CN205121887U - Ultrasonic wave vehicle route monitoring devices based on it is embedded in real time - Google Patents
Ultrasonic wave vehicle route monitoring devices based on it is embedded in real time Download PDFInfo
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- CN205121887U CN205121887U CN201520810809.0U CN201520810809U CN205121887U CN 205121887 U CN205121887 U CN 205121887U CN 201520810809 U CN201520810809 U CN 201520810809U CN 205121887 U CN205121887 U CN 205121887U
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- 238000012806 monitoring device Methods 0.000 title abstract 2
- 230000003321 amplification Effects 0.000 claims abstract description 34
- 238000003199 nucleic acid amplification method Methods 0.000 claims abstract description 34
- 238000002604 ultrasonography Methods 0.000 claims description 29
- 238000009529 body temperature measurement Methods 0.000 claims description 22
- 238000012544 monitoring process Methods 0.000 abstract description 11
- 238000001514 detection method Methods 0.000 abstract 2
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 206010039203 Road traffic accident Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000306 recurrent effect Effects 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The utility model relates to an ultrasonic wave vehicle route monitoring devices based on it is embedded in real time belongs to real -time embedded monitor control technical field. The utility model discloses a singlechip I, voltage amplifier circuit, ultrasonic transmitter, ultrasonic wave receiver, signal amplification circuit, comparator, trigger, temperature detection circuit, singlechip II, host computer, singlechip I links to each other with voltage amplifier circuit, and voltage amplifier circuit links to each other with ultrasonic transmitter, and supersonic generator links to each other with the ultrasonic wave receiver, and the ultrasonic wave receiver links to each other with signal amplification circuit, and signal amplification circuit links to each other with the comparator, and the comparator links to each other with the trigger, and the trigger links to each other with singlechip II, and temperature detection circuit links to each other with singlechip II, and singlechip II links to each other with the host computer. The utility model provides a conventional infrared monitoring transmission distance shorter, the positioning system complexity is higher to and the big scheduling problem of GPS monitoring cost.
Description
Technical field
The utility model relates to a kind of based on real-time embedded supersonic vehicle trace monitor device, belongs to real-time embedded Monitoring and Controlling technical field.
Background technology
At present, traffic safety problem takes place frequently, and therefore vehicle drive track following and monitoring technology receive extensive concern.In actual vehicle driving procedure, cause the factor of traffic safety problem a lot, the reason of existing subjective aspect, also has the reason of objective aspects.And often cause the root of traffic accidents without non-driver itself or vehicle problem, such as carry out the ground such as driving training place, vehicle performance test place in driving school, analog monitoring is carried out by installing electric auxiliary devices, effective monitoring driver is at the path of steering vehicle and vehicle running path, carry out large data analysis, good role and influence will be played.Conventional monitoring technology has infrared monitoring, but design system is comparatively complicated, accuracy is not high, and GPS location technology cost is larger, therefore the utility model is a kind of based on real-time embedded supersonic vehicle trace monitor device by designing, realize potential safety hazard Timeliness coverage, process as early as possible, effectively evade traffic risk.
Summary of the invention
The technical problems to be solved in the utility model is: the utility model provides a kind of based on real-time embedded supersonic vehicle trace monitor device, accurate not in time for solution infrared technique Monitoring Data, the problems such as system is comparatively complicated, and GPS location technology application cost is larger.
Technical solutions of the utility model are: a kind of based on real-time embedded supersonic vehicle trace monitor device, comprise single-chip microcomputer I1, voltage amplifier circuit 2, ultrasonic transmitter 3, ultrasonic receiver 4, signal amplification circuit 5, comparer 6, trigger 7, temperature measurement circuit 8, single-chip microcomputer II9, host computer 10; Described single-chip microcomputer I1 is connected with voltage amplifier circuit 2, voltage amplifier circuit 2 is connected with ultrasonic transmitter 3, ultrasonic generator 3 is connected with ultrasonic receiver 4, ultrasonic receiver 4 is connected with signal amplification circuit 5, signal amplification circuit 5 is connected with comparer 6, and comparer 6 is connected with trigger 7, and trigger 7 is connected with single-chip microcomputer II9, temperature measurement circuit 8 is connected with single-chip microcomputer II9, and single-chip microcomputer II9 is connected with host computer 10.
The triode Q1 that the resistance R4 that the resistance R3 that the resistance R2 that described voltage amplifier circuit 2 comprises resistance R1 that definite value is 100K, definite value is 20K, definite value are 25K, definite value are 50K, model are 2N2222, definite value are electric capacity C1, C2, C3, C4 of 10 μ F; Described resistance R1 one end is connected with+5V power supply, and the other end is connected with resistance R2, electric capacity C1; Described resistance R2 one end is connected with the base stage of resistance R1, electric capacity C1, triode Q1 respectively, and the other end is connected with the P1.0 mouth of single-chip microcomputer I1; Described resistance R3 one end is connected with+5V power supply, resistance R1, electric capacity C2 respectively, and the other end is connected with the collector of triode Q1, electric capacity C4 respectively; Described resistance R4 one end is connected with the emitter of triode Q1, other end ground connection; Described electric capacity C3 one end is connected with electric capacity C2, other end ground connection; Described electric capacity C4 one end is connected with the collector of resistance R3, triode Q1 respectively, and the other end is connected with the A1 port of ultrasonic transmitter 3.
Described ultrasonic transmitter 3 comprises chip hex inverter U1-7404, definite value is 10 μ F electric capacity C5, ultrasound wave emitting head; A1, A2, A3 port of described hex inverter U1-7404 is connected with the Sout mouth of voltage amplifier circuit 2, and Y1 port is connected with A4, A5; Described electric capacity C5 one end is connected with Y4, Y5 port of hex inverter U1-7404, and the other end is connected with ultrasound wave emitting head; Y2, Y3 port of described hex inverter U1-7404 is connected with ultrasound wave emitting head; The VCC port of described hex inverter U1-7404 connects+5.5V power supply; The GND port ground connection of described hex inverter U1-7404.
Described ultrasonic receiver 4 comprises definite value is 10K resistance R5, resistance R7, resistance R8, definite value are 20K resistance R6, definite value is 10 μ F electric capacity C6, C7 and C9, definite value is 100nF electric capacity C8, chip U2-51, ultrasound wave Receiver; Described electric capacity C6 one end is connected with chip U2-51 port one, other end ground connection; Described electric capacity C7 one end is connected with resistance R5, other end ground connection; Described resistance R5 one end is connected with electric capacity C7, and the other end is connected with the port 2 of chip U2-51; Described electric capacity C8 one end ground connection, the other end is connected with the port 3 of chip U2-51; Described resistance R6 one end is connected with the port 5 of chip U2-51, and the other end is connected with the port 8 of resistance R7, chip U2-51; Described electric capacity C9 one end is connected with the port 6 of chip U2-51, other end ground connection; Described resistance R7 one end is connected with resistance R6, and the other end is connected with the port 7 of resistance R8, chip U2-51; Described ultrasound wave Receiver one end is connected with the port one of chip U2-51, other end ground connection.
Described signal amplification circuit 5 comprises resistance R9, R10, R11, R13 and R15 that definite value is 10K, definite value is 5K resistance R12 and R14, amplifier N1, N2; Described resistance R9 one end is connected with the output terminal of resistance R10, amplifier N1, and the other end is connected with resistance R11, voltage input end Ui; Described resistance R10 one end is connected with the output terminal of resistance R9, amplifier N1, and the other end is connected with resistance R13, amplifier inverting input; Described resistance R11 one end is connected with resistance R9, voltage input end Ui, and the other end is connected with the inverting input of resistance R15, amplifier N2; Described resistance R12 one end is connected with the in-phase input end of amplifier N2, one end ground connection; Described resistance R13 one end is connected with the inverting input of resistance R10, amplifier N1, and the other end is connected with resistance R15, voltage output end Uo; Described resistance R14 one end is connected with the in-phase input end of amplifier N1, other end ground connection; Described resistance R15 one end is connected with the inverting input of resistance R11, amplifier N2, and the other end is connected with resistance R13, voltage output end Uo.
Resistance R16, DS18B20 temperature sensor that described temperature measurement circuit 8 comprises single-chip microcomputer II9, definite value is 10K; Described single-chip microcomputer II9 adopts 51 single-chip microcomputers, GND and the Vdd port ground connection of described DS18B20 temperature sensor, and DQ port is connected with the I/O port of resistance R16,51 single-chip microcomputers; Described resistance R16 one end is connected with the I/O port of 51 single-chip microcomputers, the DQ port of DS18B20 temperature sensor, another termination+5.5V power supply.
Principle of work of the present utility model is:
First be that ultrasound wave transmitting terminal carries out the modulation of signal by single-chip microcomputer I1, pulse width is 200 delicate, and the recurrent interval is decided to be 0.1 second according to automobile driving speed.According to traditional modulation theory, the peak value of modulation signal is higher, and hyperacoustic operating distance is far away, is therefore amplified by voltage amplifier circuit 2 pairs of single-chip microcomputer I1 signals, reload afterwards on ultrasonic sensor, then carried out the transmitting of ultrasonic signal by ultrasonic transmitter 3.Then ultrasonic receiver 4 pairs of ultrasonic signals receive, send into comparer 6 comparer technology herein after amplifying about 100dB by signal amplification circuit 5 and belong to routine techniques, sine wave signal is shaped as square wave signal, then belong to routine techniques triggered interrupts (trigger 7 is connected with single-chip microcomputer II8 by single-chip microcomputer door interface INT0) by trigger 7 trigger technology herein, single-chip microcomputer II9 reads signal data, because acoustic velocity is relevant with temperature, so the design adds temperature measurement circuit 8, the monitoring of temperature is on the spot carried out by DS18B20, then single-chip microcomputer II9 is transferred to equally, after the A/D conversion processing of signal, single-chip microcomputer II9 is by the signal data of Integration obtaining, finally send to computing machine, host computer is utilized to carry out the drafting of track of vehicle, realize the real-time display to vehicle route information.
The beneficial effects of the utility model are: it is accurate not in time that the utility model solves infrared technique Monitoring Data, the problems such as system is comparatively complicated, and GPS location technology application cost is larger.And this device does not need human intervention, data are directly obtained by single-chip microcomputer and transfer to computing machine, ensure that undistorted in transmitting procedure of data.This apparatus structure is simple, easy to operate, safe and reliable, with low cost, economical environment-protective; And this utility model has good economic universality.
Accompanying drawing explanation
Fig. 1 is that functional module of the present utility model connects block diagram;
Fig. 2 is entity structure schematic diagram of the present utility model;
Fig. 3 is voltage amplifier circuit figure in the utility model;
Fig. 4 is ultrasonic transmitter circuit diagram in the utility model;
Fig. 5 is ultrasonic receiver circuit diagram in the utility model;
Fig. 6 is signal amplification circuit figure in the utility model;
Fig. 7 is temperature measurement circuit figure in the utility model.
Each label in Fig. 1-7: 1-single-chip microcomputer I, 2-voltage amplifier circuit, 3-ultrasonic transmitter, 4-ultrasonic receiver, 5-signal amplification circuit, 6-comparer, 7-trigger, 8-temperature measurement circuit, 9-single-chip microcomputer II, 10-host computer.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Embodiment 1: as shown in figs. 1-7, based on a real-time embedded supersonic vehicle trace monitor device, comprise single-chip microcomputer I1, voltage amplifier circuit 2, ultrasonic transmitter 3, ultrasonic receiver 4, signal amplification circuit 5, comparer 6, trigger 7, temperature measurement circuit 8, single-chip microcomputer II9, host computer 10; Described single-chip microcomputer I1 is connected with voltage amplifier circuit 2, voltage amplifier circuit 2 is connected with ultrasonic transmitter 3, ultrasonic generator 3 is connected with ultrasonic receiver 4, ultrasonic receiver 4 is connected with signal amplification circuit 5, signal amplification circuit 5 is connected with comparer 6, and comparer 6 is connected with trigger 7, and trigger 7 is connected with single-chip microcomputer II9, temperature measurement circuit 8 is connected with single-chip microcomputer II9, and single-chip microcomputer II9 is connected with host computer 10.
Embodiment 2: as shown in figs. 1-7, based on a real-time embedded supersonic vehicle trace monitor device, comprise single-chip microcomputer I1, voltage amplifier circuit 2, ultrasonic transmitter 3, ultrasonic receiver 4, signal amplification circuit 5, comparer 6, trigger 7, temperature measurement circuit 8, single-chip microcomputer II9, host computer 10; Described single-chip microcomputer I1 is connected with voltage amplifier circuit 2, voltage amplifier circuit 2 is connected with ultrasonic transmitter 3, ultrasonic generator 3 is connected with ultrasonic receiver 4, ultrasonic receiver 4 is connected with signal amplification circuit 5, signal amplification circuit 5 is connected with comparer 6, and comparer 6 is connected with trigger 7, and trigger 7 is connected with single-chip microcomputer II9, temperature measurement circuit 8 is connected with single-chip microcomputer II9, and single-chip microcomputer II9 is connected with host computer 10.
The triode Q1 that the resistance R4 that the resistance R3 that the resistance R2 that described voltage amplifier circuit 2 comprises resistance R1 that definite value is 100K, definite value is 20K, definite value are 25K, definite value are 50K, model are 2N2222, definite value are electric capacity C1, C2, C3, C4 of 10 μ F; Described resistance R1 one end is connected with+5V power supply, and the other end is connected with resistance R2, electric capacity C1; Described resistance R2 one end is connected with the base stage of resistance R1, electric capacity C1, triode Q1 respectively, and the other end is connected with the P1.0 mouth of single-chip microcomputer I1; Described resistance R3 one end is connected with+5V power supply, resistance R1, electric capacity C2 respectively, and the other end is connected with the collector of triode Q1, electric capacity C4 respectively; Described resistance R4 one end is connected with the emitter of triode Q1, other end ground connection; Described electric capacity C3 one end is connected with electric capacity C2, other end ground connection; Described electric capacity C4 one end is connected with the collector of resistance R3, triode Q1 respectively, and the other end is connected with the A1 port of ultrasonic transmitter 3.
Embodiment 3: as shown in figs. 1-7, based on a real-time embedded supersonic vehicle trace monitor device, comprise single-chip microcomputer I1, voltage amplifier circuit 2, ultrasonic transmitter 3, ultrasonic receiver 4, signal amplification circuit 5, comparer 6, trigger 7, temperature measurement circuit 8, single-chip microcomputer II9, host computer 10; Described single-chip microcomputer I1 is connected with voltage amplifier circuit 2, voltage amplifier circuit 2 is connected with ultrasonic transmitter 3, ultrasonic generator 3 is connected with ultrasonic receiver 4, ultrasonic receiver 4 is connected with signal amplification circuit 5, signal amplification circuit 5 is connected with comparer 6, and comparer 6 is connected with trigger 7, and trigger 7 is connected with single-chip microcomputer II9, temperature measurement circuit 8 is connected with single-chip microcomputer II9, and single-chip microcomputer II9 is connected with host computer 10.
The triode Q1 that the resistance R4 that the resistance R3 that the resistance R2 that described voltage amplifier circuit 2 comprises resistance R1 that definite value is 100K, definite value is 20K, definite value are 25K, definite value are 50K, model are 2N2222, definite value are electric capacity C1, C2, C3, C4 of 10 μ F; Described resistance R1 one end is connected with+5V power supply, and the other end is connected with resistance R2, electric capacity C1; Described resistance R2 one end is connected with the base stage of resistance R1, electric capacity C1, triode Q1 respectively, and the other end is connected with the P1.0 mouth of single-chip microcomputer I1; Described resistance R3 one end is connected with+5V power supply, resistance R1, electric capacity C2 respectively, and the other end is connected with the collector of triode Q1, electric capacity C4 respectively; Described resistance R4 one end is connected with the emitter of triode Q1, other end ground connection; Described electric capacity C3 one end is connected with electric capacity C2, other end ground connection; Described electric capacity C4 one end is connected with the collector of resistance R3, triode Q1 respectively, and the other end is connected with the A1 port of ultrasonic transmitter 3.
Described ultrasonic transmitter 3 comprises chip hex inverter U1-7404, definite value is 10 μ F electric capacity C5, ultrasound wave emitting head; A1, A2, A3 port of described hex inverter U1-7404 is connected with the Sout mouth of voltage amplifier circuit 2, and Y1 port is connected with A4, A5; Described electric capacity C5 one end is connected with Y4, Y5 port of hex inverter U1-7404, and the other end is connected with ultrasound wave emitting head; Y2, Y3 port of described hex inverter U1-7404 is connected with ultrasound wave emitting head; The VCC port of described hex inverter U1-7404 connects+5.5V power supply; The GND port ground connection of described hex inverter U1-7404.
Embodiment 4: as shown in figs. 1-7, based on a real-time embedded supersonic vehicle trace monitor device, comprise single-chip microcomputer I1, voltage amplifier circuit 2, ultrasonic transmitter 3, ultrasonic receiver 4, signal amplification circuit 5, comparer 6, trigger 7, temperature measurement circuit 8, single-chip microcomputer II9, host computer 10; Described single-chip microcomputer I1 is connected with voltage amplifier circuit 2, voltage amplifier circuit 2 is connected with ultrasonic transmitter 3, ultrasonic generator 3 is connected with ultrasonic receiver 4, ultrasonic receiver 4 is connected with signal amplification circuit 5, signal amplification circuit 5 is connected with comparer 6, and comparer 6 is connected with trigger 7, and trigger 7 is connected with single-chip microcomputer II9, temperature measurement circuit 8 is connected with single-chip microcomputer II9, and single-chip microcomputer II9 is connected with host computer 10.
The triode Q1 that the resistance R4 that the resistance R3 that the resistance R2 that described voltage amplifier circuit 2 comprises resistance R1 that definite value is 100K, definite value is 20K, definite value are 25K, definite value are 50K, model are 2N2222, definite value are electric capacity C1, C2, C3, C4 of 10 μ F; Described resistance R1 one end is connected with+5V power supply, and the other end is connected with resistance R2, electric capacity C1; Described resistance R2 one end is connected with the base stage of resistance R1, electric capacity C1, triode Q1 respectively, and the other end is connected with the P1.0 mouth of single-chip microcomputer I1; Described resistance R3 one end is connected with+5V power supply, resistance R1, electric capacity C2 respectively, and the other end is connected with the collector of triode Q1, electric capacity C4 respectively; Described resistance R4 one end is connected with the emitter of triode Q1, other end ground connection; Described electric capacity C3 one end is connected with electric capacity C2, other end ground connection; Described electric capacity C4 one end is connected with the collector of resistance R3, triode Q1 respectively, and the other end is connected with the A1 port of ultrasonic transmitter 3.
Described ultrasonic transmitter 3 comprises chip hex inverter U1-7404, definite value is 10 μ F electric capacity C5, ultrasound wave emitting head; A1, A2, A3 port of described hex inverter U1-7404 is connected with the Sout mouth of voltage amplifier circuit 2, and Y1 port is connected with A4, A5; Described electric capacity C5 one end is connected with Y4, Y5 port of hex inverter U1-7404, and the other end is connected with ultrasound wave emitting head; Y2, Y3 port of described hex inverter U1-7404 is connected with ultrasound wave emitting head; The VCC port of described hex inverter U1-7404 connects+5.5V power supply; The GND port ground connection of described hex inverter U1-7404.
Described ultrasonic receiver 4 comprises definite value is 10K resistance R5, resistance R7, resistance R8, definite value are 20K resistance R6, definite value is 10 μ F electric capacity C6, C7 and C9, definite value is 100nF electric capacity C8, chip U2-51, ultrasound wave Receiver; Described electric capacity C6 one end is connected with chip U2-51 port one, other end ground connection; Described electric capacity C7 one end is connected with resistance R5, other end ground connection; Described resistance R5 one end is connected with electric capacity C7, and the other end is connected with the port 2 of chip U2-51; Described electric capacity C8 one end ground connection, the other end is connected with the port 3 of chip U2-51; Described resistance R6 one end is connected with the port 5 of chip U2-51, and the other end is connected with the port 8 of resistance R7, chip U2-51; Described electric capacity C9 one end is connected with the port 6 of chip U2-51, other end ground connection; Described resistance R7 one end is connected with resistance R6, and the other end is connected with the port 7 of resistance R8, chip U2-51; Described ultrasound wave Receiver one end is connected with the port one of chip U2-51, other end ground connection.
Embodiment 5: as shown in figs. 1-7, based on a real-time embedded supersonic vehicle trace monitor device, comprise single-chip microcomputer I1, voltage amplifier circuit 2, ultrasonic transmitter 3, ultrasonic receiver 4, signal amplification circuit 5, comparer 6, trigger 7, temperature measurement circuit 8, single-chip microcomputer II9, host computer 10; Described single-chip microcomputer I1 is connected with voltage amplifier circuit 2, voltage amplifier circuit 2 is connected with ultrasonic transmitter 3, ultrasonic generator 3 is connected with ultrasonic receiver 4, ultrasonic receiver 4 is connected with signal amplification circuit 5, signal amplification circuit 5 is connected with comparer 6, and comparer 6 is connected with trigger 7, and trigger 7 is connected with single-chip microcomputer II9, temperature measurement circuit 8 is connected with single-chip microcomputer II9, and single-chip microcomputer II9 is connected with host computer 10.
The triode Q1 that the resistance R4 that the resistance R3 that the resistance R2 that described voltage amplifier circuit 2 comprises resistance R1 that definite value is 100K, definite value is 20K, definite value are 25K, definite value are 50K, model are 2N2222, definite value are electric capacity C1, C2, C3, C4 of 10 μ F; Described resistance R1 one end is connected with+5V power supply, and the other end is connected with resistance R2, electric capacity C1; Described resistance R2 one end is connected with the base stage of resistance R1, electric capacity C1, triode Q1 respectively, and the other end is connected with the P1.0 mouth of single-chip microcomputer I1; Described resistance R3 one end is connected with+5V power supply, resistance R1, electric capacity C2 respectively, and the other end is connected with the collector of triode Q1, electric capacity C4 respectively; Described resistance R4 one end is connected with the emitter of triode Q1, other end ground connection; Described electric capacity C3 one end is connected with electric capacity C2, other end ground connection; Described electric capacity C4 one end is connected with the collector of resistance R3, triode Q1 respectively, and the other end is connected with the A1 port of ultrasonic transmitter 3.
Described ultrasonic transmitter 3 comprises chip hex inverter U1-7404, definite value is 10 μ F electric capacity C5, ultrasound wave emitting head; A1, A2, A3 port of described hex inverter U1-7404 is connected with the Sout mouth of voltage amplifier circuit 2, and Y1 port is connected with A4, A5; Described electric capacity C5 one end is connected with Y4, Y5 port of hex inverter U1-7404, and the other end is connected with ultrasound wave emitting head; Y2, Y3 port of described hex inverter U1-7404 is connected with ultrasound wave emitting head; The VCC port of described hex inverter U1-7404 connects+5.5V power supply; The GND port ground connection of described hex inverter U1-7404.
Described ultrasonic receiver 4 comprises definite value is 10K resistance R5, resistance R7, resistance R8, definite value are 20K resistance R6, definite value is 10 μ F electric capacity C6, C7 and C9, definite value is 100nF electric capacity C8, chip U2-51, ultrasound wave Receiver; Described electric capacity C6 one end is connected with chip U2-51 port one, other end ground connection; Described electric capacity C7 one end is connected with resistance R5, other end ground connection; Described resistance R5 one end is connected with electric capacity C7, and the other end is connected with the port 2 of chip U2-51; Described electric capacity C8 one end ground connection, the other end is connected with the port 3 of chip U2-51; Described resistance R6 one end is connected with the port 5 of chip U2-51, and the other end is connected with the port 8 of resistance R7, chip U2-51; Described electric capacity C9 one end is connected with the port 6 of chip U2-51, other end ground connection; Described resistance R7 one end is connected with resistance R6, and the other end is connected with the port 7 of resistance R8, chip U2-51; Described ultrasound wave Receiver one end is connected with the port one of chip U2-51, other end ground connection.
Described signal amplification circuit 5 comprises resistance R9, R10, R11, R13 and R15 that definite value is 10K, definite value is 5K resistance R12 and R14, amplifier N1, N2; Described resistance R9 one end is connected with the output terminal of resistance R10, amplifier N1, and the other end is connected with resistance R11, voltage input end Ui; Described resistance R10 one end is connected with the output terminal of resistance R9, amplifier N1, and the other end is connected with resistance R13, amplifier inverting input; Described resistance R11 one end is connected with resistance R9, voltage input end Ui, and the other end is connected with the inverting input of resistance R15, amplifier N2; Described resistance R12 one end is connected with the in-phase input end of amplifier N2, one end ground connection; Described resistance R13 one end is connected with the inverting input of resistance R10, amplifier N1, and the other end is connected with resistance R15, voltage output end Uo; Described resistance R14 one end is connected with the in-phase input end of amplifier N1, other end ground connection; Described resistance R15 one end is connected with the inverting input of resistance R11, amplifier N2, and the other end is connected with resistance R13, voltage output end Uo.
Embodiment 6: as shown in figs. 1-7, based on a real-time embedded supersonic vehicle trace monitor device, comprise single-chip microcomputer I1, voltage amplifier circuit 2, ultrasonic transmitter 3, ultrasonic receiver 4, signal amplification circuit 5, comparer 6, trigger 7, temperature measurement circuit 8, single-chip microcomputer II9, host computer 10; Described single-chip microcomputer I1 is connected with voltage amplifier circuit 2, voltage amplifier circuit 2 is connected with ultrasonic transmitter 3, ultrasonic generator 3 is connected with ultrasonic receiver 4, ultrasonic receiver 4 is connected with signal amplification circuit 5, signal amplification circuit 5 is connected with comparer 6, and comparer 6 is connected with trigger 7, and trigger 7 is connected with single-chip microcomputer II9, temperature measurement circuit 8 is connected with single-chip microcomputer II9, and single-chip microcomputer II9 is connected with host computer 10.
The triode Q1 that the resistance R4 that the resistance R3 that the resistance R2 that described voltage amplifier circuit 2 comprises resistance R1 that definite value is 100K, definite value is 20K, definite value are 25K, definite value are 50K, model are 2N2222, definite value are electric capacity C1, C2, C3, C4 of 10 μ F; Described resistance R1 one end is connected with+5V power supply, and the other end is connected with resistance R2, electric capacity C1; Described resistance R2 one end is connected with the base stage of resistance R1, electric capacity C1, triode Q1 respectively, and the other end is connected with the P1.0 mouth of single-chip microcomputer I1; Described resistance R3 one end is connected with+5V power supply, resistance R1, electric capacity C2 respectively, and the other end is connected with the collector of triode Q1, electric capacity C4 respectively; Described resistance R4 one end is connected with the emitter of triode Q1, other end ground connection; Described electric capacity C3 one end is connected with electric capacity C2, other end ground connection; Described electric capacity C4 one end is connected with the collector of resistance R3, triode Q1 respectively, and the other end is connected with the A1 port of ultrasonic transmitter 3.
Described ultrasonic transmitter 3 comprises chip hex inverter U1-7404, definite value is 10 μ F electric capacity C5, ultrasound wave emitting head; A1, A2, A3 port of described hex inverter U1-7404 is connected with the Sout mouth of voltage amplifier circuit 2, and Y1 port is connected with A4, A5; Described electric capacity C5 one end is connected with Y4, Y5 port of hex inverter U1-7404, and the other end is connected with ultrasound wave emitting head; Y2, Y3 port of described hex inverter U1-7404 is connected with ultrasound wave emitting head; The VCC port of described hex inverter U1-7404 connects+5.5V power supply; The GND port ground connection of described hex inverter U1-7404.
Described ultrasonic receiver 4 comprises definite value is 10K resistance R5, resistance R7, resistance R8, definite value are 20K resistance R6, definite value is 10 μ F electric capacity C6, C7 and C9, definite value is 100nF electric capacity C8, chip U2-51, ultrasound wave Receiver; Described electric capacity C6 one end is connected with chip U2-51 port one, other end ground connection; Described electric capacity C7 one end is connected with resistance R5, other end ground connection; Described resistance R5 one end is connected with electric capacity C7, and the other end is connected with the port 2 of chip U2-51; Described electric capacity C8 one end ground connection, the other end is connected with the port 3 of chip U2-51; Described resistance R6 one end is connected with the port 5 of chip U2-51, and the other end is connected with the port 8 of resistance R7, chip U2-51; Described electric capacity C9 one end is connected with the port 6 of chip U2-51, other end ground connection; Described resistance R7 one end is connected with resistance R6, and the other end is connected with the port 7 of resistance R8, chip U2-51; Described ultrasound wave Receiver one end is connected with the port one of chip U2-51, other end ground connection.
Described signal amplification circuit 5 comprises resistance R9, R10, R11, R13 and R15 that definite value is 10K, definite value is 5K resistance R12 and R14, amplifier N1, N2; Described resistance R9 one end is connected with the output terminal of resistance R10, amplifier N1, and the other end is connected with resistance R11, voltage input end Ui; Described resistance R10 one end is connected with the output terminal of resistance R9, amplifier N1, and the other end is connected with resistance R13, amplifier inverting input; Described resistance R11 one end is connected with resistance R9, voltage input end Ui, and the other end is connected with the inverting input of resistance R15, amplifier N2; Described resistance R12 one end is connected with the in-phase input end of amplifier N2, one end ground connection; Described resistance R13 one end is connected with the inverting input of resistance R10, amplifier N1, and the other end is connected with resistance R15, voltage output end Uo; Described resistance R14 one end is connected with the in-phase input end of amplifier N1, other end ground connection; Described resistance R15 one end is connected with the inverting input of resistance R11, amplifier N2, and the other end is connected with resistance R13, voltage output end Uo.
Resistance R16, DS18B20 temperature sensor that described temperature measurement circuit 8 comprises single-chip microcomputer II9, definite value is 10K; Described single-chip microcomputer II9 adopts 51 single-chip microcomputers, GND and the Vdd port ground connection of described DS18B20 temperature sensor, and DQ port is connected with the I/O port of resistance R16,51 single-chip microcomputers; Described resistance R16 one end is connected with the I/O port of 51 single-chip microcomputers, the DQ port of DS18B20 temperature sensor, another termination+5.5V power supply.
By reference to the accompanying drawings specific embodiment of the utility model is explained in detail above, but the utility model is not limited to above-described embodiment, in the ken that those of ordinary skill in the art possess, various change can also be made under the prerequisite not departing from the utility model aim.
Claims (6)
1., based on a real-time embedded supersonic vehicle trace monitor device, it is characterized in that: comprise single-chip microcomputer I(1), voltage amplifier circuit (2), ultrasonic transmitter (3), ultrasonic receiver (4), signal amplification circuit (5), comparer (6), trigger (7), temperature measurement circuit (8), single-chip microcomputer II(9), host computer (10); Described single-chip microcomputer I(1) be connected with voltage amplifier circuit (2), voltage amplifier circuit (2) is connected with ultrasonic transmitter (3), ultrasonic generator (3) is connected with ultrasonic receiver (4), ultrasonic receiver (4) is connected with signal amplification circuit (5), signal amplification circuit (5) is connected with comparer (6), comparer (6) is connected with trigger (7), trigger (7) and single-chip microcomputer II(9) be connected, temperature measurement circuit (8) and single-chip microcomputer II(9) be connected, single-chip microcomputer II(9) be connected with host computer (10).
2. according to claim 1 based on real-time embedded supersonic vehicle trace monitor device, it is characterized in that: the triode Q1 that the resistance R4 that the resistance R3 that the resistance R2 that described voltage amplifier circuit (2) comprises resistance R1 that definite value is 100K, definite value is 20K, definite value are 25K, definite value are 50K, model are 2N2222, definite value are electric capacity C1, C2, C3, C4 of 10 μ F; Described resistance R1 one end is connected with+5V power supply, and the other end is connected with resistance R2, electric capacity C1; Described resistance R2 one end is connected with the base stage of resistance R1, electric capacity C1, triode Q1 respectively, the other end and single-chip microcomputer I(1) P1.0 mouth be connected; Described resistance R3 one end is connected with+5V power supply, resistance R1, electric capacity C2 respectively, and the other end is connected with the collector of triode Q1, electric capacity C4 respectively; Described resistance R4 one end is connected with the emitter of triode Q1, other end ground connection; Described electric capacity C3 one end is connected with electric capacity C2, other end ground connection; Described electric capacity C4 one end is connected with the collector of resistance R3, triode Q1 respectively, and the other end is connected with the A1 port of ultrasonic transmitter (3).
3. according to claim 1 based on real-time embedded supersonic vehicle trace monitor device, it is characterized in that: described ultrasonic transmitter (3) comprises chip hex inverter U1-7404, definite value is 10 μ F electric capacity C5, ultrasound wave emitting head; A1, A2, A3 port of described hex inverter U1-7404 is connected with the Sout mouth of voltage amplifier circuit (2), and Y1 port is connected with A4, A5; Described electric capacity C5 one end is connected with Y4, Y5 port of hex inverter U1-7404, and the other end is connected with ultrasound wave emitting head; Y2, Y3 port of described hex inverter U1-7404 is connected with ultrasound wave emitting head; The VCC port of described hex inverter U1-7404 connects+5.5V power supply; The GND port ground connection of described hex inverter U1-7404.
4. according to claim 1 based on real-time embedded supersonic vehicle trace monitor device, it is characterized in that: described ultrasonic receiver (4) comprises definite value is 10K resistance R5, resistance R7, resistance R8, definite value are 20K resistance R6, definite value is 10 μ F electric capacity C6, C7 and C9, definite value is 100nF electric capacity C8, chip U2-51, ultrasound wave Receiver; Described electric capacity C6 one end is connected with chip U2-51 port one, other end ground connection; Described electric capacity C7 one end is connected with resistance R5, other end ground connection; Described resistance R5 one end is connected with electric capacity C7, and the other end is connected with the port 2 of chip U2-51; Described electric capacity C8 one end ground connection, the other end is connected with the port 3 of chip U2-51; Described resistance R6 one end is connected with the port 5 of chip U2-51, and the other end is connected with the port 8 of resistance R7, chip U2-51; Described electric capacity C9 one end is connected with the port 6 of chip U2-51, other end ground connection; Described resistance R7 one end is connected with resistance R6, and the other end is connected with the port 7 of resistance R8, chip U2-51; Described ultrasound wave Receiver one end is connected with the port one of chip U2-51, other end ground connection.
5. according to claim 1 based on real-time embedded supersonic vehicle trace monitor device, it is characterized in that: described signal amplification circuit (5) comprises resistance R9, R10, R11, R13 and R15 that definite value is 10K, definite value is 5K resistance R12 and R14, amplifier N1, N2; Described resistance R9 one end is connected with the output terminal of resistance R10, amplifier N1, and the other end is connected with resistance R11, voltage input end Ui; Described resistance R10 one end is connected with the output terminal of resistance R9, amplifier N1, and the other end is connected with resistance R13, amplifier inverting input; Described resistance R11 one end is connected with resistance R9, voltage input end Ui, and the other end is connected with the inverting input of resistance R15, amplifier N2; Described resistance R12 one end is connected with the in-phase input end of amplifier N2, one end ground connection; Described resistance R13 one end is connected with the inverting input of resistance R10, amplifier N1, and the other end is connected with resistance R15, voltage output end Uo; Described resistance R14 one end is connected with the in-phase input end of amplifier N1, other end ground connection; Described resistance R15 one end is connected with the inverting input of resistance R11, amplifier N2, and the other end is connected with resistance R13, voltage output end Uo.
6. according to claim 1 based on real-time embedded supersonic vehicle trace monitor device, to it is characterized in that: described temperature measurement circuit (8) comprises single-chip microcomputer II(9), definite value is resistance R16, DS18B20 temperature sensor of 10K; Described single-chip microcomputer II(9) adopt 51 single-chip microcomputers, GND and the Vdd port ground connection of described DS18B20 temperature sensor, DQ port is connected with the I/O port of resistance R16,51 single-chip microcomputers; Described resistance R16 one end is connected with the I/O port of 51 single-chip microcomputers, the DQ port of DS18B20 temperature sensor, another termination+5.5V power supply.
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|---|---|---|---|
| CN201520810809.0U CN205121887U (en) | 2015-10-20 | 2015-10-20 | Ultrasonic wave vehicle route monitoring devices based on it is embedded in real time |
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| CN201520810809.0U CN205121887U (en) | 2015-10-20 | 2015-10-20 | Ultrasonic wave vehicle route monitoring devices based on it is embedded in real time |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105243845A (en) * | 2015-10-20 | 2016-01-13 | 昆明理工大学 | Real-time embedded supersonic vehicle routing monitoring device |
| CN105825676B (en) * | 2016-05-26 | 2019-01-08 | 浙江索菱新能源汽车科技有限公司 | A kind of road vehicles traveling monitoring system based on Internet of Things |
-
2015
- 2015-10-20 CN CN201520810809.0U patent/CN205121887U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105243845A (en) * | 2015-10-20 | 2016-01-13 | 昆明理工大学 | Real-time embedded supersonic vehicle routing monitoring device |
| CN105825676B (en) * | 2016-05-26 | 2019-01-08 | 浙江索菱新能源汽车科技有限公司 | A kind of road vehicles traveling monitoring system based on Internet of Things |
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