CN205185314U - 3D printer material silk interfacing apparatus - Google Patents
3D printer material silk interfacing apparatus Download PDFInfo
- Publication number
- CN205185314U CN205185314U CN201520744096.2U CN201520744096U CN205185314U CN 205185314 U CN205185314 U CN 205185314U CN 201520744096 U CN201520744096 U CN 201520744096U CN 205185314 U CN205185314 U CN 205185314U
- Authority
- CN
- China
- Prior art keywords
- docking facilities
- material silk
- process duct
- cooling
- butt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a 3D printer material silk interfacing apparatus, solves the butt joint problem that the material silk of 3D printer use is convenient, quick and ensure the quality of products, and this interfacing apparatus includes: butt joint technology pipe is installed on technology pipe fixed bolster in the mounting groove. The heating part includes: heated mold, heating member and temperature controller, the heating member setting is on heated mold, and the heating member is connected with the temperature controller electricity, and the heated mold symmetry sets up two, and heated mold slidable mounting is in the interfacing apparatus frame. Technology pipe cooling part corresponds the installation with the mounting groove. The beneficial effects are that, simple structure, convenient to use, swift is applicable to the waste material silk butt joint that the 3D printer used.
Description
Technical field
The utility model relates to the processing unit (plant) of PLA or ABS material silk, the PLA of particularly a kind of 3D printer use or ABS material silk docking facilities.
Background technology
During the work of 3D printer, the material silk that charging tray is wound around is sent into 3D printer by feed mechanism continuously, when expecting that silk midway surprisingly disconnects, needing the manual feeding mouth material silk disconnected being sent into 3D printer, is saving material silk, material silk for different length needs to be docking together, easy to use, prior art adopts the method for melting welding, troublesome poeration, efficiency is low, and feeding stuck phenomenon has occurred in melting welding junction.For 3D printer when needing the material object promising different colours to be need the material silk of required color to link together, in prior art, also there is no silk docking calculation and docking facilities easily and efficiently.
Summary of the invention
The utility model is solve material silk that 3D printer uses easily and fast and the docking problem of ensuring the quality of products, and the utility model discloses a kind of 3D printer material silk docking facilities.
The utility model solves the technical scheme adopted: a kind of 3D printer material silk docking facilities.
(1). this docking facilities comprises: butt-joint process pipe, process duct fixed support, process duct heating part, process duct cooling segment and docking facilities frame.
(2). described process duct fixed support is provided with the mounting groove of butt-joint process pipe, and butt-joint process pipe is arranged in the mounting groove on process duct fixed support.
(3). described process duct heating part comprises: heating mould, calandria and temperature controller, calandria is arranged on heating mould, calandria is electrically connected with temperature controller, heating mould is symmetrical arranged two, heating mould is slidably mounted in docking facilities frame, forms two heating moulds and moves rear formation butt-joint process pipe package structure.
(4). described process duct cooling segment is corresponding with the mounting groove on butt-joint process pipe to be installed.
The beneficial effects of the utility model are, structure is simple, easy to use, quick, are applicable to the waste material silk docking that 3D printer uses, the mutual docking of many colors material silk.
Below in conjunction with accompanying drawing, the utility model is described in detail.
Accompanying drawing explanation
Accompanying drawing 1 the utility model embodiment 1 schematic diagram.
Accompanying drawing 2 is accompanying drawing 1 side schematic view.
Accompanying drawing 3 the utility model embodiment 2 schematic diagram.
Accompanying drawing 4 is accompanying drawing 3 side schematic view.
Accompanying drawing 5 the utility model embodiment 3 schematic diagram.
Accompanying drawing 6 is accompanying drawing 5 side schematic view.
In accompanying drawing, 1 butt-joint process pipe, 2 process duct fixed supports, 2.1 mounting grooves, 3 heating moulds, 4 calandrias, 5 temperature controllers, 6 docking facilities frames, 7 cold wind outlets, 8 cooling dies, 9 electronic refrigerating chips, 10 material silks.
Detailed description of the invention
A kind of 3D printer material silk docking facilities;
(1). this docking facilities comprises: butt-joint process pipe 1, process duct fixed support 2, process duct heating part, process duct cooling segment and docking facilities frame.
(2). described process duct fixed support 2 is provided with the mounting groove 2.1 of butt-joint process pipe 1, and butt-joint process pipe 1 is arranged in the mounting groove 2.1 on process duct fixed support 2.
(3). described process duct heating part comprises: heating mould 3, calandria 4 and temperature controller 5, calandria 4 is arranged on heating mould 3, calandria 4 is electrically connected with temperature controller 5, heating mould 3 is symmetrical arranged two, heating mould 3 is slidably mounted in docking facilities frame 6, forms two heating moulds 3 and moves rear formation butt-joint process pipe 1 package structure.
(4). described process duct cooling segment is corresponding with the mounting groove 2.1 on butt-joint process pipe 1 to be installed.
During use, process duct 1 is arranged in the mounting groove 2.1 on fixed support 2, will the material silk 10 of docking be needed respectively through process duct 1 two ends insertion process pipe 1, and contacts with each other in the middle part of process duct 1.Heating mould 3 slides and process duct 1 to be wrapped up in docking facilities frame 6, calandria 4 pairs of process duct 1 are implemented to be heated to material silk 10 hot melting temperature, until expecting in process duct 1 that silk 10 contacts with each other after part holt melt, heating mould 3 leaves process duct 1, process duct cooling segment is cooled to material silk 10 solidification temperature to process duct 1, and material silk 10 mutual connection contravention completes docking (referring to accompanying drawing 1,2).
The utility model embodiment, for realizing calandria 4 pairs of process duct 1 Fast Heating, described calandria 4 is electrons heat chip.
In the utility model embodiment 2, described process duct cooling segment is air cooling system, and the cold wind outlet 7 of air cooling system is arranged on above the mounting groove 2.1 on process duct fixed support 2.The cooling to process duct 1 is implemented in cold wind outlet 7.
In the utility model embodiment, described process duct cooling segment comprises: cooling die 8 and electronic refrigerating chip 9, electronic refrigerating chip 9 is arranged on cooling die 8, electronic refrigerating chip 9 is electrically connected with temperature controller 5, cooling die 8 is symmetrical arranged two, cooling die 8 is slidably mounted in docking facilities frame 6, forms two cooling dies 8 and moves rear formation to butt-joint process pipe 1 package structure (referring to accompanying drawing 3,4).
In the utility model embodiment 3, described process duct cooling segment comprises: cooling die 8 and electronic refrigerating chip 9, electronic refrigerating chip 9 is arranged on cooling die 8, and electronic refrigerating chip 9 is electrically connected with temperature controller 5, and cooling die 8 is slidably mounted in docking facilities frame 6.
Claims (5)
1. a 3D printer material silk docking facilities, is characterized in that:
This docking facilities comprises: butt-joint process pipe (1), process duct fixed support (2), process duct heating part, process duct cooling segment and docking facilities frame;
Described process duct fixed support (2) is provided with the mounting groove (2.1) of butt-joint process pipe (1), and butt-joint process pipe (1) is arranged in the mounting groove (2.1) on process duct fixed support (2);
Described process duct heating part comprises: heating mould (3), calandria (4) and temperature controller (5), calandria (4) is arranged on heating mould (3), calandria (4) is electrically connected with temperature controller (5), heating mould (3) is symmetrical arranged two, and heating mould (3) is slidably mounted in docking facilities frame (6);
Described process duct cooling segment is corresponding with the mounting groove (2.1) on butt-joint process pipe (1) to be installed.
2. a kind of 3D printer material silk docking facilities according to claim 1, described calandria (4) is electrons heat chip.
3. a kind of 3D printer material silk docking facilities according to claim 1 and 2, it is characterized in that: described process duct cooling segment is air cooling system, cold wind outlet (7) of air cooling system is arranged on mounting groove (2.1) top on process duct fixed support (2).
4. a kind of 3D printer material silk docking facilities according to claim 1 and 2, it is characterized in that: described process duct cooling segment comprises: cooling die (8) and electronic refrigerating chip (9), electronic refrigerating chip (9) is arranged on cooling die (8), electronic refrigerating chip (9) is electrically connected with temperature controller (5), cooling die (8) is symmetrical arranged two, cooling die (8) is slidably mounted in docking facilities frame (6), forms the mobile rear formation of two cooling dies (8) to butt-joint process pipe (1) package structure.
5. a kind of 3D printer material silk docking facilities according to claim 4, it is characterized in that: described process duct cooling segment comprises: cooling die (8) and electronic refrigerating chip (9), electronic refrigerating chip (9) is arranged on cooling die (8), electronic refrigerating chip (9) is electrically connected with temperature controller (5), and cooling die (8) is slidably mounted in docking facilities frame (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520744096.2U CN205185314U (en) | 2015-09-24 | 2015-09-24 | 3D printer material silk interfacing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520744096.2U CN205185314U (en) | 2015-09-24 | 2015-09-24 | 3D printer material silk interfacing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205185314U true CN205185314U (en) | 2016-04-27 |
Family
ID=55778344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520744096.2U Expired - Fee Related CN205185314U (en) | 2015-09-24 | 2015-09-24 | 3D printer material silk interfacing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205185314U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112082587A (en) * | 2020-08-27 | 2020-12-15 | 广东利扬芯片测试股份有限公司 | Chip gravity test tube-pouring auxiliary tool |
-
2015
- 2015-09-24 CN CN201520744096.2U patent/CN205185314U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112082587A (en) * | 2020-08-27 | 2020-12-15 | 广东利扬芯片测试股份有限公司 | Chip gravity test tube-pouring auxiliary tool |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160427 Termination date: 20170924 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |