CN205373655U - PCB warpage detection device - Google Patents
PCB warpage detection device Download PDFInfo
- Publication number
- CN205373655U CN205373655U CN201520911536.9U CN201520911536U CN205373655U CN 205373655 U CN205373655 U CN 205373655U CN 201520911536 U CN201520911536 U CN 201520911536U CN 205373655 U CN205373655 U CN 205373655U
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- China
- Prior art keywords
- pcb
- detecting device
- warpage
- ronchi grating
- optical system
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Abstract
The utility model discloses a PCB warpage detection device. Wherein, detection device is including being used for carrying out the seal heating storehouse, objective table and the shade ripple optical system that heat to PCB, the shade ripple optical system include: the setting is at the ronchi grating of objective table top, a light source and image acquisition device of parallel white light is provided, the objective table is including year thing support that is used for placing PCB, a step motor who is used for drive year thing support removal, it still sets up the fixed bolster that is used for fixed ronchi grating on the thing support to carry, objective table and ronchi grating setting are in in the mechanism of generating heat in seal heating storehouse. Through setting up integrated heating gas -tight silo and optical system, utilize shade ripple optical technique to realize detecting the non -contact warpage of PCB base plate.
Description
Technical field
This utility model relates to PCB manufacture technology field, particularly relates to a kind of PCB warpage detecting device.
Background technology
In PCB manufacture field, due to the reflow soldering of surface mount industry, it is necessary to higher processing temperature and more weak connectivity.The thickness of PCB substrate is more and more less, reduces the rigidity of components and parts.Therefore, for manufacturer, the qualification rate impact when warpage of PCB is on packaging is very big.If amount of warpage is excessive after PCB is heated, inevitably result in batch dress patch components and parts time bad.
Adopt pure manual measuring method during the detection of the basic warpage/bending of traditional PCB, substrate is placed in horizontal rustless steel table top and manually adopts the method for rule plug to check.But this method is only capable of measuring the amount of warpage of marginal portion, and the skill set requirements for operator is also higher.Therefore, it is impossible to meet existing warpage testing requirement.
Existing also have some to utilize the contactless warpage detection method of optical technology, for instance the method such as projection moire or shadow moire, but the method precision of projection moire has much room for improvement, and shadow moire then exists the problems such as detection substrate area is limited.
Therefore, prior art need development.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art part, the purpose of this utility model is in that to provide a kind of PCB warpage detecting device, it is intended to solve the problem that in prior art, PCB substrate warpage Detection results is not good.
In order to achieve the above object, this utility model takes techniques below scheme:
A kind of PCB warpage detecting device, wherein, described detecting device includes the heated sealed storehouse for PCB is heated, object stage and shadow moire optical system；
Described shadow moire optical system includes: be arranged on the Ronchi grating above object stage；Light source and the image acquiring device of collimated white light are provided；
Described object stage includes the object carrying support for placing PCB, motor for driving object carrying support to move；Described object carrying support also sets up the fixed support for fixing Ronchi grating；
Described object stage and Ronchi grating are arranged in the heating mechanism in described heated sealed storehouse.
Described PCB warpage detecting device, wherein, described heating mechanism specifically includes electrical heating wire and the multilamellar temperature diffusion sheet being arranged on electrical heating wire.
Described PCB warpage detecting device, wherein, described temperature diffusion sheet is set to 3 layers, sets gradually as mica sheet, copper coin, metal shell.
Described PCB warpage detecting device, wherein, described light source be specially LED white light and be arranged on described LED white light before battery of lens.
Described PCB warpage detecting device, wherein, described detecting device also includes a temperature control modules, for controlling the heating temp of described heating wire.
Beneficial effect: a kind of PCB warpage detecting device that this utility model provides, by arranging heated sealant storehouse and the optical system of integration, utilizes shadow moire optical technology to realize the contactless warpage of PCB substrate is detected.Described device is additionally provided with the Ronchi grating with object stage one movement, it is possible to by adjusting the position of Ronchi grating and PCB substrate, it is possible to realize manipulation easily, the use in practical operation detection operation of being more convenient for, and has a good application prospect.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of PCB warpage detecting device that this utility model is embodied as.
Fig. 2 is the structural representation of the heating mechanism of a kind of PCB warpage detecting device that this utility model is embodied as.
Detailed description of the invention
This utility model provides a kind of PCB warpage detecting device.For making the purpose of this utility model, technical scheme and effect clearly, clearly, developing simultaneously referring to accompanying drawing, the present invention is described in more detail for embodiment.Should be appreciated that specific embodiment described herein is only in order to explain this utility model, be not used to limit this utility model.
As it is shown in figure 1, be a kind of PCB warpage detecting device of this utility model specific embodiment.Wherein, described detecting device includes: for heated sealed storehouse 100, object stage 200 and shadow moire optical system 300 that PCB is heated.
Described shadow moire optical system includes: be arranged on the Ronchi grating 310 above object stage；Light source 320 and the image acquiring device 330 of collimated white light are provided.Wherein, in typical shadow moire (shadowmoire) system, described light source provides collimated white light, and with the about 45 ° of incidences of relative Ronchi grating 310, image acquiring device 330 is perpendicular to Ronchi grating 310 and arranges, and obtains the moir patterns figure formed.Described image acquiring device 330 is specifically as follows any suitable image acquiring device, for instance CCD, CMOS etc..
Change according to described moir patterns figure, it is possible to calculate PCB substrate variable quantity in vertical direction, can realize the detection of warpage degree to PCB substrate 10 by methods such as digital modeling.
Described object stage 200 includes for placing the object carrying support 210 of PCB substrate 10, the motor for driving object carrying support to move.Described object carrying support also sets up the fixed support 230 for fixing Ronchi grating.
As it is shown in figure 1, described object carrying support can take structure as shown in Figure 1, for having two thimbles of certain distance, driven by two motors respectively.Described fixed support is then arranged on object carrying support, is used for supporting described Ronchi grating 310.Arranged by said structure, it is possible to realizing the synchronization control for PCB substrate to be measured and the position of Ronchi grating 310.And above-mentioned position adjustment, it is possible to achieve the data acquisition on diverse location, result more accurately can be obtained after the data acquisition on multiple positions being integrated, and also the area of the PCB substrate that can detect can be expanded.
Described object stage 200 is arranged in the heating mechanism 110 in described heated sealed storehouse.The warpage produced when analog PCB substrate 10 is heated is carried out by mechanism of generating heat.
It is preferred that as in figure 2 it is shown, described heating mechanism specifically includes electrical heating wire 111 and the multilamellar temperature diffusion sheet being arranged on electrical heating wire.Concrete, described temperature diffusion sheet is set to 3 layers, sets gradually as mica sheet 112, copper coin 113, metal shell 114.Above-mentioned conductive structure is arranged, it is possible to avoid the impact that the multi-direction diffusion in temperature field when heating brings as much as possible.Heat that Electrothermic wire produces can be made along the stacked direction expanding of said temperature diffusion sheet, it is achieved the uniform heating to PCB substrate, it is achieved better simulate effect.
Concrete, described light source be specially LED white light and be arranged on described LED white light before battery of lens.
More preferably, described detecting device also includes a temperature control modules, for controlling the heating temp of described heating wire.When actually used, by adjusting variations in temperature and monitoring the warpage situation on each temperature spot in real time, the deformation warpage degree change curve that PCB substrate varies with temperature can be obtained, it is possible to the manufacture for pcb board provides better guidance.
It is understandable that; for those of ordinary skills; can conceive according to the technical solution of the utility model and this utility model and be equal to replacement or change, and all these change or replace the scope of the claims that all should belong to appended by this utility model.
Claims (5)
1. a PCB warpage detecting device, it is characterised in that described detecting device includes the heated sealed storehouse for PCB is heated, object stage and shadow moire optical system；
Described shadow moire optical system includes: be arranged on the Ronchi grating above object stage；Light source and the image acquiring device of collimated white light are provided；
Described object stage includes the object carrying support for placing PCB, motor for driving object carrying support to move；Described object carrying support also sets up the fixed support for fixing Ronchi grating；
Described object stage and Ronchi grating are arranged in the heating mechanism in described heated sealed storehouse.
2. PCB warpage detecting device according to claim 1, it is characterised in that described heating mechanism specifically includes electrical heating wire and the multilamellar temperature diffusion sheet being arranged on electrical heating wire.
3. PCB warpage detecting device according to claim 2, it is characterised in that described temperature diffusion sheet is set to 3 layers, sets gradually as mica sheet, copper coin, metal shell.
4. PCB warpage detecting device according to claim 1, it is characterised in that described light source be specially LED white light and be arranged on described LED white light before battery of lens.
5. PCB warpage detecting device according to claim 2, it is characterised in that described detecting device also includes a temperature control modules, for controlling the heating temp of described electrical heating wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520911536.9U CN205373655U (en) | 2015-11-16 | 2015-11-16 | PCB warpage detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520911536.9U CN205373655U (en) | 2015-11-16 | 2015-11-16 | PCB warpage detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205373655U true CN205373655U (en) | 2016-07-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520911536.9U Expired - Fee Related CN205373655U (en) | 2015-11-16 | 2015-11-16 | PCB warpage detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205373655U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110196022A (en) * | 2019-06-20 | 2019-09-03 | 英特尔半导体(大连)有限公司 | Device and method for measuring angularity |
| CN110400760A (en) * | 2018-04-25 | 2019-11-01 | 美光科技公司 | For testing the method and system of the warpage of semiconductor device |
| CN111033171A (en) * | 2017-08-24 | 2020-04-17 | C&B技术公司 | Apparatus and method for warpage measurement |
| WO2021073310A1 (en) * | 2019-10-17 | 2021-04-22 | 武汉大学 | Method and apparatus for three-dimensional on-line monitoring of warpage deformation and defect of encapsulation module |
| CN115616027A (en) * | 2022-10-13 | 2023-01-17 | 江苏瑞亿扬材料科技有限公司 | PVC calendering membrane temperature resistant detection device and detecting system |
-
2015
- 2015-11-16 CN CN201520911536.9U patent/CN205373655U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111033171A (en) * | 2017-08-24 | 2020-04-17 | C&B技术公司 | Apparatus and method for warpage measurement |
| CN110400760A (en) * | 2018-04-25 | 2019-11-01 | 美光科技公司 | For testing the method and system of the warpage of semiconductor device |
| CN110196022A (en) * | 2019-06-20 | 2019-09-03 | 英特尔半导体(大连)有限公司 | Device and method for measuring angularity |
| CN110196022B (en) * | 2019-06-20 | 2020-10-27 | 英特尔半导体(大连)有限公司 | Device and method for measuring warpage |
| WO2021073310A1 (en) * | 2019-10-17 | 2021-04-22 | 武汉大学 | Method and apparatus for three-dimensional on-line monitoring of warpage deformation and defect of encapsulation module |
| CN115616027A (en) * | 2022-10-13 | 2023-01-17 | 江苏瑞亿扬材料科技有限公司 | PVC calendering membrane temperature resistant detection device and detecting system |
| CN115616027B (en) * | 2022-10-13 | 2023-10-13 | 江苏瑞亿扬材料科技有限公司 | PVC calendering membrane temperature resistance detection device and detecting system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160706 Termination date: 20181116 |