CN205231034U - Board is peeled off to support plate - Google Patents
Board is peeled off to support plate Download PDFInfo
- Publication number
- CN205231034U CN205231034U CN201520890056.9U CN201520890056U CN205231034U CN 205231034 U CN205231034 U CN 205231034U CN 201520890056 U CN201520890056 U CN 201520890056U CN 205231034 U CN205231034 U CN 205231034U
- Authority
- CN
- China
- Prior art keywords
- spool
- support plate
- board
- lower platform
- thimble
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Abstract
The utility model relates to a board is peeled off to support plate, it includes upper mounting plate and lower platform, the upper mounting plate includes first spool (8), second spool (9) and third spool (10), install between first spool (8) and third spool (10) viscidity sticky tape (11), viscidity sticky tape (11) have sticky one ventricumbently, be provided with vacuum hole 5 down on the platform, the platform left and right sides all is provided with recess (3) down, be provided with thimble (4) of liftable in recess (3), both sides are provided with track (6) around the platform down, be provided with between front and back both sides track (6) scraper blade (7), scraper blade (7) both ends are connected with front and back both sides track (6) through the L type support (12) of two liftables respectively. The utility model relates to a board is peeled off to support plate, it not only can reduce the human cost, also can improve production efficiency simultaneously.
Description
Technical field
The utility model relates to a kind of support plate and peels off board, belongs to technical field of semiconductor encapsulation.
Background technology
Along with Electronic Packaging product is towards high density, miniaturization, high integration development, its package dimension is also more and more less, and its light, thin, little feature brings very large challenge to encapsulation technology.
For single layer substrate, substrate thickness is thin, and it is soft, needs to stick on a support plate in encapsulation process, and be beneficial to connect up and the processing of electronic component, wherein support plate has certain flexibility, and that can carry out to a certain degree is curling.After plastic packaging completes, then support plate is separated with substrate.The normal method adopting manually stripping at present, the method manually peeled off is an angle of first provoking carrier in substrate indentation, there, and then is torn it down by support plate along this angle, and the inapplicable batch production of the method, efficiency is lower.
Utility model content
Technical problem to be solved in the utility model provides a kind of support plate to peel off board for above-mentioned prior art, and it can not only reduce human cost, also can enhance productivity simultaneously.
The technical scheme in the invention for solving the above technical problem is: a kind of support plate peels off board, it comprises upper mounting plate and lower platform, described upper mounting plate comprises the first spool, the second spool and the 3rd spool, described first spool and the second spool are positioned on same level line, between described first spool and the 3rd spool, adhesive tape is installed, described adhesive tape is finally concentrated around to the 3rd spool from the first spool around to the second spool, and described adhesive tape sticking faces down; Described lower platform is provided with vacuum hole, product after plastic packaging is fixed by the mode that vacuumizes and lower platform, the described lower platform left and right sides is provided with groove, liftable thimble is provided with in described groove, before and after described lower platform, both sides are provided with track, be provided with scraper plate between the siding track of described front and back two, described scraper plate two ends are connected with front and back two siding track respectively by two liftable L-type support.
Described thimble head adopts level and smooth round end to design.
Described thimble both sides are provided with infrared sensing device.
Pulley is provided with bottom described L-type support.
Compared with prior art, the utility model has the advantage of:
A kind of support plate of the utility model peels off board, and it can not only reduce human cost, also can enhance productivity simultaneously.
Accompanying drawing explanation
Fig. 1 (a) ~ Fig. 1 (h) is the workflow diagram of a kind of support plate stripping of the utility model board.
Fig. 2 is that in the utility model, substrate is attached to the structural representation on support plate.
Fig. 3 is the structural representation that a kind of support plate of the utility model peels off board upper mounting plate.
Fig. 4 is the structural representation that a kind of support plate of the utility model peels off board lower platform.
Wherein:
Substrate 1
Support plate 2
Groove 3
Thimble 4
Vacuum hole 5
Track 6
Scraper plate 7
First spool 8
Second spool 9
3rd spool 10
Adhesive tape 11
L-type support 12.
Embodiment
Below in conjunction with accompanying drawing embodiment, the utility model is described in further detail.
As shown in Fig. 2 ~ Fig. 4, a kind of support plate in the present embodiment peels off board, it comprises upper mounting plate and lower platform, described upper mounting plate structure as shown in Figure 3, it comprises the first spool 8, second spool 9 and the 3rd spool 10, described first spool 8 and the second spool 9 are positioned on same level line, described 3rd spool 10 is positioned at the second spool 9 upper right side, between described first spool 8 and the 3rd spool 10, adhesive tape 11 is installed, described adhesive tape 11 is last from the first spool 8 around to the second spool 9 to be concentrated around to the 3rd spool 10, described adhesive tape 11 sticking faces down, described first spool 8 is installed adhesive tape volume, described second spool 9 plays the effect of stretching flat adhesive tape, described 3rd spool 10 plays the effect of collecting the support plate peeled off, described lower platform structure as shown in Figure 4, described lower platform is provided with vacuum hole 5, product after plastic packaging is fixed by the mode that vacuumizes and lower platform, the described lower platform left and right sides is provided with 3 grooves 3, and when product is placed, the breach on substrate is corresponding with groove 3 position on lower platform, liftable thimble 4 is provided with in described groove 3, described thimble 4 head adopts level and smooth round end to design, and thimble 4 both sides are provided with infrared sensing device, and when thimble 4 rises, infrared sensing device is started working, before and after lower platform, both sides are provided with track 6, scraper plate 7 is provided with between described front and back two siding track 6, described scraper plate 7 two ends are connected with front and back two siding track 6 respectively by two liftable L-type support 12, decline when scraper plate 7 blocks infrared sensing device back center 4 near thimble 4, described scraper plate 7 is for there being the sheet plastic of certain rigidity, when carrying out support plate and being separated, according to product structure, plastic packaging material thickness, substrate thickness etc., setup parameter L-type support 12 lifting heights, makes scraper plate 7 a little more than substrate edges, and described L-type support 12 is moved around by the left and right on lower platform of the pulley driving scraper plate 7 bottom it, the height of scraper plate 7 can be changed flexibly, to adapt to different product structures by liftable L-type support 12.
Utilize above-mentioned support plate to peel off a method for board stripping support plate, it comprises the following steps:
Step one, see Fig. 1 (a), get a substrate and a support plate, the described substrate left and right sides is respectively arranged with 3 breach, and with viscosity glue on support plate, substrate is attached on support plate by tack adhesive, then carries out plastic packaging material plastic packaging; Described support plate is slightly larger than substrate, and as shown in Figure 2, in encapsulation process, support plate plays carrying effect;
Step 2, see Fig. 1 (b), by the product after plastic packaging, support plate be placed on upward support plate peel off board lower platform on, open vacuum plant, fixed product;
Step 3, see Fig. 1 (c), lower platform left and right sides thimble rises, and infrared sensing device starts to start, and the distance of thimble jack-up support plate is slightly larger than the thickness of scraper plate; Then regulate the L-type support height of scraper plate, make scraper plate lifting heights a little more than substrate edges, scraper plate starts right-to-left and moves;
Step 4, see Fig. 1 (d), when moving to right groove position when scraper plate and block infrared ray near thimble, right side thimble declines, and simultaneously scraper plate continues to be moved to the left;
Step 5, see Fig. 1 (e), when scraper plate move to left groove position block infrared ray near thimble time, left side thimble decline;
Step 6, see Fig. 1 (f), scraper plate continues to shift out left groove left, and simultaneously scraper plate declines, and now support plate completes initial gross separation with substrate;
Step 7, see Fig. 1 (g), upper mounting plate moves down, and is adhered fixed by support plate on the adhesive tape between the first spool and the second spool;
Step 8, see Fig. 1 (h), upper mounting plate to move, then rotate the 3rd spool 10, be wound up into by discarded support plate on the 3rd spool 10, the first spool 8 carries new adhesive tape, for next support plate separation process is prepared simultaneously.
For different substrate length, width, described lower platform can be changed flexibly.
In addition to the implementation, the utility model also includes other execution modes, the technical scheme that all employing equivalents or equivalent substitute mode are formed, within the protection range that all should fall into the utility model claim.
Claims (4)
1. a support plate peels off board, it is characterized in that: it comprises upper mounting plate and lower platform, described upper mounting plate comprises the first spool (8), the second spool (9) and the 3rd spool (10), described first spool (8) and the second spool (9) are positioned on same level line, between described first spool (8) and the 3rd spool (10), adhesive tape (11) is installed, described adhesive tape (11) is finally concentrated around to the 3rd spool (10) from the first spool (8) around to the second spool (9), and described adhesive tape (11) sticking faces down; Described lower platform is provided with vacuum hole (5), product after plastic packaging is fixed by the mode that vacuumizes and lower platform, the described lower platform left and right sides is provided with groove (3), liftable thimble (4) is provided with in described groove (3), before and after described lower platform, both sides are provided with track (6), be provided with scraper plate (7) between described front and back two siding track (6), described scraper plate (7) two ends are connected with front and back two siding track (6) respectively by two liftable L-type support (12).
2. a kind of support plate according to claim 1 peels off board, it is characterized in that: described thimble (4) head adopts level and smooth round end to design.
3. a kind of support plate according to claim 1 peels off board, it is characterized in that: described thimble (4) both sides are provided with infrared sensing device.
4. a kind of support plate according to claim 1 peels off board, it is characterized in that: described L-type support (12) bottom is provided with pulley.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520890056.9U CN205231034U (en) | 2015-11-09 | 2015-11-09 | Board is peeled off to support plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520890056.9U CN205231034U (en) | 2015-11-09 | 2015-11-09 | Board is peeled off to support plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205231034U true CN205231034U (en) | 2016-05-11 |
Family
ID=55906080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520890056.9U Withdrawn - After Issue CN205231034U (en) | 2015-11-09 | 2015-11-09 | Board is peeled off to support plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205231034U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105280555A (en) * | 2015-11-09 | 2016-01-27 | 江苏长电科技股份有限公司 | Carrier plate stripping machine table and method for stripping carrier plate by using the same |
-
2015
- 2015-11-09 CN CN201520890056.9U patent/CN205231034U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105280555A (en) * | 2015-11-09 | 2016-01-27 | 江苏长电科技股份有限公司 | Carrier plate stripping machine table and method for stripping carrier plate by using the same |
| CN105280555B (en) * | 2015-11-09 | 2017-09-26 | 江苏长电科技股份有限公司 | A kind of method that support plate is peeled off board and support plate is peeled off using it |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160511 Effective date of abandoning: 20170926 |
|
| AV01 | Patent right actively abandoned |