CN2053318U - Full-metallic low-temp. heat-exchanger with welded baffle - Google Patents
Full-metallic low-temp. heat-exchanger with welded baffle Download PDFInfo
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- CN2053318U CN2053318U CN 89202337 CN89202337U CN2053318U CN 2053318 U CN2053318 U CN 2053318U CN 89202337 CN89202337 CN 89202337 CN 89202337 U CN89202337 U CN 89202337U CN 2053318 U CN2053318 U CN 2053318U
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- heat exchanger
- heat
- exchanger
- thermal conductivity
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Abstract
The utility model relates to heat exchanger, and is in particular to suit for the field of cryogenic technology. The utility model provides a full-metallic low-temperature heat-exchanger with welded baffle, whose heat-transfer core is formed that a wire mesh of high multiply heat conductivity coefficient and a metal heat-insulating gasket are splitlever stacked in the direction perpendicular to fluid flow, with welded by vacuum diffusion. The utility model has the advantages: (a) lowering the cost of the heat exchanger, (b) enhancing the compactness of the heat exchanger, (c) being suitable for any fluid occasion, and also being able to made into a multistand stream, multiply recuperative heat exchanger.
Description
The present invention relates to a kind of heat exchanger, be specially adapted to the cryogenic technique field.
U.S. Pat 3228460 provides the structure of all-metal porous plate low temperature partition solder type heat exchanger, its heat transfer fuse is made up of the metallic porous sheet of multilayer high-thermal conductivity coefficient and the metallic insulation pad of low thermal conductivity, and they are by piling up with the perpendicular direction staggered floor of fluid flow direction and forming through Diffusion Welding.This heat exchanger has obtained extensively to admit and use with its numerous advantage in the cryogenic technique field.But there are two tangible weak points in this all-metal low temperature partition solder type heat exchanger, the one, because porous plate adopts chemical attack or mechanical hole-punching manufacture technology, its manufacturing cost is higher; The 2nd, compactness further improves and is subjected to the too high restriction of manufacturing process difficulty when big of porous plate pore density.
The invention provides a kind of all-metal grid low temperature partition solder type heat exchanger, to overcome the weak point of foregoing invention.
The fuse of all-metal grid low temperature partition solder type heat exchanger is formed by piling up with the perpendicular direction staggered floor of fluid flow direction and connecing through vacuum diffusion welding by the low metallic insulation pad (2) of the high woven wire of multilayered thermally-conductive coefficient (3) and thermal conductivity coefficient.Every layer of woven wire can be with a slice or several pieces, and the order number of woven wire is changeable, and these all can be determined on demand.Because on the solder side of woven wire a lot of eyelets are arranged, the solder side that does not resemble porous plate is the plane of atresia, therefore, for guaranteeing its weld strength and sealing, the present invention has taked a series of technical matters measure.
Outstanding advantage of the present invention is: (one) greatly reduces the cost of heat exchanger, and for example, a porous plate heat exchanger needs hundreds of of porous plates, by 10 centimetres of every agreements that contracts a film or TV play to an actor or actress
2Calculate, its manufacturing expense is about ternary, every 10 centimetres
2Woven wire price 5 fens only; (2) improved the compactness of heat exchanger, for example, the compactness of porous plate is generally 3000~6000 meters
2/ rice
3, and after using woven wire instead, its compactness can be up to ten thousand metres
2/ rice
3(3) the present invention can also make multiple flow, many dividing wall type heat exchangers applicable to any fluid occasion, and cold fluid and hot fluid channel arrangement form also can be varied, and is extremely shown in Figure 5 as Fig. 2.What beat " * " is the low pressure cold fluid passage, and what beat " " is the hot high pressure fluid passage.Their common characteristic are that the grid of every layer of cold and hot fluid runner is a full wafer wire netting.
Fig. 1 is a concentric-ring pattern all-metal grid low temperature partition solder type heat exchanger.(1) is end socket among the figure, and (2) are the metallic insulation pads, and (3) are woven wires, and (4) are shells.This pattern is succeeded in developing, and following various types (Fig. 2 to Fig. 5) also can be implemented.
Fig. 2 is a pattern all-metal grid low temperature partition solder type heat exchanger.
Fig. 3 is a vortex patern all-metal grid low temperature partition solder type heat exchanger.
Fig. 4 is a finger-type all-metal grid low temperature partition solder type heat exchanger.
Fig. 5 is a fan type all-metal grid low temperature partition solder type heat exchanger.
Physical dimension that all-metal grid low temperature recuperator provided by the present invention and present inventor once developed in the past and the essentially identical all-metal porous plate of experiment condition low temperature recuperator performance test result are compared as follows shown in the table:
Performance parameter | All-metal porous plate heat exchanger | All-metal grid heat exchanger |
The heat exchanger efficiency (%) of normal temperature to liquid nitrogen temperature and the designing quality flow | 95.19 | 95.28 |
The flow resistance of backflowing (millimeter of water) under design conditions | 129 | 143 |
Compactness (rice 2/ rice 3) | 4190 | 4296 every layer of a slice are if two then almost double |
Weld strength | Be subjected under the liquid nitrogen temperature 25 kgfs/centimetre 2Pressure test | With a left side |
The sealing of weld seam under the effect of temperature alternating thermal stress | Stood to test no leakage phenomenon more than hundred times from normal temperature to the liquid nitrogen temperature alternation. | With a left side |
Claims (1)
1, a kind of all-metal low temperature partition solder type heat exchanger, form by high thermal conductivity coefficient metal level and low thermal conductivity heat insulating mattress, the metal level that it is characterized by high thermal conductivity coefficient is woven wire (3), and the low metallic insulation pad (2) of it and thermal conductivity factor is by piling up with the perpendicular direction staggered floor of fluid flow direction and connecing through vacuum diffusion welding and form partition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 89202337 CN2053318U (en) | 1989-03-02 | 1989-03-02 | Full-metallic low-temp. heat-exchanger with welded baffle |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 89202337 CN2053318U (en) | 1989-03-02 | 1989-03-02 | Full-metallic low-temp. heat-exchanger with welded baffle |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2053318U true CN2053318U (en) | 1990-02-21 |
Family
ID=4860102
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 89202337 Withdrawn CN2053318U (en) | 1989-03-02 | 1989-03-02 | Full-metallic low-temp. heat-exchanger with welded baffle |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2053318U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102128510A (en) * | 2010-01-20 | 2011-07-20 | 住友重机械工业株式会社 | Pulse tube refrigerator |
-
1989
- 1989-03-02 CN CN 89202337 patent/CN2053318U/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102128510A (en) * | 2010-01-20 | 2011-07-20 | 住友重机械工业株式会社 | Pulse tube refrigerator |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |