CN205366545U

CN205366545U - Modified silicon chip transport package box

Info

Publication number: CN205366545U
Application number: CN201520941085.3U
Authority: CN
Inventors: 杨国兴
Original assignee: WUXI PRITEN TRANSMISSION MACHINERY Co Ltd
Current assignee: WUXI PRITEN TRANSMISSION MACHINERY Co Ltd
Priority date: 2015-11-24
Filing date: 2015-11-24
Publication date: 2016-07-06
Anticipated expiration: 2025-11-24

Abstract

The utility model discloses a modified silicon chip transport package box, including box body (1), storage layer (2), the layer (3) and encapsulant inlet (4) of shocking resistance, the inside distribution of box body (1) has 4~9 to store layer (2), and the surface distribution one deck of storing layer (2) the layer (3) of shocking resistance is with 4~9 side wall mountings encapsulant inlet (4) of storing box body (1) connected on layer (2), the size of storing layer (2) is the same with the upper and lower bottom surface of box body (1). The utility model discloses an it is more that's modified silicon chip transport package box, the setting up of layer of shocking resistance can effectively be avoided storing the collision between layer and the silicon chip, effectively reduces the piece rate of silicon chip among the handling, can save the silicon chip in the effective space is provided. It has great spreading value to make technical field at the silicon chip container.

Description

A kind of silicon chip transportation packaging box of improvement

Technical field

This utility model relates to silicon wafer container manufacturing technology field, is specifically related to the silicon chip transportation packaging box of a kind of improvement.

Background technology

The chip that silicon chip is made is famous " miraculous foresight ", has surprising operational capability.No matter how complicated mathematical problem, physical problem and engineering problem, also the workload no matter calculated has much, as long as staff tells it by computer keyboard problem, and assigning the thinking and instruction solved a problem, computer just can tell you answer within the extremely short time.So, those manually calculate the problem needing cost several years, many decades time, and computer is likely to have only to a few minutes and just can solve.Even some manpower cannot calculate the problem of result, and computer also can quickly tell you answer.

In silicon chip of solar cell production process, silicon chip needs packed and transported, conventional packing box adopts up and down to opening structure, first puts liner in cassette bottom, then sets level silicon chip, finally puts liner again, then lid cap seal case.This manner of packing is simple, but stacks and can produce a large amount of fragment in handling process, increases production cost.

Utility model content

This utility model overcomes above-mentioned shortcoming, and provides the silicon chip transportation packaging box of a kind of improvement.

To achieve these goals, this utility model is to realize by the following technical solutions: the silicon chip transportation packaging box of this improvement includes box body, storage layer, anti-impacting layer and encapsulation mouth, the inside distribution of described box body has 4 ~ 9 storage layer, one layer of anti-impacting layer of the surface distributed of storage layer, the sidewall of the box body linked with storage layer is installed 4 ~ 9 encapsulation mouths；The size of described storage layer is identical with the upper bottom surface of box body.

Described box body is cuboid.

Preferably, the thickness of described storage layer is the 1/19 ~ 1/12 of box body height.

Preferably, described storage layer is identical with the size of anti-impacting layer.

Preferably, described encapsulation mouth is rectangle.

The beneficial effects of the utility model are: scheme is complete, make simple, easy to use；Anti-impacting layer the collision being prevented effectively between storage layer and silicon chip is set, effectively reduce the fragment rate of silicon chip in handling process；The more of silicon chip can be stored in the useful space；For ease of maintenaince and maintenance.

Accompanying drawing explanation

Fig. 1 is structural representation of the present utility model.

The implication of accompanying drawing labelling in figure, 1, box body, 2, storage layer, 3, anti-impacting layer, 4, encapsulation mouth.

Detailed description of the invention

For the technological means making this utility model realize, creation characteristic, reach purpose and effect and be easy to understand, below in conjunction with detailed description of the invention, this utility model is expanded on further.

The silicon chip transportation packaging box of this improvement is to achieve these goals, this utility model is to realize by the following technical solutions: the silicon chip transportation packaging box of this improvement includes box body 1, storage layer 2, anti-impacting layer 3 and encapsulation mouth 4, the inside distribution of described box body 1 has 4 ~ 9 storage layer 2, one layer of anti-impacting layer 3 of the surface distributed of storage layer 2, the sidewall of the box body 1 linked with storage layer 2 is installed 4 ~ 9 encapsulation mouths 4；The size of described storage layer 2 is identical with the upper bottom surface of box body 1；Box body 1 is cuboid；The thickness of storage layer 2 is the 1/19 ~ 1/12 of box body 1 height；Storage layer 2 is identical with the size of anti-impacting layer 3；Encapsulation mouth 4 is rectangle.

Of the present utility model ultimate principle and principal character and of the present utility model advantage have more than been shown and described.Skilled person will appreciate that of the industry; this utility model is not restricted to the described embodiments; described in above-described embodiment and description is that principle of the present utility model is described; under the premise without departing from this utility model spirit and scope; this utility model also has various changes and modifications, and these changes and improvements both fall within the scope of claimed this utility model.This utility model claims scope and is defined by appending claims and equivalent thereof.

Claims

1. the silicon chip transportation packaging box improved, it is characterized in that, including box body (1), storage layer (2), anti-impacting layer (3) and encapsulation mouth (4), the inside distribution of described box body (1) has 4 ~ 9 storage layer (2), one layer of anti-impacting layer (3) of the surface distributed of storage layer (2), the sidewall of the box body (1) linked with storage layer (2) is installed 4 ~ 9 encapsulation mouth (4)；The size of described storage layer (2) is identical with the upper bottom surface of box body (1).

2. the silicon chip transportation packaging box of improvement according to claim 1, it is characterised in that described box body (1) is cuboid.

3. the silicon chip transportation packaging box of improvement according to claim 1, it is characterised in that the thickness of described storage layer (2) is the 1/19 ~ 1/12 of box body (1) height.

4. the silicon chip transportation packaging box of improvement according to claim 1, it is characterised in that described storage layer (2) is identical with the size of anti-impacting layer (3).

5. the silicon chip transportation packaging box of improvement according to claim 1, it is characterised in that described encapsulation mouth (4) is rectangle.