CN205363423U - Parallel machine tool moves air -cooled system of platform - Google Patents
Parallel machine tool moves air -cooled system of platform Download PDFInfo
- Publication number
- CN205363423U CN205363423U CN201620097221.XU CN201620097221U CN205363423U CN 205363423 U CN205363423 U CN 205363423U CN 201620097221 U CN201620097221 U CN 201620097221U CN 205363423 U CN205363423 U CN 205363423U
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- China
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- moving platform
- platform
- temperature sensor
- parallel machine
- semiconductor chilling
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Abstract
The utility model discloses a parallel machine tool moves air -cooled system of platform, inlet fan (12) through air -supply line (8) with move platform (3) and be connected, semiconductor refrigeration piece (9) are in the both sides of air -supply line (8), fin (10) are between semiconductor refrigeration piece (9) and radiator fan (11), go out tuber pipe (13) and move platform (3) to be connected, straight baffle (14) and curved baffle (15) are in moving platform (3), move platform interior temperature sensor (17) and move platform outer temperature sensor (18) and install in moving platform (3), it installs on allocating platform (6) to allocate a temperature sensor (20), controller (22) respectively with semiconductor refrigeration piece (9), radiator fan (11), inlet fan (12), move platform interior temperature sensor (17), move platform outdoor temperature sensor (18) and allocate a temperature sensor (20) and connect, a compensation precision for improving move the temperature error of hinge coordinate on the platform.
Description
Technical field
This utility model relates to the cooling system of parallel machine, is specifically related to the air cooling system of parallel machine moving platform.
Background technology
On parallel machine, the centre of moving platform is electro spindle, and the lower section of moving platform is cutter, to produce heat, to produce two thermals source that heat, electro spindle and cutter are moving platforms during Tool in Cutting during electro spindle operating;Parallel machine adds man-hour, the heat that electro spindle produces is directly passed to moving platform, the heat that Tool in Cutting produces passes to moving platform through electro spindle, make moving platform temperature near electro spindle high compared with the temperature near the hinge seat of moving platform, between electro spindle and the hinge seat of moving platform, moving platform has bigger thermograde, affect the compensation precision of the temperature error of hinge coordinate on moving platform, affect the machining accuracy of parallel machine further, in addition, the temperature of moving platform is high compared with the temperature of fixed platform, on moving platform to the direction of fixed platform, connecting rod has thermograde, affect the compensation precision of the temperature error of connecting rod and the control accuracy of the temperature error of parallel machine.
Summary of the invention
The purpose of this utility model is in that: provide the air cooling system of parallel machine moving platform, for reducing the thermograde of moving platform, and the temperature difference of reduction moving platform and fixed platform, improve the compensation precision of the temperature error of hinge coordinate on moving platform and the control accuracy of the temperature error of parallel machine.
The technical solution of the air cooling system of parallel machine moving platform of the present utility model: cold wind is sent into moving platform, reduces the temperature of moving platform, and is compared with the temperature of fixed platform by moving platform, controls the temperature of moving platform, reduces the temperature difference of moving platform and fixed platform;By strengthening the heat exchange of moving platform and the cold air flowed in moving platform, reduce the thermograde of moving platform.
In the air cooling system of parallel machine moving platform of the present utility model, the air cooling system of parallel machine moving platform includes temperature sensor in heat-insulation layer, blast pipe, semiconductor chilling plate, fin, radiator fan, supply fan, discharge pipe, straight baffle, curved dividing plate, moving platform, the outer temperature sensor of moving platform, fixed platform temperature sensor, electric wire and controller;Heat-insulation layer wraps in the outer surface of moving platform, supply fan is connected with moving platform by blast pipe, semiconductor chilling plate is in the both sides of blast pipe, fin is between semiconductor chilling plate and radiator fan, fin contacts with semiconductor chilling plate, discharge pipe is connected with moving platform, straight baffle is arranged in moving platform with curved dividing plate and constitutes ventilating duct and ventilating duct together with moving platform around electro spindle, in moving platform, temperature sensor is arranged in moving platform with the outer temperature sensor of moving platform and contacts with moving platform, fixed platform temperature sensor is arranged on fixed platform and contacts with fixed platform, controller by electric wire respectively with semiconductor chilling plate, radiator fan, supply fan, temperature sensor in moving platform, the outer temperature sensor of moving platform and fixed platform temperature sensor connect.
In the air cooling system of parallel machine moving platform of the present utility model, in moving platform, temperature sensor and the outer temperature sensor of moving platform be not on the same circumference at electro spindle center, in moving platform, temperature sensor is near electro spindle, and the outer temperature sensor of moving platform is near the hinge seat of moving platform.
The beneficial effects of the utility model:
1. cold wind is sent into moving platform by radiator fan, reduce the temperature of moving platform, the controller information by fixed platform temperature sensor, control the temperature of moving platform, reduce the temperature difference of moving platform and fixed platform, be conducive to reducing the thermograde of connecting rod, make moving platform, fixed platform consistent with the temperature of connecting rod, facilitate compensating for the temperature error of moving platform, fixed platform and connecting rod, improve the compensation precision of the temperature error cutting with scissors coordinate and length of connecting rod of moving platform, fixed platform.
2., by strengthening the heat exchange of cold wind and the moving platform flowing into moving platform, reduce the thermograde of moving platform, the compensation precision of the temperature error of hinge coordinate on moving platform can be improved.
3. with semiconductor chilling plate to the air cooling in blast pipe, the temperature governing speed of blast pipe air is fast, is conducive to improving the temperature accuracy of moving platform, is conducive to improving the compensation precision of the temperature error of hinge coordinate on moving platform further.
4. the volume of semiconductor chilling plate is little, is conducive to semiconductor chilling plate, fin and radiator fan to arrange on parallel machine.
5. the simple in construction of the air cooling system of parallel machine moving platform, is conducive to arranging on parallel machine.
Accompanying drawing explanation
Fig. 1 is the schematic three dimensional views of parallel machine.
Fig. 2 is the schematic diagram of the air cooling system of parallel machine moving platform.
Fig. 3 is the A-A sectional view of Fig. 2.
Fig. 4 is the schematic diagram that fixed platform temperature sensor is arranged on fixed platform.
Fig. 5 is the control circuit schematic diagram of Fig. 2.
In figure: 1 cutter;2 electro spindle;3 moving platforms;4 hinges;5 connecting rods;6 fixed platforms;7 heat-insulation layers;8 blast pipes;9 semiconductor chilling plates;10 fin;11 radiator fans;12 supply fans;13 discharge pipes;14 straight baffles;15 curved dividing plates;16 ventilating ducts;Temperature sensor in 17 moving platforms;The outer temperature sensor of 18 moving platforms;19 hinge seats;20 fixed platform temperature sensors;21 electric wires;22 controllers.
Detailed description of the invention
The air cooling system of parallel machine moving platform is such as shown in Fig. 2 ~ 5.
In the air cooling system of parallel machine moving platform, the air cooling system of parallel machine moving platform includes temperature sensor 17 in heat-insulation layer 7, blast pipe 8, semiconductor chilling plate 9, fin 10, radiator fan 11, supply fan 12, discharge pipe 13, straight baffle 14, curved dividing plate 15, moving platform, the outer temperature sensor 18 of moving platform, fixed platform temperature sensor 20, electric wire 21 and controller 22;nullHeat-insulation layer 7 wraps in the outer surface of moving platform 3,Supply fan 12 is connected with moving platform 3 by blast pipe 8,Semiconductor chilling plate 9 is in the both sides of blast pipe 8,Fin 10 is between semiconductor chilling plate 9 and radiator fan 11,Fin 10 contacts with semiconductor chilling plate 9,Discharge pipe 13 is connected with moving platform 3,Straight baffle 14 is arranged in moving platform 3 with curved dividing plate 15 and constitutes ventilating duct 16 and ventilating duct 16 together with moving platform 3 around electro spindle 2,In moving platform, temperature sensor 17 is arranged in moving platform 3 with the outer temperature sensor 18 of moving platform and contacts with moving platform 3,Fixed platform temperature sensor 20 is arranged on fixed platform 6 and contacts with fixed platform 6,Controller 22 by electric wire 21 respectively with semiconductor chilling plate 9、Radiator fan 11、Supply fan 12、Temperature sensor 17 in moving platform、The outer temperature sensor 18 of moving platform and fixed platform temperature sensor 20 connect;Heat-insulation layer 7 is for improving the thermoregulation effect of moving platform 3;Blast pipe 8 is multiple tube, and the blast pipe 8 at blast pipe 8 with semiconductor chilling plate 9 contact position can use copper pipe, and the blast pipe 8 between semiconductor chilling plate 9 and moving platform 3 can use insulating tube;In moving platform, temperature sensor 17 and the outer temperature sensor 18 of moving platform are for measuring the temperature of moving platform 3, and the outer temperature sensor 18 of moving platform is for measuring the temperature of fixed platform 6.
In the air cooling system of parallel machine moving platform, in moving platform, temperature sensor 17 and the outer temperature sensor 18 of moving platform be not on the same circumference around electro spindle 2 center, in moving platform, temperature sensor 17 is near electro spindle 2, and the outer temperature sensor 18 of moving platform is near the hinge seat 19 of moving platform 3.
In the air cooling system of parallel machine moving platform, the temperature error of moving platform 3, fixed platform 6 and connecting rod 5 refers to the scale error on the moving platform 3 owing to variations in temperature causes, fixed platform 6 and connecting rod 5;On moving platform, hinge coordinate refers to the coordinate of the hinge 4 connecting moving platform 3 and connecting rod 5.
The operation principle of the air cooling system of parallel machine moving platform: during parallel machine work, air is sent into moving platform 3 by blast pipe 8 by supply fan 12, air is the flowing of the direction of arrow along blast pipe 8 first, then the direction of arrow flowing along ventilating duct 16, and last air flows out from discharge pipe 13;After semiconductor chilling plate 9 energising, the one side that semiconductor chilling plate 9 contacts with blast pipe 8 turns cold, the one side heating that semiconductor chilling plate 9 contacts with fin 10, the semiconductor chilling plate 9 air cooling-down to flowing through blast pipe 8, simultaneously, semiconductor chilling plate 9 transfers heat to fin 10, and radiator fan 11 distributes the heat on fin 10;Air after being lowered the temperature by semiconductor chilling plate 9 flows into moving platform 3, takes away the heat of moving platform 3, makes the temperature of moving platform 3 reduce, meanwhile, makes the thermograde of moving platform 3 reduce;The temperature difference recorded when the outer temperature sensor 18 of temperature sensor 17 and moving platform in moving platform is more than when requiring the temperature difference controlled, the thermograde of moving platform 3 is more than the thermograde required, controller 22 controls supply fan 12, the flow of increase air, makes the thermograde of moving platform 3 within the scope of the temperature gradient error required;When in moving platform, temperature sensor 17 and the outer temperature sensor 18 of moving platform record the temperature that the mean temperature of moving platform 3 records fixed platform 6 higher than fixed platform temperature sensor 20, controller 22 controls semiconductor chilling plate 9, strengthen the refrigeration to air, reduce further the temperature of the air flowing into moving platform 3, make moving platform 3 consistent with the temperature of fixed platform 6 and within the scope of the temperature error required.
Claims (2)
1. the air cooling system of parallel machine moving platform, it is characterised in that: the air cooling system of parallel machine moving platform includes temperature sensor (17) in heat-insulation layer (7), blast pipe (8), semiconductor chilling plate (9), fin (10), radiator fan (11), supply fan (12), discharge pipe (13), straight baffle (14), curved dividing plate (15), moving platform, the outer temperature sensor (18) of moving platform, fixed platform temperature sensor (20), electric wire (21) and controller (22);nullHeat-insulation layer (7) wraps in the outer surface of moving platform (3),Supply fan (12) is connected with moving platform (3) by blast pipe (8),Semiconductor chilling plate (9) is in the both sides of blast pipe (8),Fin (10) is between semiconductor chilling plate (9) and radiator fan (11),Fin (10) contacts with semiconductor chilling plate (9),Discharge pipe (13) is connected with moving platform (3),Straight baffle (14) and curved dividing plate (15) are arranged in moving platform (3) and constitute ventilating duct (16) and ventilating duct (16) together with moving platform (3) around electro spindle (2),Temperature sensor in moving platform (17) is arranged in moving platform (3) with the outer temperature sensor (18) of moving platform and contacts with moving platform (3),Fixed platform temperature sensor (20) is arranged on fixed platform (6) and above and contacts with fixed platform (6),Controller (22) by electric wire (21) respectively with semiconductor chilling plate (9)、Radiator fan (11)、Supply fan (12)、Temperature sensor in moving platform (17)、The outer temperature sensor (18) of moving platform and fixed platform temperature sensor (20) connect.
2. the air cooling system of parallel machine moving platform according to claim 1, it is characterized in that: temperature sensor in moving platform (17) and the outer temperature sensor (18) of moving platform be not on the same circumference around electro spindle (2) center, temperature sensor in moving platform (17) is near electro spindle (2), and the outer temperature sensor (18) of moving platform is near the hinge seat (19) of moving platform (3).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201620097221.XU CN205363423U (en) | 2016-02-01 | 2016-02-01 | Parallel machine tool moves air -cooled system of platform |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201620097221.XU CN205363423U (en) | 2016-02-01 | 2016-02-01 | Parallel machine tool moves air -cooled system of platform |
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CN201620097221.XU Expired - Fee Related CN205363423U (en) | 2016-02-01 | 2016-02-01 | Parallel machine tool moves air -cooled system of platform |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111251062A (en) * | 2020-03-13 | 2020-06-09 | 常州机电职业技术学院 | Cooling device for intelligent mechanical lathe machining |
CN112109415A (en) * | 2020-09-17 | 2020-12-22 | 江苏坤泰机械有限公司 | Cloth and rubber flame compounding machine |
-
2016
- 2016-02-01 CN CN201620097221.XU patent/CN205363423U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111251062A (en) * | 2020-03-13 | 2020-06-09 | 常州机电职业技术学院 | Cooling device for intelligent mechanical lathe machining |
CN112109415A (en) * | 2020-09-17 | 2020-12-22 | 江苏坤泰机械有限公司 | Cloth and rubber flame compounding machine |
CN112109415B (en) * | 2020-09-17 | 2021-05-07 | 江苏坤泰机械有限公司 | Cloth and rubber flame compounding machine |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160706 Termination date: 20170201 |
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CF01 | Termination of patent right due to non-payment of annual fee |