CN205238701U - Full grey paperboard - Google Patents

Abstract

The utility model provides a full grey paperboard, includes grey paper top layer and sandwich layer, be equipped with the adhesive layer between ash paper top layer and the sandwich layer, the gross thickness of ash paper top layer and sandwich layer is 0.8-3.0mm, the sandwich layer includes a plurality of grey paper layers, ash paper layer includes three -layer ash paper, the thickness on ash paper top layer is 3-5 times of grey paper. Thereby since the gross thickness of grey paper top layer and sandwich layer be 0.8-3.0mm than general full grey paperboard's 0.55 -1.55mm thickness will 0.25 thick-1.45mm, and the thickness on its mellow lime paper top layer is 3-5 times of grey paper, the water droplet that the surface can be slowed down in so grey paper top layer enters into the sandwich layer and dissolves the corruption adhesive layer, and the sandwich layer also is difficult to wholly permeated by the water droplet, thereby sandwich layer and grey paper top layer and the inside delamination of emergence of sandwich layer have been reduced.

Description

A kind of full chipboard

Technical field

The utility model relates to field of papermaking, relates in particular to a kind of full chipboard.

Background technology

Full chipboard is to be produced by a kind of recycled waste paper. Product is divided into single ash, two ash, entirely grey, belongs to environmental protection type packing material. The complete derivative product of chipboard has: packaging box, advertisement plate, case and bag, bound book, receiver, sample, liner plate, dividing plate etc.

And existing full chipboard general grey paper that adopts equal thickness in the process of processing, although can reduce like this paper selecting step bringing due to the difference of grey paper sheet thickness, thereby reduce staff's workload, improved the operating efficiency of full chipboard. But, can cause like this paper sheet thickness of most surface of full chipboard thinner, thereby the surface once full chipboard has a small amount of water droplet to adhere to, water droplet will infiltrate full chipboard inside very soon, thereby easily the glue-line of full chipboard inside is dissolved, and then will there is delamination in this full chipboard.

Utility model content

The deficiency existing for prior art, the purpose of this utility model is to provide a kind of full chipboard that water droplet infiltrates that is difficult for.

For achieving the above object, the utility model provides following technical scheme: a kind of full chipboard, comprise grey paper top layer and sandwich layer, between described grey paper top layer and sandwich layer, be provided with adhesive layer, it is characterized in that: the gross thickness of described grey paper top layer and sandwich layer is 0.8～3.0mm, described sandwich layer comprises some grey paper layer, and described grey paper layer comprises three layers of grey paper, the thickness on described grey paper top layer is grey paper 3～5 times.

As preferably, between described grey paper top layer and sandwich layer and the fiber of sandwich layer inside mutually intersect.

As preferably, the surface fiber on described grey paper top layer is in same level height.

As preferably, described grey paper top layer is provided with casein layer.

As preferably, described adhesive layer is Pioloform, polyvinyl acetal layer.

The utlity model has following advantage: the gross thickness of grey paper top layer and sandwich layer is that 0.8～3.0mm is than the thick 0.25～1.45mm of the 0.55-1.55mm of general full chipboard, and wherein the thickness on grey paper top layer is grey paper 3～5 times, so grey paper top layer can be slowed down surperficial water droplet and be entered into sandwich layer dissolved corrosion adhesive layer, and sandwich layer is also not easy entirety and is permeated by water droplet, thereby sandwich layer and grey paper top layer and the inner generation of sandwich layer delamination are reduced.

Brief description of the drawings

Fig. 1 is a kind of structural representation of full chipboard;

Fig. 2 is the structural representation between grey paper top layer and sandwich layer;

Fig. 3 is the structural representation on grey paper top layer.

In figure: 1, grey paper top layer; 2, sandwich layer; 3, adhesive layer; 4, grey paper; 5, casein layer; 6, fiber; 7, surface fiber.

Detailed description of the invention

Referring to figs. 1 through Fig. 3, embodiment of the present utility model is described further.

A kind of full chipboard, its gross thickness is 0.8～3.0mm, comprise grey paper top layer 1 and sandwich layer 2, between ash paper top layer 1 and sandwich layer 2, be provided with adhesive layer 3, sandwich layer 2 comprises some grey paper layer, described grey paper layer comprises three layers of grey paper 4, between adjacent grey paper 4, is also provided with adhesive layer 3, and the thickness on grey paper top layer 1 is 3～5 times of grey paper 4.

Because the gross thickness of grey paper top layer 1 and sandwich layer 2 is that 0.8～3.0mm is than the thick 0.25～1.45mm of 0.55～1.55mm of general full chipboard, and wherein the thickness on grey paper top layer 1 is 3～5 times of grey paper 4, here the gross thickness of full chipboard is 2mm, and the thickness on grey paper top layer 1 is 5 times of grey paper 4. So grey paper top layer 1 can be slowed down surperficial water droplet relative efficiency and be entered into sandwich layer 2 and dissolved corrosion adhesive layer 3, and sandwich layer 2 is also not easy entirety and is permeated by water droplet, thereby has reduced sandwich layer 2 and grey paper top layer 1 and the inner delaminations that occur of sandwich layer 2.

Between ash paper top layer 1 and sandwich layer 2 and the fiber 6 of sandwich layer 2 inside mutually intersect, between ash paper top layer 1 and sandwich layer 2 and the fiber 6 of sandwich layer 2 inside mutually intersect, increase like this distribution area of adhesive layer 3, thereby the gluing firm degree of the grey paper 4 between adjacent or paper layer strengthens, and has further prevented the generation of delamination.

Simultaneously, the surface fiber 7 on ash paper top layer 1 fits tightly together to grey paper top layer 1, thereby the surface fiber 7 of entirety is in same level height, can improve like this surface flatness of full chipboard, thereby make the degree of skewness of full chipboard be less than 3mm, angularity is less than 1cm/m2, and then makes the surface of full chipboard Paint Gloss smooth, and aesthetics improves greatly.

1 top, ash paper top layer arranges casein layer 5, and because casein itself is water insoluble and organic solvent, but it has stronger water absorbing capacity simultaneously. So it will expand rapidly after casein absorbs airborne moisture, intermolecular gap will be reduced, thereby it has just been kept apart air and grey paper 4 top layers 1, air contacts with regard to more difficult and grey paper top layer 1 like this, not only avoided cardboard to make moist but can further grey paper top layer 1 aging, ensured the integrality of the long-term storage of full chipboard.

The characteristics such as selection polyvinyl formal layer is used as adhesive layer 3, is because polyvinyl formal is except having the characteristic of general Pioloform, polyvinyl acetal, and it is high that it also has transparency, ageing-resistant, shock-resistant. While being used on cardboard, it can not exert an influence to the color and luster of cardboard, and meanwhile, vinyl alcohol formal can be because of being exposed in air and quick aging has ensured that each ply of paper can be bonded together for a long time and delamination does not occur yet.

The above is only preferred embodiment of the present utility model, and protection domain of the present utility model is also not only confined to above-described embodiment, and all technical schemes belonging under the utility model thinking all belong to protection domain of the present utility model. It should be pointed out that for those skilled in the art, in the some improvements and modifications that do not depart under the utility model principle prerequisite, these improvements and modifications also should be considered as protection domain of the present utility model.

Claims (5)

1. a full chipboard, comprise grey paper top layer and sandwich layer, between described grey paper top layer and sandwich layer, be provided with adhesive layer, it is characterized in that: the gross thickness of described grey paper top layer and sandwich layer is 0.8～3.0mm, described sandwich layer comprises some grey paper layer, described grey paper layer comprises three layers of grey paper, the thickness on described grey paper top layer is grey paper 3～5 times.

2. the full chipboard of one according to claim 1, is characterized in that: between described grey paper top layer and sandwich layer and the fiber of sandwich layer inside mutually intersect.

3. the full chipboard of one according to claim 1 and 2, is characterized in that: the surface fiber on described grey paper top layer is in same level height.

4. the full chipboard of one according to claim 1, is characterized in that: described grey paper top layer is provided with casein layer.

5. according to the full chipboard of the one described in claim 1 or 4, it is characterized in that: described adhesive layer is Pioloform, polyvinyl acetal layer.