CN205271770U - Dicyclo resin bond diamond grinding wheel - Google Patents
Dicyclo resin bond diamond grinding wheel Download PDFInfo
- Publication number
- CN205271770U CN205271770U CN201521044084.5U CN201521044084U CN205271770U CN 205271770 U CN205271770 U CN 205271770U CN 201521044084 U CN201521044084 U CN 201521044084U CN 205271770 U CN205271770 U CN 205271770U
- Authority
- CN
- China
- Prior art keywords
- ring
- agent diamond
- side ring
- resin bond
- bonding agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The utility model discloses a dicyclo resin bond diamond grinding wheel, including cyclic annular base, it has the screw to distribute on the cyclic annular base, cyclic annular base upside border department is provided with the interior side ring of resin bond diamond particulate outside ring sum resin bond diamond coarse grain, wherein it leaves the recess to be provided with between the side ring in the ring sum resin bond diamond coarse grain of the resin bond diamond particulate outside, this emery wheel especially passes through through equitable construction improvement, and through the recess between the side ring in the ring sum resin bond diamond coarse grain of the resin bond diamond particulate outside, more easy the draining of sweeps of production during the processing work piece has avoided remaining of sweeps to solve the sweeps chip removal problem that the emery wheel produced in the work piece of polishing.
Description
Technical field
This utility model relates to a kind of emery wheel, particularly a kind of emery wheel for superhard material polishing.
Background technology
At present, resin anchoring agent diamond grinding wheel is little because having grinding force, and self-sharpening is good, is not easily blocked, and generates heat little, high resilience, and polishability is good, becomes the important machining tool of pottery, hard alloy mill processing. But the mill layer of common resin anchoring agent diamond grinding wheel is in single annular distribution, in ceramic tile dry grinding edging processing, uses the emery wheel of this structure, it is easy to result in a large amount of scrap and emery wheel temperature is too high, produce mill flower or workpiece burn. A designer devises a kind of dicyclic emery wheel, referring in particular to " a kind of dicyclic skive " that the patent No. is 201520012877.2, it is mentioned that the fine grinding layer design of the corase grind layer of outer circular layer and inner circular layer, add man-hour, workpiece first contacts corase grind layer and carries out corase grind processing, and the part processed contacts fine grinding layer immediately and carries out ground finish. But this design is only suitable for the material of Large Parts Machining, and once process the situation that smallclothes workpiece is easy for scrap damaged material occur.
Summary of the invention
In order to overcome the deficiencies in the prior art, this utility model provides a kind of dicyclo resin anchoring agent diamond grinding wheel.
This utility model solves its technical problem and be the technical scheme is that
A kind of dicyclo resin anchoring agent diamond grinding wheel, including ring-type pedestal, on described ring-type pedestal, distribution has screw, described ring-type pedestal upper side edge is provided with side ring in the outer side ring of resin bonding agent diamond particulate and resin bonding agent diamond coarse grain along place, is provided with and leaves groove in the outer side ring of wherein said resin bonding agent diamond particulate and resin bonding agent diamond coarse grain between side ring.
As a preference, the outer side ring of described resin bonding agent diamond particulate is identical with width with the thickness of side ring in resin bonding agent diamond coarse grain.
As a preference, the width of described groove is 2��4mm.
As a preference, in described resin bonding agent diamond coarse grain, the aperture of side ring and the aperture ratio of ring-type pedestal are 3:1��4:1.
The beneficial effects of the utility model are: this emery wheel passes through rational structural improvement, especially by, by groove between side ring in the outer side ring of resin bonding agent diamond particulate and resin bonding agent diamond coarse grain, what the scrap produced during processing work was more prone to drains, the residual avoiding scrap solves the scrap chip removal problem that emery wheel produces in polishing workpiece, and heat dissipation problem during processing work, the outer particulate that two resin bonding agent diamond bull rings adopt, the granularity different designs of interior coarse grain, the efficiency making the production of corresponding miniature workpiece greatly increases, while ensureing production efficiency, eliminate negative effect, eliminate emery wheel in use due to the phenomenon too much making service life reduction of generating heat, solve the problem that emery wheel makes sharpness decline due to scrap and heating.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, this utility model is further illustrated.
Fig. 1 is top view of the present utility model;
Fig. 2 is left view of the present utility model.
Detailed description of the invention
In order to make the purpose of the application, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, this utility model is further elaborated. For thorough explanation this utility model, following description can relate to some specific detail. And when not having these specific detail, this utility model is then likely to still can realize, namely the technical staff in art uses the work that these describe and statement effectively introduces them to the others skilled in the art in art herein essential. In addition it should be noted that; the word "front", "rear" of use is described below, direction that "left", "right", "up" and "down" refer in accompanying drawing; word " interior " and " outward " refer respectively to the direction towards or away from particular elements geometric center, and above-mentioned direction is being made simply, creationary adjustment need not should not be construed as the technology beyond the application protection domain by person skilled. Should be appreciated that specific embodiment described herein is only in order to explain the application, be not used to limit real protection scope. And for avoiding confusion the purpose of this utility model, owing to the technology such as the emery wheel installation known, method are not it will be understood that therefore they are described in detail. With reference to Fig. 1, Fig. 2, a kind of dicyclo resin anchoring agent diamond grinding wheel, including ring-type pedestal 1, on described ring-type pedestal 1, distribution has screw 2, on the upside of described ring-type pedestal 1, edge is provided with side ring 4 in the outer side ring 3 of resin bonding agent diamond particulate and resin bonding agent diamond coarse grain, is provided with and leaves groove 5 in the outer side ring 3 of wherein said resin bonding agent diamond particulate and resin bonding agent diamond coarse grain between side ring 4. In the outer side ring 3 of resin bonding agent diamond particulate and resin bonding agent diamond coarse grain, side ring 4 is the ring-type Buddha's warrior attendant stone grinder layer being connected with ring-type pedestal 1 by resinoid bond, its ectomesoderm particulate, internal layer coarse grain design, when for miniature workpiece, roughing is carried out by side ring in the resin bonding agent diamond coarse grain of internal layer coarse grain 4, again through outer side ring 3 polish of resin bonding agent diamond particulate, the scrap of the course of processing is just discharged by groove 5.
Further embodiment, with reference to a kind of dicyclo resin anchoring agent diamond grinding wheel of Fig. 1, Fig. 2, " embodiment " wherein referred to herein refers to the special characteristic, structure or the characteristic that may be included at least one implementation of the application. Different local in this manual " in the embodiments " occurred not refer both to same embodiment, neither be independent or selective and that other embodiments are mutually exclusive embodiment. Embodiment includes ring-type pedestal 1, on described ring-type pedestal 1, distribution has screw 2, on the upside of described ring-type pedestal 1, edge is provided with side ring 4 in the outer side ring 3 of resin bonding agent diamond particulate and resin bonding agent diamond coarse grain, is provided with and leaves groove 5 in the outer side ring 3 of wherein said resin bonding agent diamond particulate and resin bonding agent diamond coarse grain between side ring 4. The outer side ring 3 of described resin bonding agent diamond particulate is identical with width with the thickness of side ring 4 in resin bonding agent diamond coarse grain.
Further embodiment, with reference to Fig. 1, Fig. 2, a kind of dicyclo resin anchoring agent diamond grinding wheel, including ring-type pedestal 1, on described ring-type pedestal 1, distribution has screw 2, on the upside of described ring-type pedestal 1, edge is provided with side ring 4 in the outer side ring 3 of resin bonding agent diamond particulate and resin bonding agent diamond coarse grain, is provided with and leaves groove 5 in the outer side ring 3 of wherein said resin bonding agent diamond particulate and resin bonding agent diamond coarse grain between side ring 4. The width of described groove 5 is 2��4mm, under ensureing the premise that scrap is drained smoothly, it is ensured that the stress-bearing capability in bruting process of side ring 4 in the outer side ring 3 of resin bonding agent diamond particulate and resin bonding agent diamond coarse grain. In described resin bonding agent diamond coarse grain, the aperture of side ring 4 and the aperture ratio of ring-type pedestal 1 are 3:1��4:1, it is ensured that in the outer side ring 3 of resin bonding agent diamond particulate and resin bonding agent diamond coarse grain, the structural strength of side ring 4 ensures the flexibility ratio of polishing simultaneously.
According to above-mentioned principle, above-mentioned embodiment can also be carried out suitable change and amendment by this utility model. Therefore, this utility model is not limited to detailed description of the invention disclosed and described above, should also be as falling in scope of the claims of the present utility model to modifications and changes more of the present utility model.
Claims (4)
1. a dicyclo resin anchoring agent diamond grinding wheel, including ring-type pedestal (1), the upper distribution of described ring-type pedestal (1) has screw (2), it is characterized in that: edge, described ring-type pedestal (1) upside is provided with side ring (4) in the outer side ring (3) of resin bonding agent diamond particulate and resin bonding agent diamond coarse grain, be provided with between side ring (4) in the outer side ring (3) of wherein said resin bonding agent diamond particulate and resin bonding agent diamond coarse grain and leave groove (5).
2. a kind of dicyclo resin anchoring agent diamond grinding wheel according to claim 1, it is characterised in that: the outer side ring (3) of described resin bonding agent diamond particulate is identical with width with the thickness of side ring (4) in resin bonding agent diamond coarse grain.
3. a kind of dicyclo resin anchoring agent diamond grinding wheel according to claim 1, it is characterised in that: the width of described groove (5) is 2��4mm.
4. a kind of dicyclo resin anchoring agent diamond grinding wheel according to claim 1, it is characterised in that: in described resin bonding agent diamond coarse grain, the aperture of side ring (4) and the aperture ratio of ring-type pedestal (1) they are 3:1��4:1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521044084.5U CN205271770U (en) | 2015-12-15 | 2015-12-15 | Dicyclo resin bond diamond grinding wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521044084.5U CN205271770U (en) | 2015-12-15 | 2015-12-15 | Dicyclo resin bond diamond grinding wheel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205271770U true CN205271770U (en) | 2016-06-01 |
Family
ID=56056391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521044084.5U Active CN205271770U (en) | 2015-12-15 | 2015-12-15 | Dicyclo resin bond diamond grinding wheel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205271770U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111015532A (en) * | 2019-12-31 | 2020-04-17 | 珠海市巨海科技有限公司 | Polishing grinding wheel and manufacturing method thereof |
| CN114888728A (en) * | 2022-04-20 | 2022-08-12 | 中航天水高新磨具有限公司 | High-temperature-resistant high-speed grinding one-step formed grinding wheel and preparation process thereof |
-
2015
- 2015-12-15 CN CN201521044084.5U patent/CN205271770U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111015532A (en) * | 2019-12-31 | 2020-04-17 | 珠海市巨海科技有限公司 | Polishing grinding wheel and manufacturing method thereof |
| CN114888728A (en) * | 2022-04-20 | 2022-08-12 | 中航天水高新磨具有限公司 | High-temperature-resistant high-speed grinding one-step formed grinding wheel and preparation process thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106002633B (en) | A kind of compound dressing method of Vitrified Bond CBN Grinding Wheel | |
| CN106392908A (en) | Diamond grinding wheel with ceramic binders and production method thereof | |
| CN204053829U (en) | A kind of high temperature resistant Split-type grinding wheel | |
| CN205271770U (en) | Dicyclo resin bond diamond grinding wheel | |
| CN105856089A (en) | Grinding composite body and preparation method thereof | |
| CN108188948A (en) | A kind of multilayer abrasive grain abrasive band structure and its manufacturing method | |
| CN105014553B (en) | A kind of ceramic microcrystalline emery wheel and its manufacture method with high-strength grinding performance | |
| CN204604125U (en) | Plating hub type saw blade | |
| CN203426874U (en) | Resin binder and ceramic binder composite cubic boron nitride plane grinding wheel | |
| CN105731449A (en) | Preparation method of porous foamed diamond | |
| CN105215795A (en) | Non-crystaline amorphous metal product shaped face processing method | |
| CN204621856U (en) | A kind of novel metal binding agent diamond chamfering abrasive wheel | |
| CN102825558A (en) | Ceramic diamond grinding wheel doped with comminuted steel shot | |
| CN105345664A (en) | Superhard grinding wheel dressing tool for external grinding and dressing method | |
| CN205817619U (en) | A kind of diamond disk | |
| CN110395973B (en) | Ceramic abrasive | |
| CN104275584A (en) | Special cutter blade for high-precision ultralow-roughness mirror surface turning | |
| CN205271767U (en) | Polish with a waterstone metal resin diamond grinding wheel | |
| CN208020030U (en) | A kind of ceramic block and resin composite diamond flexibility mill | |
| CN205201318U (en) | Superhard grinding wheel dressing tool for cylindrical grinding | |
| CN205465779U (en) | Large granule grinds disc cutter head | |
| CN205271764U (en) | Ceramic chip dry grinding resin bond diamond grinding wheel | |
| CN205631039U (en) | Pressureless sintering cuts into slices futilely | |
| CN204604128U (en) | A kind of Buddha's warrior attendant stone fan line mill for jewelry polishing | |
| CN205835064U (en) | Ceramic tile biscuit rubbing down emery wheel and polishing and grinding apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |