CN205325013U - Even duplex position workstation of being heated of function is adsorbed in area - Google Patents
Even duplex position workstation of being heated of function is adsorbed in area Download PDFInfo
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- CN205325013U CN205325013U CN201521051702.9U CN201521051702U CN205325013U CN 205325013 U CN205325013 U CN 205325013U CN 201521051702 U CN201521051702 U CN 201521051702U CN 205325013 U CN205325013 U CN 205325013U
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- thermal station
- heat platform
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- platform
- warm table
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Abstract
The utility model discloses an even duplex position workstation of being heated of function is adsorbed in area has solved the problem that warm table rate of heating is slow and temperature homogeneity is poor in the lead bonding machine. Including warm table chassis (1), be provided with guide rail (2) and cylinder (8) respectively on warm table chassis (1), it removes seat (4) to be provided with the heat platform on guide rail (2), the output shaft of cylinder (8) removes seat (4) with the heat platform and links together, , the heat platform is provided with respectively on moving seat (4) zuo retai (3), right side heat platform (5), right side heat platform controller (6) and left side heat platform controller (7), left side heat platform (3) is identical with the structure of right side heat platform (5), be provided with with hotting mask (9) on the lower bottom surface of zuo retai's (3) left side heating platen (10), it adsorbs gas circuit (11) and chip negative pressure absorption gas circuit (12) to be provided with the anchor clamps negative pressure in left side heating platen (10) respectively. The high function of heating work platform temperature controll accuracy has been realized.
Description
Technical field
This utility model relates to a kind of heating station being applied to wire bonding field, particularly to the panel type heating station of a kind of double with adsorption function。
Background technology
Full-automatic lead bonding equipment is to realize the preheating function before device wire bonding by heating station, heating station adopts the mode of vac sorb, realize the fixing of multiple device, it is prevented that it produces displacement under the effect of welding pressure, thus completing absorption and the location of chip and substrate。Heating station on existing full-automatic lead bonding equipment all cannot move, and realizes the wire bonding of device array only by the motion of equipment head。So the size of heating station (number of the put device of thermal station table top) is determined by wire bonding apparatus head XY directional run。As, during to increase the quantity of single batch of welding device to increase welding efficiency, increased the stroke in head XY direction, do so can be greatly increased on the one hand the cost of equipment, also can affect the precision that head is bonded on the other hand。The heating station of existing full-automatic lead bonding special equipment, mainly adopt and add what heat pipe was heated, although adding heat pipe uniform intensive layout as much as possible in warm table, but added heat pipe processing and structure is limit, it is slow to there is firing rate in this heating means, poor temperature uniformity, it is difficult to reach lead key closing process requirement。
Summary of the invention
This utility model provides a kind of Double-station bench being heated evenly with adsorption function, solves that the warm table firing rate in wire bonder is slow and the technical problem of poor temperature uniformity。
This utility model is to solve above technical problem by the following technical programs:
A kind of Double-station bench being heated evenly with adsorption function, including warm table underframe, warm table underframe is respectively arranged with guide rail and cylinder, guide rail is provided with thermal station Mobile base, the output shaft of cylinder and thermal station Mobile base link together, thermal station Mobile base is respectively arranged with left thermal station, right thermal station, right thermal station controller and left thermal station controller, the structure of left thermal station and right thermal station is identical, the bottom surface of the left heated plate of left thermal station is provided with heating film, left heated plate is respectively arranged with fixture negative-pressure adsorption gas circuit and chip negative pressure absorption gas circuit。
The thickness of heating film is 1.5 millimeters。
This utility model is separate due to temperature control unit and the gas circuit of two thermal station, and two thermal station can use simultaneously also can be used alone。Right thermal station controller and left thermal station controller temperature-controlled precision are high, simple to operation, are conducive to temperature adjusting, it is achieved that the function that heating station accuracy of temperature control is high。
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model；
Fig. 2 is the structural representation of thermal station of the present utility model。
Detailed description of the invention
Below in conjunction with accompanying drawing, this utility model is described in detail:
A kind of Double-station bench being heated evenly with adsorption function, including warm table underframe 1, warm table underframe 1 is respectively arranged with guide rail 2 and cylinder 8, guide rail 2 is provided with thermal station Mobile base 4, the output shaft of cylinder 8 and thermal station Mobile base 4 link together, thermal station Mobile base 4 is respectively arranged with left thermal station 3, right thermal station 5, right thermal station controller 6 and left thermal station controller 7, the structure of left thermal station 3 and right thermal station 5 is identical, the bottom surface of the left heated plate 10 of left thermal station 3 is provided with heating film 9, left heated plate 10 is respectively arranged with fixture negative-pressure adsorption gas circuit 11 and chip negative pressure absorption gas circuit 12。
The thickness of heating film 9 is 1.5 millimeters。
Gas circuit and heated plate institute junction all adopt high temperature resistant gas path joint and pipeline, thus extending the service life of each part。Described heated plate internal cavity space is big, effectively enhances the flow of vacuum pump, is conducive to the vacuum that vacuum pump maintenance is higher, thus chip fixture or chip are produced bigger absorption affinity。
Claims (2)
1. the Double-station bench being heated evenly with adsorption function, including warm table underframe (1), warm table underframe (1) is respectively arranged with guide rail (2) and cylinder (8), guide rail (2) is provided with thermal station Mobile base (4), the output shaft of cylinder (8) and thermal station Mobile base (4) link together, it is characterized in that, thermal station Mobile base (4) is respectively arranged with left thermal station (3), right thermal station (5), right thermal station controller (6) and left thermal station controller (7), the structure of left thermal station (3) and right thermal station (5) is identical, the bottom surface of the left heated plate (10) of left thermal station (3) is provided with heating film (9), left heated plate (10) is respectively arranged with fixture negative-pressure adsorption gas circuit (11) and chip negative pressure absorption gas circuit (12)。
2. a kind of Double-station bench being heated evenly with adsorption function according to claim 1, it is characterised in that the thickness of heating film (9) is 1.5 millimeters。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521051702.9U CN205325013U (en) | 2016-03-28 | 2016-03-28 | Even duplex position workstation of being heated of function is adsorbed in area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521051702.9U CN205325013U (en) | 2016-03-28 | 2016-03-28 | Even duplex position workstation of being heated of function is adsorbed in area |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205325013U true CN205325013U (en) | 2016-06-22 |
Family
ID=56207104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521051702.9U Active CN205325013U (en) | 2016-03-28 | 2016-03-28 | Even duplex position workstation of being heated of function is adsorbed in area |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205325013U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105436757A (en) * | 2015-12-16 | 2016-03-30 | 中国电子科技集团公司第二研究所 | Uniformly heated double-position worktable with adsorption function |
| CN106001832A (en) * | 2016-06-29 | 2016-10-12 | 海宁市智慧光电有限公司 | Apparatus for making WW-D9 reflow soldering type high-power light emitting diodes |
-
2016
- 2016-03-28 CN CN201521051702.9U patent/CN205325013U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105436757A (en) * | 2015-12-16 | 2016-03-30 | 中国电子科技集团公司第二研究所 | Uniformly heated double-position worktable with adsorption function |
| CN106001832A (en) * | 2016-06-29 | 2016-10-12 | 海宁市智慧光电有限公司 | Apparatus for making WW-D9 reflow soldering type high-power light emitting diodes |
| CN106001832B (en) * | 2016-06-29 | 2018-03-13 | 海宁市智慧光电有限公司 | A kind of equipment for making WW D9 Reflow Soldering type large-power light-emitting diodes |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |