CN205121464U - Novel disjunctor radiator structure - Google Patents

Novel disjunctor radiator structure Download PDF

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Publication number
CN205121464U
CN205121464U CN201520928627.3U CN201520928627U CN205121464U CN 205121464 U CN205121464 U CN 205121464U CN 201520928627 U CN201520928627 U CN 201520928627U CN 205121464 U CN205121464 U CN 205121464U
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CN
China
Prior art keywords
end fin
fin
distal end
cpu
far
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520928627.3U
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Chinese (zh)
Inventor
王聪
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Inspur Electronic Information Industry Co Ltd
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Inspur Electronic Information Industry Co Ltd
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Priority to CN201520928627.3U priority Critical patent/CN205121464U/en
Application granted granted Critical
Publication of CN205121464U publication Critical patent/CN205121464U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a novel disjunctor radiator structure, the radiator structure includes distal end fin, near -end fin, base plate, and wherein distal end fin and near -end fin set up in the both ends of base plate, and the quantity of near -end fin is less than the quantity of distal end fin. The utility model discloses it overlaps the condition of arranging to prolong distinguished and admirable direction to CPU in the double - circuit server, the quantity of near -end fin has been reduced, make its front face area be less than distal end fin front face area, the messenger directly reachs the distal end fin without the air of heating, the temperature of the inlet air of distal end fin is reduced, the amount of wind has been increased simultaneously, distal end CPU's the heat dissipation condition has effectively been improved, can be used to company's double - circuit product especially in the rack product, can effectively reduce distal end CPU temperature, high system stability.

Description

A kind of novel conjoined heat spreader structures
Technical field
The utility model relates to computer to dissipate heat technical field, is specifically related to a kind of novel conjoined heat spreader structures.
Background technology
Cpu fan is a unremarkable pocket-handkerchief, but its effect is just extraordinary, no matter is for keeping system is stablized, or want digging system potential, all will allow CPU " clearly "; Along with weather gradually warms up, CPU heat dissipation problem is also more and more outstanding.We know, the working temperature of CPU is related to stability and the serviceable life of computing machine.Allow the working temperature of CPU remain in rational scope, except reducing the operating ambient temperature of computing machine, carry out radiating treatment to CPU exactly.
Common cpu heat exothermic temperature effect is bad, and temperature is too high, affects CPU and normally works.When two CPU work simultaneously, be all generally that two independently cpu heats will be installed, but heat radiation independently between heating radiator, can be caused uneven, affect heat dissipation, had a strong impact on CPU work like this.
Application number 201120566854.8 utility model provides a passive type CPU combined radiator, belongs to heat abstractor field.The structure of this heating radiator comprises backboard, fin and heat pipe, and fin is arranged on backboard, and backboard and fin are respectively arranged with two and size is identical, and two backboards are set together mutually respectively by its right-hand member; Described fin is separately positioned on the left portion of backboard, be that backboard is provided with independent U-lag below fin left part, backboard on the right side of independent U-lag be also provided with two L shape grooves relatively fastened and fit with it, be respectively arranged with heat pipe in independent U-lag and L shape groove, the heat pipe on two backboards in L shape groove is connected together.
In two-way server, due to motherboard size restriction, two CPU often prolong wind direction overlapping arrangement, and the CPU position nearer apart from air intake vent is called near-end, and the position at another CPU place is called far-end.In server operational process, far-end heat radiator fin be heated cascading impact, inlet air temperatures is higher, and air quantity is less, and CPU radiating condition is comparatively severe.In order to reduce the overheated risk of far-end CPU, usually can adopt combined radiator, by the transfer of heat of far-end CPU to near-end fin, the radiating condition good by this position dissipates to heat.
Combined radiator is connected by traditional heat sinks with heat pipe, realizes the transmission of two ends heat.The radiating effect of combined radiator, depends on one end that radiating condition is severe, in the server, is namely the position at far-end CPU place.
Utility model content
The technical problems to be solved in the utility model is: in order to solve the problem, a kind of novel conjoined heat spreader structures is provided, structure optimization has been carried out to combined radiator, core is the front face area reducing near-end fin, make the air without heating flow through the fin of far-end CPU position, improve the radiating condition in this region.
The technical scheme that the utility model adopts is:
A kind of novel conjoined heat spreader structures, described heat spreader structures comprises far-end fin, near-end fin, substrate, and wherein far-end fin and near-end fin are arranged at the two ends of substrate, and the quantity of near-end fin is less than the quantity of far-end fin.
Conventional one-piece heating radiator adopts the scheme that two ends fin front face area is identical, and the utility model is in order to optimize the heat radiation of far-end CPU, hot cascading is avoided to make it occur overheated, by decreasing the quantity of near-end fin, make far-end fin front face area be greater than near-end fin front face area, compare traditional combined radiator, the inlet air temperatures of far-end fin can be reduced, improve air quantity simultaneously, effectively optimize the radiating condition of far-end CPU.
The below that described substrate is positioned at far-end fin and near-end fin is inlaid with copper coin respectively, and during use, the copper coin subsidy CPU surface of heating radiator, is convenient to heat radiation.
Described substrate is provided with heat pipe, is positioned at below far-end fin and near-end fin, is connected with described copper coin.
Described substrate is provided with 8 screws, and described screw is arranged at the position at 4 angles of far-end fin and near-end fin respectively, and for heating radiator is fixed on CPU, described screw is arranged on substrate by spring and packing ring.
The beneficial effects of the utility model are:
The utility model prolongs the situation of wind direction overlapping arrangement for CPU in two-way server, decrease the quantity of near-end fin, its front face area is made to be less than far-end fin front face area, make the air without heating directly arrive far-end fin, reduce the inlet air temperatures of far-end fin, increase air quantity simultaneously, effectively improve the heat dispersal situations of far-end CPU, can be used for company's two-way product particularly in Rack product, can effectively reduce far-end cpu temperature, improve system stability.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation.
Embodiment
Below according to Figure of description, in conjunction with embodiment, the utility model is further illustrated:
Embodiment 1:
As shown in Figure 1, a kind of novel conjoined heat spreader structures, described heat spreader structures comprises far-end fin 2, near-end fin 1, substrate 3, and wherein far-end fin 2 and near-end fin 1 are arranged at the two ends of substrate 3, and the quantity of near-end fin is less than the quantity of far-end fin.
Conventional one-piece heating radiator adopts the scheme that two ends fin front face area is identical, and the utility model is in order to optimize the heat radiation of far-end CPU, hot cascading is avoided to make it occur overheated, by decreasing the quantity of near-end fin, make far-end fin front face area be greater than near-end fin front face area, compare traditional combined radiator, the inlet air temperatures of far-end fin can be reduced, improve air quantity simultaneously, effectively optimize the radiating condition of far-end CPU.
Embodiment 2:
On the basis of embodiment 1, the below that substrate 3 described in the present embodiment is positioned at far-end fin 2 and near-end fin 1 is inlaid with copper coin respectively, and during use, the copper coin subsidy CPU surface of heating radiator, is convenient to heat radiation.
Embodiment 3:
On the basis of embodiment 2, substrate 3 described in the present embodiment is provided with heat pipe 4, is positioned at below far-end fin 2 and near-end fin 1, is connected with described copper coin.
Embodiment 4:
On the basis of 1-4 any embodiment, substrate 3 described in the present embodiment is provided with 8 screws 5, described screw 5 is arranged at the position at 4 angles of far-end fin 2 and near-end fin 1 respectively, and for heating radiator is fixed on CPU, described screw 5 is arranged on substrate 3 by spring and packing ring.
Above embodiment is only for illustration of the utility model; and be not limitation of the utility model; the those of ordinary skill of relevant technical field; when not departing from spirit and scope of the present utility model; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present utility model, and scope of patent protection of the present utility model should be defined by the claims.

Claims (4)

1. a novel conjoined heat spreader structures, is characterized in that: described heat spreader structures comprises far-end fin, near-end fin, substrate, and wherein far-end fin and near-end fin are arranged at the two ends of substrate, and the quantity of near-end fin is less than the quantity of far-end fin.
2. the novel conjoined heat spreader structures of one according to claim 1, is characterized in that: the below that described substrate is positioned at far-end fin and near-end fin is inlaid with copper coin respectively.
3. the novel conjoined heat spreader structures of one according to claim 2, is characterized in that: described substrate is provided with heat pipe, is positioned at below far-end fin and near-end fin, is connected with described copper coin.
4. the novel conjoined heat spreader structures of one according to claim 2, it is characterized in that: described substrate is provided with 8 screws, described screw is arranged at the position at 4 angles of far-end fin and near-end fin respectively, and described screw is arranged on substrate by spring and packing ring.
CN201520928627.3U 2015-11-20 2015-11-20 Novel disjunctor radiator structure Expired - Fee Related CN205121464U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520928627.3U CN205121464U (en) 2015-11-20 2015-11-20 Novel disjunctor radiator structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520928627.3U CN205121464U (en) 2015-11-20 2015-11-20 Novel disjunctor radiator structure

Publications (1)

Publication Number Publication Date
CN205121464U true CN205121464U (en) 2016-03-30

Family

ID=55577054

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520928627.3U Expired - Fee Related CN205121464U (en) 2015-11-20 2015-11-20 Novel disjunctor radiator structure

Country Status (1)

Country Link
CN (1) CN205121464U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160330

Termination date: 20171120

CF01 Termination of patent right due to non-payment of annual fee