CN205342778U - Silicon wafer clamp tightly installs - Google Patents
Silicon wafer clamp tightly installs Download PDFInfo
- Publication number
- CN205342778U CN205342778U CN201620086901.1U CN201620086901U CN205342778U CN 205342778 U CN205342778 U CN 205342778U CN 201620086901 U CN201620086901 U CN 201620086901U CN 205342778 U CN205342778 U CN 205342778U
- Authority
- CN
- China
- Prior art keywords
- storage tank
- plate
- open slot
- silicon wafer
- silicon chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a silicon wafer clamp tightly installs, including anchor clamps box and fixed connection in the apron of anchor clamps box, to establish the storage tank on the anchor clamps box and locate the open slot of storage tank one side, the open slot link up with the storage tank, and the apron seals the storage tank. The utility model provides a silicon wafer clamp tightly installs and will lap and seal the storage tank and expose the open slot because open slot and storage tank link up, so when grind, can place in the storage tank silicon chip in order fixing the silicon chip, then utilize the open slot to spout and carry out the purpose of grinding in order to reach to the silicon chip into the grit. Replace the artifical handheld silicon chip of current adoption and carried out the mode of grinding, but because in the storage tank silicon chip of the different thickness of holding multi -disc, therefore application scope is wide and the grinding efficiency is higher, in addition, utilize the open slot to spout and grind into the grit, and need not to adopt artifical handheld abrasive paper to grind, reduced operating personnel's working strength and be difficult to appear the silicon chip fracture, be favorable to improving the production yield of silicon chip.
Description
Technical field
This utility model relates to silicon chip cutting field, particularly relates to a kind of silicon wafer clamping device.
Background technology
At present in the industry when processing silicon chip edge bright border or bright spot, generally adopt sand paper to grind or silicon carbide slurry polishing processes.Owing to both schemes all can only process by monolithic, therefore, inefficient.Additionally, both scheme whole process needs the hand-held silicon chip of operator to be ground, and the thinner thickness of silicon chip own, and it is not provided with other fixing devices and fixes silicon chip, so the situation of silicon chip part easily occurs when being ground, cause damage.
Utility model content
A kind of silicon wafer clamping device provided by the utility model, it is possible to fix silicon chip and prevent silicon chip from occurring the situation of part in process of lapping, is conducive to improving production yield.
In order to solve above-mentioned technical problem, this utility model provides a kind of silicon wafer clamping device, described silicon wafer clamping device includes clamp box and is fixedly connected on the cover plate of described clamp box, described clamp box offers storage tank and is located at the open slot of described storage tank side, and described open slot is through with described storage tank, storage tank described in described cover closure.
Wherein, described clamp box includes loading plate, is connected to the base plate of described loading plate one end and is connected to the side plate of described loading plate both sides, and described loading plate and described base plate form described storage tank, and side plate described in described loading plate and two forms described open slot.
Wherein, described clamp box includes loading plate and is connected to the base plate of described loading plate one end, described loading plate and described base plate form described storage tank, described cover plate includes mainboard and is connected to the side plate of described mainboard both sides, described mainboard is fixedly connected on described base plate, to close described storage tank, described biside plate is fixedly connected on described loading plate, and described open slot exposes between described loading plate and described biside plate.
Wherein, described open slot and described base plate are oppositely arranged.
Wherein, described base plate offering several sand losing openings, several sand losing openings described are arranged side by side successively along the length direction of described base plate.
Wherein, described silicon wafer clamping device also includes at least one clamping element, and at least one clamping element described is located between described cover plate and described clamp box, to clamp described cover plate and described clamp box.
Wherein, described clamping element is located on described clamp box, and the position of the corresponding described clamping element of described cover plate offers groove, the described clamping element described groove of traverse.
Wherein, described clamping element is butterfly screws, bolt or screw rod.
Wherein, described storage tank and described open slot are square groove.
Wherein, being provided with screening glass in described opening, described screening glass is attached at the inwall of described opening and arranges.
Silicon wafer clamping device provided by the utility model by being provided with storage tank and being positioned at the open slot of storage tank side on clamp box, and open slot and storage tank are through, then by cover closure storage tank and expose open slot, so when being ground, can silicon chip be positioned in storage tank, to reach the purpose of fixing silicon chip, then utilize this open slot to spray into sand to reach the purpose that silicon chip is ground.Instead of the mode that the artificial hand-held silicon chip of existing employing is ground, owing to the silicon chip of multi-disc different-thickness can be housed in storage tank, therefore applied widely and grinding efficiency is higher；Additionally, utilize this open slot to be ground to spray into sand, without adopting artificial hand-held sand paper to grind, reduce the working strength of operator and be not easy that the situation that silicon chip ruptures occurs, being conducive to improving the production yield of silicon chip.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical solution of the utility model, the accompanying drawing used required in embodiment will be briefly described below, apparently, accompanying drawing in the following describes is embodiments more of the present utility model, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the assembling schematic diagram of the silicon wafer clamping device that this utility model embodiment provides；
Fig. 2 is the structural representation at another visual angle of Fig. 1；
Fig. 3 is the structural representation of the clamp box of the silicon wafer clamping device that this utility model embodiment provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is clearly and completely described, it is clear that described embodiment is only a part of embodiment of this utility model, rather than whole embodiments.Based on the embodiment in this utility model, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of this utility model protection.
For ease of describing, can use such as here " ... under ", " ... below ", D score, " ... on ", " on " etc. space relative terms the relation of an element or feature and another (a bit) element or feature as illustrated in the drawing is described.It is appreciated that, when an element or layer be referred to as another element or layer " on ", " being connected to " or " being couple to " another element or during layer, it can directly on another element or layer, be directly connected to or be couple to another element or layer, or can there is intervening elements or layer.
It is appreciated that terminology used here merely to describe specific embodiment, is not intended to limit this utility model.When here using, clearly stating unless the context otherwise, otherwise singulative " " and " being somebody's turn to do " are also intended to include plural form.Further, when using in this manual, term " includes " and/or shows " comprising " existence of described feature, entirety, step, element and/or assembly, but is not excluded for existence or the increase of other features one or more, entirety, step, element, assembly and/or its combination.Description subsequent descriptions is for implementing better embodiment of the present utility model, and right described description is to illustrate for the purpose of rule of the present utility model, is not limited to scope of the present utility model.Protection domain of the present utility model is when being as the criterion depending on the defined person of claims.
See also Fig. 1 to Fig. 3, for a kind of silicon wafer clamping device 100 that this utility model embodiment provides.Described silicon wafer clamping device 100 includes clamp box 10 and is fixedly connected on the cover plate 20 of described clamp box 10, described clamp box 10 offers storage tank 11 and is positioned at the open slot 12 of described storage tank 11 side, and described open slot 12 is through with described storage tank 11.Described storage tank 11 closed by described cover plate 20, and described open slot 12 is exposed to described cover plate 20.
In the present embodiment, the material of described clamp box 10 can adopt plastics or metal.When adopting plastics, polypropylene (PolypropylenePP) or Merlon (PC) can be adopted, there is good impact resistance and light quality so that moving；When adopting metal material, simple metal or alloy can be adopted, such as aluminium alloy, magnalium, rustless steel or steel etc., clamp box 10 be caused damage by sandblasting procedures preventing having good intensity.Described clamp box 10 is square box body, i.e. described storage tank 11 and described open slot 12 are square groove, in order to the form fit of silicon chip such that it is able to while being easy to place silicon chip, also allows for taking-up silicon chip after follow-up grinding completes.
Further, the bottom of described storage tank 11 is 100mm to 120mm to the distance between the upper surface of described open slot 12, owing to current silicon chip specification is generally 125mm × 125mm or 156mm × 156mm.When described silicon chip is positioned in described storage tank 11, owing to the hem width of described silicon chip can house the height of described silicon chip more than described storage tank 11, therefore, one end of described silicon chip is exposed outside described open slot 12, thus after follow-up grinding completes, will by described silicon chip from described storage tank 11 take out time, by described open slot 12, described silicon chip can be extracted out, it is thus possible to the situation that the described silicon chip preventing from directly taking out from described storage tank 11 and being likely to cause clashes into the inwall of described storage tank 11 and ruptures, greatly increase the grinding yield of described silicon chip.It is understandable that, in other embodiments, the bottom of described storage tank 11 also can be arranged according to practical situation adjustment to the distance between the upper surface of described open slot 12, can by as described in storage tank 11 bottom to as described in distance between open slot 12 upper surface be set to 130mm or 140mm etc., concrete distance is so that taking out described silicon chip and being as the criterion.
Described clamp box 10 includes loading plate 13, is connected to the base plate 14 of described loading plate 13 one end and is connected to the side plate 15 of described loading plate 13 both sides, described loading plate 13 and described base plate 14 form described storage tank 11, and described loading plate 13 forms described open slot 12 with described biside plate 15.In the present embodiment, described loading plate 13 is square plate, and described base plate 14 is fixedly connected on one end of described loading plate 13, and described base plate 14 is one piece of square plate, and in order to ensure that described base plate 14 has enough intensity, the thickness of described base plate 14 is more than the thickness of described loading plate 13.Described loading plate 13 forms described storage tank 11 with described base plate 14, i.e. described loading plate 13 is the diapire of described storage tank 11, and described base plate 14 is the sidewall of described storage tank 11.When described silicon chip is positioned in described storage tank 11, the diapire (that is, described loading plate 13) of the described silicon chip described storage tank 11 of laminating is arranged.Owing to described storage tank 11 has bigger accommodation space, therefore, it is possible to place the silicon chip of multi-disc same thickness or different-thickness, thus utilizing described silicon wafer clamping device 100 can one-time fix multi-disc silicon chip, so grinding efficiency can be improved.It is understood that in other embodiments, described loading plate can be also circular slab or U-board etc..
It addition, for the silicon chip adapting to different size, described biside plate 15 is the both sides being removably connected to described base plate 14, in order to the groove width of described storage tank 11 can be adjusted according to the specification of described silicon chip.Such as, described biside plate 15 can be adopted the mode being screwed and is fixed on base plate 14, in order to dismounting.
In the present embodiment, side plate 15 described in two is respectively perpendicular to be located on described loading plate 13, and described in two, side plate 15 is square plate.Side plate 15 and described base plate 14 described in two enclose formation one square space, and described square space is described storage tank 11 and described open slot 12.
Further, described open slot 12 is oppositely arranged with described base plate 14, i.e. the opening direction of described open slot 12 is the direction away from described base plate 14, in order to take out described silicon chip after having ground.Offering several sand losing openings 141 on described base plate 14, several sand losing openings 141 described are arranged side by side successively along the length direction of described base plate 14.Specifically, several sand losing openings 141 described are circular hole, and the diameter of several sand losing openings 141 described is more than the diameter of described sandblasting, so that described sandblasting is spilt, thus in the process that described silicon chip is carried out abrasive blasting, enter the sandblasting within described storage tank 11 to be spilt by described sand losing opening 141, consequently facilitating while the cleaning within described storage tank 11, also allow for the cleaning of described silicon chip surface.It is understood that in other embodiments, described sand losing opening 141 can be also square hole, U-shaped hole or other erose holes.
Further; it is provided with in described opening 12 and is attached at the screening glass (not shown) that described opening 12 inwall is arranged; described screening glass is in order to protect described silicon chip; to isolate the inwall of described silicon chip and described opening 12, it is prevented that described silicon chip is ruptured by described opening 12 inwall thrust effect.Preferably, described screening glass can be foam piece, silica gel piece or sponge pad etc..
In the present embodiment, described cover plate 20 is one piece of square plate, and the material of described cover plate 20 is consistent with the material of described clamp box 10, can be all plastics or metal.When the material of described clamp box 10 is plastics, the material of described cover plate 20 is also plastics；And when the material of described clamp box 10 is metal, the material of described cover plate 20 is also metal, to ensure the global consistency of described cover plate 20 and described clamp box 10.Described cover plate 20 is in order to close described storage tank 11, thus the described silicon chip being positioned in described storage tank 11 is fixed, play the effect of fixing described silicon chip, in order to follow-up abrasive blasting, it is prevented that the situation that described silicon chip occurs shifting and causes grinding effect not good.
In order to improve further, described silicon wafer clamping device 100 also includes at least one clamping element 30, at least one clamping element 30 described is located between described cover plate 20 and described clamp box 10, to clamp described cover plate 20 and described clamp box 10.In the present embodiment, described clamping element 30 is located on the biside plate 15 of described clamp box 10, and described clamping element 30 is four, is symmetrically set on side plate 15 described in two respectively between two.Specifically, described clamping element 30 includes fixed part 31 and clamping section 32, described side plate 15 offers fixing hole (not shown), on described cover plate 20, corresponding described fixing hole offers groove 21, described fixed part 31 is arranged in described fixing hole and described groove 21 simultaneously, then described clamping section 32 is utilized to be locked by described fixed part 31, thus reaching to lock onto described cover plate 20 purpose of described clamp box 10.Preferably, described clamping element 30 is butterfly screws, in order to manual locking or unscrew, consequently facilitating start described storage tank 11 at any time or close described storage tank 11, reaches the purpose taking out described silicon chip or fixing described silicon chip at any time.It is understood that in other embodiments, described clamping element 30 can be also bolt or screw rod etc..
It addition, in other embodiments, described clamp box 10 also can only include described loading plate 13 and be connected to the base plate 14 of described loading plate 13 one end, and described loading plate 13 forms described storage tank 11 with described base plate 14.Described cover plate 20 includes mainboard and is connected to the side plate of mainboard both sides, and described mainboard is fixedly connected on described base plate 14, to close described storage tank 11.Described biside plate is fixedly connected on described loading plate, and described open slot is exposed between described loading plate and described biside plate.Adopt the structure form, when being connected with described clamp box 10 by described cover plate 20, screw can be set on the loading plate of described clamp box 10 and base plate simultaneously, on the biside plate of described cover plate and mainboard, be then respectively provided with screw fix through screw.
Silicon wafer clamping device provided by the utility model by being provided with storage tank and being positioned at the open slot of storage tank side on clamp box, and open slot and storage tank are through, then by cover closure storage tank and expose open slot, so when being ground, can silicon chip be positioned in storage tank, to reach the purpose of fixing silicon chip, then utilize this open slot to spray into sand to reach the purpose that silicon chip is ground.Instead of the mode that the artificial hand-held silicon chip of existing employing is ground, owing to the silicon chip of multi-disc different-thickness can be housed in storage tank, therefore applied widely and grinding efficiency is higher；Additionally, utilize this open slot to be ground to spray into sand, without adopting artificial hand-held sand paper to grind, reduce the working strength of operator and be not easy that the situation that silicon chip ruptures occurs, being conducive to improving the production yield of silicon chip.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example ", " some examples " or similar " first embodiment " etc. means in conjunction with this embodiment or example describe are contained at least one embodiment of the present utility model or example.In this manual, the schematic representation of above-mentioned term is not necessarily referring to identical embodiment or example.And, the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiments or example.
The above is preferred implementation of the present utility model; it should be pointed out that, for those skilled in the art, under the premise without departing from this utility model principle; can also making some improvements and modifications, these improvements and modifications are also considered as protection domain of the present utility model.
Claims (10)
1. a silicon wafer clamping device, it is characterized in that, including clamp box and the cover plate being fixedly connected on described clamp box, described clamp box offers storage tank and is located at the open slot of described storage tank side, described open slot is through with described storage tank, storage tank described in described cover closure.
2. silicon wafer clamping device according to claim 1, it is characterized in that, described clamp box includes loading plate, is connected to the base plate of described loading plate one end and is connected to the side plate of described loading plate both sides, described loading plate and described base plate form described storage tank, and side plate described in described loading plate and two forms described open slot.
3. silicon wafer clamping device according to claim 1, it is characterized in that, described clamp box includes loading plate and is connected to the base plate of described loading plate one end, described loading plate and described base plate form described storage tank, described cover plate includes mainboard and is connected to the side plate of described mainboard both sides, and described mainboard is fixedly connected on described base plate, to close described storage tank, described biside plate is fixedly connected on described loading plate, and described open slot is between described loading plate and described biside plate.
4. the silicon wafer clamping device according to Claims 2 or 3, it is characterised in that described open slot and described base plate are oppositely arranged.
5. the silicon wafer clamping device according to Claims 2 or 3, it is characterised in that offering several sand losing openings on described base plate, several sand losing openings described are arranged side by side successively along the length direction of described base plate.
6. silicon wafer clamping device according to claim 1, it is characterised in that described silicon wafer clamping device also includes at least one clamping element, and at least one clamping element described is located between described cover plate and described clamp box, to clamp described cover plate and described clamp box.
7. silicon wafer clamping device according to claim 6, it is characterised in that described clamping element is located on described clamp box, the position of the corresponding described clamping element of described cover plate offers groove, the described clamping element described groove of traverse.
8. silicon wafer clamping device according to claim 6, it is characterised in that described clamping element is butterfly screws, bolt or screw rod.
9. silicon wafer clamping device according to claim 1, it is characterised in that described storage tank and described open slot are square groove.
10. silicon wafer clamping device according to claim 1, it is characterised in that be provided with screening glass in described opening, described screening glass is attached at the inwall of described opening and arranges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620086901.1U CN205342778U (en) | 2016-01-28 | 2016-01-28 | Silicon wafer clamp tightly installs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620086901.1U CN205342778U (en) | 2016-01-28 | 2016-01-28 | Silicon wafer clamp tightly installs |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205342778U true CN205342778U (en) | 2016-06-29 |
Family
ID=56180491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620086901.1U Expired - Fee Related CN205342778U (en) | 2016-01-28 | 2016-01-28 | Silicon wafer clamp tightly installs |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205342778U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111360690A (en) * | 2020-03-17 | 2020-07-03 | 北京航天时代光电科技有限公司 | Clamp capable of grinding chips with multiple lengths |
-
2016
- 2016-01-28 CN CN201620086901.1U patent/CN205342778U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111360690A (en) * | 2020-03-17 | 2020-07-03 | 北京航天时代光电科技有限公司 | Clamp capable of grinding chips with multiple lengths |
| CN111360690B (en) * | 2020-03-17 | 2021-08-10 | 北京航天时代光电科技有限公司 | Clamp capable of grinding chips with multiple lengths |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105290965B (en) | A kind of metallographic specimen grinding and polishing clamping device and its external member | |
| CN205342778U (en) | Silicon wafer clamp tightly installs | |
| CN203993548U (en) | A kind of wheel dresser | |
| US6981911B2 (en) | Abrasive drill bit | |
| CN103978431A (en) | Grinding wheel dressing device | |
| CN205184533U (en) | A double -sided lapping machine for metallurgical work piece processing of metal powder | |
| CN106670198A (en) | Washing device for soft material | |
| CN208729397U (en) | A kind of silicon steel sheet polishing burr remover | |
| JP5936972B2 (en) | Processing equipment | |
| CN205166648U (en) | Vibratory finishing machine | |
| CN206826880U (en) | A kind of protection device of marine lashing eye thimble | |
| CN216542664U (en) | Grinding structure for diamond processing | |
| CN106239390B (en) | Sand paper clipper | |
| CN210078989U (en) | Filter layer drawer | |
| CN206393448U (en) | A kind of grinding head of intelligent liquid-crystal electrode plate surface grinder | |
| CN106425824B (en) | A kind of intelligent liquid-crystal electrode plate surface grinder | |
| CN205950491U (en) | Intelligence liquid crystal plate electrode surface grinding machine | |
| CN205587787U (en) | Electronic screw sander | |
| CN106363545A (en) | Monocrystalline silicon wafer grinding wheel and using method thereof | |
| CN108857713A (en) | Mobile phone shell grinding device | |
| CN203097195U (en) | Marble dimension stone non-hole-opening dry-hanging device | |
| CN107186581A (en) | Recycle the jewel sanding apparatus at water source | |
| CN210616113U (en) | Grinding machine with polishing length measuring device | |
| CN211292305U (en) | Pressure chamber fixing device of triaxial apparatus | |
| CN214932649U (en) | Effectively slow down container corner fittings of wearing and tearing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160629 Termination date: 20200128 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |