CN205232560U - Double -deck PCB board dispels heat - Google Patents

Double -deck PCB board dispels heat Download PDF

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Publication number
CN205232560U
CN205232560U CN201520924948.6U CN201520924948U CN205232560U CN 205232560 U CN205232560 U CN 205232560U CN 201520924948 U CN201520924948 U CN 201520924948U CN 205232560 U CN205232560 U CN 205232560U
Authority
CN
China
Prior art keywords
carborundum
carborundum plate
heat
pcb board
usb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520924948.6U
Other languages
Chinese (zh)
Inventor
计志峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIAXING CENTURY ELECTRONICS CO Ltd
Original Assignee
JIAXING CENTURY ELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIAXING CENTURY ELECTRONICS CO Ltd filed Critical JIAXING CENTURY ELECTRONICS CO Ltd
Priority to CN201520924948.6U priority Critical patent/CN205232560U/en
Application granted granted Critical
Publication of CN205232560U publication Critical patent/CN205232560U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a double -deck PCB board dispels heat, including first carborundum board and U sections, first carborundum board both ends all are provided with first recess, first carborundum backboard face is provided with the hinge, install second carborundum board on the hinge, be provided with the second recess on the second carborundum board, second carborundum backboard face posts heat conduction silica gel sheet, heat conduction silica gel sheet inlays there is the heat pipe, all be provided with the silver foil wire on first carborundum board and the second carborundum board, all be provided with the female head of USB in first recess and the second recess, female head of USB and silver foil wire electric connection, the inside insulated wire that is provided with of U sections, the insulated wire both ends all link there is the public head of USB, the public head of USB is connected with the female head of USB, this double -deck PCB board dispels heat has outstanding heat -sinking capability.

Description

A kind of heat radiation double-layer PCB board
Technical field
The utility model relates to a kind of heat radiation double-layer PCB board.
Background technology
Printed circuit board, also known as printed circuit board (PCB), is the supplier of electronic devices and components electrical connection.Its development has the history of more than 100 year; Its design mainly layout design; Adopt the major advantage of circuit board to be the mistake greatly reducing wiring and assembling, improve the gentle productive labor rate of Automated water.
Before printed circuit board occurs, the interconnection between electronic component is all rely on electric wire directly connect and form complete circuit.In the present age, circuit board just exists as effective experimental tool, and printed circuit board (PCB) has become the status occupying empery in the electronics industry.
But current pcb board is due to heat dispersion deficiency, especially doubling plate, caloric value is very large, easily has influence on the life-span of the equipment on pcb board.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of heat radiation double-layer PCB board with outstanding heat-sinking capability.
For solving the problem, the utility model adopts following technical scheme:
A kind of heat radiation double-layer PCB board, comprise the first carborundum plate and U-shaped iron, described first carborundum plate two ends are provided with the first groove, the described first carborundum plate back side is provided with hinge, described hinge is provided with the second carborundum plate, described second carborundum plate is provided with the second groove, heat-conducting silica gel sheet is posted at the described second carborundum plate back side, described heat-conducting silica gel sheet is inlaid with heat pipe, described first carborundum plate and the second carborundum plate are provided with silver foil wire, USB female is provided with in described first groove and the second groove, described USB female and silver foil wire are electrically connected, described U-shaped iron inside is provided with insulated conductor, described insulated conductor two ends are all connected with USB male joint, described USB male joint is connected with USB female.
As preferably, described U-shaped iron is welded with connecting plate, facilitates user to connect.
As preferably, described second carborundum plate is provided with magnetic rubber pad, not only can plays certain position-limiting action, but also can prevent from because of misoperation, the second carborundum plate being broken.
As preferably, described U-shaped iron is provided with anti-interference magnet ring, has and inhale the ability that EMI absorbs magnet ring receipts electrostatic pulse ability and release electrostatic, prevent insulated conductor to be interfered.
As preferably, described hinge scribbles anti-static coatings, can lead and let out electrostatic pressure savings, avoid producing electric discharge and cause fire alarm or destroy electronic devices and components.
The beneficial effects of the utility model are: be connected by hinged mode with the second carborundum plate by the first carborundum plate, make that there is between the first carborundum plate and the second carborundum plate sufficient room, and post heat-conducting silica gel sheet at the second carborundum plate back side, heat-conducting silica gel sheet is inlaid with heat pipe, thus plays outstanding radiating effect.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of a kind of double-layer PCB board that dispels the heat of the utility model.
Embodiment
As shown in Figure 1, a kind of heat radiation double-layer PCB board, comprise the first carborundum plate 1 and U-shaped iron 2, described first carborundum plate 1 two ends are provided with the first groove 3, described first carborundum plate 1 back side is provided with hinge 4, described hinge 4 is provided with the second carborundum plate 5, described second carborundum plate 5 is provided with the second groove 6, heat-conducting silica gel sheet 7 is posted at described second carborundum plate 5 back side, described heat-conducting silica gel sheet 7 is inlaid with heat pipe 8, described first carborundum plate 1 and the second carborundum plate 5 are provided with silver foil wire 9, USB female (not shown) is provided with in described first groove 3 and the second groove 6, described USB female and silver foil wire 9 are electrically connected, described U-shaped iron 2 inside is provided with insulated conductor (not shown), described insulated conductor two ends are all connected with USB male joint 10, described USB male joint 10 is connected with USB female.
Described U-shaped iron 2 is welded with connecting plate 11, facilitates user to connect.
Described second carborundum plate 5 is provided with magnetic rubber pad 12, not only can plays certain position-limiting action, but also can prevent from because of misoperation, the second carborundum plate 5 being broken.
Described U-shaped iron 2 is provided with anti-interference magnet ring (not shown), there is the ability absorbing electrostatic pulse ability and release electrostatic, prevent insulated conductor to be interfered.
Described hinge 4 scribbles anti-static coatings (not shown), can lead and let out electrostatic pressure savings, avoid producing electric discharge and cause fire alarm or destroy electronic devices and components.
The beneficial effects of the utility model are: be connected by hinged mode with the second carborundum plate by the first carborundum plate, make that there is between the first carborundum plate and the second carborundum plate sufficient room, and post heat-conducting silica gel sheet at the second carborundum plate back side, heat-conducting silica gel sheet is inlaid with heat pipe, thus plays outstanding radiating effect.
The above, be only embodiment of the present utility model, but protection range of the present utility model is not limited thereto, and any change of expecting without creative work or replacement, all should be encompassed within protection range of the present utility model.

Claims (5)

1. a heat radiation double-layer PCB board, it is characterized in that: comprise the first carborundum plate and U-shaped iron, described first carborundum plate two ends are provided with the first groove, the described first carborundum plate back side is provided with hinge, described hinge is provided with the second carborundum plate, described second carborundum plate is provided with the second groove, heat-conducting silica gel sheet is posted at the described second carborundum plate back side, described heat-conducting silica gel sheet is inlaid with heat pipe, described first carborundum plate and the second carborundum plate are provided with silver foil wire, USB female is provided with in described first groove and the second groove, described USB female and silver foil wire are electrically connected, described U-shaped iron inside is provided with insulated conductor, described insulated conductor two ends are all connected with USB male joint, described USB male joint is connected with USB female.
2. heat radiation double-layer PCB board according to claim 1, is characterized in that: described U-shaped iron is welded with connecting plate.
3. heat radiation double-layer PCB board according to claim 2, is characterized in that: described second carborundum plate is provided with magnetic rubber pad.
4. heat radiation double-layer PCB board according to claim 3, is characterized in that: described U-shaped iron is provided with anti-interference magnet ring.
5. heat radiation double-layer PCB board according to claim 4, is characterized in that: described hinge scribbles anti-static coatings.
CN201520924948.6U 2015-11-19 2015-11-19 Double -deck PCB board dispels heat Expired - Fee Related CN205232560U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520924948.6U CN205232560U (en) 2015-11-19 2015-11-19 Double -deck PCB board dispels heat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520924948.6U CN205232560U (en) 2015-11-19 2015-11-19 Double -deck PCB board dispels heat

Publications (1)

Publication Number Publication Date
CN205232560U true CN205232560U (en) 2016-05-11

Family

ID=55907597

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520924948.6U Expired - Fee Related CN205232560U (en) 2015-11-19 2015-11-19 Double -deck PCB board dispels heat

Country Status (1)

Country Link
CN (1) CN205232560U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106231791A (en) * 2016-07-28 2016-12-14 广东欧珀移动通信有限公司 The circuit board of mobile terminal and the mobile terminal with it
CN108566729A (en) * 2018-06-25 2018-09-21 Oppo广东移动通信有限公司 Circuit board assemblies and electronic equipment with it

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106231791A (en) * 2016-07-28 2016-12-14 广东欧珀移动通信有限公司 The circuit board of mobile terminal and the mobile terminal with it
CN106231791B (en) * 2016-07-28 2019-02-05 Oppo广东移动通信有限公司 The circuit board of mobile terminal and mobile terminal with it
CN108566729A (en) * 2018-06-25 2018-09-21 Oppo广东移动通信有限公司 Circuit board assemblies and electronic equipment with it
CN108566729B (en) * 2018-06-25 2020-12-15 Oppo广东移动通信有限公司 Circuit board assembly and electronic equipment with same

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160511

Termination date: 20161119