CN205140991U - SMD and assembly thereof - Google Patents
SMD and assembly thereof Download PDFInfo
- Publication number
- CN205140991U CN205140991U CN201520955973.0U CN201520955973U CN205140991U CN 205140991 U CN205140991 U CN 205140991U CN 201520955973 U CN201520955973 U CN 201520955973U CN 205140991 U CN205140991 U CN 205140991U
- Authority
- CN
- China
- Prior art keywords
- pole pin
- negative pole
- chip
- plastic
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
(B, ) the utility model discloses a SMD and assembly thereof, including the chip, respectively with anodal pin and negative pole pin that the upper and lower surface of chip is connected, and wrap up in the plastic -sealed body in the chip outside, a serial communication port, anodal pin the negative pole pin all extends out and extends to the plastic -sealed body outside to opposite direction from the plastic -sealed body bottom through the back of buckling for twice, is in simultaneously anodal pin with the negative pole pin extends the inside part of plastic -sealed body all is equipped with the wicking layer that is the cambered surface and sets up, this wicking layer is at anodal pin and negative pole pin wicking in -process, naturally, form by tin liquor surface tension, it is when welding with the circuit board, it welds successfully to have the easier and circuit board of anodal pin and the negative pole pin of radian, production efficiency is improved, and the process of wicking contrast electrotinplate, it does not basically produce hazardous gas, waste water and metal ion, in the time of the environmental protection, difficult harm staff is healthy. (B, )
Description
Technical field
the utility model belongs to semiconductor electronic component technical field, is specifically related to a kind of chip diode and assembly thereof.
Background technology
in numerous semiconductor electronic component, chip diode is the original paper on basis, be widely used in every field, but the main production process of the chip diode in existing is: chip testing → assemble with lead frame → sinter → pickling → gluing → baking → plastic packaging → Post RDBMS → go gives up → flattens → Trim Molding → plating → lettering tests → examine → pack outward → and QA checks → puts in storage, key step in its electroplating process refers to carries out electrotinning to the positive pole pin of diode and negative pole pin, tin coating on its positive pole pin and negative pole pin is plane layer, when welding with circuit board, cumbersome and consuming time, in the production process of simultaneously tin coating, a large amount of toxic and harmful can be given out, waste water and metal ion, easily cause environmental pollution, harm staff is healthy.
Summary of the invention
the utility model object is: not only structure is simple to provide one, and is more prone to weld with circuit board, the chip diode of enhancing productivity and assembly thereof.
the technical solution of the utility model is: a kind of chip diode, comprises chip, respectively the positive pole pin that is connected of surface upper and lower with described chip and negative pole pin, and is wrapped in the plastic-sealed body outside described chip, it is characterized in that, described positive pole pin, described negative pole pin all extends out and extends to plastic-sealed body outside round about after twice bending bottom plastic-sealed body, the part of simultaneously extending described plastic-sealed body inside at described positive pole pin and described negative pole pin is equipped with the wicking layer arranged in cambered surface, this wicking layer is in positive pole pin and negative pole pin wicking process, by tin liquor surface tension self-assembling formation, it is when welding with circuit board, with the positive pole pin of radian and negative pole pin more easily with welding circuit board successfully, not only increase production efficiency, and the process of wicking contrast electrotinning, it does not produce toxic and harmful substantially, while environmental protection, not easily endanger staff healthy.
as preferred technical scheme, described positive pole pin and described negative pole pin are the sheet of copper pin being provided with two 90 ° of bending angles.
as preferred technical scheme, the junction of described positive pole pin, described negative pole pin and described chip is provided with soldering-tin layer.
as preferred technical scheme, the upper and lower surface of described plastic-sealed body is shiny surface, and the surface being positioned at described positive pole pin and described negative pole pin both sides is matsurface.
as preferred technical scheme, the external shape of described plastic-sealed body is rectangular.
an assembly for chip diode, comprises the some groups of chip diodes be arranged side by side successively, and the plastic-sealed body of adjacent patch formula diode is one-body molded.
the utility model chip diode in use, is affixed on circuit board, and positive pole pin and negative pole pin just can directly directly weld with the circuit that circuit board is laid.
the utility model has the advantages that:
1. the utility model is that the wicking layer of cambered surface setting is in positive pole pin and negative pole pin wicking process, by tin liquor surface tension self-assembling formation, it is when welding with circuit board, with the positive pole pin of radian and negative pole pin more easily with welding circuit board successfully, not only increase production efficiency, and the process of wicking contrast electrotinning, it does not produce toxic and harmful, waste water and metal ion substantially, while environmental protection, not easily endanger staff healthy.
Accompanying drawing explanation
below in conjunction with drawings and Examples, the utility model is further described:
fig. 1 is the internal structure schematic diagram of the utility model chip diode;
fig. 2 is the structural representation of the utility model stamp-mounting-paper diode assembly;
wherein: 1 chip, 2 positive pole pins, 3 negative pole pins, 4 plastic-sealed bodies, 5 wicking layers, 6 soldering-tin layers.
Embodiment
embodiment: with reference to shown in Fig. 1, a kind of chip diode, comprises chip 1, respectively the positive pole pin 2 that is connected of surface upper and lower with chip 1 and negative pole pin 3, and be wrapped in the plastic-sealed body 4 outside chip 1; This positive pole pin 2, negative pole pin 3 all extend out after twice bending bottom plastic-sealed body 4 and to extend to plastic-sealed body 4 round about outside, and the part of simultaneously extending plastic-sealed body 4 inside at positive pole pin 2 and negative pole pin 3 is equipped with the wicking layer 5 arranged in cambered surface.
positive pole pin 2 of the present utility model and negative pole pin 3 are the sheet of copper pin being provided with two 90 ° of bending angles, and this positive pole pin 2, negative pole pin 3 are provided with soldering-tin layer 6 with the junction of chip 1, and the external shape of plastic-sealed body 4 is rectangular.
the utility model chip diode in use, be affixed on circuit board, positive pole pin 2 and negative pole pin 3 just can directly directly weld with the circuit that circuit board is laid, wicking layer 5 on this positive pole pin 2 and negative pole pin 3 is in positive pole pin 2 and negative pole pin 3 wicking process, by tin liquor surface tension self-assembling formation, it is when welding with circuit board, with the positive pole pin 2 of radian and negative pole pin 3 more easily with welding circuit board successfully, not only increase production efficiency, and the process of wicking contrast electrotinning, it does not produce toxic and harmful substantially, waste water and metal ion, while environmental protection, not easily endanger staff healthy.
with reference to shown in Fig. 2, a kind of assembly of chip diode, comprise the some groups of chip diodes be arranged side by side successively, and the plastic-sealed body 4 of adjacent patch formula diode is one-body molded, before the use of this stamp-mounting-paper diode assembly, adopt cutting technique, stamp-mounting-paper diode assembly is divided into some monolithic chip diodes, therefore plastic-sealed body 4 is upper, lower surface is shiny surface, the surface being positioned at positive pole pin 2 and negative pole pin 3 both sides is matsurface, i.e. cut surface, then be affixed on circuit board, positive pole pin 2 and negative pole pin 3 just can directly directly weld with the circuit that circuit board is laid, not only structure is simple for it, and technique is simple, production efficiency is high, in production process, the utilance of capsulation material and copper is high simultaneously, reduce production cost.
above-described embodiment, only for technical conceive of the present utility model and feature are described, its object is to person skilled in the art can be understood content of the present utility model and implement according to this, can not limit protection range of the present utility model with this.All equivalences done according to the utility model Spirit Essence change or modify, and all should be encompassed within protection range of the present utility model.
Claims (6)
1. a chip diode, comprises chip (1), the positive pole pin (2) be connected with the upper and lower surface of described chip (1) respectively and negative pole pin (3), and is wrapped in the plastic-sealed body (4) in described chip (1) outside; It is characterized in that, described positive pole pin (2), described negative pole pin (3) all extend out from plastic-sealed body (4) bottom and extend to plastic-sealed body (4) outside round about after twice bending, extend the inner part of described plastic-sealed body (4) be simultaneously equipped with the wicking layer (5) arranged in cambered surface described positive pole pin (2) and described negative pole pin (3).
2. chip diode according to claim 1, is characterized in that, described positive pole pin (2) and described negative pole pin (3) are the sheet of copper pin being provided with two 90 ° of bending angles.
3. chip diode according to claim 1, is characterized in that, described positive pole pin (2), described negative pole pin (3) are provided with soldering-tin layer (6) with the junction of described chip (1).
4. chip diode according to claim 1, is characterized in that, the upper and lower surface of described plastic-sealed body (4) is shiny surface, and the surface being positioned at described positive pole pin (2) and described negative pole pin (3) both sides is matsurface.
5. chip diode according to claim 1, is characterized in that, the external shape of described plastic-sealed body (4) is rectangular.
6. an assembly for the chip diode as described in any one of claim 1 to 5, is characterized in that, comprises the some groups of chip diodes be arranged side by side successively, and the plastic-sealed body (4) of adjacent patch formula diode is one-body molded.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520955973.0U CN205140991U (en) | 2015-11-26 | 2015-11-26 | SMD and assembly thereof |
| EP16200470.9A EP3174088B1 (en) | 2015-11-26 | 2016-11-24 | Method of manufacturing a plastic packaged smd diode |
| US15/361,144 US20170154840A1 (en) | 2015-11-26 | 2016-11-25 | SMD Diode Taking A Runner As Body And Manufacturing Method Thereof |
| TW105138807A TWI618257B (en) | 2015-11-26 | 2016-11-25 | SMD diode with glue channel as main body and manufacturing method thereof |
| JP2016228619A JP2017098553A (en) | 2015-11-26 | 2016-11-25 | Surface mount type diode with runner as main body and method of manufacturing the same |
| US16/677,150 US11024567B2 (en) | 2015-11-26 | 2019-11-07 | SMD diode taking a runner as body and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520955973.0U CN205140991U (en) | 2015-11-26 | 2015-11-26 | SMD and assembly thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205140991U true CN205140991U (en) | 2016-04-06 |
Family
ID=55626754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520955973.0U Active CN205140991U (en) | 2015-11-26 | 2015-11-26 | SMD and assembly thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205140991U (en) |
-
2015
- 2015-11-26 CN CN201520955973.0U patent/CN205140991U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160711 Address after: 223700, Suqian City, Jiangsu province Siyang County Road, Tai Yuen Road north side of your mouth Road West National Pioneer Park Patentee after: Suzhou Qunxin Electronics Co., Ltd. Address before: Jiangfeng road Jinchang District of Suzhou City, Jiangsu Province, No. 93 215000 Patentee before: Zhong Yunhui |