CN205177793U - Etching board - Google Patents
Etching board Download PDFInfo
- Publication number
- CN205177793U CN205177793U CN201520780059.7U CN201520780059U CN205177793U CN 205177793 U CN205177793 U CN 205177793U CN 201520780059 U CN201520780059 U CN 201520780059U CN 205177793 U CN205177793 U CN 205177793U
- Authority
- CN
- China
- Prior art keywords
- bottom crown
- etching machine
- crown
- substrate
- power transmission
- Prior art date
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- 238000005530 etching Methods 0.000 title claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 230000005540 biological transmission Effects 0.000 claims description 17
- 239000002826 coolant Substances 0.000 claims description 15
- 239000000498 cooling water Substances 0.000 claims description 15
- 238000001816 cooling Methods 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 7
- 239000012809 cooling fluid Substances 0.000 claims description 5
- 230000005484 gravity Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 4
- 238000003913 materials processing Methods 0.000 abstract description 2
- 239000008187 granular material Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 150000001768 cations Chemical class 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
The utility model relates to a technical field of materials processing provides etching board, comprising a main body, the inside cavity that is used for processing the base plate that is equipped with of main part, be equipped with the work piece of treating processing on the base plate, be equipped with the top crown and the bottom crown of relative setting in the cavity, there is a contained angle between bottom crown and the horizontal plane, be equipped with on the bottom crown and fix the fixed structure of base plate. The utility model provides an etching board, its bottom crown relative level face sets up with the slope of certain angle, and domatic droing can be followed to the granule that the etching produced, is difficult for attached to substrate surface influence processing effect, though the setting of base plate slope simultaneously can be avoided receiving effect of gravity cracked.
Description
Technical field
The utility model relates to the technical field of materials processing, particularly relates to etching machine.
Background technology
Dry etching is a kind of common coating technique, as shown in Figure 1, the chamber upper end of etching machine 2 of the prior art is provided with the top crown 21 of horizontal positioned, and lower end is provided with the bottom crown 22 of horizontal positioned, bottom crown 22 is placed with substrate, and process cavity glow discharge etches.In etching process, cation, according to the direction shown in arrow, bombards substrate and etches under electric field action.Due in metal etch, product is generally solid particle, is easily attached on substrate, and the clean level for substrate surface has extreme influence, thus causes figure extremely to lose efficacy with device performance.
Utility model content
The purpose of this utility model is to provide etching machine, and be intended to solve in dry etching of the prior art, particle is easily attached on substrate, causes the problem that figure exception and device performance lost efficacy.
The utility model realizes like this, etching machine, comprise main body, described body interior is provided with the chamber for substrate processing, described substrate is provided with workpiece to be processed, be provided with the top crown be oppositely arranged and bottom crown in described chamber, there is an angle between described bottom crown and horizontal plane, described bottom crown is provided with the fixed structure can fixing described substrate.
Further, the angular range between described bottom crown and described horizontal plane is 70 ° ~ 90 °.
Further, described fixed structure is the clamp structure that can clamp described substrate.
Further, described chamber upper end offers air inlet, and lower end offers gas outlet.
Further, described bottom crown is provided with the rotational structure of rotatable described substrate.
Further, described bottom crown is provided with the cooling structure for cooling described substrate.
Further, described rotational structure comprises the power transmission shaft being arranged at described bottom crown described top crown side dorsad.
Further, described power transmission shaft is hollow structure, described cooling structure comprises the cooling water pipe be attached at inside described power transmission shaft, described cooling water pipe comprises can with the rotation section of described drive axis with for being communicated to outside transport part, and described rotation section and junction, described transport part are provided with sealing ring.
Further, described power transmission shaft is hollow structure, and described cooling structure comprises the cooling water pipe be attached at inside described power transmission shaft, and described cooling water pipe inside is provided with cooling fluid and one end is attached at the side of described bottom crown described top crown dorsad.
Further, described cooling water pipe comprises the first coolant pipe be attached at inside described power transmission shaft and the second coolant pipe be set in described first coolant pipe, described first coolant pipe inside is provided with many feed tubes, and described second coolant pipe inside is provided with many drain pipes be communicated with described feed tube respectively.
Compared with prior art, etching machine in the utility model changes the direction of top crown, bottom crown, and bottom crown forms slope, and the particle that etching produces is direct under gravity to be slided from substrate, not easily be attached on substrate, avoid the problem of figure exception and device performance inefficacy.The gravity of the substrate be obliquely installed bears a part by bottom crown, can not bend cracked under the influence of gravity, has preferably processing effect and longer useful life.
Accompanying drawing explanation
Fig. 1 is the etching machine structural representation in background technology;
The structural representation of the etching machine that Fig. 2 provides for the utility model embodiment;
The bottom crown structural representation that Fig. 3 provides for the utility model embodiment;
The radial cross-sectional schematic of the cooling water pipe that Fig. 4 provides for the utility model embodiment;
The sealing ring sealing place partial schematic diagram that Fig. 5 provides for the utility model embodiment.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Be described in detail below in conjunction with the realization of concrete accompanying drawing to the present embodiment.
As shown in Figures 2 to 5, the present embodiment provides etching machine, comprises main body 1, and the inside of main body 1 is provided with the chamber for substrate processing 131, and substrate 131 is provided with workpiece to be processed.
Relatively be provided with top crown 12 and bottom crown 13 in chamber, have an angle between bottom crown 13 and horizontal plane, bottom crown 13 is provided with can the fixed structure 132 of fixing base 131.
Etching machine in the present embodiment, in practical operation, because bottom crown is heeling condition, makes substrate 131 be formed domatic, and the particle that etching produces directly from landing substrate 131, and can not easily be attached to impact processing on substrate 131 under the influence of gravity.Because substrate 131 is fixed on the bottom crown 13 tilted, its gravity can bear a part by bottom crown 13, can not produce stress under the influence of gravity and cause bending cracked.
So the etching machine in employing the present embodiment, compared with prior art, that it changes the direction of substrate 131, in guarantee, it is not vulnerable under stress guide causes cracked prerequisite, make its slant setting, the particle that processing produces not easily adheres to, and also can not produce the problems such as figure exception and device performance inefficacy.
The mode of fixed structure 132 can have multiple, and such as screw is fixed, gluing, the mode such as magnetic-adsorption, clamp structure, is structure common in prior art, does not repeat.
As shown in Figure 2, have a comparatively mitre between the bottom crown 13 of the present embodiment and horizontal plane, scope is 70 ° ~ 90 °, and in this angular range, bottom crown 12 is close to vertical state, and the particle of generation more easily comes off.
In order to improve cation etching efficiency, in the present embodiment, both bottom crown 13 top crowns 12 are parallel to each other, and the two is close to vertical state.
As shown in Figure 2, owing to changing the direction of upper bottom crown 13 in the present embodiment, so the flow direction of etching gas also needs to change thereupon, in the present embodiment, the upper end of chamber offers air inlet 14, and lower end offers gas outlet 15, air flows through chamber along this direction, participates in etching.
After have employed the etching air-flow vertically flowed to, the etching air-flow of the highest point of bottom crown 13 and lowest part can be caused uneven, cause etching uneven, in order to head it off, bottom crown 13 is provided with the rotational structure of rotatable substrate 131, make substrate 131 take its center as rotating shaft, carry out rotation etching to ensure the even of etching.The speed of rotation can adjust according to actual process demand, and velocity interval is 30 ~ 120rpm.
As shown in Figure 3, rotational structure comprises and is arranged at bottom crown 13 top crown 12 side dorsad, i.e. the power transmission shaft 133 in left side.
Bottom crown 13 is provided with the cooling structure for cooling base 131, its working temperature can be reduced.Power transmission shaft 133 is hollow structure, and cooling structure comprises the cooling water pipe 134 be attached at inside power transmission shaft 133, and cooling water pipe 134 inside is provided with cooling fluid and one end is sticked in the side of bottom crown 13 top crown 12 dorsad, and cooling fluid can take away heat, plays the effect of cooling.
As shown in Figure 5, from end on observation, cooling water pipe 134 comprises can with the rotation section 1345 of power transmission shaft 133 rotation with for being communicated to outside transport part 1344, rotation section 1345 and junction, transport part 1344 are provided with sealing ring 1343, sealing ring 1343 adopts high elasticity abrasion-proof to damage acid-proof base material and makes, cross section, contact position is for falling " V " shape, and effectively prevention is in rotation process, coming off of sealing ring 1343.
As shown in Figure 4, observe from radial direction, cooling water pipe 134 comprises nested two-layer tubular construction, namely the second coolant pipe 1342 being attached at the first coolant pipe 1341 inside power transmission shaft 133 and being set in the first coolant pipe 1341, first coolant pipe 1341 inside is provided with many feed tubes 1346, second coolant pipe 1342 inside is provided with many drain pipes 1347 be communicated with feed tube 1346 respectively, cooling fluid circulates between feed tube 1346 and drain pipe 1347, enter central part 1348, for substrate 131 cools.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (10)
1. etching machine, comprise main body, described body interior is provided with the chamber for substrate processing, described substrate is provided with workpiece to be processed, it is characterized in that, be provided with the top crown be oppositely arranged and bottom crown in described chamber, there is an angle between described bottom crown and horizontal plane, described bottom crown is provided with the fixed structure can fixing described substrate.
2. etching machine as claimed in claim 1, it is characterized in that, the angular range between described bottom crown and described horizontal plane is 70 ° ~ 90 °.
3. etching machine as claimed in claim 2, it is characterized in that, described fixed structure is the clamp structure that can clamp described substrate.
4. etching machine as claimed in claim 2, it is characterized in that, described chamber upper end offers air inlet, and lower end offers gas outlet.
5. etching machine as claimed in claim 4, it is characterized in that, described bottom crown is provided with the rotational structure of rotatable described substrate.
6. etching machine as claimed in claim 5, it is characterized in that, described bottom crown is provided with the cooling structure for cooling described substrate.
7. etching machine as claimed in claim 6, is characterized in that, described rotational structure comprises the power transmission shaft being arranged at described bottom crown described top crown side dorsad.
8. etching machine as claimed in claim 7, it is characterized in that, described power transmission shaft is hollow structure, described cooling structure comprises the cooling water pipe be attached at inside described power transmission shaft, described cooling water pipe comprises can with the rotation section of described drive axis with for being communicated to outside transport part, and described rotation section and junction, described transport part are provided with sealing ring.
9. etching machine as claimed in claim 8, it is characterized in that, described power transmission shaft is hollow structure, and described cooling structure comprises the cooling water pipe be attached at inside described power transmission shaft, and described cooling water pipe inside is provided with cooling fluid and one end is attached at the side of described bottom crown described top crown dorsad.
10. etching machine as claimed in claim 9, it is characterized in that, described cooling water pipe comprises the first coolant pipe be attached at inside described power transmission shaft and the second coolant pipe be set in described first coolant pipe, described first coolant pipe inside is provided with many feed tubes, and described second coolant pipe inside is provided with many drain pipes be communicated with described feed tube respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520780059.7U CN205177793U (en) | 2015-10-09 | 2015-10-09 | Etching board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520780059.7U CN205177793U (en) | 2015-10-09 | 2015-10-09 | Etching board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205177793U true CN205177793U (en) | 2016-04-20 |
Family
ID=55741745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520780059.7U Active CN205177793U (en) | 2015-10-09 | 2015-10-09 | Etching board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205177793U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109004069A (en) * | 2017-06-21 | 2018-12-14 | 佛山市国星半导体技术有限公司 | A kind of production method of metal substrate LED chip |
-
2015
- 2015-10-09 CN CN201520780059.7U patent/CN205177793U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109004069A (en) * | 2017-06-21 | 2018-12-14 | 佛山市国星半导体技术有限公司 | A kind of production method of metal substrate LED chip |
| CN109004069B (en) * | 2017-06-21 | 2020-10-27 | 佛山市国星半导体技术有限公司 | Manufacturing method of metal substrate LED chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220107 Address after: No.8, liufangyuanheng Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430074 Patentee after: WUHAN TIANMA MICROELECTRONICS Co.,Ltd. Patentee after: Wuhan Tianma Microelectronics Co.,Ltd. Shanghai Branch Patentee after: Tianma Micro-Electronics Co.,Ltd. Address before: Room 509, building 1, No. 6111, Longdong Avenue, Pudong New Area, Shanghai, 200120 Patentee before: SHANGHAI TIANMA AM-OLED Co.,Ltd. Patentee before: Tianma Micro-Electronics Co.,Ltd. |