CN205097702U - Regeneration ink horn chip, regeneration ink horn - Google Patents
Regeneration ink horn chip, regeneration ink horn Download PDFInfo
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- CN205097702U CN205097702U CN201520818920.4U CN201520818920U CN205097702U CN 205097702 U CN205097702 U CN 205097702U CN 201520818920 U CN201520818920 U CN 201520818920U CN 205097702 U CN205097702 U CN 205097702U
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- tin
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- 230000008929 regeneration Effects 0.000 title claims abstract description 67
- 238000011069 regeneration method Methods 0.000 title claims abstract description 67
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 127
- 239000012790 adhesive layer Substances 0.000 claims description 26
- 230000008439 repair process Effects 0.000 claims description 23
- 229910000679 solder Inorganic materials 0.000 abstract description 21
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000003384 imaging method Methods 0.000 abstract description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 52
- 239000006071 cream Substances 0.000 description 35
- 229910052742 iron Inorganic materials 0.000 description 26
- 238000003466 welding Methods 0.000 description 16
- 230000000875 corresponding effect Effects 0.000 description 15
- 239000004831 Hot glue Substances 0.000 description 13
- 229910000831 Steel Inorganic materials 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 12
- 239000010959 steel Substances 0.000 description 12
- 238000001514 detection method Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 10
- 239000003292 glue Substances 0.000 description 10
- 239000012943 hotmelt Substances 0.000 description 10
- 238000007639 printing Methods 0.000 description 10
- 239000012528 membrane Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000004064 recycling Methods 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000002596 correlated effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000010079 rubber tapping Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000010257 thawing Methods 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- 244000137852 Petrea volubilis Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to an imaging technique field is printed in the inkjet, especially relates to a regeneration ink horn chip, regeneration ink horn and production technology. Be in including former chip, restoration chip, setting former chip with restore between the chip and connect former chip with restore the bond line of chip, the tin point of repairing the chip passes the bond line with the contact contact of former chip. Connect through the bond line restore the chip with former chip keeps their phase position fixed, good electrical contact between the solder joint of assurance restoration chip and the contact of former chip.
Description
Technical field
The utility model relates to inkjet printing technical field of imaging, particularly relates to a kind of ink horn of regeneration chip, ink horn of regeneration and production technology thereof.
Background technology
In print job carries out, between printer and print cartridge, remain data communication at any time, and the ink consumption information of reality can be stored in print cartridge by printer, until after the ink in print cartridge finishes using, namely this information be stored in print cartridge, and can not change.When this type of discarded print cartridge loads printer again, printer can judge the internal data of print cartridge (model, the place of production, the date of production etc.), and reads the consumption ink information be stored in print cartridge, judges the ink amount of print cartridge.Because the black information of consumption be stored in print cartridge can not be changed, even if again fill print cartridge, printer still can judge that ink quantity of ink is low, thus quits work, and makes low ink and reports to the police or ink prompting to the greatest extent, discarded print cartridge cannot be recycled.
For realizing the function reused by discarded print cartridge, need recover the ink amount data of discarded print cartridge, now need increase by one and repair chip on discarded print cartridge, the discarded print cartridge repairing chip is installed and loads printer, printer can carry out data judgement and reading to it, when judging the legal and black amount information of data as full ink, this print cartridge can normally use.But the installation of repairing chip needs to keep the structure of former discarded print cartridge and the basic function of the former chip of print cartridge, also to ensure that the electrical connection of repairing chip and discarded print cartridge is good simultaneously.The reparation chip that paster technique is produced, to, by realizing the electrical connection of repairing chip and former chip, need reparation chip and former chip again to weld, in the process of again welding, be easy to cause the circuit of former chip to occur the faults such as short circuit, affect the recycling of print cartridge.
Utility model content
The purpose of this utility model is to provide a kind of ink horn of regeneration chip, ink horn of regeneration and production technology thereof, to realize the recycling of discarded print cartridge.
For achieving the above object, the utility model provides a kind of ink horn of regeneration chip, it is characterized in that: comprise former chip, repair chip, to be arranged between described former chip and described reparation chip and connect the adhesive layer of described former chip and described reparation chip; The tin point of described reparation chip passes the contact of described adhesive layer and described former chip.Connect described reparation chip and described former chip by adhesive layer, keep their phase position to fix, ensure to repair electrical contact good between the solder joint of chip and the contact of former chip.
As preferably, the thickness of described tin point equals the thickness of described adhesive layer.If the thickness of tin point is greater than the thickness of described adhesive layer, the degree of being connected firmly of adhesive layer can be had influence on, between described reparation chip and described former chip, have gap, if having conduction foreign matter to enter this gap may cause circuit board accidental short circuit; In addition, some is exposed in the gap between described reparation chip and described former chip to make described tin point, easily fractures.If the thickness of tin point is less than the thickness of described adhesive layer, the excellent electric contact between described reparation chip tin point and described former chip contacts can not be ensured.
As preferably, described former chip arranges dielectric film, and the tin point of described reparation chip is through the contact of described adhesive layer and described dielectric film and described former chip.Described dielectric film prevents other contacts of described former chip from surprisingly connecting, and improves the security of circuit, prevents interference.Even if adhesive layer lost efficacy and caused former chip and repaired chip and misplace, be also not easy to occur the phenomenon that short circuit causes chip and can burn out.The thickness of described tin point equals the thickness sum of described adhesive layer and described dielectric film.If the thickness of described former chip tin point is greater than the thickness sum of described adhesive layer and described dielectric film, the degree of being connected firmly of described adhesive layer can be affected, gap is had, if having conduction foreign matter to enter this gap may cause circuit board accidental short circuit between described reparation chip and described former chip; In addition, some is exposed in the gap between described reparation chip and described former chip to make described tin point, easily fractures.If the thickness of tin point is less than the thickness sum of described adhesive layer and described dielectric film, the excellent electric contact between described reparation chip tin point and described former chip contacts can not be ensured.
The utility model also provides a kind of ink horn of regeneration, it is characterized in that: above-mentioned a kind of ink horn of regeneration chip, for holding the container of ink, described reparation chip is arranged on inside described former chip, makes described reparation chip connect described former chip and described container outer surface.Repair chip to be arranged between described former chip and described container, make in the profile of print cartridge consistent with former print cartridge, do not see difference.
The utility model also provides a kind of ink horn of regeneration, it is characterized in that: above-mentioned a kind of ink horn of regeneration chip, container for holding ink is set, described reparation chip is arranged on outside described former chip, makes described former chip connect described reparation chip and described container outer surface.Repair chip to be directly installed on outside described former chip, do not need described former chip to be separated with described container.
The utility model also provides a kind of production technology of ink horn of regeneration, for being installed to inside described former chip by reparation chip, it is characterized in that:
S11: described former chip is separated with the container of described ink horn of regeneration; Conveniently described reparation chip is installed on inside described former chip.
S12: the dielectric film contact of described former chip being exposed described former chip; Make the solder joint of described reparation chip can realize being electrically connected with described contact.
S13: the one side at the solder joint place of described reparation chip pastes hot melt adhesive, exposes at hot melt adhesive outside by the solder joint of described reparation chip; The substrate of described reparation chip and described former chip firmly links together by described hot melt adhesive, prevents relative displacement between them.
S14: realize contacting with each other of the solder joint of described reparation chip and the contact of described former chip by the mode of tin means of spot welds or tin point cantact.Described tin point and described electric shock contact with each other the electrical connection realizing described reparation chip and described former chip.
S15: the container of the ink horn of regeneration chip completed in step S14 and ink horn of regeneration is installed together again.
S16: detect the ink horn of regeneration completed in step S15, detects and successfully represents that ink horn of regeneration can use; Detect and unsuccessfully represent that ink horn of regeneration cannot use, need to reprocess.
Wherein, described tin means of spot welds mode comprises the steps:
S1411: be covered with tin cream at the contact surface of the described contact corresponding with described tin point; The tin point of the contact of described former chip and described reparation chip links together by described tin cream after thawing of being heated.Tin cream has certain mobility, can be good at being coated on tin point surrounding, the contact of former chip is connected with the good electrical of repairing chip tin point, reduces the possibility of rosin joint.
S1412: by described reparation chip together with described former chip attach, makes the tin point of described reparation chip and the contact of described former chip; By described reparation chip together with described former chip attach, keep the relative position of the described contact that described tin point is corresponding with it constant.
S1413: by described tin cream heating and melting, makes described tin point together with described contact weld.
Wherein, described tin point cantact mode comprises the steps:
S1421: by described reparation chip together with described former chip attach, makes the tin point of described reparation chip and the contact of described former chip; By described reparation chip together with described former chip attach, keep the relative position of the described contact that described tin point is corresponding with it constant.
S1422: heat the chip of completing steps S1421, increases the firm pasting degree between described reparation chip and described former chip.
The utility model also provides a kind of production technology of ink horn of regeneration, for being installed to outside described former chip by described ink horn of regeneration chip, it is characterized in that:
S21: the described contact of former chip and the contact surface of described tin point are cleaned, to ensure the excellent electric contact of described contact and described solder joint.
S22: the one side at the solder joint place of described reparation chip pastes hot melt adhesive, exposes at hot melt adhesive outside by the solder joint of described reparation chip; The substrate of described reparation chip and described former chip firmly links together by described hot melt adhesive, prevents relative displacement between them.
S23: realize contacting with each other of the solder joint of described reparation chip and the contact of described former chip by the mode of tin means of spot welds or tin point cantact.Described tin point and described electric shock contact with each other the electrical connection realizing described reparation chip and described former chip.
S24: detect the ink horn of regeneration completed in step S23, detects and successfully represents that ink horn of regeneration can use; Detect and unsuccessfully represent that ink horn of regeneration cannot use, need to reprocess.
Wherein, described tin means of spot welds mode comprises the steps:
S2311: be covered with tin cream at the contact surface of the described contact corresponding with described tin point; The tin point of the contact of described former chip and described reparation chip links together by described tin cream after thawing of being heated.Tin cream has certain mobility, can be good at being coated on tin point surrounding, the contact of former chip is connected with the good electrical of repairing chip tin point, reduces the possibility of rosin joint.
S2312: by described reparation chip together with described former chip attach, makes the tin point of described reparation chip and the contact of described former chip; By described reparation chip together with described former chip attach, keep the relative position of the described contact that described tin point is corresponding with it constant.
S2313: by described tin cream heating and melting, makes described tin point together with described contact weld.
Wherein, described tin point cantact mode comprises the steps:
S2321: by described reparation chip together with described former chip attach, makes the tin point of described reparation chip and the contact of described former chip; By described reparation chip together with described former chip attach, keep the relative position of the described contact that described tin point is corresponding with it constant.
S2322: heat the chip of completing steps S2321, increases the firm pasting degree between described reparation chip and described former chip.
The utility model has following beneficial effect:
1. between former chip and reparation chip, adhesive layer is set, to ensure its excellent electric contact.Under the prerequisite not changing former chip and reparation chip structure, improve the structural stability of regeneration chip.
2. former chip arranges dielectric film, protects the circuit contact of former chip, prevents accidental short circuit.Improve security and the anti-interference of regeneration chip.
3. former chip and regeneration chip adopt the mode of tin point cantact to be connected, and avoid the welding to repairing chip and former chip, increase circuit impaired risk in welding process again.
4. former chip and regeneration chip adopt the mode of tin means of spot welds to be connected, and first brush tin cream in the contact of former chip, improve former chip and regeneration chip is directly electrically connected intensity, reduce the risk of rosin joint.
5. the multiple installation site of former chip and regeneration chip, meets different user demands.
Accompanying drawing explanation
Fig. 1 embodiment one regenerates print cartridges structure schematic diagram;
Fig. 2 embodiment one regenerates ink box chip structural representation;
Fig. 3 embodiment two ink horn of regeneration structural representation;
Fig. 4 embodiment two ink horn of regeneration chip structure schematic diagram
Wherein, 2-container, the former chip of 11-, 12-repair chip, 13-adhesive layer, 14-dielectric film, 111-contact, 121-tin point.
Detailed description of the invention
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in detail.
Embodiment one
A kind of ink horn of regeneration, comprises ink horn of regeneration chip, for holding the container of ink.Wherein, the structure of ink horn of regeneration chip, as Fig. 2, comprises former chip 11, repairs chip 12, is arranged on former chip 11 and repairs between chip 12 and to connect former chip 11 and repair the adhesive layer 13 of chip 12; Repair the tin point 121 of chip 12 through the contact 111 of adhesive layer 13 with former chip 11.Ink horn of regeneration chip is installed on the container 2 of print cartridge, and the reparation chip 12 of ink horn of regeneration chip is arranged on outside former chip 11 (as Fig. 1), makes former chip 11 connect the outer surface repairing chip 12 and container 2.In order to ensure the good contact repairing chip 12 and former chip 11, the thickness of tin point 121 need equal the thickness of adhesive layer 13.If the too low meeting of thickness of tin point 121 causes loose contact, directly cause print cartridge to print or printing effect bad, print quality decline; If the too high meeting of thickness of tin point 121 causes leader portion by jack-up, thus cause and take the lead the damage of upper contact, even damage the thimble on stamping ink car, cause associated printer line short, even burn printer.
The production of above-mentioned ink horn of regeneration comprises the steps:
S21: the contact of former chip and the contact surface of tin point are cleaned, to ensure the excellent electric contact of contact and solder joint.Obtain print cartridge, use the contact surface of sand paper to former chip to polish.Because discarded print cartridge is substantially from the recycling on market, print cartridge is in long-distance transport, use or in storing process, there is contact surface oxidation, dirty even corrosion phenomena, therefore need be all clean clean by this layer of oxide, otherwise the phenomenon that not there will be tin or loose contact when welding can be caused.
S22: paste hot melt adhesive in the one side at the solder joint place of repairing chip, the solder joint repairing chip is exposed at hot melt adhesive outside.
Paste Hot melt glue film in the tin point face of repairing chip, attention need be exposed tin point and be used for later process.Wherein, Hot melt glue film is similar to the double faced adhesive tape of the band shape of office.Hot melt adhesive directly can be cut by the size of repairing chip; Hot melt glue film can also customize by the tin point quantity and position of repairing chip, and have the place of tin point, perforate is just carried out in corresponding Hot melt glue film position, and the diameter of institute's perforate is 110% ~ 140%(recommended value of repairing tin spot diameter on chip: 120%).The diameter of tin point is preferably 70% ~ 90%(recommended value of former chip contacts diameter: 80%), when the contact topographies of former chip is irregular polygon, should be as the criterion with the diameter of most leptoprosopy.When tin spot diameter is greater than 90% of former chip contacts diameter, easily produces bad because the skew of reparation chip attach causes with contact perimeter circuit short circuit, cause print cartridge to scrap; When tin spot diameter is less than 70% of former chip contacts diameter, loose contact is easily caused to cause print cartridge to print.
S23: realize repairing contacting with each other of the solder joint of chip and the contact of former chip by the mode of tin means of spot welds or tin point cantact.
Wherein, tin means of spot welds mode comprises the steps:
S2311: be covered with tin cream at the contact surface of the described contact corresponding with described tin point.The selection of tin cream has three kinds of schemes: low temperature tin cream, fusing point 100 DEG C ~ 135 DEG C; Middle temperature tin cream, fusing point 150 DEG C ~ 175 DEG C; High temperature tin cream, fusing point 220 DEG C ~ 230 DEG C.Former chip is put on working metal table top, takes out directly over little steel disc is put in and takes the lead.It is corresponding that perforate and the former chip of little steel disc remove the contact of exposing after glued membrane, tin cream put into by little steel disc, scraper (scraper can be the conventional scraper that common small blade or SMT use when stirring tin cream) is used to scrape along little steel disc tapping is parallel, now tin cream has been printed onto by the perforate of little steel disc on the contact of former chip, remove little steel disc, complete paste solder printing.
S2312: will repair chip together with former chip attach, makes to repair the tin point of chip and the contact of former chip.The contact tin point repairing chip being faced former chip is installed, and by locating hole own on former chip, to guarantee that contraposition does not accurately offset, can be positioned on heating platform during contraposition.
S2313: by tin cream heating and melting, makes tin point together with contact weld.Use electric iron to the chip of completing steps S2312, technical requirement is as follows:
Electric iron can be common adjustable thermostatic firing equipment or device for ultrasonic welding, according to the tin cream type used in step S2311, arranges the temperature of electric iron:
Low temperature tin cream: fusing point 100 DEG C ~ 135 DEG C, electric iron is set to 120 DEG C ~ 155 DEG C;
Middle temperature tin cream: fusing point 150 DEG C ~ 175 DEG C, electric iron is set to 170 DEG C ~ 195 DEG C;
High temperature tin cream: fusing point 220 DEG C ~ 230 DEG C, electric iron is set to 235 DEG C ~ 255 DEG C.
Consider electric iron contact chip in a flash, larger temperature decrease phenomenon can be produced, the temperature of above-mentioned electric iron can be arranged each raising 20 DEG C, to obtain corresponding thermal compensation, realize good welding effect.
Electric iron touch chip completely until electric iron depart from chip be required to be 3S ~ 5S during this period of time.If be less than 3S, welding can be caused not complete, cause failure welding even cold welding rosin joint etc. cause machine on print cartridge not recognize or printing effect bad; If be greater than 5S, near injecting after scolding tin can be caused to melt, print cartridge short circuit is caused in contact, causes machine not recognized and maybe cannot print, even burn printer.
Tin point cantact mode comprises the steps:
S2321: will repair chip together with former chip attach, makes to repair the tin point of chip and the contact of former chip.The contact tin point repairing chip being faced former chip is installed, and by locating hole own on former chip, to guarantee that contraposition does not accurately offset, can be positioned on heating platform during contraposition.
S2322: heat the chip of completing steps S2321, increases the firm pasting degree repaired between chip and former chip.The chip of completing steps S2321 is positioned on heating platform, uses electric iron to carry out heat and melt.Electric iron touch chip completely until electric iron depart from chip be required to be 3S ~ 5S during this period of time.If be less than 3S, heat can be caused to melt and not complete, cause repair chip welding spot and former chip contacts cannot close contact and cause machine on print cartridge not recognize or printing effect bad; If be greater than 5S, Hot melt glue film can be caused because the adhesion failure too for a long time scalded causes to repair chip and former chip contacts cannot close contact, final print cartridge occur above machine do not recognize or printing effect bad.
S24: detect the ink horn of regeneration completed in step S23, detects and successfully represents that ink horn of regeneration can use; Detect and unsuccessfully represent that ink horn of regeneration cannot use, need to reprocess.
Ink horn of regeneration is installed to the printer supporting with print cartridge and carries out Function detection, or ink horn of regeneration is installed to the detector supporting with print cartridge and carries out Function detection.Detection comprises model and detects, ink amount detects, Function detection etc., and detector can be that regeneration chip manufacturer provides or other channels obtain has and to be equal to or close to the equipment of printer correlated performance, this equipment is only limitted to herein to the detection of ink horn of regeneration, can not use by alternative print machine completely.
Embodiment two
Repair chip 12 also can be arranged on inside former chip 11 (as Fig. 3), make reparation chip 12 connect the outer surface of former chip 11 and container 2.In order to prevent other contacts of former chip 11 from surprisingly connecting, improving the security of circuit, preventing interference; Even if ensure when adhesive layer 13 lost efficacy, former chip 11 misplaces with reparation chip 12, is also not easy to occur the phenomenon that short circuit causes chip and can burn out.Can arrange dielectric film 14 at former chip 11 back side, the tin point 121 repairing chip 12 contacts (as Fig. 4) with the contact 111 of dielectric film 14 with former chip 11 through adhesive layer 13.In order to ensure the good contact repairing chip 12 and former chip 11, the thickness of tin point 121 need be the dielectric film 14 of former chip 11 and the thickness sum of adhesive layer 13.If can loose contact be caused lower than sum of the two, directly cause print cartridge to print or printing effect bad, print quality decline; If leader portion can be caused by jack-up higher than sum of the two, thus cause and take the lead the damage of upper contact, even damage the thimble on stamping ink car, cause associated printer line short, even burn printer.
The production of above-mentioned ink horn of regeneration comprises the steps:
S11: former chip is separated with the container of ink horn of regeneration.
Obtain discarded print cartridge, peeled off by the container part of former chip part from print cartridge, can use common blade of carving knife during stripping, the locating dowel of the former chip pruned on print cartridge makes former chip automatically peel off, attention can not scratch the contact and circuit pack of taking the lead, and even scraps in order to avoid cause print cartridge to print; Or use ultrasonic equipment, the former chip positioning post melted on print cartridge makes former chip automatically peel off; Or use general industry heat gun, and temperature is arranged between 280 DEG C ~ 320 DEG C (recommended value: 300 DEG C), plastic portions heating 8S ~ 10S(recommended value to former chip: 10S) to make plastic portions soften, former chip is peeled off by recycling blade of carving knife gently, notice that blade can not scratch the contact and circuit pack of taking the lead, even scrap in order to avoid cause print cartridge to print; Or also can use related chemistry glue-dispenser, after spreading upon former die sites, former chip be peeled off.
S12: the dielectric film contact of former chip back being exposed former chip.
The back side of the discarded former chip of print cartridge is originally just with the glued membrane of one deck insulation.Need the glued membrane at the back side, contact corresponding to solder joint of removing former chip and repairing chip, it is outside exposed.Specific practice is: face down to be placed on heated at constant temperature platform by one of the glued membrane place of former chip and toast, heating platform temperature is set to (recommended value: 150 DEG C) between 130 DEG C ~ 160 DEG C, heat time is 5S, with the instrument such as tweezers or prong glued membrane directly torn off or choose, note contact and circuit to be torn to shreds, in order to avoid cause print cartridge to scrap when removing glued membrane; Or use laser marking machine directly will the glued membrane removing position to be needed to remove; Or by the contact face of former chip towards being placed down on smooth workbench, use the high temperature of tack solder horn to be removed by glued membrane, the temperature of tack flatiron is set between 300 DEG C ~ 400 DEG C, and (recommended value: 350 DEG C), ironing-time is 5S.
S13: paste hot melt adhesive in the one side at the solder joint place of repairing chip, the solder joint repairing chip is exposed at hot melt adhesive outside.
Paste Hot melt glue film in the tin point face of repairing chip, attention need be exposed tin point and be used for later process.Wherein, Hot melt glue film is similar to the double faced adhesive tape of the band shape of office.Hot melt adhesive directly can be cut by the size of repairing chip; Hot melt glue film can also customize by the tin point quantity and position of repairing chip, and have the place of tin point, perforate is just carried out in corresponding Hot melt glue film position, and the diameter of institute's perforate is 110% ~ 140%(recommended value of repairing tin spot diameter on chip: 120%).The diameter of tin point is preferably 70% ~ 90%(recommended value of former chip contacts diameter: 80%), when the contact topographies of former chip is irregular polygon, should be as the criterion with the diameter of most leptoprosopy.When tin spot diameter is greater than 90% of former chip contacts diameter, easily produces bad because the skew of reparation chip attach causes with contact perimeter circuit short circuit, cause print cartridge to scrap; When tin spot diameter is less than 70% of former chip contacts diameter, loose contact is easily caused to cause print cartridge to print.
S14: realize repairing contacting with each other of the solder joint of chip and the contact of former chip by the mode of tin means of spot welds or tin point cantact.
Wherein, tin means of spot welds mode comprises the steps:
S1411: be covered with tin cream at the contact surface of the described contact corresponding with described tin point.The selection of tin cream has three kinds of schemes: low temperature tin cream, fusing point 100 DEG C ~ 135 DEG C; Middle temperature tin cream, fusing point 150 DEG C ~ 175 DEG C; High temperature tin cream, fusing point 220 DEG C ~ 230 DEG C.Former chip is put on working metal table top, takes out directly over little steel disc is put in and takes the lead.It is corresponding that perforate and the former chip of little steel disc remove the contact of exposing after glued membrane, tin cream put into by little steel disc, scraper (scraper can be the conventional scraper that common small blade or SMT use when stirring tin cream) is used to scrape along little steel disc tapping is parallel, now tin cream has been printed onto by the perforate of little steel disc on the contact of former chip, remove little steel disc, complete paste solder printing.
S1412: will repair chip together with former chip attach, makes to repair the tin point of chip and the contact of former chip.The contact tin point repairing chip being faced former chip is installed, and by locating hole own on former chip, to guarantee that contraposition does not accurately offset, can be positioned on heating platform during contraposition.
S1413: by tin cream heating and melting, makes tin point together with contact weld.Use electric iron to the chip of completing steps S1412, technical requirement is as follows:
Electric iron can be common adjustable thermostatic firing equipment or device for ultrasonic welding, according to the tin cream type used in step S1411, arranges the temperature of electric iron:
Low temperature tin cream: fusing point 100 DEG C ~ 135 DEG C, electric iron is set to 120 DEG C ~ 155 DEG C;
Middle temperature tin cream: fusing point 150 DEG C ~ 175 DEG C, electric iron is set to 170 DEG C ~ 195 DEG C;
High temperature tin cream: fusing point 220 ~ 230 DEG C DEG C, electric iron is set to 235 DEG C ~ 255 DEG C.
Consider electric iron contact chip in a flash, larger temperature decrease phenomenon can be produced, the temperature of above-mentioned electric iron can be arranged each raising 20 DEG C, to obtain corresponding thermal compensation, realize good welding effect.
Electric iron touch chip completely until electric iron depart from chip be required to be 3S ~ 5S during this period of time.If be less than 3S, welding can be caused not complete, cause failure welding even cold welding rosin joint etc. cause machine on print cartridge not recognize or printing effect bad; If be greater than 5S, near injecting after scolding tin can be caused to melt, print cartridge short circuit is caused in contact, causes machine not recognized and maybe cannot print, even burn printer.
Tin point cantact mode comprises the steps:
S1421: will repair chip together with former chip attach, makes to repair the tin point of chip and the contact of former chip.The contact tin point repairing chip being faced former chip is installed, and by locating hole own on former chip, to guarantee that contraposition does not accurately offset, can be positioned on heating platform during contraposition.
S1422: heat the chip of completing steps S1421, increases the firm pasting degree repaired between chip and former chip.The chip of completing steps S1421 is positioned on heating platform, uses electric iron to carry out heat and melt.Electric iron touch chip completely until electric iron depart from chip be required to be 3S ~ 5S during this period of time.If be less than 3S, heat can be caused to melt and not complete, cause repair chip welding spot and former chip contacts cannot close contact and cause machine on print cartridge not recognize or printing effect bad; If be greater than 5S, Hot melt glue film can be caused because the adhesion failure too for a long time scalded causes to repair chip and former chip contacts cannot close contact, final print cartridge occur above machine do not recognize or printing effect bad.
S15: the container of the ink horn of regeneration chip completed in step S14 and ink horn of regeneration is installed together again.
Stick hot melt adhesive in the reparation chip face of the ink horn of regeneration chip of completing steps S14, chip attach is returned on the original position of print cartridge container.
S16: detect the ink horn of regeneration completed in step S15, detects and successfully represents that ink horn of regeneration can use; Detect and unsuccessfully represent that ink horn of regeneration cannot use, need to reprocess.
Ink horn of regeneration is installed to the printer supporting with print cartridge and carries out Function detection, or ink horn of regeneration is installed to the detector supporting with print cartridge and carries out Function detection.Detection comprises model and detects, ink amount detects, Function detection etc., and detector can be that regeneration chip manufacturer provides or other channels obtain has and to be equal to or close to the equipment of printer correlated performance, this equipment is only limitted to herein to the detection of ink horn of regeneration, can not use by alternative print machine completely.
Although describe embodiment of the present utility model by reference to the accompanying drawings, those of ordinary skill in the art can make various distortion or amendment within the scope of the appended claims.
Claims (5)
1. an ink horn of regeneration chip, is characterized in that: comprise former chip (11), repair chip (12), to be arranged between described former chip (11) and described reparation chip (12) and connect the adhesive layer (13) of described former chip (11) and described reparation chip (12); The tin point (121) of described reparation chip (12) contacts through the contact (111) of described adhesive layer (13) with described former chip (11).
2. a kind of ink horn of regeneration chip according to claim 1, the thickness of described tin point (121) equals the thickness of described adhesive layer (13).
3. a kind of ink horn of regeneration chip according to claim 1, it is characterized in that: described former chip (11) arranges dielectric film (14), the tin point (121) of described reparation chip (12) contacts with the contact (111) of described dielectric film (14) with described former chip (11) through described adhesive layer (13); The thickness of described tin point (121) equals the thickness sum of described adhesive layer (13) and described dielectric film (14).
4. an ink horn of regeneration, it is characterized in that: comprise a kind of ink horn of regeneration chip as described in claim 1 or 2 or 3, for holding the container (2) of ink, described reparation chip (12) is arranged on described former chip (11) inner side, makes described reparation chip (12) connect described former chip (11) and described container (2) outer surface.
5. an ink horn of regeneration, it is characterized in that: comprise a kind of ink horn of regeneration chip as described in claim 1 or 2 or 3, container (2) for holding ink is set, described reparation chip (12) is arranged on described former chip (11) outside, makes described former chip (11) connect described reparation chip (12) and described container (2) outer surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520818920.4U CN205097702U (en) | 2015-10-22 | 2015-10-22 | Regeneration ink horn chip, regeneration ink horn |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520818920.4U CN205097702U (en) | 2015-10-22 | 2015-10-22 | Regeneration ink horn chip, regeneration ink horn |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205097702U true CN205097702U (en) | 2016-03-23 |
Family
ID=55513511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520818920.4U Active CN205097702U (en) | 2015-10-22 | 2015-10-22 | Regeneration ink horn chip, regeneration ink horn |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205097702U (en) |
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2015
- 2015-10-22 CN CN201520818920.4U patent/CN205097702U/en active Active
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| C14 | Grant of patent or utility model | ||
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Address after: 12th Floor, Huachuang Building, No. 511 Jianye Road, Binjiang District, Hangzhou City, Zhejiang Province, 310052 Patentee after: Hangzhou Qijie Technology Co.,Ltd. Country or region after: China Address before: Room 5-11, Building 6, No. 262 Wantang Road, Xihu District, Hangzhou City, Zhejiang Province, 310012 Patentee before: HANGZHOU CHIPJET TECHNOLOGY Co.,Ltd. Country or region before: China |