CN205192445U - Optics three -dimensional imaging device - Google Patents
Optics three -dimensional imaging device Download PDFInfo
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- CN205192445U CN205192445U CN201521030458.8U CN201521030458U CN205192445U CN 205192445 U CN205192445 U CN 205192445U CN 201521030458 U CN201521030458 U CN 201521030458U CN 205192445 U CN205192445 U CN 205192445U
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Abstract
The utility model provides an optics three -dimensional imaging device, this optics three -dimensional imaging device of includes: the optical microscope system for the micro - light path that the object was awaited measuring in the formation obtains the planar coordinates signal of object awaits measuring, three -dimensional surface imaging module, with the optical microscope headtotail for generate and interfere the light path and obtain through once scanning to survey the high coordinate signal of every pixel in the whole visual field of the object that awaits measuring, and will the planar coordinates signal with high coordinate signal is the direct three -dimensional image who generates and export the object that awaits measuring after the computing to realize quick three -dimensional surface imaging, and actuating mechanism, with await measuring the object or three -dimensional surface imaging module is connected, and it is right to be used for realizing the scanning of optical axis orientation is followed to the object that awaits measuring.
Description
Technical field
The utility model relates to a kind of optical 3-dimensional imaging device, particularly a kind of hypervelocity optics three-dimensional image forming apparatus.
Background technology
Along with the raising that each technical fields such as industrial processes production, safety check, product quality monitoring require Product processing, the requirement of every profession and trade to examination and controlling precision and speed is also more and more higher.Meanwhile, the detection demand of each field to three-dimensional appearance also gets more and more, and therefore, superfast high-precision optical D surface contouring technology is the technology trends that futurity industry detects.For different applications, rapid three dimensional imaging technology also should possess configuration flexibility and the integration of superelevation, that is, rapid three dimensional imaging technology will be integrated in the production line of every field, the most cheap solution is upgraded on existing Plane Detecting Technique, realizes low input high production.
Conventional white light interferometer, the 3 d surface topography utilizing optical interference circuit and CCD camera to realize is measured.The mensuration of the degree of depth is realized by the change of detection interference relation, this test needs to do the point by point scanning in XY direction to sample surfaces and z direction is successively scanned, and each scanning plane needs to export a large amount of data, therefore the speed scanned is very slow, and for large-area scanning, need to do long image mosaic, the time of whole test can increase greatly.This technology is also higher to operating environment requirements, particularly damping, and sample stage can not have too large vibration.
Lens type atomic force microscope, implementation is install atomic force microscopy module on the object lens of optical microscope, this module comprises atomic force probe, miniature XY displacement bimorph platform and data receiver, transmit port, the imaging function of optical microscope is utilized to observe sample, recycle atomic force microscopy module after finding region to be measured and three-dimensional appearance sign is carried out to region to be measured, Measurement Resolution can higher than optical imagery resolution, but because point by point scanning and probe-type survey quantitative limitation will be done by the motion of displacement platform in XY direction, the measurement range of this method is little, XY only has in direction a hundreds of micron, Z-direction only has tens microns, three-dimensional imaging needs probe in the point by point scanning of XY direction, Measuring Time is very long.The time of usual survey one width three-dimensional appearance figure is the time of dozens of minutes.
Common focus point migration three-dimensional imaging instrument, utilize the scanning of focused light passages and laser altogether to realize the three-dimensional imaging of sample surfaces, this imaging technique can realize the resolution of superelevation.But laser needs to change focussing plane, successively scans, the burnt Z-direction scanning of each copolymerization can only obtain the data of single-layer single-point, so just makes image taking speed reduce greatly.
Three-coordinates measuring machine, can the 3 D stereo surface topography of measurement component, but measuring process carries out point-to-point measurement to the surface of measured object, and the time wanting the three-dimensional appearance of the entirety measuring parts to need is very long.Because volume is comparatively large, this Integration ofTechnology needs larger space to producing on line, and needs accurate three-dimensional mobile control, and measuring accuracy cannot reach below micron simultaneously.Be used in the measurement of larger part 3-D solid structure.
Cubic light three-dimensional imaging, utilize cubic light imaging can realize the imaging of exploded perspective profile, this technology needs the position repeatedly configuring light source, and such Measuring Time just cannot shorten, and meanwhile, measuring accuracy is the highest can only arrive several micron.Be suitable for larger piece surface three-dimensional imaging.Once part diminishes, substantially cannot measure, and piece surface needs to make marks in advance.
Current existing high-precision three-dimensional imaging device all cannot overcome this bottleneck of speed, and how realizing quick high accuracy three-dimensional imaging on the basis of existing technology becomes industrial and that scientific research field is urgent demand.
Utility model content
Technical problem to be solved in the utility model is the above-mentioned defect for prior art, and provide a kind of hypervelocity optics three-dimensional image forming apparatus, on the basis of white light interference, integrated high-speed three-dimensional imaging module, realizes quick high accuracy three-dimensional imaging.
To achieve these goals, the utility model provides a kind of optical 3-dimensional imaging device, wherein, comprising:
Optical microscope system, for generating the micro-light path of object under test and obtaining the planimetric coordinates signal of described object under test;
Three-dimensional surface image-forming module, be connected with described optical microscope system, for generating optical interference circuit and being detected the height coordinate signal obtaining each pixel in the whole visual field of described object under test by single pass, and described planimetric coordinates signal and described height coordinate signal are processed rear direct generation as calculated and exports the 3-D view of object under test, to realize quick three-dimensional surface imaging; And driving mechanism, be connected with described object under test or described three-dimensional surface image-forming module, for realizing the scanning of described object under test along optical axis direction.
Above-mentioned optical 3-dimensional imaging device, wherein, described optical microscope system is optical microscope, optical loupes or object lens.
Above-mentioned optical 3-dimensional imaging device, wherein, described three-dimensional surface image-forming module comprises:
White light source, for providing the light source of three-dimensional surface imaging;
Optical interference circuit, for generating optical interference circuit and being detected the height coordinate signal obtaining each pixel in the whole visual field of described object under test by single pass;
Array cmos sensor, for receiving the signal of described optical interference circuit and output plane coordinate signal and described height coordinate signal; And
Intelligence pixel chip, after described planimetric coordinates signal and described height coordinate signal being carried out to the calculating of background signal compensation, lock-in amplify and height coordinate, generates described 3-D view and exports.
Above-mentioned optical 3-dimensional imaging device, wherein, described optical interference circuit comprises:
Launch light path, comprise the first collimation prism and spectroscope, described first collimation prism is arranged between described white light source and described spectroscope, light path through above-mentioned first collimation prism is divided into the first light path vertically downward and level the second light path left by described spectroscope, described first light path for detecting described object under test, described second light path for the formation of interference light to obtain described height coordinate signal;
Reference path, comprise reference mirror, the second collimation or focus prism and 45 degree of catoptrons, described second collimation or focus prism are arranged between described 45 degree of catoptrons and described reference mirror, described 45 degree of catoptrons are arranged relative to described spectroscope, and the light of described second light path enters described spectroscope after described 45 degree of catoptrons, the second collimation or focus prism and the reflection of described reference mirror; And
Detection light path, comprises the 3rd collimation or focus prism, is arranged between described spectroscope and described array cmos sensor, for the signal of described reference path and described first light path is delivered to described array cmos sensor.
Above-mentioned optical 3-dimensional imaging device, wherein, described reference path also comprises center intensity filtrator, is arranged between described 45 degree of catoptrons and described spectroscope.
Above-mentioned optical 3-dimensional imaging device, wherein, described reference path also comprises compensating plate, is arranged on described 45 degree of catoptrons and described second and collimates or between focus prism.
Above-mentioned optical 3-dimensional imaging device, wherein, described detection light path also comprises the optics aperture for auxiliary collimation and signal optimizing, be arranged on described spectroscope and described 3rd collimation or focus prism between.
Above-mentioned optical 3-dimensional imaging device, wherein, described driving mechanism is drive motor, and described drive motor is connected with described reference mirror, moves along optical axis to drive described reference mirror.
Above-mentioned optical 3-dimensional imaging device, wherein, described optical microscope system is optical microscope, comprise imaging optical path and observation light path, described imaging optical path comprises imaging spectroscopes and object lens, described observation light path comprises eyepiece, and described imaging spectroscopes is just arranged described first light path, and described object lens are arranged on immediately below described imaging spectroscopes.
Above-mentioned optical 3-dimensional imaging device, wherein, described driving mechanism is drive motor, and described drive motor is connected with the displacement platform of described object under test, moves along optical axis to drive described object under test.
Technique effect of the present utility model is:
Hypervelocity optics three-dimensional image forming apparatus of the present utility model, relate to optical microscopy, parallel optical coherent imaging technology (pOCT) (see EuropeanpatentapplicaitionfromHeliotisAG, and Smart Image primitive matrix column Detection Techniques pantentNo.EP1887312A1), integrated hypervelocity three-dimensional imaging module on the basis of plane microtechnic, optical microphotograph equipment is allowed to realize hypervelocity high precision, particularly the three-dimensional imaging function of short transverse (Z-direction) nanometer resolution, is applicable to the field such as scientific research and commercial production.The utility model image taking speed is ultrafast, areas imaging can very Datong District time ensure precision very high, maximum field of view can reach millimeter, and XY directional resolution can reach micron level.Z-direction measurement range can reach millimeter, and Z-direction resolution can reach Nano grade.Both met application demand, reduced realizing cost simultaneously.
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail, but not as to restriction of the present utility model.
Accompanying drawing explanation
Fig. 1 is the three-dimensional surface imaging schematic diagram of the utility model one embodiment;
Fig. 2 is the utility model one embodiment principle of work schematic diagram;
Fig. 3 is the three-dimensional image forming apparatus structural representation of the utility model one embodiment;
Fig. 4 is the three-dimensional surface image-forming module structural representation of the utility model one embodiment;
Fig. 5 is the three-dimensional image forming apparatus structural representation of the utility model one embodiment;
Fig. 6 is the three-dimensional image forming apparatus structural representation of another embodiment of the utility model.
Wherein, Reference numeral
10 three-dimensional surface image-forming modules
1 center intensity filtrator
2 white light sources
3 first collimation prisms
4 launch light path
5 spectroscopes
6 optics apertures
7 detection light paths
8 the 3rd collimation or focus prisms
9 array cmos sensors
1145 degree of catoptrons
12 compensating plates
13 reference paths
14 second collimation or focus prisms
15 reference mirrors
16 intelligent pixel chip
17 optical interference circuits
18 multimode optical fibers
20 optical microscope systems
21 convex lens
22 imaging spectroscopes
23 object lens
24 eyepieces
30 driving mechanisms
40 objects under test
50 imaging optical paths
60 displacement platforms
70 mechanical arms
Embodiment
Below in conjunction with accompanying drawing, structural principle of the present utility model and principle of work are described in detail:
See the three-dimensional surface imaging schematic diagram that Fig. 1-Fig. 3, Fig. 1 are the utility model one embodiment, Fig. 2 is the utility model one embodiment principle of work schematic diagram, and Fig. 3 is the three-dimensional image forming apparatus structural representation of the utility model one embodiment.Optical 3-dimensional imaging device of the present utility model, comprising: optical microscope system 20, for generating the micro-light path of object under test 40 and obtaining the planimetric coordinates signal of described object under test 40; Three-dimensional surface image-forming module 10, be connected with described optical microscope system 20, for generating optical interference circuit 17 and being detected the height coordinate signal obtaining each pixel in the described whole visual field of object under test 40 by single pass, and described planimetric coordinates signal and described height coordinate signal are processed rear direct generation as calculated and exports the 3-D view of object under test 40, to realize quick three-dimensional surface imaging; And driving mechanism 30, be connected with described object under test 40 or described three-dimensional surface image-forming module 10, for realizing the scanning of described object under test 40 along optical axis direction.Described driving mechanism 30 is preferably drive motor, described drive motor can be connected with described reference mirror 15, move along optical axis to drive described reference mirror 15, or described drive motor can be connected with the displacement platform 60 of described object under test 40, move along optical axis to drive described object under test 40.Or as shown in Figure 2, this driving mechanism 30 also can adopt three-dimensional machinery arm 70, is connected with displacement platform 60, realize by mobile this displacement platform 60 that drives of this mechanical arm 70 motion needed.
See the three-dimensional surface image-forming module structural representation that Fig. 4, Fig. 4 are the utility model one embodiment.In the present embodiment, described three-dimensional surface image-forming module 10 comprises: white light source 2, for providing the light source of three-dimensional surface imaging; Optical interference circuit 17, for generating interference light and being detected the height coordinate signal obtaining each pixel in the described whole visual field of object under test 40 by single pass; Array cmos sensor 9, for receiving the signal of described optical interference circuit 17 and output plane coordinate signal and described height coordinate signal; And intelligent pixel chip 16, after described planimetric coordinates signal and described height coordinate signal being carried out to the calculating of background signal compensation, lock-in amplify and height coordinate, generate described 3-D view and export.
In the present embodiment, described optical interference circuit 17 comprises: launch light path 4, comprise the first collimation prism 3 and spectroscope 5, described first collimation prism 3 is arranged between described white light source 2 and described spectroscope 5, and be connected with described white light source 2 by multimode optical fiber 18, light path through above-mentioned first collimation prism 3 is divided into the first light path vertically downward and level the second light path left by described spectroscope 5, described first light path is for detecting described object under test 40, through the rear i.e. imaging optical path 50 of optical microscope system 20, described second light path for the formation of interference light to obtain described height coordinate signal, reference path 13, comprise reference mirror 15, second to collimate or focus prism 14 and 45 degree of catoptrons 11, described second collimation or focus prism 14 are arranged between described 45 degree of catoptrons 11 and described reference mirror 15, described 45 degree of catoptrons 11 are arranged relative to described spectroscope 5, and the light of described second light path enters described spectroscope 5 after described 45 degree of catoptrons 11, second collimation or focus prism 14 and described reference mirror 15 reflection, and detection light path 7, comprise the 3rd collimation or focus prism 8, be arranged between described spectroscope 5 and described array cmos sensor 9, for the signal of described reference path 13 and described imaging optical path 50 is delivered to described array cmos sensor 9.
Wherein, described reference path 13 also can comprise center intensity filtrator 1, is arranged between described 45 degree of catoptrons 11 and described spectroscope 5.Described reference path 13 also can comprise compensating plate 12, is arranged on described 45 degree of catoptrons 11 and described second and collimates or between focus prism 14.Described detection light path 7 also can comprise the optics aperture 6 for auxiliary collimation and signal optimizing, be arranged on described spectroscope 5 and described 3rd collimation or focus prism 8 between.
In the utility model, described optical microscope system 20 is optical microscope, optical loupes or object lens.See the three-dimensional image forming apparatus structural representation that Fig. 5, Fig. 5 are the utility model one embodiment.In the present embodiment, described optical microscope system 20 is optical microscope, comprise imaging optical path 50 and observation light path, described imaging optical path comprises imaging spectroscopes 22 and object lens 23, described observation light path comprises eyepiece 24, described imaging spectroscopes 22 is just arranged described first light path, and described object lens 23 are arranged on immediately below described imaging spectroscopes 22.See the three-dimensional image forming apparatus structural representation that Fig. 6, Fig. 6 are another embodiment of the utility model.In this embodiment, described optical microscope system 20 is convex lens 21, and these convex lens 21 are just arranged described first light path.
Optical 3-dimensional imaging device of the present utility model, comprises following job step:
Step S100, preparation imaging, in microscope, connect cone for the interface of the CCD camera of imaging or eyepiece 24, the other end of described cone is connected with three-dimensional surface image-forming module 10; Particularly, can take off microscope Central Plains has CCD camera for imaging or eyepiece 24, and at original interface connection activity cone, the cone other end is connected with high speed three-dimensional surface image-forming module 10;
Step S200, drive motor for driving described three-dimensional surface image-forming module 10 or described object under test 40 movement is installed, adjust and the operation angle fixing described drive motor with the plane orthogonal to be measured of the moving direction and object under test 40 that ensure described drive motor; The present embodiment can install the motor of mechanical fastening system in order to the movement of fixed drive three-dimensional imaging module on microscope fuselage, and adjustment fixed angle ensures moving direction and the testing sample plane orthogonal of drive motor; Or, institute's translation stage 60 is connected with three-dimensional machinery arm 70, realizes by mobile this displacement platform 60 that drives of this mechanical arm 70 motion needed;
Step S300, the data transmission port of the intelligent pixel chip 16 of described three-dimensional surface image-forming module 10 is connected to computing machine, connect the driving port of described drive motor and control port to direct current driving power supply and electric machine controller simultaneously, and electric machine controller is connected with described computing machine, the driver of described drive motor is set, with the movement of command displacement platform 60, thus control the movement of described object under test 40, the signal handler of described intelligent pixel chip 16 is set simultaneously; And
Step S400, described microscopical adjustment of focusing system is utilized to regulate the focal length of described object under test 40 imaging (now, microscopical background light source can be replaced by the low-coherence light source in three-dimensional surface image-forming module 10 and white light source 2), make three-dimensional surface image-forming module 10 can blur-free imaging, the region of three-dimensional imaging is needed to move in target area described object under test 40, this area size and position by microscope magnifications and light source focus on object under test 40 plane position determine, just can manipulate displacement platform 60 after choosing imaging region and prolong optical axis direction scanning, described object under test 40 is scanned along optical axis direction, and the intelligent pixel chip 16 controlling three-dimensional surface image-forming module 10 receives and processing signals, the signal that three-dimensional surface image-forming module 10 receives directly does background signal compensation by intelligent pixel chip 16, the operations such as lock-in amplify and elevation information calculating, then through data line transfer to computer export imaging.Whereby, the utility model obtains the height coordinate signal of each pixel in the described whole visual field of object under test 40 by single pass detection, and directly generates the 3-D view of object under test 40 as calculated after process and be transferred to described computing machine and export three-dimensional surface imaging fast.
The utility model installs high speed three-dimensional surface image-forming module in the image-receptive end or light path of optical microscope, low-coherence light source in three-dimensional surface image-forming module can launch two beamwidth spectrum visible rays to object under test and reference planes, the reflected light of object under test and reference light are interfering phenomenon through spectroscope, utilize displacement platform to move reference planes, the light path of reflected light is changed, and so the reflected light of object under test and the coherent relationships of reference light just can reflect the elevation information of object under test.The signal that sensor array in three-dimensional surface image-forming module receives is for data processing by intelligent pixel chip, is then transferred to computing machine and realizes quick three-dimensional surface imaging.Optical interference circuit can be Michelson formula optical interference circuit, also can be other any two-beam interference light paths such as Mirau optical interference circuit, and the present embodiment illustrates for the interference of Michelson formula.This intelligent pixel chip can each array element receives on parallel processing array formula cmos sensor detectable signal, the corresponding CMOS sensor array unit of each chip unit, as shown in Figure 1, contents processing comprise signal interference relation decoding, phase-locked, amplify, signal calculate and export.The high speed three-dimensional surface image-forming module of the utility model installation of modular on ordinary optical microscope can make optical microscope realize ultrafast surface three dimension imaging.
Certainly; the utility model also can have other various embodiments; when not deviating from the utility model spirit and essence thereof; those of ordinary skill in the art are when making various corresponding change and distortion according to the utility model, but these change accordingly and are out of shape the protection domain that all should belong to the claim appended by the utility model.
Claims (10)
1. an optical 3-dimensional imaging device, is characterized in that, comprising:
Optical microscope system, for generating the micro-light path of object under test and obtaining the planimetric coordinates signal of described object under test;
Three-dimensional surface image-forming module, be connected with described optical microscope system, for generating optical interference circuit and being detected the height coordinate signal obtaining each pixel in the whole visual field of described object under test by single pass, and described planimetric coordinates signal and described height coordinate signal are processed rear direct generation as calculated and exports the 3-D view of object under test, to realize quick three-dimensional surface imaging; And
Driving mechanism, is connected with described object under test or described three-dimensional surface image-forming module, for realizing the scanning of described object under test along optical axis direction.
2. optical 3-dimensional imaging device as claimed in claim 1, it is characterized in that, described optical microscope system is optical microscope, optical loupes or object lens.
3. optical 3-dimensional imaging device as claimed in claim 1 or 2, it is characterized in that, described three-dimensional surface image-forming module comprises:
White light source, for providing the light source of three-dimensional surface imaging;
Optical interference circuit, for generating optical interference circuit and being detected the height coordinate signal obtaining each pixel in the whole visual field of described object under test by single pass;
Array cmos sensor, for receiving the signal of described optical interference circuit and output plane coordinate signal and described height coordinate signal; And
Intelligence pixel chip, after described planimetric coordinates signal and described height coordinate signal being carried out to the calculating of background signal compensation, lock-in amplify and height coordinate, generates described 3-D view and exports.
4. optical 3-dimensional imaging device as claimed in claim 3, it is characterized in that, described optical interference circuit comprises:
Launch light path, comprise the first collimation prism and spectroscope, described first collimation prism is arranged between described white light source and described spectroscope, light path through above-mentioned first collimation prism is divided into the first light path vertically downward and level the second light path left by described spectroscope, described first light path for detecting described object under test, described second light path for the formation of interference light to obtain described height coordinate signal;
Reference path, comprise reference mirror, the second collimation or focus prism and 45 degree of catoptrons, described second collimation or focus prism are arranged between described 45 degree of catoptrons and described reference mirror, described 45 degree of catoptrons are arranged relative to described spectroscope, and the light of described second light path enters described spectroscope after described 45 degree of catoptrons, the second collimation or focus prism and the reflection of described reference mirror; And
Detection light path, comprises the 3rd collimation or focus prism, is arranged between described spectroscope and described array cmos sensor, for the signal of described reference path and described first light path is delivered to described array cmos sensor.
5. optical 3-dimensional imaging device as claimed in claim 4, it is characterized in that, described reference path also comprises center intensity filtrator, is arranged between described 45 degree of catoptrons and described spectroscope.
6. optical 3-dimensional imaging device as claimed in claim 4, it is characterized in that, described reference path also comprises compensating plate, is arranged on described 45 degree of catoptrons and described second and collimates or between focus prism.
7. optical 3-dimensional imaging device as claimed in claim 4, it is characterized in that, described detection light path also comprises the optics aperture for auxiliary collimation and signal optimizing, is arranged between described spectroscope and described 3rd collimation or focus prism.
8. optical 3-dimensional imaging device as claimed in claim 4, it is characterized in that, described driving mechanism is drive motor, and described drive motor is connected with described reference mirror, moves along optical axis to drive described reference mirror.
9. optical 3-dimensional imaging device as claimed in claim 4, it is characterized in that, described optical microscope system is optical microscope, comprise imaging optical path and observation light path, described imaging optical path comprises imaging spectroscopes and object lens, described observation light path comprises eyepiece, and described imaging spectroscopes is just arranged described first light path, and described object lens are arranged on immediately below described imaging spectroscopes.
10. optical 3-dimensional imaging device as claimed in claim 1, it is characterized in that, described driving mechanism is drive motor, and described drive motor is connected with the displacement platform of described object under test, moves along optical axis to drive described object under test.
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| CN201521030458.8U CN205192445U (en) | 2015-12-10 | 2015-12-10 | Optics three -dimensional imaging device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105423947A (en) * | 2015-12-10 | 2016-03-23 | 常州雷欧仪器有限公司 | Optical three-dimensional imaging device and imaging method thereof |
| CN108507677A (en) * | 2017-02-27 | 2018-09-07 | 北京航空航天大学 | It is a kind of to synchronize the detection system for obtaining single-point spectrum and three-dimensional data |
| CN111077437A (en) * | 2020-01-17 | 2020-04-28 | 天津市滨海新区军民融合创新研究院 | Device and method for assisting accurate positioning of integrated circuit near-field scanner |
| CN111854638A (en) * | 2020-07-23 | 2020-10-30 | 华中科技大学 | Cross-scale micro-nano structure three-dimensional measurement device and measurement method |
-
2015
- 2015-12-10 CN CN201521030458.8U patent/CN205192445U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105423947A (en) * | 2015-12-10 | 2016-03-23 | 常州雷欧仪器有限公司 | Optical three-dimensional imaging device and imaging method thereof |
| CN108507677A (en) * | 2017-02-27 | 2018-09-07 | 北京航空航天大学 | It is a kind of to synchronize the detection system for obtaining single-point spectrum and three-dimensional data |
| CN111077437A (en) * | 2020-01-17 | 2020-04-28 | 天津市滨海新区军民融合创新研究院 | Device and method for assisting accurate positioning of integrated circuit near-field scanner |
| CN111854638A (en) * | 2020-07-23 | 2020-10-30 | 华中科技大学 | Cross-scale micro-nano structure three-dimensional measurement device and measurement method |
| CN111854638B (en) * | 2020-07-23 | 2021-06-04 | 华中科技大学 | Cross-scale micro-nano structure three-dimensional measurement device and measurement method |
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Effective date of registration: 20220121 Address after: 201807 room jt22541, building 4, zone B, No. 925, Yecheng Road, industrial zone, Jiading District, Shanghai Patentee after: Baiji Nanotechnology (Shanghai) Co.,Ltd. Address before: 213000 Room 502, building 16, Tian'an Digital City, No. 588, Changwu South Road, Wujin high tech Industrial Development Zone, Changzhou City, Jiangsu Province Patentee before: CHANGZHOU LEO INSTRUMENTS Co.,Ltd. |