CN205232588U - A vacuum adsorption positioner that is used for accurate replacement of circuit board to process - Google Patents

A vacuum adsorption positioner that is used for accurate replacement of circuit board to process Download PDF

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Publication number
CN205232588U
CN205232588U CN201521063059.1U CN201521063059U CN205232588U CN 205232588 U CN205232588 U CN 205232588U CN 201521063059 U CN201521063059 U CN 201521063059U CN 205232588 U CN205232588 U CN 205232588U
Authority
CN
China
Prior art keywords
absorption
vacuum
wiring board
circuit board
pressing mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201521063059.1U
Other languages
Chinese (zh)
Inventor
徐登峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN COSUN ELECTRON TECHNOLOGY Co Ltd
Original Assignee
KUNSHAN COSUN ELECTRON TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN COSUN ELECTRON TECHNOLOGY Co Ltd filed Critical KUNSHAN COSUN ELECTRON TECHNOLOGY Co Ltd
Priority to CN201521063059.1U priority Critical patent/CN205232588U/en
Application granted granted Critical
Publication of CN205232588U publication Critical patent/CN205232588U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a vacuum adsorption positioner that is used for accurate replacement of circuit board to process, including suction table (3), it adsorbs through -hole (5) to be provided with the multiunit on suction table (3), still including adsorbing moulding -die (4), vacuum adsorption pipe (2) and vacuum pump (1), the circuit board is placed on suction table (3), it adopts flexible material to adsorb moulding -die (4), it covers the circuit board completely to adsorb moulding -die (4), the multiunit that vacuum pump (1) is passed through on vacuum adsorption pipe (2) and vacuum adsorption platform (3) adsorbs through -hole (5) intercommunication, suction table (3) and adsorb the extraction that air between moulding -die (4) passes through vacuum pump (1) and can adsorb the location with the circuit board by the vacuum production. The utility model discloses a mode of evacuation will be adsorbed the moulding -die and compressed tightly the circuit board, realize the location then, can be applied to and not have the circuit board replacement of location PIN hole class processing, practice thrift the cost, adopt flexible material can not crush the circuit board by pressure.

Description

The vacuum adsorption positioning apparatus of processing is replaced for wiring board precision
Technical field
The utility model relates to a kind of positioner, particularly relates to a kind of vacuum adsorption positioning apparatus replacing processing for wiring board precision.
Background technology
The existing locate mode be applied in wiring board replacement procedure for processing generally adopts pin, PIN to locate processing.As in a Chinese utility model patent of China, the authorized announcement date of this utility model is 2013-05-22, publication number is 202949647U, disclose a kind of circuit board positioning device, include base plate and several positioning element, base plate is provided with several location hole, positioning element and location hole suitable, positioning element is fixedly connected with base plate by location hole; This utility model utilizes location hole to realize being fixedly connected with of shop bolt and base plate, the object that can reach the production optimizing mould, the production adapting to plurality of specifications wiring board and save production cost, but, along with the development of technology,, there is novel wiring board in improving constantly of demand, this type of plate feature is that 1. size is less, typesetting is more, 2. without PIN hole, location.Existing like this locate mode cannot be applicable to the processing of this type of wiring board, mainly contains following shortcoming: 1. cannot process for the wiring board without PIN hole, location.2. when the plate that size is less, typesetting is more uses existing locate mode, localization tool makes difficulty, and cost is higher.
Utility model content
For overcoming above-mentioned shortcoming, the purpose of this utility model be to provide a kind of can efficient solution decision bit processing problems, the cost-saving vacuum adsorption positioning apparatus replacing processing for wiring board precision for the wiring board without PIN hole, location.
In order to reach above object, the technical solution adopted in the utility model is: a kind of vacuum adsorption positioning apparatus replacing processing for wiring board precision, comprise absorption platform, described absorption platform is provided with many group absorption through holes, also comprise absorption pressing mold, vacuum suction pipe and vacuum pump, wiring board is placed on described absorption platform, described absorption pressing mold adopts flexible material, described absorption pressing mold covers wiring board completely, described vacuum pump adsorbs through hole by vacuum suction pipe and many groups on vacuum absorbing platform and is communicated with, air between described absorption platform and absorption pressing mold can form vacuum by the extraction of vacuum pump and be adsorbed by wiring board and locate.The utility model adopts flexible material as absorption pressing mold, by the mode vacuumized, wiring board is compressed by absorption pressing mold, then location is realized, the wiring board that can be applicable to without PIN hole, location class replaces processing, in addition, the wiring board that, typesetting little for size is many also can adopt this kind of mode cost-saved; Adopt flexible material to damage wiring board by pressure, avoid the phenomenon of damaging wiring board because negative pressure is too large by pressure to occur.
Preferably, described absorption pressing mold is in flake, and described absorption pressing mold adopts flexible plastic diaphragm.Employing is laminar, is convenient to vacuumize be positioned on absorption platform by wiring board; Adopt soft plastic cement diaphragm, this material can be fitted wiring board preferably.
Preferably, the thickness of described absorption pressing mold is for being 0.5-1mm.
As further improvement of the utility model be, in order to ensure that vacuum adsorption positioning apparatus is comparatively clean and tidy, then described absorption platform hollow is arranged, and described many group absorption through holes are arranged on the upper surface of absorption platform, and described vacuum suction pipe is communicated with the absorption platform of hollow.Absorption platform is arranged in hollow, be arranged on absorption platform upper surface owing to organizing absorption through hole more, once vacuum pump starts, air then between absorption platform and absorption pressing mold successively by organizing the cavity of through hole, absorption platform more, finally lead to vacuum pump from vacuum suction pipe, like this, a vacuum suction pipe just can be used to complete the work of vacuumizing, without the need to the corresponding vacuum suction pipe of each absorption through hole, solve the problem that winding displacement is mixed and disorderly.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment.
In figure: 1-vacuum pump; 2-vacuum suction pipe; 3-absorption platform; 4-adsorbs pressing mold; 5-adsorbs through hole.
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in detail, to make advantage of the present utility model and feature can be easier to be readily appreciated by one skilled in the art, thus more explicit defining is made to protection range of the present utility model.
Shown in accompanying drawing 1, a kind of vacuum adsorption positioning apparatus replacing processing for wiring board precision in the present embodiment, comprise absorption platform 3, absorption platform 3 is provided with many group absorption through holes 5, in order to wiring board being located, this vacuum adsorption positioning apparatus also comprises absorption pressing mold 4, vacuum pump 1 and vacuum suction pipe 2, vacuum suction pipe 2 is provided with one, absorption platform 3 hollow is arranged, many groups of absorption through holes 5 are arranged on the upper surface of absorption platform 3, vacuum suction pipe 2 is communicated with the absorption platform 3 of hollow, vacuum pump 1 adsorbs through hole 5 by vacuum suction pipe 2 and many groups on vacuum absorbing platform 3 and is communicated with, wiring board is placed on absorption platform 3, absorption pressing mold 4 adopts flexible material, concrete, absorption pressing mold 4 is in flake, the thickness of absorption pressing mold 4 is for being 0.5-1mm, absorption pressing mold 4 adopts the flexible plastic diaphragm of wiring board of better fitting, absorption pressing mold 4 covers wiring board completely, air between absorption platform 3 and absorption pressing mold 4 can form vacuum by the extraction of vacuum pump 1 and be adsorbed by wiring board and locate.
Above execution mode is only for illustrating technical conceive of the present utility model and feature; its object is to allow person skilled in the art understand content of the present utility model and to be implemented; protection range of the present utility model can not be limited with this; all equivalences done according to the utility model Spirit Essence change or modify, and all should be encompassed in protection range of the present utility model.

Claims (4)

1. replace the vacuum adsorption positioning apparatus of processing for wiring board precision for one kind, comprise absorption platform (3), described absorption platform (3) is provided with many groups absorption through hole (5), it is characterized in that: also comprise absorption pressing mold (4), vacuum suction pipe (2) and vacuum pump (1), wiring board is placed on described absorption platform (3), described absorption pressing mold (4) adopts flexible material, described absorption pressing mold (4) covers wiring board completely, described vacuum pump (1) adsorbs through hole (5) by vacuum suction pipe (2) and many groups on vacuum absorbing platform (3) and is communicated with, air between described absorption platform (3) and absorption pressing mold (4) can form vacuum by the extraction of vacuum pump (1) and be adsorbed by wiring board and locate.
2. the vacuum adsorption positioning apparatus replacing processing for wiring board precision according to claim 1, is characterized in that: described absorption pressing mold (4) is in flake, and described absorption pressing mold (4) adopts flexible plastic diaphragm.
3. the vacuum adsorption positioning apparatus replacing processing for wiring board precision according to claim 2, is characterized in that: the thickness of described absorption pressing mold (4) is 0.5-1mm.
4. the vacuum adsorption positioning apparatus replacing processing for wiring board precision according to claim 1, it is characterized in that: described absorption platform (3) hollow is arranged, described many groups absorption through hole (5) are arranged on the upper surface of absorption platform (3), and described vacuum suction pipe (2) is communicated with the absorption platform (3) of hollow.
CN201521063059.1U 2015-12-18 2015-12-18 A vacuum adsorption positioner that is used for accurate replacement of circuit board to process Expired - Fee Related CN205232588U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201521063059.1U CN205232588U (en) 2015-12-18 2015-12-18 A vacuum adsorption positioner that is used for accurate replacement of circuit board to process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201521063059.1U CN205232588U (en) 2015-12-18 2015-12-18 A vacuum adsorption positioner that is used for accurate replacement of circuit board to process

Publications (1)

Publication Number Publication Date
CN205232588U true CN205232588U (en) 2016-05-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201521063059.1U Expired - Fee Related CN205232588U (en) 2015-12-18 2015-12-18 A vacuum adsorption positioner that is used for accurate replacement of circuit board to process

Country Status (1)

Country Link
CN (1) CN205232588U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106028680A (en) * 2016-07-28 2016-10-12 苏州高通机械科技有限公司 PCB transplanting and splicing fixture
CN106028681A (en) * 2016-07-28 2016-10-12 苏州高通机械科技有限公司 Novel PCB transplanting and splicing fixture
CN112533400A (en) * 2019-09-19 2021-03-19 宏启胜精密电子(秦皇岛)有限公司 Method for manufacturing circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106028680A (en) * 2016-07-28 2016-10-12 苏州高通机械科技有限公司 PCB transplanting and splicing fixture
CN106028681A (en) * 2016-07-28 2016-10-12 苏州高通机械科技有限公司 Novel PCB transplanting and splicing fixture
CN106028680B (en) * 2016-07-28 2019-02-19 苏州高通机械科技有限公司 A kind of PCB transplanting splicing jig
CN106028681B (en) * 2016-07-28 2019-02-19 苏州高通机械科技有限公司 A kind of novel PCB transplanting splicing jig
CN112533400A (en) * 2019-09-19 2021-03-19 宏启胜精密电子(秦皇岛)有限公司 Method for manufacturing circuit board

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Legal Events

Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160511

Termination date: 20171218

CF01 Termination of patent right due to non-payment of annual fee