CN205159298U - Moulds of industrial equipment of sintering location of semiconductor device chip - Google Patents
Moulds of industrial equipment of sintering location of semiconductor device chip Download PDFInfo
- Publication number
- CN205159298U CN205159298U CN201520378084.2U CN201520378084U CN205159298U CN 205159298 U CN205159298 U CN 205159298U CN 201520378084 U CN201520378084 U CN 201520378084U CN 205159298 U CN205159298 U CN 205159298U
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- China
- Prior art keywords
- molybdenum sheet
- location
- molybdenum
- location hole
- moulds
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Abstract
The utility model relates to a moulds of industrial equipment of the sintering location of semiconductor device chip (step -down diode), including moulds such as last top cap, molybdenum sheet storage chamber, molybdenum sheet locating hole, the locating hole of breathing in, suction disk, aspirator pumps. Go up the molybdenum sheet that top cap and molybdenum sheet storage chamber constitutes storage step -down diode, the molybdenum sheet locating hole is the molybdenum sheet position of fixed step -down diode, the locating hole of breathing in is used for absorbing the molybdenum sheet, and its locating hole corresponds with the molybdenum sheet locating hole, the suction disk is connected with the aspirator pump to be used as and is absorb the molybdenum sheet and use. Once can absorb 31 molybdenum sheets in the use, once can only absorb 1 molybdenum sheet than before and can improve 30 times more than in the efficiency again to its molybdenum sheet location is more accurate, and is more neat when putting respectively than 1 molybdenum sheet. Tens of times more than have been improved on production efficiency.
Description
Technical field
The present invention relates to semiconductor device packaging technique field, particularly relate to a kind of assembling mould of semiconductor device.
Background technology
Buck diode is a kind of diode of minor diameter, has that volume is little, structure is relatively simple, pressure drop is large, the through-flow feature such as large, is one of semiconductor device relatively commonly used.Usually time in use can by several or tens even tens buck diodes to be cascaded the effect using and reached step-down.
Current buck diode many employings single-chip mode assembles sintering, its production efficiency and low, and technique is extremely loaded down with trivial details, and waste the operation of a lot of procedure step, rate of finished products is extremely low.By improving sintering processing, much unnecessary operation (as cyclotomy, folder aluminium foil) can be reduced, sinter 31 simultaneously, can by former improving productivity 31 times more than.Its agglomerant reload request is simple, and method is easy to grasp, production cost is lower and be widely applied.
Summary of the invention
The invention provides the moulds of industrial equipment of the sintering location of a kind of semiconductor device chip (buck diode), the operation that multiple tracks is unnecessary can be reduced, invention also provides the encapsulating mould adopting the method.
In order to achieve the above object, the present invention realizes by the following technical solutions:
A kind of moulds of industrial equipment of sintering location of semiconductor device chip (buck diode), is characterized in that, comprise upper top cover, molybdenum sheet stores chamber, molybdenum sheet location hole, air-breathing location hole, suction disk, asepwirator pump.Detailed process is as follows:
1) clear up mould (molybdenum sheet storage chamber) internal dust or foreign matter, by molybdenum sheet location hole and the grafting of air-breathing location hole good;
2) cleaned molybdenum sheet is placed on molybdenum sheet to store in chamber, builds upper top cover simultaneously and rotate locked;
3) rock the molybdenum sheet in molybdenum sheet storage chamber gently, molybdenum sheet is dropped in molybdenum sheet location hole, guarantees there is molybdenum sheet in each location hole;
4) suction disk and asepwirator pump emulsion tube are connected, start asepwirator pump, stifled good gas vent, gently 180 degree, rotary die frame, guaranteeing in rotary course that molybdenum sheet will hold can not fall down;
5) get out sintering graphite cylinder before this, with asepwirator pump draw silicon chip be placed in graphite pads, then draw aluminium pool be placed on silicon chip;
6), after suction disk being mentioned vertically upward gently, suction disk is fallen in graphite tube vertically downward and contacts with aluminium foil; Unclamping air vent again makes molybdenum sheet drop on aluminium foil; Suction disk is mentioned vertically upward gently; Again suction disk is fallen vertically downward in molybdenum sheet location hole;
7) in repetition 3)-6) step repeat assembling.
8), after repeating the full stove of assembling, graphite tube is placed in sintering furnace and sinters.
A kind of moulds of industrial equipment of sintering location of semiconductor device chip (buck diode), comprise upper top cover, molybdenum sheet store chamber, molybdenum sheet location hole, air-breathing location hole, suction disk, asepwirator pump.
Described upper top cover and molybdenum sheet store chamber and form the molybdenum sheet storing buck diode, can deposit a large amount of molybdenum sheets, simple and convenient when making operation.
Described molybdenum sheet location hole is the molybdenum sheet position of fixing buck diode, makes molybdenum sheet fall in location hole during each operation, can place 31 molybdenum sheets simultaneously.
Described air-breathing location hole is used for drawing molybdenum sheet, and its location hole is corresponding with molybdenum sheet location hole; 31 molybdenum sheets can be drawn to simultaneously.
Described molybdenum sheet location hole and suction disk location hole must be corresponding, and the special marginal position at two increases location and cuts and location notch.
Described suction disk is connected with asepwirator pump to be used as draws molybdenum sheet use.
Described material therefor is vinyon, uses easy to clean.
Compared with present technology, the invention has the beneficial effects as follows:
1) take to sinter on large stretch of silicon chip, when sintering than monolithic, because aluminium foil is sufficient, sintering back edge is stained with profit and is improved a lot simultaneously.
2) assemble 31 molybdenum sheets simultaneously, than artificial every sheet assembling in the past, production efficiency improves a lot of work efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of moulds of industrial equipment of the present invention.
Fig. 2 is molybdenum sheet location hole schematic diagram of the present invention.
Fig. 3 is air-breathing location hole schematic diagram of the present invention.
Fig. 4 is upper top cover schematic diagram of the present invention.
Fig. 5 is suction disk schematic diagram of the present invention.
In figure: 1. upper top cover 2. molybdenum sheet stores chamber 3. molybdenum sheet location hole 4. air-breathing location hole 5. suction disk 6. air vent 7. asepwirator pump
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described further:
Seeing Fig. 1, is controllable silicon encapsulation process schematic diagram of the present invention.A kind of moulds of industrial equipment of sintering location of semiconductor device chip (buck diode), is characterized in that, comprise upper top cover, molybdenum sheet stores chamber, molybdenum sheet location hole, air-breathing location hole, suction disk, asepwirator pump.Detailed process is as follows:
1) clear up mould (molybdenum sheet storage chamber) internal dust or foreign matter, by molybdenum sheet location hole (as shown in Figure 2) and air-breathing location hole (as shown in Figure 3) grafting good;
2) cleaned molybdenum sheet is placed on molybdenum sheet to store in chamber, builds upper top cover simultaneously and rotate locked (as shown in Figure 4);
3) rock the molybdenum sheet in molybdenum sheet storage chamber gently, molybdenum sheet is dropped in molybdenum sheet location hole (as shown in Figure 2), guarantees there is molybdenum sheet in each location hole;
4) suction disk (as shown in Figure 5) and asepwirator pump emulsion tube are connected, start asepwirator pump, stifled good gas vent, gently 180 degree, rotary die frame, guaranteeing in rotary course that molybdenum sheet will hold can not fall down;
5) get out sintering graphite cylinder before this, with asepwirator pump draw silicon chip be placed in graphite pads, then draw aluminium pool be placed on silicon chip;
6), after suction disk being mentioned vertically upward gently, suction disk is fallen in graphite tube vertically downward and contacts with aluminium foil; Unclamping air vent again makes molybdenum sheet drop on aluminium foil; Suction disk is mentioned vertically upward gently; Again suction disk is fallen vertically downward in molybdenum sheet location hole;
7) in repetition 3)-6) step repeat assembling.
8), after repeating the full stove of assembling, graphite tube is placed in sintering furnace and sinters.
Seeing Fig. 1, is the structural representation of moulds of industrial equipment of the present invention.A kind of moulds of industrial equipment of sintering location of semiconductor device chip (buck diode), is characterized in that, comprise upper top cover, molybdenum sheet stores chamber, molybdenum sheet location hole, air-breathing location hole, suction disk, asepwirator pump.
Described upper top cover and molybdenum sheet store chamber and form the molybdenum sheet storing buck diode, can deposit a large amount of molybdenum sheets, simple and convenient when making operation.
Described molybdenum sheet location hole is the molybdenum sheet position of fixing buck diode, makes molybdenum sheet fall in location hole during each operation, can place 31 molybdenum sheets simultaneously.
Described air-breathing location hole is used for drawing molybdenum sheet, and its location hole is corresponding with molybdenum sheet location hole; 31 molybdenum sheets can be drawn to simultaneously.
Described molybdenum sheet location hole and suction disk location hole must be corresponding, and the special marginal position at two increases location and cuts and location notch.
Described suction disk is connected with asepwirator pump to be used as draws molybdenum sheet use.
Described material therefor is vinyon, uses easy to clean.
Following examples are implemented under premised on technical solution of the present invention, give detailed execution mode and concrete operating process, but protection scope of the present invention are not limited to following embodiment.In following embodiment, method therefor is conventional method if no special instructions.
Claims (7)
1. moulds of industrial equipment for the sintering location of semiconductor device chip, is characterized in that, comprise upper top cover, molybdenum sheet stores chamber, molybdenum sheet location hole, air-breathing location hole, suction disk, asepwirator pump.
2. the moulds of industrial equipment of the sintering location of a kind of semiconductor device chip according to claim 1, is characterized in that, described upper top cover and molybdenum sheet store chamber and form the molybdenum sheet storing buck diode, can deposit a large amount of molybdenum sheets, simple and convenient when making operation.
3. the moulds of industrial equipment of the sintering location of a kind of semiconductor device chip according to claim 1, it is characterized in that, described molybdenum sheet location hole is the molybdenum sheet position of fixing buck diode, makes molybdenum sheet fall in location hole during each operation, can place 31 molybdenum sheets simultaneously.
4. the moulds of industrial equipment of the sintering location of a kind of semiconductor device chip according to claim 1, is characterized in that, described air-breathing location hole is used for drawing molybdenum sheet, and its location hole is corresponding with molybdenum sheet location hole; 31 molybdenum sheets can be drawn to simultaneously.
5. the moulds of industrial equipment of the sintering location of a kind of semiconductor device chip according to claim 1, it is characterized in that, described molybdenum sheet location hole and suction disk location hole must be corresponding, and the special marginal position at two increases location and cuts and location notch.
6. the moulds of industrial equipment of the sintering location of a kind of semiconductor device chip according to claim 1, is characterized in that, described suction disk is connected with asepwirator pump to be used as draws molybdenum sheet use.
7. the moulds of industrial equipment of the sintering location of a kind of semiconductor device chip according to claim 1, it is characterized in that, described material therefor is vinyon, uses easy to clean.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520378084.2U CN205159298U (en) | 2015-06-04 | 2015-06-04 | Moulds of industrial equipment of sintering location of semiconductor device chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520378084.2U CN205159298U (en) | 2015-06-04 | 2015-06-04 | Moulds of industrial equipment of sintering location of semiconductor device chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205159298U true CN205159298U (en) | 2016-04-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520378084.2U Expired - Fee Related CN205159298U (en) | 2015-06-04 | 2015-06-04 | Moulds of industrial equipment of sintering location of semiconductor device chip |
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| Country | Link |
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| CN (1) | CN205159298U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109524291A (en) * | 2017-09-18 | 2019-03-26 | 株洲中车时代电气股份有限公司 | A kind of production method and tooling for power electronics unit |
-
2015
- 2015-06-04 CN CN201520378084.2U patent/CN205159298U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109524291A (en) * | 2017-09-18 | 2019-03-26 | 株洲中车时代电气股份有限公司 | A kind of production method and tooling for power electronics unit |
| CN109524291B (en) * | 2017-09-18 | 2020-12-18 | 株洲中车时代半导体有限公司 | Production method and tool for power electronic unit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190927 Address after: 114000 No. 24, Shuang Tai Road, Tiexi District, Liaoning, Anshan Patentee after: Anshan Shengtuoxin Electronics Co.,Ltd. Address before: 114000 No. 24, Shuang Tai Road, Tiexi District, Liaoning, Anshan Patentee before: ANSHAN LIANDA ELECTRONIC Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160413 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |