oxygen buried layer 16, single-crystal silicon device layer 17, second oxygen buried layer 18, second basal layer 19, precise rotating platform 20, adjust knob 21, calculus of differences circuit 22, signal conditioning circuit 23, output voltage signal 24.
Detailed description of the invention
Describing embodiment of the present utility model in detail below with reference to accompanying drawing and specific instantiation, those skilled in the art can be understood other advantages of the present utility model and effect by this specification.It should be noted that, the diagram provided in the present embodiment only illustrates basic conception of the present utility model in a schematic manner, relevant assembly in schematic diagram might not implement according to reality in component count, the drafting of shape and size, each assembly form in practical embodiments, number, layout and ratio are likely more complexity.
The micro-machine acceleration sensitive structure suppressing crosstalk that this utility model provides is applied in high-precise uniaxial optics micro-acceleration gauge, purpose is to suppress the off-axis crosstalk owing to micro mechanical structure unsymmetry causes, and improves the optics micro-acceleration gauge output signal contrast when being subject to non-sensitive axial acceleration effect and sensitivity.As it is shown in figure 1, this high-precise uniaxial optics micro-acceleration gauge is mainly made up of optical displacement measurement system 1 and this two large divisions of micro-machine acceleration sensory system 2, both cooperations complete the high-acruracy survey of individual axis acceleration.Wherein optical displacement measurement system comprises: the reflectance coating 13 on laser instrument 3, diffraction grating 4, piezoelectric ceramics 5, signal light path photodetector 6, environment light path photodetector 7 and mass；Micro-machine acceleration sensory system comprises: reflectance coating 13 on sensitive-mass block 10, cantilever beam 11, silicon base framework 12, mass and substrate 14.Laser instrument 3, in order to provide measuring 632.8nm incoming laser beam 8, contains displacement variable information and extraneous input acceleration size information between mass 10 and diffraction grating 4 in first-order diffraction interference light signal 9.
The operation principle of this uniaxial optical micro-acceleration gauge is as follows: beam of laser 8 launched by laser instrument 3, and this laser vertical incides on diffraction grating 4, a portion laser generation reflective diffraction, forms 0 grade, ± 1 grade and ± 3 order diffraction levels time；Another part passes through diffraction grating 4, is reflected again by grating 4 by reflectance coating 13 and transmissive diffraction occurs, and produces 0 grade, ± 1 grade and ± 3 order diffraction levels time.Under ensureing the premise that diffraction grating 4 is parallel to reflectance coating 13, reflective diffraction level time can form interference fringe with transmissive diffraction level time coherent superposition, specifically, + 1 (-1) level of reflective diffraction time can with-1 (+1) level of transmissive diffraction time coherent superposition, and between 1 order diffraction interference signal light intensity and mass 10, the diffraction grating 4 of formation, displacement variable has clear and definite relation；And when there being extraneous acceleration to be loaded in micro-machine acceleration sensory system 2, sensitive-mass block 10 is made cantilever beam 11 deform upon by inertia force effect, and change the displacement between the reflectance coating 13 of mass top surface and diffraction grating 4.When applying acceleration and being in the acceleration dynamic range of optics micro-acceleration gauge, displacement variable is linear with applying acceleration, measures this displacement accurately by optical displacement measurement system 1 and can obtain the acceleration magnitude of applying.Phase-modulation demodulation can be introduced, with this signal to noise ratio improving optics micro-acceleration gauge and certainty of measurement by adding piezoelectric ceramics 5.
In an ideal case, uniaxial optical micro-acceleration gauge is only to the axial acceleration sensitive of sensitivity, namely the mass of micro-machine acceleration sensitive structure will not be subject to the impact of non-sensitive axial acceleration in the displacement that sensitivity is axial.But for former micro-machine acceleration sensitive structure and a lot of optics micro-acceleration gauge, unsymmetry due to micro-machine acceleration sensitive structure, non-sensitive axial acceleration can cause that mass is in the axial extra displacement of sensitivity and deflection, thus causes the off-axis crosstalk in uniaxial optical micro-acceleration gauge.
This utility model is described in detail by suppressing the micro-machine acceleration sensitive structure of crosstalk to suppress the principle of off-axis crosstalk below with reference to accompanying drawing.
As shown in Figure 4, described structure is made the micro-machine acceleration sensitive structure of the suppression crosstalk that this utility model provides by one piece of special five layers of SOI Substrate as shown in Figure 3.This substrate is the high degree of symmetry structure of first basal layer 15-the first oxygen buried layer 16-device layer 17-the second oxygen buried layer 18-the second basal layer 19, wherein the first basal layer 15 and the second basal layer 19, the first oxygen buried layer 16 and the second oxygen buried layer 18 are symmetrical respectively about the i.e. SOI central plane of device layer 17.The symmetrical concrete size of SOI Substrate can be modified according to the actual requirements, in this embodiment, described SOI gross thickness is about 415 μm, first basal layer 15 of SOI and the monocrystal silicon that the second basal layer 19 is thickness 200 μm, device layer is the monocrystal silicon of 10 μm of crystal orientation (100) of thickness, the silicon dioxide that the first oxygen buried layer 16 and the second oxygen buried layer 18 are thickness about 2 μm.The thickness of mass 10 is equal to the gross thickness of SOI Substrate, and center of gravity is positioned at the central plane of SOI Substrate, namely on the central plane of device layer 17；The thickness of base frame 12 is also equal to the gross thickness of SOI Substrate；Cantilever beam 11 builds completely on device layer 17, and its thickness is equal to device layer 17, and central plane overlaps with the central plane of device layer 17.Because mass 10 center of gravity of the micro-machine acceleration sensitive structure of this suppression crosstalk is positioned on the central plane of cantilever beam 11, therefore non-sensitive axial acceleration will not cause extra moment of torsion, mass will not produce extra torsion and the axial displacement of sensitivity, thus serves the purpose suppressing off-axis crosstalk.Further, by adjusting the thickness of device layer 17 and basal layer 15 and 19 in SOI, it is possible to adjust the coefficient of elasticity of cantilever beam 11-mass 10 structure, under not reducing the premise of acceleration-displacement sensitivity of former mechanical acceleration sensitive structure, complete the suppression of crosstalk.
Consulting Fig. 5 to Figure 12, this utility model additionally provides the micro Process manufacture method of the micro-machine acceleration sensitive structure of this suppression crosstalk, specifically includes following steps:
Fig. 5: the reflectance coating of fabricating quality block 10 upper surface on described SOI Substrate upper surface；
Fig. 6: the first half of fabricating quality block 10 and substrate 12 on described SOI Substrate upper surface；
Fig. 7: remove the first oxygen buried layer 16 exposed in described SOI Substrate；
Fig. 8: make cantilever beam 11 figure on the device layer 17 of described SOI Substrate；
Fig. 9: pre-the second oxygen buried layer 18 etched in described SOI Substrate；
Figure 10: from the latter half of the lower surface fabricating quality block 10 of described SOI Substrate with substrate 12；
Figure 11: remove the second oxygen buried layer 18 exposed in described SOI Substrate；
Figure 12: remove photoresist, anneal, connects substrate pedestal 14；
Concrete, before carrying out the step of Fig. 5, it is necessary to described SOI Substrate is carried out standard RCA clean, and removes the oxide layer on SOI surface.
Concrete, when performing the step of Fig. 5, first with double-layer glue for mask, the mode adopting photoetching makes the mask pattern of plated film, adopt mode plated with gold film and the deielectric-coating respectively of magnetron sputtering again, finally adopt stripping technology to remove the reflective coating in non-mass block 10 region, obtain the reflectance coating 13 of mass 10 upper surface.
Concrete, when performing the step of Fig. 6, first using thick glue as mask, adopt the mode Graphic transitions extremely described SOI upper surface by mass 10 with substrate 12 of photoetching, trench region is etched to the first oxygen buried layer 16 by recycling deep reactive ion bundle etching, produces the first half of mass 10 and substrate 12.
Concrete, when performing the step of Fig. 7, utilize the silica erosion liquid (BOE) of buffering to remove the first oxygen buried layer 16 to the device layer exposed.
Concrete, when performing the step of Fig. 8, first with spray-bonding craft, SPR glue is sprayed onto on the device layer 17 that bottom land exposes, and ensure that the thickness of glue enough performs twice at being completely covered of etching and corner and sidewall, carrying out photoetching again on cantilever beam 11 Graphic transitions to device layer 17, will finally utilize deep reactive ion bundle to etch cantilever beam 11.
Concrete, when performing the step of Fig. 9, second oxygen buried layer 18 is etched in advance by the cantilever beam 11 figure cull of previous step as mask, pre-etching is completed till being etched to the second basal layer 19, this step is possible to prevent the pressure and the stress mismatch that cause when reversely etching due to the existence of the second oxygen buried layer 18, it is to avoid the explosion damage of structure.
Concrete, when performing the step of Figure 10, by the reverse side alignment lower surface by the Graphic transitions of mass 10 and substrate 12 to described SOI Substrate, and by deep reactive ion bundle etching, trench region is etched to remaining second oxygen buried layer 18, produces the latter half of mass 10 and substrate 12.
Concrete, when performing the step of Figure 11, utilize the silica erosion liquid (BOE) of buffering to remove residual the second oxygen buried layer 18 exposed.
Concrete, when performing the step of Figure 12, the mode that organic immersion and dry plasma are removed photoresist is utilized to remove cull to avoid the damage of cantilever beam 11-mass 10 structure, then reserved etching scribe line is utilized to adopt the mode of laser scribing to complete scribing, the last making being connected the micro-machine acceleration sensitive structure suppressing crosstalk with substrate 14.
In the present embodiment, adopting the micro-machine acceleration sensitive structure of suppression crosstalk of the present utility model to be applied in concrete high-precise uniaxial optics micro-acceleration gauge, concrete Experimental equipment is as shown in figure 13.Wherein, the uniaxial optical micro-acceleration gauge being made up of optical displacement measurement system 1 and micro-machine acceleration sensory system 2 is installed on precise rotating platform 20, and the signal of photodetector 6 and 7 output obtains output voltage signal 24 through the process of calculus of differences circuit 22 and signal conditioning circuit 23.Introduce by rotating adjustment knob 21This accelerometer can be applied different size of acceleration, the acceleration that accelerometer sensitive axially applies is a quadrature component of acceleration of gravity, same, when the acceleration that rotating table change accelerometer sensitive is axial, another quadrature component of acceleration of gravity also can change as being loaded into the non-sensitive axial acceleration of accelerometer simultaneously, affects the output signal 24 of this accelerometer.It is possible not only to detect the acceleration analysis sensitivity that this optics micro-acceleration gauge is sensitive axial by this metering system, it is also possible to obtain off-axis crosstalk and this optics micro-acceleration gauge exports the impact of signal.
Figure 14 is the graph of relation of the sensitive axially loaded acceleration of uniaxial optical micro-acceleration gauge and the output voltage that have employed former micro-machine acceleration sensitive structure；Figure 15 is the graph of relation of the non-sensitive axially loaded acceleration of uniaxial optical micro-acceleration gauge and the output voltage that have employed former micro-machine acceleration sensitive structure；Figure 16 is the uniaxial optical micro-acceleration gauge sensitive axially loaded acceleration graph of relation with output voltage of the micro-machine acceleration sensitive structure that have employed suppression crosstalk of the present utility model；Figure 17 is the uniaxial optical micro-acceleration gauge non-sensitive axially loaded acceleration graph of relation with output voltage of the micro-machine acceleration sensitive structure that have employed suppression crosstalk of the present utility model.The slope of curve in each figure has reacted the optics micro-acceleration gauge the adopting different micro-machine acceleration sensitive structure sensitivity to the acceleration of different directions.From Figure 14 and Figure 16, the micro-machine acceleration sensitive structure suppressing crosstalk that the utility model proposes will not reduce the sensitivity for the axial acceleration analysis of sensitivity of this optics micro-acceleration gauge compared to original structure, and its sensitivity remains to maintain 1000V/g magnitude.From Figure 15 and Figure 17, optics micro-acceleration gauge can be declined about 13 times by the micro-machine acceleration sensitive structure suppressing crosstalk that the utility model proposes for the sensitivity of non-sensitive axial acceleration, is properly arrived at the purpose of clutter reduction.Actual clutter reduction effect can be passed through to control the structural parameters of SOI Substrate and improve technique degree of accuracy to promote further.
In sum, this utility model provides a kind of micro-machine acceleration sensitive structure suppressing crosstalk being applied in high-precise uniaxial optics micro-acceleration gauge and micro Process manufacture method thereof.This utility model is the structure such as fabricating quality block 10, cantilever beam 11 and substrate 12 on specially designed high symmetrical five layers of SOI Substrate, the center of gravity of mass 10 is accurately adjusted to the central plane of cantilever beam layer, and construct with this there is high symmetric clutter reduction structure, under not affecting the premise of certainty of measurement of optics micro-acceleration gauge, fundamentally inhibit off-axis crosstalk.The micro Process manufacture method that the utility model proposes has been verified effective by embodiment and with IC process compatible, can make for high-volume and laid the first stone.
Above-described embodiment only illustrative principle of the present utility model and effect thereof, not for restriction this utility model.Above-described embodiment all under spirit of the present utility model and category, can be modified or change by any those skilled in the art.Therefore, art has all equivalence modification or changes that usually intellectual completes under the spirit disclosed without departing from this utility model with technological thought such as, must be contained by claim of the present utility model.
Claims (4)
1. a high-precise uniaxial optics micro-acceleration gauge suppresses the micro-machine acceleration sensitive structure of crosstalk, it is characterized in that: described micro-machine acceleration sensitive structure is positioned at immediately below diffraction grating in optics micro-acceleration gauge, can with diffraction grating integration packaging, for passive device；
Described micro-machine acceleration sensitive structure includes: mass, and the crab-leg cantilever that described mass is connected, the silicon base that cantilever beam end connects, and is plated in mass top surface and serves as metal and the media coating of reflectance coating；
Wherein, the thickness of mass and silicon base is equal to the thickness of five layers of SOI Substrate, and the thickness of cantilever beam is equal to the thickness of single-crystal silicon device layer；Single-crystal silicon device layer is positioned at the central authorities of SOI Substrate, and described clutter reduction structure is being encapsulated under actual acceleration timing to be connected together to the suspension structure of sensitive-mass block and cantilever beam with a substrate.
2. micro-machine acceleration sensitive structure according to claim 1, it is characterized in that: described micro-machine acceleration sensitive structure is made by a kind of five layers of symmetrical SOI Substrate, described substrate from top to bottom respectively the first basal layer, the first oxygen buried layer, device layer, the second oxygen buried layer, the second basal layer, wherein the first basal layer and the second basal layer are the monocrystal silicon that thickness is identical, device layer is the monocrystal silicon in crystal orientation 100, and the first oxygen buried layer and the second oxygen buried layer are the silicon dioxide that thickness is identical.
3. micro-machine acceleration sensitive structure according to claim 1, it is characterised in that: mass center of gravity is accurately located on cantilever beam central plane, and optics micro-acceleration gauge acceleration sensitive direction of principal axis is vertical with cantilever beam central plane.
4. micro-machine acceleration sensitive structure according to claim 1, it is characterised in that: the rete of mass top surface plating is divided into two-layer, and upper strata is deielectric-coating, and lower floor is gold.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105372449A (en) * | 2015-12-03 | 2016-03-02 | 浙江大学 | Micro mechanical acceleration sensitive structure for inhibiting crosstalk in high-precision single-shaft optical micro-accelerometer, and manufacturing method thereof |
| CN114034884A (en) * | 2021-11-19 | 2022-02-11 | 中国工程物理研究院电子工程研究所 | Multi-differential capacitance type acceleration sensor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105372449A (en) * | 2015-12-03 | 2016-03-02 | 浙江大学 | Micro mechanical acceleration sensitive structure for inhibiting crosstalk in high-precision single-shaft optical micro-accelerometer, and manufacturing method thereof |
| CN105372449B (en) * | 2015-12-03 | 2018-12-07 | 浙江大学 | Inhibit the micro-machine acceleration sensitive structure and its manufacturing method of crosstalk in high-precise uniaxial optics micro-acceleration gauge |
| CN114034884A (en) * | 2021-11-19 | 2022-02-11 | 中国工程物理研究院电子工程研究所 | Multi-differential capacitance type acceleration sensor |
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