CN205294830U - Optical chip and inertial sensor's integrated device - Google Patents
Optical chip and inertial sensor's integrated device Download PDFInfo
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- CN205294830U CN205294830U CN201620007354.3U CN201620007354U CN205294830U CN 205294830 U CN205294830 U CN 205294830U CN 201620007354 U CN201620007354 U CN 201620007354U CN 205294830 U CN205294830 U CN 205294830U
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- optical
- chip
- pcb board
- sensor chip
- inertial sensor
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Abstract
The utility model discloses an optical chip and inertial sensor's integrated device, optical chip's optics region connects on the pad of PCB board through planting the tin ball bonding towards PCB board, its pin still be provided with the optical window who corresponds with optical chip on the PCB board, wherein, still including covering optical window's printing opacity portion, the one side of keeping away from the PCB board on optical chip is fixed to the inertial sensor chip, the outside of optical chip, inertial sensor chip is provided with light tight plastic -sealed body, light tight plastic -sealed body will optical chip, the common plastic envelope of inertial sensor chip are on the PCB board. The utility model discloses an integrated device, with the equal inertial sensor chip inequality of structure and principle, optical chip integrated in same packaging structure, but the whole integrated device's of greatly reduced encapsulation size from this.
Description
Technical field
This utility model relates to the integrating device of a kind of chip, more specifically, this utility model relates to the integrating device of a kind of optical chip and inertial sensor.
Background technology
Along with the development of science and technology, Wearable device is increasingly becoming the focus of consumer electronics, and it generally adopts the sensor that multiple sign detects, to reach human body physical sign parameter is carried out the purpose of monitoring in real time. And in some applications, optical pickocff and inertia device can be used simultaneously, such as utilize optics heart rate/blood oxygen transducer to detect heart rate and blood oxygen concentration, utilize inertia device to compensate the error brought in motor process. But owing to MEMS inertia device is different with the structure of optical pickocff and operation principle so that the integrated difficulty of MEMS inertia device and optical pickocff is bigger. Finally, optical pickocff and what inertia device can only be packaged with discrete form. This not only occupies bigger board area, and discrete package is relatively costly, significantly hinders the lightening development of modern electronic product.
Utility model content
A purpose of the present utility model is to provide the new solution of a kind of optical chip and the integrating device of inertial sensor.
According to first aspect of the present utility model, provide the integrating device of a kind of optical chip and inertial sensor, including pcb board, there is the optical chip of optical region, inertial sensor chip, the optical region of described optical chip is towards pcb board, its pin is connected on the pad of pcb board by planting stannum ball bonding, is additionally provided with the optical window corresponding with optical chip on described pcb board; Wherein, the transmittance section covering described optical window is also included; Described inertial sensor chip is fixed on optical chip away from the side of pcb board; Arranged outside at described optical chip, inertial sensor chip has light tight plastic-sealed body, described light tight plastic-sealed body by described optical chip, the common plastic packaging of inertial sensor chip on pcb board.
Preferably, described optical chip is provided with two, respectively optical sensor chip, LED chip.
Preferably, described optical sensor chip, LED chip are spaced apart and arranged on pcb board; Described light tight plastic-sealed body position between optical sensor chip, LED chip forms blocking part optical sensor chip, LED chip separated.
Preferably, described inertial sensor chip is arranged on optical sensor chip.
Preferably, described optical sensor chip, LED chip are bonded on pcb board by rubberised layer.
Preferably, described transmittance section is filled in the optical window of pcb board, and covers the optical region of described optical chip.
Preferably, the bottom of described transmittance section flushes with the lower surface of pcb board.
Preferably, described transmittance section stretches out from the position of optical window, forms one in hemispheric optical lens structure.
Integrating device of the present utility model, inertial sensor chip structure and principle all differed, optical chip are integrated in same encapsulating structure, thus can be substantially reduced the package dimension of whole integrating device. Each optical chip adopts the mode that stannum ball is planted in inversion to be weldingly fixed on pcb board so that is positioned at the injection-molding surfaces outside optical chip and is in from optical window on different surfaces, thus directly can carry out injection moulding in the outside of optical chip, form light tight injection molding body; This reduce further the size of encapsulation and thickness for traditional encapsulating structure, also reduces the cost of manufacture simultaneously.
Of the present utility model inventor have found that, conventionally, as inertial sensor is different from the structure of optical pickocff and principle, be difficult to two kinds of integrated chips in same encapsulation. Therefore, technical assignment that this utility model to realize or that the those skilled in the art of technical problem is that to be solved never expect or it is not expected that, therefore this utility model is a kind of new technical scheme.
By referring to the accompanying drawing detailed description to exemplary embodiment of the present utility model, further feature of the present utility model and advantage thereof will be made apparent from.
Accompanying drawing explanation
Combined in the description and the accompanying drawing of the part constituting description illustrate embodiment of the present utility model, and be used for explaining principle of the present utility model together with its explanation.
Fig. 1 is the structural representation of this utility model integrating device.
Fig. 2 to Fig. 6 is the schematic flow sheet of this utility model integrating device manufacture method.
Fig. 7 is the structural representation of this utility model another embodiment of integrating device.
Detailed description of the invention
Of the present utility model various exemplary embodiment is described in detail now with reference to accompanying drawing. It should also be noted that unless specifically stated otherwise, the parts otherwise set forth in these embodiments and positioned opposite, the numerical expression of step and numerical value are not intended to scope of the present utility model.
Description only actually at least one exemplary embodiment is illustrative below, never as any restriction to this utility model and application or use.
The known technology of person of ordinary skill in the relevant, method and apparatus are likely to be not discussed in detail, but in the appropriate case, described technology, method and apparatus should be considered a part for description.
Shown here with in all examples discussed, any occurrence should be construed as merely exemplary, not as restriction. Therefore, other example of exemplary embodiment can have different values.
It should also be noted that similar label and letter below figure represent similar terms, therefore, once a certain Xiang Yi accompanying drawing is defined, then it need not be further discussed in accompanying drawing subsequently.
With reference to Fig. 1, this utility model provides the integrating device of a kind of optical chip and inertial sensor, and it includes pcb board 7, optical chip, inertial sensor chip 11, wherein, described optical chip has optical region 10, receives by this optical region 10 or send optical signal. Optical chip of the present utility model can be the optical chip well-known to those skilled in the art such as optical sensor chip, LED chip. Wherein, the optical region of optical sensor chip is used for sensing optical signal, for instance optical sensor chip can be made to send different control signals according to the power of light; The optical region of LED chip is used for launching optical signal, and it can be the luminescent devices such as light emitting diode. Inertial sensor chip 11 of the present utility model can be the inertia measurement sensor well-known to those skilled in the art such as accelerometer and/or gyroscope.
For the ease of understanding the technical solution of the utility model, existing for optical sensor chip 2, LED chip 3, the technical solution of the utility model is described. Wherein, optical chip of the present utility model can be separately provided, it is also possible to is be configured in the way of multiple combinations.
With reference to Fig. 1, optical sensor chip 2, LED chip 3 compartment of terrain are distributed on pcb board 7, and wherein optical sensor chip 2, LED chip 3 are reverse mounted so that optical sensor chip 2, LED chip 3 optical region 10 towards the direction of pcb board 7. Optical sensor chip 2, LED chip 3 pin on be provided with and plant stannum ball 4 so that optical sensor chip 2, LED chip 3 are fixed together by stannum ball 4 pad solder corresponding with pcb board 7 of planting on respective pin. This not only achieves optical sensor chip 2, LED chip 3 is fixed with pcb board 7, is also linked in the circuit layout on pcb board 7 by the pin of optical sensor chip 2, LED chip 3 simultaneously.
Integrating device of the present utility model, inertial sensor chip 11 may be provided at the side on optical sensor chip 2 away from pcb board 7, and with reference to the view direction of Fig. 1, inertial sensor chip 11 can be arranged on the upper end of optical sensor chip 2 by the mode mounted. Glue material can be adopted between inertial sensor chip 11 and optical sensor chip 2 to bond, for instance COB glue etc. For a person skilled in the art, as fruit structure allows, inertial sensor chip 11 can also be arranged on LED chip 3, can realize the installation of inertial sensor chip 11 equally.
Integrating device of the present utility model, pcb board 7 is provided with two optical windows 70 corresponding respectively to optical sensor chip 2, LED chip 3, with reference to Fig. 1, Fig. 2, the optical signal that LED chip 3 sends can be shone out by corresponding optical window, and optical sensor chip 2 can pass through corresponding optical window and receive the optical signal that the sensing external world injects. This utility model one preferred embodiment in, two optical windows 70 be separately positioned on pcb board 7 with optical sensor chip 2, LED chip 3 optical region 10 just to position.
This utility model one preferred embodiment in, be additionally provided with rubberised layer 6 between described optical sensor chip 2, LED chip 3 and pcb board 7, this rubberised layer 6 can be the glue materials well-known to those skilled in the art such as COB glue. Described optical sensor chip 2, LED chip 3 are bonded on pcb board 7 respectively through this rubberised layer 6, thus having consolidated the connection of optical sensor chip 2, LED chip 3 and pcb board 7 further.
Integrating device of the present utility model, described optical sensor chip 2, LED chip 3, inertial sensor chip 11 arranged outside have light tight plastic-sealed body 1, by this light tight plastic-sealed body 1 by optical sensor chip 2, LED chip 3, the common plastic packaging of inertial sensor chip 11 on pcb board 7. Light tight plastic-sealed body 1 of the present utility model is made up of the material of light tight line, and this belongs to the known general knowledge of those skilled in the art, no longer illustrates at this. Utilize lighttight material that optical sensor chip 2, LED chip 3, inertial sensor chip 11 are carried out plastic packaging, due to optical sensor chip 2, LED chip 3 optical region 10 towards the direction of pcb board 1, make, when forming light tight plastic-sealed body 1, to be damaged from the optical region 10 of optical sensor chip 2, LED chip 3.
Optical sensor chip 2, LED chip 3 are spaced apart and arranged on pcb board 7, after forming light tight plastic-sealed body 1, can form a blocking part 9 described optical sensor chip 2, LED chip 3 separated in the position between optical sensor chip 2, LED chip 3. Optical sensor chip 2, LED chip 3 can be intercepted and open by this blocking part 9, it is prevented that the light that LED chip 3 sends directly is sensed by optical sensor chip 2.
Integrating device of the present utility model; in order to protect the optical region 10 of optical sensor chip 2, LED chip 3; it is additionally provided with the transmittance section 5 covering two optical windows 70; this transmittance section 5 adopts the material of printing opacity to make; this belongs to the known general knowledge of those skilled in the art, no longer illustrates at this.
Integrating device of the present utility model, inertial sensor chip structure and principle all differed, optical chip are integrated in same encapsulating structure, thus can be substantially reduced the package dimension of whole integrating device. Each optical chip adopts the mode that stannum ball is planted in inversion to be weldingly fixed on pcb board so that is positioned at the injection-molding surfaces outside optical chip and is in from optical window on different surfaces, thus directly can carry out injection moulding in the outside of optical chip, form light tight injection molding body; This reduce further the size of encapsulation and thickness for traditional encapsulating structure, also reduces the cost of manufacture simultaneously.
In one specific embodiment of this utility model, transmittance section 5 can be placed only in the outside of optical window 70, it is preferred that described transmittance section 5 is filled in the optical window 70 of pcb board 7, and is covered by the optical region 10 of two optical chips. Wherein, the bottom of transmittance section 5 can flush with the lower surface of pcb board 7, with reference to Fig. 1; Can also be that described transmittance section 5 stretches out from the position of optical window 70, form one in hemispheric optical lens structure 8, with reference to Fig. 7. The optical lens that this optical lens structure 8 can come in and go out as optical signal, thus can improve the intensity that optical signal goes out, enters, thus improve optical sensor chip 2, the sensitivity of LED chip 3 and resolution.
This utility model additionally provides the manufacture method of a kind of optical chip and the integrating device of inertial sensor, is in that to comprise the following steps:
A) first offering optical window 70 on pcb board 7, the quantity of optical window 70 is determined according to the quantity of optical chip, with reference to Fig. 2; This utility model need two optical chips are set on pcb board 7, respectively optical sensor chip 2, LED chip 3, therefore offer two optical windows 70 at pcb board 7;
B) optical sensor chip 2, LED chip 3 pin on arrange plant stannum ball 4, with reference to Fig. 3, and by optical sensor chip 2, LED chip 3 hot pressing on pcb board 7, make optical sensor chip 2, the pin of LED chip 3 is fixed together with the respective pad on pcb board 7 by planting stannum ball 4, with reference to Fig. 4;
C) inertial sensor chip 11 is mounted on the upper end of optical sensor chip 2, with reference to Fig. 5; When mounting, at the upper end gluing of optical sensor chip 2, then inertial sensor chip 11 can be mounted on the upper end of optical sensor chip 2;
D) optical sensor chip 2, LED chip 3, inertial sensor chip 11 outside carry out injection moulding, form light tight plastic-sealed body 1, with reference to Fig. 6; By this light tight plastic-sealed body 1 by optical sensor chip 2, LED chip 3, the common plastic packaging of inertial sensor chip 11 on pcb board 7; And this light tight plastic-sealed body 1 position between optical sensor chip 2, LED chip 3 defines optical sensor chip 2, the separated blocking part 9 of LED chip 3; When injection moulding forms light tight plastic-sealed body 1, last layer gummed paper can be pasted on the optical window 70 of pcb board 7 bottom, in order to optical window 70 is protected;
E) optical window 70 on pcb board 7 is carried out plastic packaging, form the transmittance section 5 covering described optical window 70. As described above, the bottom of transmittance section 5 can flush with the lower surface of pcb board 7, it is also possible to is, described transmittance section 5 stretches out from the position of optical window 70, forms one in hemispheric optical lens structure 8, with reference to Fig. 7. The optical lens that this optical lens structure 8 can come in and go out as optical signal, thus can improve the intensity that optical signal goes out, enters, thus improve optical sensor chip 2, the sensitivity of LED chip 3 and resolution.
This utility model one preferred embodiment in, in described step a), be additionally included on pcb board 7 be coated with rubberised layer 6 step. This rubberised layer 6 can adopt the adhesive for mounting materials well-known to those skilled in the art such as COB glue. In the process carrying out hot pressing optical sensor chip 2, LED chip 3, the stannum ball 4 of planting on its pin through rubberised layer 6, can be electrically coupled together with the pad on pcb board 7; Meanwhile, optical sensor chip 2, LED chip 3 surface again can pass through rubberised layer 6 be mounted on pcb board 7.
Although specific embodiments more of the present utility model being described in detail already by example, but it should be appreciated by those skilled in the art, example above is merely to illustrate, rather than in order to limit scope of the present utility model. It should be appreciated by those skilled in the art, when without departing from scope and spirit of the present utility model, above example can be modified. Scope of the present utility model is defined by the following claims.
Claims (8)
1. the integrating device of an optical chip and inertial sensor, it is characterized in that: include pcb board (7), there is the optical chip of optical region (10), inertial sensor chip (11), the optical region (10) of described optical chip is towards pcb board (7), its pin is welded on the pad of pcb board (7) by planting stannum ball (4), is additionally provided with the optical window (70) corresponding with optical chip on described pcb board (7); Wherein, the transmittance section (5) covering described optical window (70) is also included; Described inertial sensor chip (11) is fixed on optical chip away from the side of pcb board (7);Arranged outside at described optical chip, inertial sensor chip (11) has light tight plastic-sealed body (1), described light tight plastic-sealed body (1) by described optical chip, the common plastic packaging of inertial sensor chip (11) on pcb board (7).
2. integrating device according to claim 1, it is characterised in that: described optical chip is provided with two, respectively optical sensor chip (2), LED chip (3).
3. integrating device according to claim 2, it is characterised in that: described optical sensor chip (2), LED chip (3) are spaced apart and arranged on pcb board (7); The described light tight plastic-sealed body (1) position between optical sensor chip (2), LED chip (3) forms a blocking part (9) optical sensor chip (2), LED chip (3) separated.
4. integrating device according to claim 3, it is characterised in that: described inertial sensor chip (11) is arranged on optical sensor chip (2).
5. integrating device according to claim 3, it is characterised in that: described optical sensor chip (2), LED chip (3) are bonded on pcb board (7) by rubberised layer (6).
6. integrating device according to claim 1, it is characterised in that: described transmittance section (5) are filled in the optical window (70) of pcb board (7), and cover the optical region (10) of described optical chip.
7. integrating device according to claim 6, it is characterised in that: the bottom of described transmittance section (5) flushes with the lower surface of pcb board (7).
8. integrating device according to claim 6, it is characterised in that: described transmittance section (5) stretch out from the position of optical window (70), form one in hemispheric optical lens structure (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620007354.3U CN205294830U (en) | 2016-01-04 | 2016-01-04 | Optical chip and inertial sensor's integrated device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620007354.3U CN205294830U (en) | 2016-01-04 | 2016-01-04 | Optical chip and inertial sensor's integrated device |
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| Publication Number | Publication Date |
|---|---|
| CN205294830U true CN205294830U (en) | 2016-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620007354.3U Withdrawn - After Issue CN205294830U (en) | 2016-01-04 | 2016-01-04 | Optical chip and inertial sensor's integrated device |
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| CN (1) | CN205294830U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105502275A (en) * | 2016-01-04 | 2016-04-20 | 歌尔声学股份有限公司 | Optical chip and inertial sensor integrated device and manufacture method thereof |
-
2016
- 2016-01-04 CN CN201620007354.3U patent/CN205294830U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105502275A (en) * | 2016-01-04 | 2016-04-20 | 歌尔声学股份有限公司 | Optical chip and inertial sensor integrated device and manufacture method thereof |
| CN105502275B (en) * | 2016-01-04 | 2017-04-05 | 歌尔股份有限公司 | The integrating device and its manufacture method of optical chip and inertial sensor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160608 Effective date of abandoning: 20170405 |