CN205352557U - Two take place ofs area array infrared detector subassembly pixel spectral response conformance testing devices - Google Patents
Two take place ofs area array infrared detector subassembly pixel spectral response conformance testing devices Download PDFInfo
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- CN205352557U CN205352557U CN201521128633.7U CN201521128633U CN205352557U CN 205352557 U CN205352557 U CN 205352557U CN 201521128633 U CN201521128633 U CN 201521128633U CN 205352557 U CN205352557 U CN 205352557U
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Abstract
The utility model provides a two take place ofs area array infrared detector subassembly pixel spectral response conformance testing devices, the device includes: fourier spectrum appearance, testing driver controller, simulation capture card and spectrum processing module, the testing driver controller is two take the place ofs area array infrared detector subassemblies provides required pulse of during operation and electric energy, the light of fourier spectrum appearance transmission is received to two take the place ofs area array infrared detector subassemblies, and convert to the voltage signal of two take the place ofs each pixel outputs of area array infrared detector subassembly, the simulation capture card is right voltage signal gathers, and will voltage signal inputs spectrum processing module, spectrum processing module is right voltage signal handles, obtains the spectral curve of two take the place ofs each pixels of area array infrared detector subassembly, and according to the spectral curve is right the spectrum uniformity of two take the place ofs each pixels of area array infrared detector subassembly is judged.
Description
Technical field
This utility model relates to spectrum test technical field, particularly relates to a kind of secondary area array infrared detector assembly pixel spectral response consistency test device.
Background technology
Secondary infrared detector module is the detector module on focal plane of infrared ray of main flow in the world at present, and its chip adopts semi-conducting material to make.Owing to the response wave length of chip is closely related with the material component in semi-conducting material, its response that identical energy is radiated of the secondary infrared detector module of different wave length is also inconsistent, therefore, response wave length also determines the response homogeneity of whole secondary infrared detector module.Being difficult to avoid that in process of production owing to the component of semi-conducting material is uneven, so secondary infrared detector module naturally occurs the inhomogeneities of response, and this inhomogeneities is the key affecting infrared imaging.What conventional secondary infrared detector module spectrum test method adopted is monochromator, utilize the monochromatic light exposure that monochromator sends to detector chip, gather the magnitude of voltage of detector chip irradiated area, carry out the test of relative spectral, method of testing and principle have defined GB, being numbered GB/T17444-2013, name is called " infrared focal plane array parameter test method ".But adopt monochromator test to there is problems in that the testing time is long, test the spectrum required time of a secondary area array infrared detector assembly more than 30 minutes；Test pixel quantity is few, only can test by the pixel of monochromatic light exposure, if it is big to choose area, monochromatic radiation exists bigger error；Test once only can test the averaged spectrum response of a pixel or multiple pixel, it is impossible to tests the spectral response of whole pixel, it is impossible to characterize the response homogeneity of spectrum.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of secondary area array infrared detector assembly pixel spectral response consistency test device, it is possible to whole pixels of secondary area array infrared detector assembly are carried out fast spectrum test.
The technical solution adopted in the utility model is, described secondary area array infrared detector assembly pixel spectral response consistency test device, including: Fourier spectrometer, Test driver controller, analog acquisition card and spectral manipulation module；
Pulse required when Test driver controller is for secondary area array infrared detector assembly offer work and electric energy；Described secondary area array infrared detector assembly receives the light that Fourier spectrometer is launched, and converts the voltage signal of described secondary each pixel of area array infrared detector assembly output to；Described voltage signal is acquired by analog acquisition card, and described voltage signal is input to spectral manipulation module；Described voltage signal is processed by described spectral manipulation module, obtain the curve of spectrum of described secondary area array infrared detector each pixel of assembly, and according to the described curve of spectrum, the spectrum concordance of described secondary area array infrared detector each pixel of assembly is judged.
Further, described Test driver controller includes: pulse driving circuit plate and bias voltage drive circuit board；Described pulse driving circuit plate is connected with the pulsed drive end of secondary area array infrared detector assembly, pulse required during to described secondary area array infrared detector assembly offer work；The biased electrical press bond of described bias voltage drive circuit board and secondary area array infrared detector assembly, electric energy required during to described secondary area array infrared detector assembly offer work.
Further, described Test driver controller also includes output waveform adjustment plate, the input of described output waveform adjustment plate is connected with the voltage signal output end of secondary area array infrared detector assembly, and the outfan of described output waveform adjustment plate is connected with analog acquisition card；Described output waveform adjustment plate is for being adjusted reducing the noise of described voltage signal to the waveform of the voltage signal of described secondary area array infrared detector assembly output.
Further, described device also includes synchronizing signal module, described synchronizing signal module is to Fourier spectrometer, secondary area array infrared detector assembly and analog acquisition card input sync signal so that described Fourier spectrometer, secondary area array infrared detector assembly and analog acquisition are stuck under the effect of synchronizing signal synchronous working.
Adopting technique scheme, this utility model at least has the advantage that
Secondary area array infrared detector assembly pixel spectral response consistency test device described in the utility model, secondary area array infrared detector assembly can be carried out fast spectrum test, with use compared with secondary infrared detector module carries out spectrum test by monochromator, the spectrum required time testing a secondary formation detector assembly in this utility model shortened to 5 minutes from original 30 minutes.Additionally, use the spectrum test result of Fourier spectrometer in this utility model compared with the spectrum test result using monochromator, spectrum cutoff wavelength differs 0.01 μm.Whole pixels of secondary area array infrared detector assembly can be carried out spectral response measurement by the test device in this utility model.
Accompanying drawing explanation
Fig. 1 is the composition structural representation of the secondary area array infrared detector assembly pixel spectral response consistency test device of this utility model embodiment.
Detailed description of the invention
For further setting forth that this utility model is reach technological means and effect that predetermined purpose is taked, below in conjunction with accompanying drawing and preferred embodiment, this utility model is described in detail as rear.
This utility model embodiment, a kind of secondary area array infrared detector assembly pixel spectral response consistency test device, as it is shown in figure 1, include:
Fourier spectrometer 10, Test driver controller 30, analog acquisition card 40 and spectral manipulation module 50；
Pulse that Test driver controller 30 is required when providing work for secondary area array infrared detector assembly 20 and electric energy；Secondary area array infrared detector assembly 20 receives the light that Fourier spectrometer 10 is launched, and converts the voltage signal of secondary each pixel of area array infrared detector assembly 20 output to；Described voltage signal is acquired by analog acquisition card 40, and described voltage signal is input to spectral manipulation module 50；Described voltage signal is processed by spectral manipulation module 50, obtains the curve of spectrum of secondary each pixel of area array infrared detector assembly 20, and according to the described curve of spectrum, the spectrum concordance of secondary each pixel of area array infrared detector assembly 20 is judged.
Concrete, Test driver controller 30 includes: pulse driving circuit plate 31, bias voltage drive circuit board 32 and output waveform adjustment plate 33；
Pulse driving circuit plate 31 is connected with the pulsed drive end of secondary area array infrared detector assembly 20, to secondary area array infrared detector assembly 20 work is provided time required pulse；
The biased electrical press bond of bias voltage drive circuit board 32 and secondary area array infrared detector assembly 20, to secondary area array infrared detector assembly 20 work is provided time required electric energy；
The input of output waveform adjustment plate 33 is connected with the voltage signal output end of secondary area array infrared detector assembly 20, and the outfan of output waveform adjustment plate 33 is connected with analog acquisition card 40；Output waveform adjustment plate 33 is for being adjusted reducing the noise of described voltage signal to the waveform of the voltage signal of secondary area array infrared detector assembly 20 output.
The magnitude of voltage of secondary each pixel of area array infrared detector assembly 20 that analog acquisition card 40 is collected by spectral manipulation module 50 processes, obtain the curve of spectrum of secondary each pixel of area array infrared detector assembly 20, the curve of spectrum of arbitrary pixel can be extracted, also dependent on the described curve of spectrum, the spectrum concordance of secondary each pixel of area array infrared detector assembly 20 is judged, obtain diverse location, different materials component and the impact on each pixel spectrum of the different materials thickness.
Further, device described in the present embodiment also includes synchronizing signal module, described synchronizing signal module is to Fourier spectrometer 10, secondary area array infrared detector assembly 20 and analog acquisition card 40 input sync signal so that Fourier spectrometer 10, secondary area array infrared detector assembly 20 and analog acquisition card 40 work asynchronously under the effect of synchronizing signal.
Secondary area array infrared detector assembly pixel spectral response consistency test device described in the utility model, secondary area array infrared detector assembly can be carried out fast spectrum test, with use compared with secondary infrared detector module carries out spectrum test by monochromator, the spectrum required time testing a secondary formation detector assembly in this utility model shortened to 5 minutes from original 30 minutes.Additionally, use the spectrum test result of Fourier spectrometer in this utility model compared with the spectrum test result using monochromator, spectrum cutoff wavelength differs 0.01 μm.Whole pixels of secondary area array infrared detector assembly can be carried out spectral response measurement by the test device in this utility model.
By the explanation of detailed description of the invention, should be reach technological means that predetermined purpose takes and effect is able to more deeply and concrete understanding to this utility model, but appended diagram be only to provide with reference to and purposes of discussion, be not used for this utility model is any limitation as.
Claims (4)
1. a secondary area array infrared detector assembly pixel spectral response consistency test device, it is characterised in that described device includes: Fourier spectrometer, Test driver controller, analog acquisition card and spectral manipulation module；
Pulse required when Test driver controller is for secondary area array infrared detector assembly offer work and electric energy；Described secondary area array infrared detector assembly receives the light that Fourier spectrometer is launched, and converts the voltage signal of described secondary each pixel of area array infrared detector assembly output to；Described voltage signal is acquired by analog acquisition card, and described voltage signal is input to spectral manipulation module；Described voltage signal is processed by described spectral manipulation module, obtain the curve of spectrum of described secondary area array infrared detector each pixel of assembly, and according to the described curve of spectrum, the spectrum concordance of described secondary area array infrared detector each pixel of assembly is judged.
2. secondary area array infrared detector assembly pixel spectral response consistency test device according to claim 1, it is characterised in that described Test driver controller includes: pulse driving circuit plate and bias voltage drive circuit board；Described pulse driving circuit plate is connected with the pulsed drive end of secondary area array infrared detector assembly, pulse required during to described secondary area array infrared detector assembly offer work；The biased electrical press bond of described bias voltage drive circuit board and secondary area array infrared detector assembly, electric energy required during to described secondary area array infrared detector assembly offer work.
3. secondary area array infrared detector assembly pixel spectral response consistency test device according to claim 2, it is characterized in that, described Test driver controller also includes output waveform adjustment plate, the input of described output waveform adjustment plate is connected with the voltage signal output end of secondary area array infrared detector assembly, and the outfan of described output waveform adjustment plate is connected with analog acquisition card；Described output waveform adjustment plate is for being adjusted reducing the noise of described voltage signal to the waveform of the voltage signal of described secondary area array infrared detector assembly output.
4. the secondary area array infrared detector assembly pixel spectral response consistency test device according to any one of claims 1 to 3, it is characterized in that, described device also includes synchronizing signal module, described synchronizing signal module is to Fourier spectrometer, secondary area array infrared detector assembly and analog acquisition card input sync signal so that described Fourier spectrometer, secondary area array infrared detector assembly and analog acquisition are stuck under the effect of synchronizing signal synchronous working.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107144356A (en) * | 2017-06-26 | 2017-09-08 | 电子科技大学 | Non-refrigerated infrared focal plane probe array thermal Response Time Test System and method |
| CN107197175A (en) * | 2017-05-31 | 2017-09-22 | 北京空间机电研究所 | A kind of high rail level battle array stares infrared camera imaging circuit system |
| CN107884077A (en) * | 2017-11-10 | 2018-04-06 | 中国电子科技集团公司第四十研究所 | A kind of non-brake method photodetector relative spectral response temperature characterisitic calibration method |
-
2015
- 2015-12-29 CN CN201521128633.7U patent/CN205352557U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107197175A (en) * | 2017-05-31 | 2017-09-22 | 北京空间机电研究所 | A kind of high rail level battle array stares infrared camera imaging circuit system |
| CN107197175B (en) * | 2017-05-31 | 2020-02-14 | 北京空间机电研究所 | High-rail area array staring infrared camera imaging circuit system |
| CN107144356A (en) * | 2017-06-26 | 2017-09-08 | 电子科技大学 | Non-refrigerated infrared focal plane probe array thermal Response Time Test System and method |
| CN107144356B (en) * | 2017-06-26 | 2019-06-04 | 电子科技大学 | Non-refrigerated infrared focal plane probe array thermal Response Time Test System and method |
| CN107884077A (en) * | 2017-11-10 | 2018-04-06 | 中国电子科技集团公司第四十研究所 | A kind of non-brake method photodetector relative spectral response temperature characterisitic calibration method |
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